CN105132777A - Molybdenum-copper electrical contact material and preparation method thereof - Google Patents
Molybdenum-copper electrical contact material and preparation method thereof Download PDFInfo
- Publication number
- CN105132777A CN105132777A CN201510555304.9A CN201510555304A CN105132777A CN 105132777 A CN105132777 A CN 105132777A CN 201510555304 A CN201510555304 A CN 201510555304A CN 105132777 A CN105132777 A CN 105132777A
- Authority
- CN
- China
- Prior art keywords
- molybdenum
- electrical contact
- powder
- contact material
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a molybdenum-copper electrical contact material and a preparation method thereof. The molybdenum-copper electrical contact material comprises, by mass, 35.0-90.0% of molybdenum, 1.0-5.0% of wolfram carbide, 0.05-1.0% of nickel, 0.05-1.0% of lanthanum chloride, and the balance copper. According to the molybdenum-copper electrical contact material, the wolfram carbide (WC) is dispersed into Mo-Cu matrices, and thus the anti-sticking performance of the material is improved; the Ni serves as a wetting activating agent, and thus the wetting capacity of the Mo-Cu can be improved; the LaCl3 is used for connecting two phases of the Mo-Cu under the effect of the Ni, so that the two-phase interface of the Mo-Cu is strengthened, and the adhesion strength of the Mo-Cu is improved; all the components take effect synergistically, so that the material has the characteristics of being high in hardness and electrical conductivity. Meanwhile, the invention provides a liquid phase sintering method of the molybdenum-copper electrical contact material, so that the porosity of the material can be reduced, and the compactness can be improved.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to a kind of molybdenum copper electrical contact material and preparation method thereof.
Background technology
Electrical contact is very important contact member in instrument, electric switch.High voltage power transmission and transforming is to the development of Large Copacity ultra-high voltage, and low-voltage distribution system and Controlling System, to the update of automatization level, raising that sensitivity level requires and electronic industrial products, all propose new requirement to contact material.Desirable electrical contact material must possess good physicals, mechanical property, electrical contact performance, chemical property and processing characteristics.
Early stage contact material many employings pure tungsten, pure molybdenum, fine copper and noble silver, the electroconductibility of these materials, hardness and high-temperature behavior are often difficult to take into account, and can not meet the high speed development in the fields such as Aeronautics and Astronautics, microelectronics, electric power, communications and transportation to the requirement of contact material comprehensively.The application of composite material of molybdenum and copper in electrical contact originates from the later stage eighties 20th century, abroad first by the contact material of this materials'use in vacuum switch tube and high-voltage appliance switch, compensate for the some shortcomings of vacuum Tungsten-copper Composites at that time.Composite material of molybdenum and copper combines the intrinsic physicals of molybdenum and copper, possesses good anti-melting welding, resistance to ablation and the performance such as hot strength, electric-conductivity heat-conductivity high.Compared with electrical contact common element tungsten, the electron work functon of molybdenum is less, shut off value is less, and the anti-electric-arc being more conducive to improve material is ablative, and meanwhile, comparatively tungsten is high, comparatively tungsten is good for processibility for the electric conductivity of molybdenum, and thus it contributes to the further raising of this zone material performance.
The density of composite material of molybdenum and copper is one of important factor affecting its thermal characteristics and intensity, and the density due to W is 19.32g/cm
3, the less (10.22g/cm of density of molybdenum
3), molybdenum copper, as pseudoalloy, is difficult to by conventional powder metallurgical technique the material obtaining high molybdenum content high-compactness.Reducing material internal hole quantity, preparation is one of researchist direction of making great efforts close to the composite material of molybdenum and copper of complete fine and close (>=98%).
(the Study on influencing factors of composite material of molybdenum and copper density such as Dong Yinghu, material heat treatment technology, in March, 2009), high fine and close composite material of molybdenum and copper has been prepared by powder metallurgy lqiuid phase sintering method, without under activated sintering process factors existence condition, the liquid phase sintering conditions of Mo/30Cu matrix material should at about 1350 DEG C; Add micro-Fe, Co, Ni or NH
4cl can improve the wettability between molybdenum copper, realizes activated sintering process, thus improves the density of sintered article.When this matrix material works at relatively high temperatures, easily there is the recrystallize of crystal grain and phenomenon of growing up, thus occur larger copper rich region, when standing arc erosion, easily occurring oxidation, melting welding and bridge joint and destroying; Meanwhile, Mo-Cu two-phase is owing to neither dissolving each other and not forming intermetallic compound, and cause Mo-Cu two-phase interface weak, adhesion strength is not high, causes the electric conductivity of molybdenum copper electrical contact material and hardness to be difficult to be further improved.
