CN105137741A - Vibration-proof CSAC (chip-scale atomic clock) physical system - Google Patents
Vibration-proof CSAC (chip-scale atomic clock) physical system Download PDFInfo
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- CN105137741A CN105137741A CN201510682486.6A CN201510682486A CN105137741A CN 105137741 A CN105137741 A CN 105137741A CN 201510682486 A CN201510682486 A CN 201510682486A CN 105137741 A CN105137741 A CN 105137741A
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- China
- Prior art keywords
- physical system
- ceramic skeleton
- vcsel
- atomic clock
- lcc
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- G—PHYSICS
- G04—HOROLOGY
- G04F—TIME-INTERVAL MEASURING
- G04F5/00—Apparatus for producing preselected time intervals for use as timing standards
- G04F5/14—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention discloses a vibration-proof CSAC (chip-scale atomic clock) physical system, which solves the problems that existing chip-scale atomic clocks are complicated in structure, high in cost and energy consumption, and the like. The vibration-proof CSAC physical system comprises an LCC base, a VCSEL (vertical cavity surface emitting laser) carrier, a VCSEL module, a ceramic skeleton, a photocell and a ceramic sealing cap, wherein the VCSEL carrier is welded on the LCC base, the VCSEL module is arranged on the VCSEL carrier, the ceramic skeleton is located above the VCSEL carrier and the lower end of the ceramic skeleton is fixed on the LCC base, the photocell is arranged at the upper end of the ceramic skeleton, and the ceramic sealing cap is used for carrying out vacuum seal on each component in cooperation with the LCC base; and the ceramic skeleton is hollow, an electrode routing for transmitting electrical signals is arranged on the surface of the ceramic skeleton, and a 1/4 slide, a Polaroid and a bubble-absorbing module are sequentially arranged in the ceramic skeleton from bottom to top. The vibration-proof CSAC physical system disclosed by the invention is simple in structure and low in production cost, and a solid foundation is laid for the large-scale popularization and application of the physical system.
Description
Technical field
The present invention relates to a kind of chip atomic clock physical system, specifically, relate to a kind of chip atomic clock physical system of shock type.
Background technology
People's daily life needs to know correct time, all the more so in production, scientific research.At present, timing tool is exactly atomic clock the most accurately in the world.The electromagnetic wave that atomic clock sends when being and utilizing Atomic absorption or release energy carries out timing.Chip-scale atomic clock is the one of atomic clock, and it is widely used in every field, but in prior art, chip-scale atomic clock mainly exists the defects such as structure is responsible for, intensity is low, cost of manufacture is high, limits chip-scale atomic clock and promotes the use of.
Summary of the invention
The object of the invention is to overcome above-mentioned defect, the chip atomic clock physical system of the shock type that a kind of structure is simple, cost is low, intensity is high is provided.
In the present invention, english note is as follows:
VCSEL: vertical cavity surface emitting laser;
To achieve these goals, the technical solution used in the present invention is as follows:
A kind of chip atomic clock physical system of shock type, comprise LCC base, be welded on the VCSEL support plate on described LCC base, be arranged on the VCSEL assembly on described VCSEL support plate, be positioned at above described VCSEL support plate and lower end and be fixed on ceramic skeleton on described LCC base, be arranged on the photoelectric cell of described ceramic skeleton upper end, and with described LCC base engagement, each parts carried out vacuum-packed ceramic sealing cap; Described ceramic skeleton hollow, is provided with the electrode cabling for transmitting electric signal on the surface of described ceramic skeleton, be fixed with 1/4 slide and polaroid from the bottom to top successively and absorb to steep assembly in described ceramic skeleton.
Further, described absorb bubble assembly comprise be fixed in described ceramic skeleton absorption bubble support plate, and be bonded in described absorb bubble support plate on absorption bubble and thermistor.
Further, heating film is coated with at described absorption bubble upper surface.
Further, described heating film is transparent heating film.
Further, described ceramic skeleton is made up of alundum (Al2O3) white pottery porcelain.
Further, described electrode cabling is surperficial at described ceramic skeleton by evaporation.
Further, described LCC base and described ceramic sealing cap are welded by vacuum seal.
Further, described photoelectric cell is adhered to described ceramic skeleton upper end.
Compared with prior art, the present invention has following beneficial effect:
(1) present invention employs firm alundum (Al2O3) white pottery porcelain as skeleton, meanwhile, all connections adopt high strength epoxy bonding, and physical strength is high;
(2) all electric signal of the present invention are transmitted by the electrode cabling of evaporation on ceramic cylinder, and enforcement is convenient, transmission efficiency is high;
(3) in the present invention, whole physical system and ceramic skeleton are as primary structure support, and other parts are all arranged on ceramic skeleton, and meanwhile, one-piece construction is more simplified than prior art;
(4) present invention employs vacuum seal welding, reduce equipment energy consumption;
(5) structure of the present invention is simple, production cost is low, for it is applied on a large scale, has established solid foundation.
Accompanying drawing explanation
Fig. 1 is exploded perspective view of the present invention.
Fig. 2 is the structural representation after the present invention has assembled.
In above-mentioned accompanying drawing, the component names that Reference numeral is corresponding is as follows: 1-LCC base, 2-VCSEL support plate, 3-VCSEL assembly, 4-ceramic skeleton, 5-1/4 slide and polaroid, 6-photoelectric cell, 7-electrode cabling, 8-pottery sealing cap, 9-absorbs bubble support plate, and 10-absorbs bubble, 11-thermistor, 12-heats film.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described, and embodiments of the present invention include but not limited to the following example.
Embodiment
As shown in Figure 1, 2, present embodiments provide a kind of chip atomic clock physical system of shock type, this chip atomic clock physical system forms hermetically-sealed construction by LCC base 1 and ceramic sealing cap 8, and remaining part is all arranged in sealing structure.Vacuum seal is adopted to weld between LCC base and ceramic sealing cap, concrete technology is as follows: adopt choice of solder Sn/Pb solder in vacuum drying oven, be heated to 180 DEG C ~ 200 DEG C and carry out soldering and sealing, the effect of vacuum seal welding be realize physical system Vacuum Package and reduce power consumption.
The parts be arranged in the hermetically-sealed construction that is made up of LCC base and ceramic sealing cap have: VCSEL support plate 2, VCSEL assembly 3, ceramic skeleton 4,1/4 slide and polaroid 5, photoelectric cell 6, electrode cabling 7, absorb bubble support plate 9, absorb bubble 10, thermistor 11 and heating film 12.Wherein, ceramic skeleton 4 is primary structure support, and other parts are all arranged on ceramic skeleton; Ceramic skeleton preferred alundum (Al2O3) white pottery porcelain is made, and its shape is cylindricality, and its lower end and sidewall all offer breach, its inner hollow.The cylinder of ceramic skeleton has electrode cabling 7 by evaporation, and electrode cabling is for transmitting all electric signal.Photoelectric cell 6 is bonded with at the upper end open place of ceramic skeleton.
Be fixed on LCC base bottom ceramic skeleton, the below of ceramic skeleton is VCSEL support plate and VCSEL assembly, is provided with 1/4 slide and polaroid 5 from the bottom to top successively and absorbs to steep assembly in ceramic skeleton inside; Wherein, 1/4 slide and polaroid refer to the assembly that 1/4 slide and polaroid bond together, absorb bubble and comprise absorption bubble support plate 9, and 10 and thermistor 11 are steeped in the absorption be bonded on absorption bubble support plate 9, in the present embodiment, absorbing bubble adopts traditional manufacturing technique to produce, and compared with the MEMS technology that itself and chip-scale atomic clock of the prior art adopt, cost of manufacture obtains and greatly reduces.Further, the present embodiment is also coated with heating film 12 at the upper surface absorbing bubble.The chip-scale atomic clock provided by the present embodiment, its structure is lower compared to prior art, and physical strength is high, consumes energy low.
According to above-described embodiment, just the present invention can be realized well.What deserves to be explained is; under prerequisite based on above-mentioned design concept; for solving same technical matters; even if some making on architecture basics disclosed in this invention are without substantial change or polishing; the essence of the technical scheme adopted is still the same with the present invention, therefore it also should in protection scope of the present invention.
Claims (8)
1. the chip atomic clock physical system of a shock type, it is characterized in that, comprise LCC base (1), be welded on the VCSEL support plate (2) on described LCC base (1), be arranged on the VCSEL assembly (3) on described VCSEL support plate (2), be positioned at described VCSEL support plate (2) top and lower end is fixed on the ceramic skeleton (4) on described LCC base (1), be arranged on the photoelectric cell (6) of described ceramic skeleton (4) upper end, and coordinate with described LCC base (1) each parts are carried out vacuum-packed ceramic sealing cap (8); Described ceramic skeleton (4) hollow, is provided with the electrode cabling (7) for transmitting electric signal on the surface of described ceramic skeleton (4), be fixed with 1/4 slide and polaroid (5) from the bottom to top successively and absorb and steep assembly in described ceramic skeleton (4).
2. the chip atomic clock physical system of a kind of shock type according to claim 1, it is characterized in that, the described bubble assembly that absorbs comprises absorption bubble support plate (9) be fixed in described ceramic skeleton (4), and is bonded in described absorption bubble (10) and the thermistor (11) absorbed on bubble support plate (9).
3. the chip atomic clock physical system of a kind of shock type according to claim 2, is characterized in that, is coated with heating film (12) at described absorption bubble (10) upper surface.
4. the chip atomic clock physical system of a kind of shock type according to claim 3, is characterized in that, described heating film (12) is transparent heating film.
5. the chip atomic clock physical system of a kind of shock type according to claim 1, is characterized in that, described ceramic skeleton (4) is made up of alundum (Al2O3) white pottery porcelain.
6. the chip atomic clock physical system of a kind of shock type according to claim 1, is characterized in that, described electrode cabling (7) is surperficial at described ceramic skeleton (4) by evaporation.
7. the chip atomic clock physical system of a kind of shock type according to claim 1, is characterized in that, described LCC base (1) and described ceramic sealing cap (8) are welded by vacuum seal.
8. the chip atomic clock physical system of a kind of shock type according to claim 1, is characterized in that, described photoelectric cell (6) is adhered to described ceramic skeleton (4) upper end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510682486.6A CN105137741A (en) | 2015-10-21 | 2015-10-21 | Vibration-proof CSAC (chip-scale atomic clock) physical system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510682486.6A CN105137741A (en) | 2015-10-21 | 2015-10-21 | Vibration-proof CSAC (chip-scale atomic clock) physical system |
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| Publication Number | Publication Date |
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| CN105137741A true CN105137741A (en) | 2015-12-09 |
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| CN201510682486.6A Pending CN105137741A (en) | 2015-10-21 | 2015-10-21 | Vibration-proof CSAC (chip-scale atomic clock) physical system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111510141A (en) * | 2020-06-03 | 2020-08-07 | 江苏集萃微纳自动化***与装备技术研究所有限公司 | Miniature atomic clock physical package and miniature atomic clock |
| CN114578677A (en) * | 2022-02-22 | 2022-06-03 | 中科启迪光电子科技(广州)有限公司 | Suspended chip atomic clock physical system |
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| JPH05508969A (en) * | 1990-06-01 | 1993-12-09 | リサーチ コーポレーション テクノロジー | Improved frequency prototype using optically cooled atomic flow |
| CN102063054A (en) * | 2011-02-22 | 2011-05-18 | 合肥威师智能电子电器厂 | CPT (Coherent Population Trapping) atomic clock |
| EP2355271A2 (en) * | 2010-02-04 | 2011-08-10 | Honeywell International Inc. | Designs and processes for thermally stabilizing a vertical cavity surface emitting laser (vcsel) in a chip-scale atomic clock |
| CN102830608A (en) * | 2011-06-13 | 2012-12-19 | 霍尼韦尔国际公司 | Vapor cell atomic clock physics package |
| CN103856215A (en) * | 2014-03-03 | 2014-06-11 | 苏州大学 | Low-power-consumption chip level atomic clock physical packaging device |
| CN103997339A (en) * | 2013-02-18 | 2014-08-20 | 精工爱普生株式会社 | Quantum interference device, atomic oscillator, and moving object |
-
2015
- 2015-10-21 CN CN201510682486.6A patent/CN105137741A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05508969A (en) * | 1990-06-01 | 1993-12-09 | リサーチ コーポレーション テクノロジー | Improved frequency prototype using optically cooled atomic flow |
| EP2355271A2 (en) * | 2010-02-04 | 2011-08-10 | Honeywell International Inc. | Designs and processes for thermally stabilizing a vertical cavity surface emitting laser (vcsel) in a chip-scale atomic clock |
| CN102063054A (en) * | 2011-02-22 | 2011-05-18 | 合肥威师智能电子电器厂 | CPT (Coherent Population Trapping) atomic clock |
| CN102830608A (en) * | 2011-06-13 | 2012-12-19 | 霍尼韦尔国际公司 | Vapor cell atomic clock physics package |
| CN103997339A (en) * | 2013-02-18 | 2014-08-20 | 精工爱普生株式会社 | Quantum interference device, atomic oscillator, and moving object |
| CN103856215A (en) * | 2014-03-03 | 2014-06-11 | 苏州大学 | Low-power-consumption chip level atomic clock physical packaging device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111510141A (en) * | 2020-06-03 | 2020-08-07 | 江苏集萃微纳自动化***与装备技术研究所有限公司 | Miniature atomic clock physical package and miniature atomic clock |
| CN111510141B (en) * | 2020-06-03 | 2023-09-15 | 江苏集萃微纳自动化***与装备技术研究所有限公司 | Physical package of miniature atomic clock and miniature atomic clock |
| CN114578677A (en) * | 2022-02-22 | 2022-06-03 | 中科启迪光电子科技(广州)有限公司 | Suspended chip atomic clock physical system |
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Application publication date: 20151209 |