CN105180697A - Temperature-uniforming plate and method making same - Google Patents
Temperature-uniforming plate and method making same Download PDFInfo
- Publication number
- CN105180697A CN105180697A CN201510732085.7A CN201510732085A CN105180697A CN 105180697 A CN105180697 A CN 105180697A CN 201510732085 A CN201510732085 A CN 201510732085A CN 105180697 A CN105180697 A CN 105180697A
- Authority
- CN
- China
- Prior art keywords
- upper plate
- plate
- capillary structure
- temperature
- lower plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a temperature-uniforming plate and a method making the same. The temperature-uniforming plate has an upper plate and a lower plate. The lower plate has a groove, the upper plate seals the groove to form a closed chamber, and the chamber is filled with a fluid medium. The inner surface of the upper plate is provided with a layer of first capillary structure, the inner surface of the lower plate is provided with a layer of second capillary structure. A support structure is disposed in the chamber. The inner surface of the upper plate is a corrugated curved surface. When the fluid medium extends from the thinnest portion of the upper plate to the adjacent thickest portion, the drive force to the fluid medium applied by the first capillary structure points to the thickest portion of the upper plate. The temperature-uniforming plate can raise the cooling effect, and expand the scope of application.
Description
Technical field
The invention belongs to heat sink technology field, refer to that a kind of take fluid as temperature-uniforming plate with great heat radiation effect of heat eliminating medium and preparation method thereof especially.
Background technology
Along with the size of electronic installation is toward frivolous future development, but electronic installation heat problem in the course of the work does not obtain more effective raising, and the heat dissipation problem of electronic installation becomes the bottleneck of restriction electronic device evolution.
In order to the radiating effect to electronic installation can be improved, have developed a kind of temperature-uniforming plate being called flat plate heat tube, because it has excellent thermal conduction characteristic, be widely used in the radiator of the electronic installations such as central processing unit, high-capacity transistor and High Power LED.
The temperature-uniforming plate now used consists essentially of the housing of hollow, is filled with fluid media (medium) as water, alcohol, gasoline etc., the base plate and cover plate of housing are provided with capillary structure in cavity.In use, base plate and electronic installation are fitted, the heat produced by heat abstractor passes to fluid media (medium) by base plate, under normal circumstances, the thermal conductivity factor of fluid media (medium) all exceedes the thermal conductivity factor of base plate material, fluid media (medium) is evaporated to gas being heated, and gas is cooled to liquid at cover plate place, and the heat of release is derived by the heat abstractor of outside.
The equal disordered state of capillary structure of existing technology, and the capillary structure that existing described average-temperature structure adopts, no matter be powder type capillary structure or netted capillary structure, all there is following problem: a kind of is because the capillary structure at the temperature-uniforming plate cover plate place of existing technology is similar plane, the effect that can be subject to gravity after fluid media (medium) cools condensation herein moves downward, and rely on capillarity slower to the speed of two lateral movements, now, the power that condensed fluid media (medium) contacts with cover plate weakens, when new gas moves to cover plate, first be that the fluid media (medium) of these condensations contacts with gas, gas can under the fluid media (medium) effect of condensation condensation release heat, and this heat can have gap due to the existence of cooling medium in advance with cover plate, heat is caused all outwards not discharged by cover plate, namely the heat meeting reverse flow of is had, although make existing temperature-uniforming plate have higher radiating effect, but still can not reach optimum state.Another problem is, when the base plate of existing temperature-uniforming plate and electronics contacts, can only be that temperature-uniforming plate is placed in a horizontal manner, if when electronic installation being sidelong or placing with other direction, temperature-uniforming plate then cannot realize good radiating effect, and in actual application, the setting direction of electronic installation cannot realize all being horizontally disposed with, this brings larger limitation with regard to giving the application of temperature-uniforming plate.
Summary of the invention
The object of the invention is to propose improvement opportunity scheme to existing temperature-uniforming plate, by the temperature-uniforming plate of the technical program, can not only radiating effect be improved, and improve the range of application of temperature-uniforming plate.
Another object of the present invention is to provide a kind of preparation method of temperature-uniforming plate, by the technical program, can realize the preparation to the application's temperature-uniforming plate.
The present invention is achieved by the following technical solutions:
A kind of temperature-uniforming plate, includes upper plate and lower plate; Described lower plate is provided with groove; Described upper plate and described lower plate are spliced sealing mutually, and described upper plate seals the cavity that described groove forms sealing; Fluid-filled medium in described cavity;
The inner surface of described upper plate is provided with one deck first capillary structure; The inner surface of described lower plate is provided with one deck second capillary structure;
The inner surface of described upper plate is corrugated curved surface; When described upper plate thinnest part extends to adjacent described upper plate thickness, the power that described first capillary structure is applied to described fluid media (medium) points to the described the thickest direction of upper plate;
Supporting construction is provided with in described cavity; One end of described supporting construction is divided and is fixed with the inner surface of described lower plate, and the inner surface in the other end and described upper plate thickness is fixed.