Summary of the invention
The object of this invention is to provide a kind of molybdenum copper electrical contact material, thus it is weak to solve Mo-Cu two-phase interface in existing molybdenum copper electrical contact material, the technical problem that adhesion strength is not high, gives the higher electric conductivity of material and hardness.
Second object of the present invention is to provide the preparation method of above-mentioned molybdenum copper electrical contact material.
In order to realize above object, the technical solution adopted in the present invention is:
A kind of molybdenum copper electrical contact material, is made up of the component of following weight percent: molybdenum (Mo) 35.0 ~ 90.0%, wolfram varbide (WC) 1.0 ~ 5.0%, nickel (Ni) 0.05 ~ 1.0%, Lanthanum trichloride (LaCl
3) 0.05 ~ 1.0%, surplus is copper.
In molybdenum copper electrical contact material provided by the invention, WC disperse is evenly distributed in Mo-Cu matrix, and on the one hand, WC has good high-temperature stability, when working under the high temperature conditions, both can not decompose, also can not with molybdenum, copper generation chemical reaction; On the other hand, WC can be pinned at crystal particle crystal boundary place mutually as dispersion-strengthened, thus inhibits material re-crystallizes and grain growth, keeps the stability of crystal grain, thus the electric conductivity of material and hardness under contributing to keeping hot environment; Ni, as wetting activator, can improve the wetting ability of Mo-Cu, LaCl
3then under the effect of Ni, play the effect connecting Mo-Cu two-phase, thus strengthen Mo-Cu two-phase interface, improve the adhesion strength of Mo-Cu; By the change of Mo-Cu proportion of composing, and WC, Ni, LaCl
3, the synergy of three kinds of components, according to the electric conductivity of no applied environment adjustment molybdenum copper electrical contact material and hardness, can expand the range of application of material.
Requiring the occasion of higher hardness or high electrical conductivity, above-mentioned molybdenum copper electrical contact material, preferably, be made up of the component of following weight percent: tungsten 35.0 ~ 51.0%, wolfram varbide 3.0 ~ 5.0%, nickel 0.75 ~ 1.0%, Lanthanum trichloride 0.75 ~ 1.0%, surplus is copper.
The preparation method of above-mentioned molybdenum copper electrical contact material, comprises the following steps:
1) get the molybdenum powder of formula ratio, tungsten carbide powder, nickel powder, Lanthanum trichloride powder, copper powder, mixes, and obtains compound;
2) by step 1) compression moulding of gained compound, obtain blank;
3) by step 2) gained blank sinters, to obtain final product under protective atmosphere.
The preparation method of molybdenum copper electrical contact material provided by the invention adopts powder metallurgy lqiuid phase sintering method, and Mo powder forms Mo skeleton in liquid phase sintering; WC powder permeates into the antisticking activity and high-temperature stability that improve material in Mo-Cu matrix; Ni powder plays the effect improving wettability and fluid mobility, LaCl
3the effect of staflux can be played, while raising two-phase adhesion strength, reduce the viscosity of local melt, improve the mobility of melt, thus play the effect reducing sintering temperature.
The problem that the density that the preparation method of molybdenum copper electrical contact material provided by the invention can avoid conventional solid to sinter bringing is on the low side; The Mo avoiding employing infiltration method easily to occur assembles or Cu assembles and causes the underproof problem of metallographic structure; Molybdenum copper electrical contact material density >=98.0% adopting this preparation method to obtain, electric conductivity is 26 ~ 65%IACS, and hardness is 105 ~ 265HBS.
