CN105141279A - Method for changing bandwidth of fan surface acoustic wave filter - Google Patents
Method for changing bandwidth of fan surface acoustic wave filter Download PDFInfo
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- CN105141279A CN105141279A CN201510472173.8A CN201510472173A CN105141279A CN 105141279 A CN105141279 A CN 105141279A CN 201510472173 A CN201510472173 A CN 201510472173A CN 105141279 A CN105141279 A CN 105141279A
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Abstract
The invention discloses a method for changing bandwidth of a fan surface acoustic wave filter. The method is realized through painting a sound absorption glue, and painting of the sound absorption glue is divided into painting of high-frequency part bandwidth sound absorption glue on fingers of an input interdigital transducer and painting of low-frequency part bandwidth sound absorption glue on fingers of an output interdigital transducer; and the method comprises the following specific steps: the high-frequency part bandwidth sound absorption glue is painted downwards from the upper edge of the fingers of the input interdigital transducer, the low-frequency part bandwidth sound absorption glue is used for controlling response of low-frequency part bandwidth and is painted upwards from the lower edge of the fingers, length of the sound absorption glue is controlled by a silk-screen printing plate with adjustable width, the sound absorption glue with fixed length is painted on the surface of a wafer through a silk screen, and thus, needed bandwidth is obtained. According to the invention, bandwidth of the fan surface acoustic wave filter can be changed without changing a finger pattern, and problems of tedious procedures and higher cost caused by redesigning the pattern are solved well.
Description
Technical field
The present invention relates to a kind of method, particularly relate to a kind of method changing fan-shaped Surface Acoustic Wave Filter bandwidth.
Background technology
In traditional fan-shaped Surface Acoustic Wave Filter manufacturing process, the bandwidth among the index of device is determined by the interdigital pattern of chip surface, and interdigital pattern is formed by mask plate exposure, once after determining, is just difficult to change.When determining the interdigital pattern of chip, the band merit of SAW (Surface Acoustic Wave) device is also just difficult to change again.As changed bandwidth, need to redesign pattern plate-making, cost is higher.Therefore a kind of method that can change fan-shaped Surface Acoustic Wave Filter bandwidth is needed.
Summary of the invention
In order to solve the weak point existing for above-mentioned technology, the invention provides a kind of method changing fan-shaped Surface Acoustic Wave Filter bandwidth.
In order to solve above technical problem, the technical solution used in the present invention is: a kind of method changing fan-shaped Surface Acoustic Wave Filter bandwidth, method realizes by smearing sound absorption glue, the smearing of sound absorption glue be divided into spread upon input interdigital transducer interdigital on high-frequency place bandwidth sound absorption glue and spread upon output interdigital transducer interdigital on low frequency place bandwidth sound absorption glue;
Concrete steps are divided into:
A, high-frequency place bandwidth sound absorption glue smear position from input interdigital transducer interdigital top edge down, actual effective length be interdigital lap down start calculate, the position of the high-end f2 of frequency response moves down, high-end frequency response place goes one piece less, low side frequency response is constant, and bandwidth reduces, and frequency reduces; Effective length is longer, and the bandwidth of high-end reduction is more;
B, low frequency place bandwidth sound absorption glue is for controlling the response of low frequency place bandwidth, sound absorption glue smears position from interdigital lower limb up, actual effective length is that interdigital lap up starts to calculate, frequency response low side f1 moves by position, and low side frequency response place goes one piece less, and high-end frequency response is constant, bandwidth reduces, frequency raises, and effective length is longer, and the bandwidth that low side reduces is more;
C, sound absorption glue are smeared length and are calculated by the edge of interdigital lap, extended to the length of chip internal, control the size of bandwidth by adjustment sound absorption glue;
The relation that the length d of interdigital overlap is directly proportional to the size f2-f1 of bandwidth, sound absorption glue length corresponding to the bandwidth width of adjustment is by calculating; High-end bandwidth needs to reduce Δ f2, effective length=Δ f2/ (f2-f1) the * d of high-frequency place bandwidth sound absorption glue 2; In like manner, low side bandwidth needs to reduce Δ f1, effective length=Δ f1/ (f2-f1) the * d of low frequency place bandwidth sound absorption glue 3;
The length of sound absorption glue is controlled by the plates for screen printing of an adjustable width, by silk screen, the sound absorption glue of regular length is applied to wafer surface, obtains the bandwidth wanted.
The present invention when not changing interdigital pattern, can change the bandwidth of fan-shaped Surface Acoustic Wave Filter, and fine solving needs to redesign pattern plate-making, the problem that loaded down with trivial details and cost is higher.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is whole implementation schematic diagram of the present invention.
Fig. 2 is the schematic diagram that sector structure forms frequency response.
Fig. 3 is the frequency response figure of the fan-shaped Surface Acoustic Wave Filter of existing design.
Fig. 4 is the frequency response figure after Fig. 1 high frequency place bandwidth sound absorption glue is smeared.
Fig. 5 is the frequency response figure after Fig. 1 low and medium frequency place bandwidth sound absorption glue is smeared.
In figure: 1, input interdigital transducer; 2, high-frequency place bandwidth sound absorption glue; 3, low frequency place bandwidth sound absorption glue; 4, output interdigital transducer; 5, frequency response low side f1; 6, the high-end f2 of frequency response; 7, the length d of interdigital overlap.
The region that the bandwidth of fan-shaped Surface Acoustic Wave Filter is corresponding interdigital, interdigital narrow part, the part that corresponding frequency response frequency is high, the part that the corresponding frequency response frequency of interdigital wide part is low.
Embodiment
As shown in Figure 1 and Figure 2, form the principle of frequency response according to fan-shaped Surface Acoustic Wave Filter, the response of the high-end f2 of frequency response is more carefully controlled by finger, and the response of frequency response low side f1 is more slightly controlled by finger.Band width (f2-f1) is corresponding with interdigital aperture.
Sound absorption glue can suppress surface acoustic wave in on-chip propagation, usually the two ends that sound absorption glue is coated in Surface Acoustic Wave Filter is carried out the end face reflection of suppression device, eliminates clutter.In SAW (Surface Acoustic Wave) device manufacturing process before, can not the surface acoustic wave forming frequency response be processed.Here by the characteristic of sound absorption glue, sound absorption glue is smeared between input interdigital transducer 1 and output interdigital transducer 4, acoustic surface wave propagation between control inputs, output interdigital transducer, be equivalent to change interdigital aperture d, thus suppress the position changing frequency response low side f1 and the high-end f2 of frequency response, change the bandwidth of Surface Acoustic Wave Filter.
Accompanying drawing 3 is the frequency response figure of the fan-shaped Surface Acoustic Wave Filter of former design.What it was formed at substrate surface by SAW (Surface Acoustic Wave) device interdigitally decides the indexs such as its bandwidth, and generally as needed change, need again to make mask plate photoetching again, cost is higher.
High-frequency place bandwidth sound absorption glue 2 is for controlling the response of high-frequency place bandwidth, high-frequency place bandwidth sound absorption glue 2 smear position from the interdigital top edge of input interdigital transducer 1 down, actual effective length is that interdigital lap down starts to calculate, after smearing high-frequency place bandwidth sound absorption glue 2, frequency response figure as shown in Figure 4, the position of the high-end f2 of frequency response moves down, and high-end frequency response place will go one piece less, and low side frequency response is constant, bandwidth reduces, and frequency reduces.Effective length is longer, and the bandwidth of high-end reduction is more.
Low frequency place bandwidth sound absorption glue 3 is for controlling the response of low frequency place bandwidth, sound absorption glue smears position from the interdigital lower limb of output interdigital transducer 4 up, actual effective length is that interdigital lap up starts to calculate, after smearing low frequency place bandwidth sound absorption glue, frequency response figure as shown in Figure 5, frequency response low side f1 moves by position, and low side frequency response place will go one piece less, and high-end frequency response is constant, bandwidth reduces, and frequency raises.Effective length is longer, and the bandwidth that low side reduces is more.
Sound absorption glue is smeared length and is calculated by the edge of interdigital lap, is extended to the length of chip internal, can control the size of required bandwidth by adjustment sound absorption glue.Because of the relation that the length d of interdigital overlap is directly proportional to the size (f2-f1) of bandwidth, so sound absorption glue length corresponding to the bandwidth width that will regulate can by calculating.Suppose that high-end bandwidth needs to reduce Δ f2, so effective length=Δ f2/ (f2-f1) the * d of high-frequency place bandwidth sound absorption glue 2.In like manner, suppose that low side bandwidth needs to reduce Δ f1, so effective length=Δ f1/ (f2-f1) the * d of low frequency place bandwidth sound absorption glue 3.
The length of sound absorption glue can be controlled by the plates for screen printing of an adjustable width, by silk screen, the sound absorption glue of regular length is applied to wafer surface, thus obtains the bandwidth wanted.
The composition of sound absorption glue can be epoxy resin etc. easily by the material of acetone welding, if the bandwidth of change is wrong, by again smearing after acetone clean wafers, the alterability of device performance can be enhanced.
Advantage of the present invention is, when can not change interdigital pattern, changes the bandwidth of fan-shaped Surface Acoustic Wave Filter.
The above; be only the present invention's preferably embodiment, but protection scope of the present invention is not limited to this, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the change that can expect easily or replacement, be all encompassed within protection scope of the present invention.
Claims (1)
1. one kind changes the method for fan-shaped Surface Acoustic Wave Filter bandwidth, it is characterized in that: described method realizes by smearing sound absorption glue, the smearing of sound absorption glue be divided into spread upon input interdigital transducer (1) interdigital on high-frequency place bandwidth sound absorption glue (2) and spread upon output interdigital transducer (4) interdigital on low frequency place bandwidth to absorb sound glue (3);
Concrete steps are divided into:
A, high-frequency place bandwidth sound absorption glue (2) smear position from input interdigital transducer (1) interdigital top edge down, actual effective length is that interdigital lap down starts to calculate, the position of the high-end f2 of frequency response moves down, high-end frequency response place goes one piece less, low side frequency response is constant, bandwidth reduces, and frequency reduces; Effective length is longer, and the bandwidth of high-end reduction is more;
B, low frequency place bandwidth sound absorption glue (3) are for controlling the response of low frequency place bandwidth, sound absorption glue smears position from interdigital lower limb up, actual effective length is that interdigital lap up starts to calculate, frequency response low side f1 moves by position, and low side frequency response place goes one piece less, and high-end frequency response is constant, bandwidth reduces, frequency raises, and effective length is longer, and the bandwidth that low side reduces is more;
C, sound absorption glue are smeared length and are calculated by the edge of interdigital lap, extended to the length of chip internal, control the size of bandwidth by adjustment sound absorption glue;
The relation that the length d of interdigital overlap is directly proportional to the size f2-f1 of bandwidth, sound absorption glue length corresponding to the bandwidth width of adjustment is by calculating; High-end bandwidth needs to reduce Δ f2, effective length=Δ f2/ (f2-f1) the * d of high-frequency place bandwidth sound absorption glue (2); In like manner, low side bandwidth needs to reduce Δ f1, effective length=Δ f1/ (f2-f1) the * d of low frequency place bandwidth sound absorption glue (3);
The length of sound absorption glue is controlled by the plates for screen printing of an adjustable width, by silk screen, the sound absorption glue of regular length is applied to wafer surface, obtains the bandwidth wanted.
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Cited By (3)
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| CN112152588A (en) * | 2020-09-25 | 2020-12-29 | 福建晶安光电有限公司 | Surface acoustic wave filter and method for processing wafer for surface acoustic wave filter |
| CN113691232A (en) * | 2021-08-19 | 2021-11-23 | 中国电子科技集团公司第二十六研究所 | Acoustic meter filter with 21.4MHz surface-mounted packaging fan-shaped structure |
| CN113708738A (en) * | 2021-08-19 | 2021-11-26 | 中国电子科技集团公司第二十六研究所 | Acoustic surface filter with low-linear-phase fan-shaped structure |
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| CN112152588A (en) * | 2020-09-25 | 2020-12-29 | 福建晶安光电有限公司 | Surface acoustic wave filter and method for processing wafer for surface acoustic wave filter |
| CN112152588B (en) * | 2020-09-25 | 2024-01-30 | 福建晶安光电有限公司 | Surface acoustic wave filter and method for processing wafer for surface acoustic wave filter |
| CN113691232A (en) * | 2021-08-19 | 2021-11-23 | 中国电子科技集团公司第二十六研究所 | Acoustic meter filter with 21.4MHz surface-mounted packaging fan-shaped structure |
| CN113708738A (en) * | 2021-08-19 | 2021-11-26 | 中国电子科技集团公司第二十六研究所 | Acoustic surface filter with low-linear-phase fan-shaped structure |
| CN113708738B (en) * | 2021-08-19 | 2024-05-28 | 中电科技集团重庆声光电有限公司 | Acoustic surface filter with low-linearity phase sector structure |
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