The inner surface of described recess sidewall is provided with one deck the 3rd capillary structure; The curved structure in cross section of the inner surface of described recess sidewall.
Described 3rd capillary structure is identical with the shape of described recess sidewall inner surface.
Described first capillary structure is not identical with the shape of described second capillary structure.
Described fluid media (medium) is water.
Described fluid media (medium) charge is exceed described cavity body over half.
Prepare a preparation method for temperature-uniforming plate described in above-mentioned any one,
Comprise the following steps,
1) clean, respectively to upper plate and lower plate cleaning;
2) be coated with, prepare the material of capillary structure in the coating of the inner surface of described upper plate, the groove floor of described lower plate and sidewall;
3) in the groove internal fixtion supporting construction of described lower plate; Ensure that the other end of described supporting construction is corresponding with the thickness of described upper plate inner surface;
4), sintering, by the inner surface of described upper plate downwards, the inner surface of described lower plate be upwards positioned in respective sintering furnace respectively sinter; Described upper plate, in sintering process, keeps upper plate constant level to rotate;
5) by step 4) in the described upper plate that sinters weld with described lower plate;
6) in cavity, fluid media (medium) is injected;
7) degasification, removes the gas in described cavity, seals after making to reach in described cavity the vacuum of setting.
The described material preparing capillary structure is copper.
In described step 4) and step 5) between also include the smooth operation of pressing.
After sealing, also include and operation is polished to the outer surface of described upper plate and the outer surface of described lower plate.
The invention has the beneficial effects as follows:
1, the present invention is by being set to corrugated curved surface by the inner surface of upper plate, namely the upper surface of cavity is corrugated curved surface, and the first capillary structure is set to when described upper plate thinnest part extends to adjacent described upper plate thickness, the power that described first capillary structure is applied to described fluid media (medium) points to described upper plate thickness, such design, when the steam of heat is after upper plate condensation, the fluid media (medium) of condensation flows to the thickness of upper plate fast from the thinnest part of upper plate, the steam of postorder is in uphill process, because vapor movement is long more than the time moving to upper plate thickness to the time of upper plate thinnest part, now upper plate thinnest part can directly contact with steam, the heat discharged in Condensation can directly be distributed by upper plate, simultaneously, even the steam risen meets with the fluid media (medium) of condensation in other position of upper plate, because the power of fluid media (medium) is not relative with the power that steam rises, but have certain angle, now, namely can not hinder the rising of gas, and gas also can not hinder the flowing of fluid media (medium), can ensure that condensed fluid media (medium) is got back to lower plate fast and participated in absorbing heat.
2, the technical scheme of the application is by being set to arcuate structure by the side wall inner surfaces of cavity, even if temperature-uniforming plate is vertically used, because at arcuate structure, the gas of the charge of fluid media (medium) and evaporation ensures that condensed fluid media (medium) flows back to fast, ensure that the effect of heat radiation, improve the scope of application of temperature-uniforming plate.
3, the sintering method of the application by adopting inner surface downward to upper plate, and the sintering method horizontally rotated in sintering process, make capillary structure on upper plate in preparation process, copper material can grow downwards in sintering fusion process, simultaneously because the effect of the centrifugal force horizontally rotated, make downward power can not undue growth, the effect of centrifugal force makes capillary structure oblique close to upper plate inner surface, and such capillary structure can realize the specific capillary structure of the application's temperature-uniforming plate upper plate.
Accompanying drawing explanation
Fig. 1 is temperature-uniforming plate sectional view of the present invention;
Fig. 2 is lower plate top view of the present invention.
Description of reference numerals
1 upper plate, 2 lower plates, 3 grooves, 4 first capillary structures, 5 second capillary structures, 6 the 3rd capillary structures, 7 supporting constructions, 11 upper plate thinnest parts, 12 upper plate thickness, 21 recess sidewall.
Detailed description of the invention
Describe technical scheme of the present invention in detail below by way of specific embodiment, following embodiment is only exemplary, only can be used for explaining and technical scheme of the present invention being described, and can not be interpreted as being the restriction to technical solution of the present invention.