Step 1) raw material powder meet the needs of powder metallurgy, be improve the efficiency of liquid phase sintering and obtain the molybdenum copper electrical contact material of more high-compactness, preferably, the particle diameter of molybdenum powder is 38.0 ~ 75.0 μm, purity >=99.9wt%.The particle diameter of tungsten carbide powder is 38.0 ~ 75.0 μm, purity >=99.9wt%.The particle diameter of nickel powder is 38.0 ~ 45.0 μm, purity >=99.9wt%.The particle diameter of Lanthanum trichloride powder is 2.0 ~ 38.0 μm, purity >=99.9wt%.The particle diameter of copper powder is 5.0 ~ 45.0 μm, purity >=99.5wt%.
Step 2) pressure of compression moulding is 200 ~ 300MPa.
Step 3) described protective atmosphere is Ar gas.
Step 3) temperature of described sintering is 1250 ~ 1400 DEG C, soaking time is 2 ~ 6h.Under this temperature range, Cu powder is liquid phase, can the densification of acceleration of sintering, obtains highdensity material.
Step 3) gained electrical contact material can carry out aftertreatment according to needs, and can be carry out mechanical workout as requested, and through being up to the standards, obtain electrical contact material finished product.
The preparation method of electrical contact material provided by the invention has the advantage that sintering temperature is low, cost is low, efficiency is high, obtained electrical contact material has high rigidity, high-compactness and high conductivity, high resistance fusion welding, microelectronic industry and electronic information industry can be met to the requirement of high-performance electric contact copper alloy, can be used for resistance welding electrode, substitute silver based contact material, electric switch and touch the fields such as bridge, welding burner, high-voltage switch electric appliance contact, be with a wide range of applications in mechanical industry, electric power, national defense industry and electronics and information industry.
Embodiment
Below in conjunction with specific embodiment, the present invention is further illustrated.
Embodiment 1
The molybdenum copper electrical contact material that the present embodiment provides, is made up of the component of following weight percent: molybdenum 35.0%, wolfram varbide 5.0%, nickel 1.0%, Lanthanum trichloride 1.0%, and surplus is copper.
The preparation method of the above-mentioned molybdenum copper electrical contact material that the present embodiment provides, comprises the following steps:
1) get the molybdenum powder of formula ratio, tungsten carbide powder, nickel powder, Lanthanum trichloride powder, copper powder, adopt SZ-100 type Y type to mix powder machine and raw material is fully mixed 3 hours, obtain compound;
2) by step 1) gained compound is placed in GCr15 steel die, compression moulding on Y-630T hydropress, and pressing pressure controls at 200MPa, obtains the blank of diameter 30mm;
3) by step 2) gained blank puts into graphite jig, and pass into Ar gas and make protection gas, in JR-50-160 type high temperature sintering furnace, sinter with the sintering temperature of 1250 DEG C, insulation 4h, obtains crude product; Carrying out mechanical workout on request, through being up to the standards, obtaining final product.
Described Mo powder, particle diameter is 60.0 ~ 75.0 μm, purity>=99.9wt%; Described WC powder, particle diameter is 60.0 ~ 75.0 μm, purity>=99.9wt%; Described Ni powder, particle diameter is 38.0 ~ 45.0 μm, purity>=99.9wt%; Described LaCl
3powder, particle diameter is 25.0 ~ 38.0 μm, purity>=99.9wt%; Described Cu powder, particle diameter is 38.0 ~ 45.0 μm, purity>=99.5wt%.
Embodiment 2
The molybdenum copper electrical contact material that the present embodiment provides, is made up of the component of following weight percent: molybdenum 51.0%, wolfram varbide 3.0%, nickel 0.05%, Lanthanum trichloride 0.5%, and surplus is copper.
The preparation method of the above-mentioned molybdenum copper electrical contact material that the present embodiment provides, comprises the following steps:
1) get the molybdenum powder of formula ratio, tungsten carbide powder, nickel powder, Lanthanum trichloride powder, copper powder, adopt SZ-100 type Y type to mix powder machine and raw material is fully mixed 3 hours, obtain compound;
2) by step 1) gained compound is placed in GCr15 steel die, compression moulding on Y-630T hydropress, and pressing pressure controls at 300MPa, obtains the blank of diameter 50mm;
3) by step 2) gained blank puts into graphite jig, and pass into Ar gas and make protection gas, in JR-50-160 type high temperature sintering furnace, sinter with the sintering temperature of 1300 DEG C, insulation 6h, obtains crude product; Carrying out mechanical workout on request, through being up to the standards, obtaining final product.
Described Mo powder, particle diameter is 45.0 ~ 55.0 μm, purity>=99.9wt%; Described WC powder, particle diameter is 45.0 ~ 55.0 μm, purity>=99.9wt%; Described Ni powder, particle diameter is 38.0 ~ 45.0 μm, purity>=99.9wt%; Described LaCl
3powder, particle diameter is 10.0 ~ 25.0 μm, purity>=99.9wt%; Described Cu powder, particle diameter is 25.0 ~ 38.0 μm, purity>=99.5wt%.
Embodiment 3
The molybdenum copper electrical contact material that the present embodiment provides, is made up of the component of following weight percent: molybdenum 88.0%, wolfram varbide 1.0%, nickel 0.75%, Lanthanum trichloride 0.75%, and surplus is copper.
The preparation method of the above-mentioned molybdenum copper electrical contact material that the present embodiment provides, comprises the following steps:
1) get the molybdenum powder of formula ratio, tungsten carbide powder, nickel powder, Lanthanum trichloride powder, copper powder, adopt SZ-100 type Y type to mix powder machine and raw material is fully mixed 3 hours, obtain compound;
2) by step 1) gained compound is placed in GCr15 steel die, compression moulding on Y-630T hydropress, and pressing pressure controls at 245MPa, obtains the blank of diameter 40mm;
3) by step 2) gained blank puts into graphite jig, and pass into Ar gas and make protection gas, in JR-50-160 type high temperature sintering furnace, sinter with the sintering temperature of 1400 DEG C, insulation 2h, obtains crude product; Carrying out mechanical workout on request, through being up to the standards, obtaining final product.
Described Mo powder, particle diameter is 38.0 ~ 45.0 μm, purity>=99.9wt%; Described WC powder, particle diameter is 38.0 ~ 45.0 μm, purity>=99.9wt%; Described Ni powder, particle diameter is 38.0 ~ 45.0 μm, purity>=99.9wt%; Described LaCl
3powder, particle diameter is 2.0 ~ 5.0 μm, purity>=99.9wt%; Described Cu powder, particle diameter is 5.0 ~ 25.0 μm, purity>=99.5wt%.
Embodiment 4
The molybdenum copper electrical contact material that the present embodiment provides, is made up of the component of following weight percent: molybdenum 70.0%, wolfram varbide 2.0%, nickel 0.5%, Lanthanum trichloride 0.05%, and surplus is copper.
The preparation method of the above-mentioned molybdenum copper electrical contact material that the present embodiment provides, comprises the following steps:
1) get the molybdenum powder of formula ratio, tungsten carbide powder, nickel powder, Cerium II Chloride powder, copper powder, adopt SZ-100 type Y type to mix powder machine and raw material is fully mixed 3 hours, obtain compound;
2) by step 1) gained compound is placed in GCr15 steel die, compression moulding on Y-630T hydropress, and pressing pressure controls at 300MPa, obtains the blank of diameter 40mm;
3) by step 2) gained blank puts into graphite jig, and pass into Ar gas and make protection gas, in JR-50-160 type high temperature sintering furnace, sinter with the sintering temperature of 1350 DEG C, insulation 3h, obtains crude product; Carrying out mechanical workout on request, through being up to the standards, obtaining final product.
Described Mo powder, particle diameter is 55.0 ~ 65.0 μm, purity>=99.9wt%; Described WC powder, particle diameter is 55.0 ~ 65.0 μm, purity>=99.9wt%; Described Ni powder, particle diameter is 38.0 ~ 45.0 μm, purity>=99.9wt%; Described LaCl
3powder, particle diameter is 7.0 ~ 14.0 μm, purity>=99.9wt%; Described Cu powder, particle diameter is 5.0 ~ 25.0 μm, purity>=99.5wt%.
Test example
Carry out Performance Detection to the compactness of the molybdenum copper electrical contact material of embodiment 1 ~ 4, electric conductivity and hardness, result is as shown in table 1.From the test-results of table 1, molybdenum copper electrical contact material prepared by the present embodiment has higher density, and has higher intensity and high conductivity, can meet microelectronic industry and electronic information industry to the requirement of high property copper alloy electrical contact material.