The invention provides a kind of temperature-uniforming plate modified node method, as depicted in figs. 1 and 2, include upper plate 1 and lower plate 2; Lower plate is provided with groove 3, and described upper plate 1 and described lower plate 2 are spliced sealing mutually, form the cavity of sealing at described upper plate by the groove of the described lower plate of sealing; Fluid-filled medium in described cavity.
Material for the preparation of upper plate or lower plate is prior art, can adopt the material of existing use to prepare, not affect the protection domain of the application, and concrete which kind of material that adopts is according to needing the electronic installation of heat radiation or needing to determine.
Wherein lower plate fits with the radiating surface of electronic installation, and upper plate fits with other radiator structure.
The inner surface of described upper plate 1 is provided with one deck first capillary structure 4; The inner surface of described lower plate 2 is provided with one deck second capillary structure 5; In the present embodiment, the shape of the first capillary structure is not identical with the shape of the second capillary structure.First capillary structure of the application adopts metal powder sintered forming, and the second capillary structure also adopts metal powder sintered forming, and same 3rd capillary structure is also formed by metal powder sintered, and in the present embodiment, all metal dusts are copper powder.
The inner surface of described upper plate 1 is corrugated curved surface; Refer to herein and cut upper plate open observation, the outer surface of upper plate is plane, and the inner surface of upper plate is corrugated curved surface, forms crest and trough structure like this on the inner surface of upper plate, wherein, and the close together of crest and lower plate, and trough and lower plate is distant.
When described upper plate thinnest part 11 extends to adjacent described upper plate thickness 12, namely when trough extends to crest, the power that described first capillary structure is applied to described fluid media (medium) points to the described the thickest direction of upper plate; Namely power points to crest direction, sees that, shown in the arrow in Fig. 1, this structure is conducive to the backflow of fluid media (medium).
Supporting construction 7 is provided with in described cavity; In the embodiment of the application, the outer surface of supporting construction 7 is also provided with capillary structure, and power points to lower plate, to improve the speed of fluid media (medium) backflow.
One end of described supporting construction is divided and is fixed with the inner surface of described lower plate, and the inner surface in the other end and described upper plate thickness is fixed.
The inner surface of described recess sidewall 21 is provided with one deck the 3rd capillary structure 6; The curved structure in cross section of the inner surface of described recess sidewall.
Described 3rd capillary structure is identical with the shape of described cavity sidewalls inner surface.
Between the inner surface and described first capillary structure of described cavity, between the inner surface of described cavity and described second capillary structure, and be provided with watertight composition between the inner surface of described cavity and described 3rd capillary structure.In this application, the thickness of the first capillary structure, the second capillary structure and the 3rd capillary structure is all greater than the thickness of watertight composition.
Described first capillary structure is not identical with the shape of described second capillary structure.
In this application, fluid media (medium) is water; In other embodiment of the application, fluid media (medium) can be also other medium, such as alcohol, gasoline etc., all can realize the technical scheme of the application.
Described fluid media (medium) charge is exceed described cavity body over half, and this technical scheme to ensure when samming device is vertically used, the radiating effect that also can play.
The preparation method of the application's temperature-uniforming plate is comprise the following steps,
1) clean, respectively to upper plate and lower plate cleaning; For removing the dirt impurity etc. in upper plate or lower plate, in the present embodiment, abrasive blast equipment and ultrasonic cleaning apparatus is adopted to complete cleaning successively.
2) be coated with, prepare the copper powder of capillary structure in the coating of the inner surface of described upper plate, the groove floor of described lower plate and sidewall; In the application's employing is that electrostatic applications equipment is to complete coating.
3) in the groove internal fixtion supporting construction of described lower plate; Ensure that the other end of described supporting construction is corresponding with the thickness of described upper plate inner surface; In the present embodiment, adopt former to complete the fixing of supporting construction, in this application, the arrangement of supporting construction is according to realizing for the thickness supporting upper plate.
4), sintering, by the inner surface of described upper plate downwards, the inner surface of described lower plate be upwards positioned in respective sintering furnace respectively sinter; Described upper plate, in sintering process, keeps upper plate constant level to rotate; Rotary speed is no more than 100 revs/min.By the upper plate sintered and lower plate smooth to complete respectively by pressing flattening apparatus, obtain best capillarity, and make the outerplanar of capillary structure smooth, with the direction avoiding irregular capillary structure to upset air-flow, and then have influence on radiating effect.
5) by step 4) in the described upper plate that sinters weld with described lower plate; Inner chamber is made to form annular seal space.After welding, the air-tightness of the rear cavity of welding be measured, after the air-tightness detecting cavity is qualified.