The performance test results of the molybdenum copper electrical contact material of table 1 embodiment 1 ~ 4
| Formula | Compactness | Electric conductivity, IACS | Hardness, HBS |
| Embodiment 1 | 99.0％ | 61.0％ | 105 |
| Embodiment 2 | 98.5％ | 53.5％ | 116 |
| Embodiment 3 | 98.1％ | 27.4％ | 263 |
| Embodiment 4 | 98.3％ | 32.5％ | 215 |
Claims (10)
1. a molybdenum copper electrical contact material, is characterized in that, is made up of the component of following weight percent: molybdenum 35.0 ~ 90.0%, wolfram varbide 1.0 ~ 5.0%, nickel 0.05 ~ 1.0%, Lanthanum trichloride 0.05 ~ 1.0%, and surplus is copper.
2. molybdenum copper electrical contact material as claimed in claim 1, it is characterized in that, be made up of the component of following weight percent: molybdenum 35.0 ~ 51.0%, wolfram varbide 3.0 ~ 5.0%, nickel 0.75 ~ 1.0%, Lanthanum trichloride 0.75 ~ 1.0%, surplus is copper.
3. a preparation method for molybdenum copper electrical contact material as claimed in claim 1, is characterized in that, comprise the following steps:
1) get the molybdenum powder of formula ratio, tungsten carbide powder, nickel powder, Lanthanum trichloride powder, copper powder, mix, obtain compound;
2) by step 1) compression moulding of gained compound, obtain blank;
3) by step 2) gained blank sinters, to obtain final product under protective atmosphere.
4. the preparation method of molybdenum copper electrical contact material as claimed in claim 3, is characterized in that, step 1) in, the particle diameter of molybdenum powder is 38.0 ~ 75.0 μm.
5. the preparation method of molybdenum copper electrical contact material as claimed in claim 3, is characterized in that, step 1) in, the particle diameter of tungsten carbide powder is 38.0 ~ 75.0 μm.
6. the preparation method of molybdenum copper electrical contact material as claimed in claim 3, is characterized in that, step 1) in, the particle diameter of nickel powder is 38.0 ~ 45.0 μm.
7. the preparation method of molybdenum copper electrical contact material as claimed in claim 3, is characterized in that, step 1) in, the particle diameter of Lanthanum trichloride powder is 2.0 ~ 38.0 μm.
8. the preparation method of molybdenum copper electrical contact material as claimed in claim 3, is characterized in that, step 1) in, the particle diameter of copper powder is 5.0 ~ 45.0 μm.
9. the preparation method of molybdenum copper electrical contact material as claimed in claim 3, is characterized in that, step 2) pressure of compression moulding is 200 ~ 300MPa.
10. the preparation method of molybdenum copper electrical contact material as claimed in claim 3, is characterized in that, step 3) temperature that sinters is 1250 ~ 1400 DEG C, soaking time is 2 ~ 6h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510555304.9A CN105132777A (en) | 2015-09-01 | 2015-09-01 | Molybdenum-copper electrical contact material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510555304.9A CN105132777A (en) | 2015-09-01 | 2015-09-01 | Molybdenum-copper electrical contact material and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105132777A true CN105132777A (en) | 2015-12-09 |
Family
ID=54718341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510555304.9A Pending CN105132777A (en) | 2015-09-01 | 2015-09-01 | Molybdenum-copper electrical contact material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105132777A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106623925A (en) * | 2016-12-07 | 2017-05-10 | 中北大学 | Method for selective laser melting of molybdenum-copper composite selective laser melting and forming |
| CN108149042A (en) * | 2017-12-22 | 2018-06-12 | 北京工业大学 | A kind of cryogenic activating sintering preparation method of high-compactness molybdenum material |
| CN110093530A (en) * | 2019-06-10 | 2019-08-06 | 河南科技大学 | It is a kind of high to lead wear-resistant copper based composites and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08253833A (en) * | 1995-03-15 | 1996-10-01 | Toho Kinzoku Kk | Copper-molybdenum alloy and its production |
| CN101121972A (en) * | 2007-09-11 | 2008-02-13 | 中北大学 | Method for preparing Mo-Cu composite material |
| CN101942592A (en) * | 2010-08-04 | 2011-01-12 | 湖南科技大学 | Method for preparing molybdenum copper alloy by activated sintering |
| CN102677069A (en) * | 2012-01-10 | 2012-09-19 | 河南科技大学 | High performance copper alloy composite integrated contact material and preparation method thereof |
-
2015
- 2015-09-01 CN CN201510555304.9A patent/CN105132777A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08253833A (en) * | 1995-03-15 | 1996-10-01 | Toho Kinzoku Kk | Copper-molybdenum alloy and its production |
| CN101121972A (en) * | 2007-09-11 | 2008-02-13 | 中北大学 | Method for preparing Mo-Cu composite material |
| CN101942592A (en) * | 2010-08-04 | 2011-01-12 | 湖南科技大学 | Method for preparing molybdenum copper alloy by activated sintering |
| CN102677069A (en) * | 2012-01-10 | 2012-09-19 | 河南科技大学 | High performance copper alloy composite integrated contact material and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 程新乐等: "Cu- 49. 5Mo-1WC 复合材料的电弧侵蚀特性", 《材料热处理学报》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106623925A (en) * | 2016-12-07 | 2017-05-10 | 中北大学 | Method for selective laser melting of molybdenum-copper composite selective laser melting and forming |
| CN106623925B (en) * | 2016-12-07 | 2019-03-26 | 中北大学 | A kind of composite material of molybdenum and copper selective laser melting manufacturing process |
| CN108149042A (en) * | 2017-12-22 | 2018-06-12 | 北京工业大学 | A kind of cryogenic activating sintering preparation method of high-compactness molybdenum material |
| CN108149042B (en) * | 2017-12-22 | 2020-04-14 | 北京工业大学 | Low-temperature activation sintering preparation method of high-density molybdenum material |
| CN110093530A (en) * | 2019-06-10 | 2019-08-06 | 河南科技大学 | It is a kind of high to lead wear-resistant copper based composites and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Dong et al. | Recent progress in development of tungsten-copper composites: Fabrication, modification and applications | |
| Yang et al. | Effect of WC and CeO2 on microstructure and properties of W–Cu electrical contact material | |
| CN102162055B (en) | Method for preparing a tungsten-copper composite material with high arc ablation resistance | |
| He et al. | Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam | |
| CN105177346B (en) | A kind of tungsten copper contact material and preparation method thereof | |
| CN104911434B (en) | A kind of carbide strengthens Mo2NiB2Ceramic metal and preparation method thereof | |
| CN105624505B (en) | A kind of Metal Substrate super-hard compound material and preparation method thereof | |
| Fu et al. | Brazing copper and alumina metallized with Ti-containing Sn0. 3Ag0. 7Cu metal powder | |
| Zhou et al. | Effects of metal phases and carbides on the microstructure and mechanical properties of Ti (C, N)-based cermets cutting tool materials | |
| CN102492884A (en) | Preparation method of novel tungsten-copper-zinc alloy material | |
| CN103160701A (en) | Preparation method for high-temperature-resistant Mo-Si-B alloy | |
| CN105132777A (en) | Molybdenum-copper electrical contact material and preparation method thereof | |
| Cai et al. | Microstructure and properties of Al/Sip composites for thermal management applications | |
| Dong et al. | W–Cu system: synthesis, modification, and applications | |
| CN104711457A (en) | High temperature solder and application thereof | |
| CN103045895A (en) | Electric contact material and preparation method thereof | |
| CN102031411B (en) | Method for preparing compact W-Cu composite material at low temperature | |
| US7186369B1 (en) | Method of forming a part made of a molybdenum-copper composite material | |
| CN106086493B (en) | A kind of method that fast low temperature sintering prepares CuCr alloy materials | |
| CN111390195B (en) | Micro-interface quantum scattering-free tungsten-copper alloy and preparation method and application thereof | |
| CN108517429A (en) | A kind of Ti2AlC enhances the preparation method of Cu-base composites | |
| CN111230103A (en) | Preparation method of tungsten-copper alloy wear-resistant electrode | |
| Guo et al. | Relationship between the MgOp/Cu interfacial bonding state and the arc erosion resistance of MgO/Cu composites | |
| CN103938048B (en) | Carbon aluminium titanium base electric contact material and its production and use | |
| CN105761956A (en) | Contact material, vacuum arc-extinguishing chamber contact and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151209 |