6) in cavity, fluid media (medium) is injected; In the present embodiment, the fluid media (medium) of injection is ultra-pure water, in other embodiment of the application, can inject other fluid media (medium) as required.
7) degasification, removes the gas in described cavity, seals after making to reach in described cavity the vacuum of setting.In the present embodiment, degassing apparatus is vaccum-pumping equipment, for extracting vacuum in cavity, in this application, vacuum in concrete cavity does not have clear and definite requirement, as long as can meet the technical scheme requirement that vacuum that steam flows fast all can meet the application.
After sealing, also include and operation is polished to the outer surface of described upper plate and the outer surface of described lower plate, for the outer surface of upper plate and the outer surface of lower plate are polished, improve the contact area of lower plate and electronic installation, reduce interstitial space; Improve the contact area of upper plate and other heat abstractor simultaneously, reduce space, improve heat transfer efficiency.
Although illustrate and describe embodiments of the invention, for the ordinary skill in the art, be appreciated that and can carry out multiple change, amendment, replacement and modification to these embodiments without departing from the principles and spirit of the present invention, scope of the present invention is by claims and equivalency thereof.
Claims (10)
1. a temperature-uniforming plate, includes upper plate and lower plate; Described lower plate is provided with groove; Described upper plate and described lower plate are spliced sealing mutually, and described upper plate seals the cavity that described groove forms sealing; Fluid-filled medium in described cavity; It is characterized in that:
The inner surface of described upper plate is provided with one deck first capillary structure; The inner surface of described lower plate is provided with one deck second capillary structure;
The inner surface of described upper plate is corrugated curved surface; When described upper plate thinnest part extends to adjacent described upper plate thickness, the power that described first capillary structure is applied to described fluid media (medium) points to the described the thickest direction of upper plate;
Supporting construction is provided with in described cavity; One end of described supporting construction is divided and is fixed with the inner surface of described lower plate, and the inner surface in the other end and described upper plate thickness is fixed.
2. temperature-uniforming plate according to claim 1, is characterized in that: the inner surface of described recess sidewall is provided with one deck the 3rd capillary structure; The curved structure in cross section of the inner surface of described recess sidewall.
3. temperature-uniforming plate according to claim 2, is characterized in that: described 3rd capillary structure is identical with the shape of described recess sidewall inner surface.
4. temperature-uniforming plate according to claim 1, is characterized in that: described first capillary structure is not identical with the shape of described second capillary structure.
5. temperature-uniforming plate according to claim 1, is characterized in that: described fluid media (medium) is water.
6. temperature-uniforming plate according to claim 1, is characterized in that: described fluid media (medium) charge is exceed described cavity body over half.
7. a preparation method for temperature-uniforming plate according to any one of claim 1 to 6, is characterized in that:
Comprise the following steps,
1) clean, respectively to upper plate and lower plate cleaning;
2) be coated with, prepare the material of capillary structure in the coating of the inner surface of described upper plate, the groove floor of described lower plate and sidewall;
3) in the groove internal fixtion supporting construction of described lower plate; Ensure that the other end of described supporting construction is corresponding with the thickness of described upper plate inner surface;
4), sintering, by the inner surface of described upper plate downwards, the inner surface of described lower plate be upwards positioned in respective sintering furnace respectively sinter; Described upper plate, in sintering process, keeps upper plate constant level to rotate;
5) by step 4) in the described upper plate that sinters weld with described lower plate;
6) in cavity, fluid media (medium) is injected;
7) degasification, removes the gas in described cavity, seals after making to reach in described cavity the vacuum of setting.
8. preparation method according to claim 7, is characterized in that: the described material preparing capillary structure is copper.
9. preparation method according to claim 7, is characterized in that: in described step 4) and step 5) between also include the smooth operation of pressing.
10. preparation method according to claim 7, is characterized in that: after sealing, also includes and polishes operation to the outer surface of described upper plate and the outer surface of described lower plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732085.7A CN105180697B (en) | 2015-11-03 | 2015-11-03 | A kind of temperature-uniforming plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732085.7A CN105180697B (en) | 2015-11-03 | 2015-11-03 | A kind of temperature-uniforming plate and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105180697A true CN105180697A (en) | 2015-12-23 |
| CN105180697B CN105180697B (en) | 2018-06-26 |
Family
ID=54902958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510732085.7A Active CN105180697B (en) | 2015-11-03 | 2015-11-03 | A kind of temperature-uniforming plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105180697B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108801015A (en) * | 2017-05-05 | 2018-11-13 | 双鸿科技股份有限公司 | Temperature equalizing plate |
| CN110132039A (en) * | 2018-02-09 | 2019-08-16 | 通用电气公司 | The structure of the increasing material manufacturing of heat and/or mechanical system and the method for manufacturing the structure |
| WO2021109175A1 (en) * | 2019-12-06 | 2021-06-10 | 昆山联德电子科技有限公司 | Thin temperature-equalizing plate |
| CN114083841A (en) * | 2021-12-16 | 2022-02-25 | 成都四威高科技产业园有限公司 | High-thermal-conductivity graphite film temperature-equalizing plate and preparation method thereof |
| CN115763394A (en) * | 2022-10-18 | 2023-03-07 | 广州华钻电子科技有限公司 | Phase change heat conduction structure with capillary structure connecting piece and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194195A (en) * | 1986-02-19 | 1987-08-26 | Nishiyodo Kuuchiyouki Kk | Heat transfer tube equipped with internal surface fin |
| CN202918642U (en) * | 2012-11-16 | 2013-05-01 | 奇鋐科技股份有限公司 | Heat radiation device |
-
2015
- 2015-11-03 CN CN201510732085.7A patent/CN105180697B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62194195A (en) * | 1986-02-19 | 1987-08-26 | Nishiyodo Kuuchiyouki Kk | Heat transfer tube equipped with internal surface fin |
| CN202918642U (en) * | 2012-11-16 | 2013-05-01 | 奇鋐科技股份有限公司 | Heat radiation device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108801015A (en) * | 2017-05-05 | 2018-11-13 | 双鸿科技股份有限公司 | Temperature equalizing plate |
| CN110132039A (en) * | 2018-02-09 | 2019-08-16 | 通用电气公司 | The structure of the increasing material manufacturing of heat and/or mechanical system and the method for manufacturing the structure |
| CN110132039B (en) * | 2018-02-09 | 2021-07-13 | 通用电气公司 | Cooling assembly and additive manufacturing method thereof |
| WO2021109175A1 (en) * | 2019-12-06 | 2021-06-10 | 昆山联德电子科技有限公司 | Thin temperature-equalizing plate |
| CN114083841A (en) * | 2021-12-16 | 2022-02-25 | 成都四威高科技产业园有限公司 | High-thermal-conductivity graphite film temperature-equalizing plate and preparation method thereof |
| CN115763394A (en) * | 2022-10-18 | 2023-03-07 | 广州华钻电子科技有限公司 | Phase change heat conduction structure with capillary structure connecting piece and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105180697B (en) | 2018-06-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105180697A (en) | Temperature-uniforming plate and method making same | |
| CN104634148B (en) | A kind of nanostructured flat-plate heat pipe | |
| CN103000595B (en) | A kind of multidirectional turnover phase change heat-transfer device and preparation method thereof | |
| CN102883584B (en) | High-efficiency heat dissipation device | |
| CN110425918A (en) | A kind of ultrathin flexible flat-plate heat pipe | |
| CN105716461A (en) | Temperature equalizing plate with gradient porous capillary cores in plane direction and manufacturing method for temperature equalizing plate | |
| CN105352351A (en) | Improved vapor chamber structure | |
| WO2020143493A1 (en) | Vapor chamber, heat dissipation module, and semiconductor device | |
| CN205510653U (en) | Liquid cooling cold plate | |
| CN205748068U (en) | Stagewise composite construction flat late heat transfer pipe | |
| CN106329025A (en) | Battery heat management device | |
| CN105682431A (en) | Liquid-cooling cold plate | |
| CN110387211B (en) | Thermal interface material and preparation method and application thereof | |
| CN110828404A (en) | Micro-channel vapor chamber with recess structure | |
| CN211012603U (en) | Ultrathin flexible flat heat pipe | |
| CN204388671U (en) | A kind of NEW TYPE OF COMPOSITE capillary wick plume | |
| JP5112374B2 (en) | Heat dissipating device for electronic equipment and manufacturing method thereof | |
| CN104703442A (en) | Efficient radiating device | |
| CN105689717A (en) | Manufacturing method for part with capillary-structure pipe embedded therein | |
| CN110572983B (en) | Direct contact low thermal resistance type heat pipe radiator for heating device | |
| TWI476361B (en) | Method for forming capillary of vapor chamber and structure of the same | |
| CN112414189B (en) | Flat evaporator suitable for cast capillary core | |
| CN210805756U (en) | Micro-channel vapor chamber with recess structure | |
| CN105222019A (en) | A kind of LED lamp and application thereof | |
| CN210470132U (en) | Direct-contact low-thermal-resistance heat pipe radiator for heating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Liu Shuyu Document name: Notification that Application Deemed not to be Proposed |
|
| DD01 | Delivery of document by public notice | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |