CN105131598B - 低介电的树脂组合物及应用其的树脂膜、半固化胶片及电路板 - Google Patents
低介电的树脂组合物及应用其的树脂膜、半固化胶片及电路板 Download PDFInfo
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- CN105131598B CN105131598B CN201510069450.0A CN201510069450A CN105131598B CN 105131598 B CN105131598 B CN 105131598B CN 201510069450 A CN201510069450 A CN 201510069450A CN 105131598 B CN105131598 B CN 105131598B
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- 230000008023 solidification Effects 0.000 description 1
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- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
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Abstract
本发明是提供一种树脂组合物,其包含:(A)聚酰亚胺树脂;(B)预聚化马来酰亚胺树脂;(C)热固性树脂;以及(D)阻燃剂;其中,该聚酰亚胺树脂的合成反应物包含酸酐及二胺,该二胺包含4,4’‑二胺基‑二苯基甲烷类化合物及聚醚二胺(Polyetherdiamine)类化合物。本发明通过包含特定结构二胺所合成的聚酰亚胺树脂及经预聚化的马来酰亚胺树脂,可制作成树脂膜或半固化胶片,从而可达到低介电常数、低介电损耗、高耐热性及高接着性等电路基板特性,进而达到可应用于金属积层板及印刷电路板的目的。
Description
技术领域
本发明是关于一种树脂组合物,尤指一种应用于印刷电路板的树脂组合物。
背景技术
新世代的电子产品趋向轻薄短小,并适合高频传输,因此电路板的配线走向高密度化,电路板的材料选用走向更严谨的需求。就电气性质而言,主要需考虑者包括材料的介电常数(dielectric constant,Dk)以及介电损耗(又称损失因子,dissipation factor,Df)。一般而言,由于基板的讯号传送速度与基板材料的介电常数的平方根成反比,故基板材料的介电常数通常越小越好;另一方面,由于介电损耗越小代表讯号传递的损失越少,故介电损耗较小的材料所能提供的传输质量也较为良好。高频电子组件与电路板接合,为了维持传输速率及保持传输讯号完整性,电路板的基板材料必须兼具较低的介电常数以及介电损耗。同时,为了于高温、高湿度环境下依然维持电子组件正常运作功能,电路板也必须兼具耐热、难燃及低吸水性的特性。
现有技术1(TW I384908)揭示一种用于印刷线路板的树脂复合铜箔,其包含铜箔及含有聚酰亚胺嵌段共聚物及马来酰亚胺化合物的树脂层,该树脂层系在铜箔的一个表面上形成,该聚酰亚胺嵌段共聚物具有固定比例范围的特定式结构的单元所组成。
现有技术2(TW 201245332A)揭示一种印刷电路板用树脂组合物,包含聚酰亚胺树脂、热硬化性树脂及填充材,该聚酰亚胺树脂包含以固定比例范围的特定式结构的重复单元所组成。
现有技术1及2所揭示的树脂组合物中,均使用特定结构的二胺,如1,3-双(4-胺基苯氧基)苯(1,3-Bis(4-aminophenoxy)benzene,TPE-R)或2,2-双[4-(4-胺基苯氧基)苯基]丙烷(2,2-Bis[4-(4-aminophenoxy)phenyl]propane,BAPP),以其与酸酐反应而形成聚酰亚胺树脂,但实际应用于树脂膜或半固化胶片以制作电路基板时,发现上述的聚酰亚胺树脂会产生难溶于甲苯(Toluene)溶剂的问题,同时所制作的电路基板的介电特性较高、基板压合后会产生干板、多空洞(空泡)以及需较高压合温度等缺点。
因此,如何开发出具有低介电常数以及低介电损耗的材料,并具有优异的耐热性及黏着性,将其应用于印刷电路板的制造,乃是现阶段印刷电路板材料供货商亟欲解决之问题。
发明内容
鉴于上述现有技术的缺憾,发明人有感其未臻完善,遂竭其心智悉心研究克服,凭其从事该项产业多年累积的经验,研发出一种树脂组合物。
本发明的主要目的在提供一种树脂组合物,其包含:(A)聚酰亚胺树脂;(B)预聚化马来酰亚胺树脂;(C)热固性树脂;以及(D)阻燃剂;其中,该聚酰亚胺树脂的合成反应物包含酸酐及二胺,该二胺包含4,4’-二胺基-二苯基甲烷类化合物及聚醚二胺(Polyetherdiamine)类化合物。本发明通过包含特定结构二胺所合成的聚酰亚胺树脂及经预聚化的马来酰亚胺树脂,可制作成树脂膜或半固化胶片,以使可达到低介电常数、低介电损耗、高耐热性及高接着性等电路基板特性,进而达到可应用于金属积层板及印刷电路板的目的。
为达上述目的,本发明提供一种树脂组合物,其包含:(A)100重量份的聚酰亚胺树脂;(B)10至50重量份的预聚化马来酰亚胺树脂;(C)10至150重量份的热固性树脂;以及(D)15至150重量份的阻燃剂;其中,该聚酰亚胺树脂的合成反应物包含酸酐及二胺,该二胺包含4,4’-二胺基-二苯基甲烷类化合物及聚醚二胺类化合物。
本发明所述的聚酰亚胺树脂的合成反应物包含酸酐(X)及二胺(Y),所述二胺(Y)包含4,4’-二胺基-二苯基甲烷类化合物及聚醚二胺类化合物,所述4,4’-二胺基-二苯基甲烷类化合物并无特别限制,优选自下列组中至少一种:4,4’-二胺基-3,3’,5,5’-四乙基二苯基甲烷(4,4’-Diamino-3,3’,5,5’-tetraethyldiphenylmethane,MDEA,或称4,4’-亚甲基双-(2,6-二乙基)苯胺(4,4’-Methylenebis(2,6-diethylaniline))、4,4’-二胺基-3,3’,5,5’-四甲基二苯基甲烷(4,4’-Diamino-3,3’,5,5’-tetramethyldiphenylmethane)、4,4’-二胺基-3,3’-二甲基二苯基甲烷(4,4’-Diamino-3,3’-dimethyldiphenylmethane)及4,4’-二胺基-3,3’-二乙基二苯基甲烷(4,4’-Diamino-3,3’-diethyldiphenylmethane)。
所述聚醚二胺类化合物具有二个末端一级胺(Primary amine),其高分子主链(Backbone)优选地包含氧化乙烯(oxyethylene)嵌段、氧化丙烯(oxypropylene)嵌段或同时包含二者,其数量平均分子量(Mn)范围约为100至5,000,优选地,分子量范围约为500至2,500,如Huntsman公司生产的商品名D-230、D-400、D-2000、D-4000、ED-600、ED-900、ED-2003、EDR-148或EDR-176等聚醚二胺类化合物。
所述酸酐(X)并无特别限制,优选自下列组中至少一种:均苯四甲酸二酐(Pyromellitic dianhydride,PMDA)、3,3’,4,4’-二苯甲酮四甲酸二酐(3,3’,4,4’-Benzophenonetetracarboxylic dianhydride,BTDA)、双酚A二苯二甲酸酐(Bisphenol-Adiphthalic anhydride,BisDA)及4,4’-氧二邻苯二甲酸酐(4,4’-Oxydiphthalicanhydride,OPDA)。
本发明所述的聚酰亚胺树脂的合成反应物进一步包含封端化合物(Z),以改变末端的反应官能基,所述封端化合物(Z)可为苯酚、酸酐或胺类化合物,例如:4-氨基苯酚(4-Aminophenol,AMP)、邻苯二甲酸酐、马来酸酐、纳迪克酸酐(Nadic anhydride)、对甲苯胺、对甲氧基苯胺及对苯氧基苯胺。优选地,使用4-氨基苯酚,利用其胺基与酸酐反应缩合成酰亚胺官能基,并保留其羟基做为反应官能基。
本发明所述的聚酰亚胺树脂的合成反应物包含酸酐(X)及二胺(Y),该聚酰亚胺树脂可以由下列化学式描述:X-(Y-X)n,n为1至10的任一正整数;当合成反应物进一步使用封端化合物(Z)时,可以由下列化学式描述:Z-X-(Y-X)n-Z,n为1至10的任一正整数。
本发明所述的聚酰亚胺树脂的分子量,以数量平均分子量(Mn)换算为2,000~100,000,优选为5,000~80,000,更优选为10,000~30,000。此外,树脂的数量平均分子量(Mn)可利用凝胶渗透层析(GPC)、尺寸筛除层析(SEC)、基质辅助激光脱附离子化质量法(MALDI-MS)等已知的方法测定。
本发明所述的聚酰亚胺树脂,相较于现有技术使用的聚酰亚胺树脂的优点如下:
(1)本发明所述的聚酰亚胺树脂可溶于甲苯等非极性溶液中,且溶解度超过30%,商业取得的一般聚酰亚胺树脂仅可溶于高极性高沸点溶剂中,如二甲基乙酰胺(DMAC)、甲基吡咯酮(NMP)、二甲基亚砜(DMSO)或二甲基甲酰胺(DMF)等高沸点溶剂,其于甲苯中的溶解度通常小于5%。本发明所述的聚酰亚胺树脂溶于甲苯等非极性溶液中可利于制作树脂膜,于树脂膜的烘烤过程中可于低温(约120℃)烘烤成半固化(B-stage)。反之,一般聚酰亚胺树脂溶于DMAC、NMP、DMSO、DMF等高沸点溶剂中,在制作树脂膜时的烘烤温度需高达150至200℃,造成能源消耗太大。此外,本发明所述的聚酰亚胺树脂溶于甲苯等非极性溶液中可提高其保存性,避免其随存放时间增加而性质劣化。
(2)本发明所述的聚酰亚胺树脂熔融黏度低,适用压机制程于约80至150℃的较低熔融温度下压合操作,且最高压合温度为约200至220℃;一般聚酰亚胺树脂的熔融黏度高且甚至不熔融,需在约200至250℃的熔融温度下压合操作,且最高压合温度需极高温下操作(约250至350℃),此高温压合需要额外添购特殊规格的压机,会大幅增加资本支出。
本发明所述的预聚化马来酰亚胺树脂的合成反应物包含马来酰亚胺与二胺类化合物,优选在约50至150℃下反应而成。
所述马来酰亚胺并无特别限制,优选自下列组中的至少一种:4,4’-二苯甲烷双马来酰亚胺(4,4’-diphenylmethane bismaleimide)、苯甲烷马来酰亚胺寡聚物(oligomerof phenylmethane maleimide)、m-亚苯基双马来酰亚胺(m-phenylene bismaleimide)、双酚A二苯基醚双马来酰亚胺(bisphenol A diphenyl ether bismaleimide)、3,3’-二甲基-5,5’-二乙基-4,4’-二苯基甲烷双马来酰亚胺(3,3’-dimethyl-5,5’-diethyl-4,4’-diphenylmethane bismaleimide)、4-甲基-1,3-亚苯基双马来酰亚胺(4-methyl-1,3-phenylene bismaleimide)及1,6-双马来酰亚胺-(2,2,4-三甲基)己烷(1,6-bismaleimide-(2,2,4-trimethyl)hexane。
所述二胺类化合物并无特别限制,优选自下列组中至少一种:4,4’-二胺基-二苯基甲烷类化合物、二胺基二苯砜(Diphenyldiaminosulfone,DDS)、二胺基联苯(Diaminodiphenylmethane,DDM)、二氨基二苯醚(3,4’-Oxydianiline,ODA)。所述4,4’-二胺基-二苯基甲烷类化合物并无特别限制,优选自下列组中至少一种:4,4’-二胺基-3,3’,5,5’-四乙基二苯基甲烷(4,4’-Diamino-3,3’,5,5’-tetraethyldiphenylmethane,MDEA)、4,4’-二胺基-3,3’,5,5’-四甲基二苯基甲烷(4,4’-Diamino-3,3’,5,5’-tetramethyldiphenylmethane)、4,4’-二胺基-3,3’-二甲基二苯基甲烷(4,4’-Diamino-3,3’-dimethyldiphenylmethane)及4,4’-二胺基-3,3’-二乙基二苯基甲烷(4,4’-Diamino-3,3’-diethyldiphenylmethane)。
本发明所述的预聚化马来酰亚胺树脂,相较于商业取得的一般马来酰亚胺树脂的优点为,本发明所述的预聚化马来酰亚胺树脂于溶剂中的溶解性好,与树脂组合物中的其它树脂的兼容也好,不易造成马来酰亚胺析出。相对地,一般马来酰亚胺树脂于溶剂中的溶解性差,且溶解后持续摆放会造成马来酰亚胺树脂再析出,影响后续基板特性。
本发明所述的热固性树脂(thermosetting resin)并无特别限制,优选自下列组中的至少一种:环氧树脂、氰酸酯树脂、聚苯醚树脂、聚酯树脂及苯氧(phenoxy)树脂。
所述环氧树脂并无特别限制,优选自下列组中至少一种:双酚A型环氧树脂、双酚F型环氧树脂、双酚S型环氧树脂、苯酚酚醛(phenol novolac)环氧树脂、甲酚酚醛(cresolnovolac)环氧树脂、联苯(biphenyl)环氧树脂、联苯酚醛环氧树脂、双酚A酚醛(bisphenol-A novolac)环氧树脂、三官能环氧树脂、四官能环氧树脂、含萘环氧树脂、含双环戊二烯环氧树脂、苯酚芳烷基酚醛(phenol aralkyl novolac)环氧树脂、异氰酸酯改质环氧树脂、二聚酸改质环氧树脂及含磷环氧树脂。
所述氰酸酯树脂并无特别限制,优选自下列群组中至少一者:2,2-双(4-氰氧基苯基)丙烷、双(4-氰氧基苯基)乙烷、双(3,5-二甲基-4-氰氧基苯基)甲烷、2,2-双(4-氰氧基苯基)-1,1,1,3,3,3-六氟丙烷及双环戊二烯-苯酚共聚氰酸酯树脂。所述氰酸酯树脂优选是选择Lonza公司生产的商品名PT-30S、PT-60S、BA-230S、BA-3000S、BTP-6020S或ULL-950等氰酸酯树脂。
所述聚苯醚树脂并无特别限制,优选自下列组中至少一种:末端羟基的聚苯醚树脂(如Sabic生产的商品名SA-90)、末端乙烯基或丙烯基的聚苯醚树脂(如Sabic生产的商品名SA-9000)及末端乙烯苄基醚的聚苯醚树脂(如三菱瓦斯化学生产的商品名OPE-2st)。
所述聚酯树脂并无特别限制,优选是二羧酸基的芳香族与二羟基的芳香族酯化而成,例如,大日本油墨化学公司生产的商品名EXB-9460或EXB-9465。
所述阻燃剂可为含磷阻燃剂或溴化阻燃剂,其中所述溴化阻燃剂并无特别限制,优选自下列组中至少一种:乙基-双(四溴苯邻二甲酰亚胺)(如购自Albemarle的SAYTEXBT-93)、乙烷-1,2-双(五溴苯)(如购自Albemarle的SAYTEX 8010)及2,4,6-三-(2,4,6-三溴苯氧基)-1,3,5-三嗪(2,4,6-Tris(2,4,6-tribromophenoxy)-1,3,5-triazine,如ICLIndustrial公司生产的商品名FR-245)。所述含磷阻燃剂并无限制,优选自下列组中至少一种:双酚联苯磷酸盐(bisphenol diphenyl phosphate)、聚磷酸铵(ammoniumpolyphosphate)、对苯二酚-双-(联苯基磷酸盐)(hydroquinone bis-(diphenylphosphate))、双酚A-双-(联苯基磷酸盐)(bisphenol A bis-(diphenylphosphate))、三(2-羧乙基)膦(tri(2-carboxyethyl)phosphine,TCEP)、三(异丙基氯)磷酸盐、三甲基磷酸盐(trimethyl phosphate,TMP)、二甲基-甲基磷酸盐(dimethyl methyl phosphonate,DMMP)、间苯二酚双二甲苯基磷酸盐(resorcinol dixylenylphosphate,RDXP,如PX-200)、磷腈化合物(phosphazene,如SPB-100)、聚磷酸三聚氰胺(melamine polyphosphate)、9,10-二氢-9-氧杂-10-磷菲-10-氧化物(9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide,DOPO)及其衍生物或树脂、三聚氰胺氰尿酸酯(melamine cyanurate)及三-羟乙基异氰尿酸酯(tri-hydroxy ethyl isocyanurate)。但并不以此为限,举例来说,阻燃性化合物可为DOPO化合物、DOPO树脂(如DOPO-HQ、DOPO-NQ、DOPO-PN、DOPO-BPN)、DOPO键结的环氧树脂等,其中DOPO-BPN可为DOPO-BPAN、DOPO-BPFN、DOPO-BPSN等双酚酚醛化合物。
本发明的树脂组合物,可进一步包含无机填充物,所述无机填充物并无特别限制,优选自下列组中至少一种:二氧化硅(熔融态、非熔融态、多孔质或中空型)、氧化铝、氢氧化铝、氧化镁、氢氧化镁、碳酸钙、氮化铝、氮化硼、碳化铝硅、碳化硅、碳酸钠、二氧化钛、氧化锌、氧化锆、石英、钻石粉、类钻石粉、石墨、碳酸镁、钛酸钾、陶瓷纤维、云母、勃姆石(boehmite,AlOOH)、钼酸锌、钼酸铵、硼酸锌、磷酸钙、煅烧滑石、滑石、氮化硅、莫莱石、段烧高岭土、黏土、碱式硫酸镁晶须、莫莱石晶须、硫酸钡、氢氧化镁晶须、氧化镁晶须、氧化钙晶须、纳米碳管、纳米级二氧化硅与其相关无机粉体、及具有有机核外层壳为绝缘体修饰的粉体粒子。所述无机填充物可为球型、纤维状、板状、粒状、片状或针须状,并可选择性经由硅烷偶合剂预处理。
本发明的树脂组合物,可进一步包含热塑性树脂,该热塑性树脂可为聚烯烃类树脂,例如但不限于:聚丁二烯均聚物、苯乙烯-丁二烯共聚物、苯乙烯-丁二烯-二乙烯基苯共聚物、苯乙烯-聚丁二烯-马来酸酐共聚物、聚丁二烯-尿酯-甲基压克力共聚物、氢化二烯-丁二烯-苯乙烯共聚物、苯乙烯-异戊二烯-苯乙烯共聚物的其一者或其组合。
本发明的树脂组合物,可进一步包含下列群组中至少一种添加物:硬化促进剂、硅烷偶合剂、增韧剂、溶剂。
本发明所述硬化促进剂可包含路易斯碱或路易斯酸等催化剂催化剂(catalyst)或过氧化物(peroxide)。其中,路易斯碱可包含咪唑(imidazole)、三氟化硼胺复合物、氯化乙基三苯基鏻(ethyltriphenyl phosphonium chloride)、2-甲基咪唑(2-methylimidazole,2MI)、2-苯基-1H-咪唑(2-phenyl-1H-imidazole,2PZ)、2-乙基-4-甲基咪唑(2-ethyl-4-methylimidazole,2E4MI)、三苯基膦(triphenylphosphine,TPP)与4-二甲基胺基吡啶(4-dimethylaminopyridine,DMAP)中一种或多种。路易斯酸可包含金属盐类化合物,如锰、铁、钴、镍、铜、锌等金属盐化合物,如辛酸锌、辛酸钴等金属催化剂。所述过氧化物,例如但不限于:过氧化二异丙苯(dicumyl peroxide)、过氧苯甲酸三级丁酯(tert-butyl peroxybenzoate)及二叔丁基过氧化二异丙基苯(di(tert-butylperoxyisopropyl)benzene,BIPB)。根据本发明的一实施例,适用于本发明树脂组合物中的硬化促进剂优选为二叔丁基过氧化二异丙基苯。
本发明所述硅烷偶合剂,可包含硅烷化合物(silane)及硅氧烷化合物(siloxane),依官能团种类又可分为胺基硅烷化合物(amino silane)、胺基硅氧烷化合物(amino siloxane)、环氧基硅烷化合物(epoxide silane)及环氧基硅氧烷化合物(epoxidesiloxane)。
本发明所述增韧剂,可选自:橡胶(rubber)树脂、聚丁二烯丙烯腈橡胶(carboxyl-terminated butadiene acrylonitrile rubber,CTBN)、核壳聚合物(core-shell rubber)等添加物。
本发明所述溶剂可选自甲醇、乙醇、乙二醇单甲醚、丙酮、丁酮(甲基乙基酮)、甲基异丁基酮、环己酮、甲苯、二甲苯、甲氧基乙基乙酸酯、乙氧基乙基乙酸酯、丙氧基乙基乙酸酯、乙酸乙酯、二甲基甲酰胺、丙二醇甲基醚等溶剂或其混合溶剂。
本发明的另一目的在提供一种树脂膜(resin film),其包含上述的树脂组合物。该树脂膜可涂布于PET膜(polyester film)或PI膜(polyimide film),或是涂布于铜箔,再经由烘烤加热而成半固化态(B-Staged),而形成一背胶铜箔(resin coated copper,RCC)。
本发明的又一目的为提供一种半固化胶片(prepreg),可包含补强材及前述树脂组合物,其中该树脂组合物以含浸等方式附着于该补强材上,并经由高温加热形成半固化态。其中,补强材可为纤维材料、织布及不织布,如玻璃纤维布等,其可增加该半固化胶片机械强度。此外,该补强材可选择性经由硅烷偶合剂进行预处理。其中,补强材可为纤维材料、织布及不织布,如玻璃纤维布等,其可增加该半固化胶片机械强度。此外,该补强材可选择性经由硅烷偶合剂进行预处理。
本发明的又一目的为提供一种积层板(laminate),如铜箔基板(copper cladlaminate),其包含两个或两个以上金属箔及至少一绝缘层。其中,金属箔例如为铜箔,可进一步包含铝、镍、铂、银、金等至少一种金属合金;绝缘层由前述半固化胶片或是树脂膜于高温高压下固化而成,如将前述半固化胶片迭合于两个金属箔间且于高温与高压下进行压合而成。
据上,本发明的又一目的为提供一种印刷电路板,该电路板包含至少一个前述积层板,且该电路板可由已知过程制作而成。
为进一步揭露本发明,以使本发明所属技术领域中的技术人员可据以实现,以下谨以数个实施例进一步说明本发明。但是应注意,以下实施例仅用以对本发明做进一步的说明,并非用以限制本发明的实施范围,且任何本发明所属技术领域中的技术人员,在不违背本发明的精神下所作的修饰及变化,均属于本发明的范围。
附图说明
图1显示本发明所述的聚酰亚胺树脂的FTIR光谱图。
具体实施方式
为充分了解本发明的目的、特征及功效,现通过下述具体的实施例,对本发明做一详细说明,说明如后:
制造例1(合成聚酰亚胺树脂)
制造例1-1(合成本发明所述的聚酰亚胺树脂)
将5克MDEA及95克D-2000的二胺化合物,溶于100克DMAC溶剂中,置于玻璃搅拌反应槽内搅拌至固态反应物完全溶解。再将0.5克冰醋酸(脱水剂)及0.01克醋酸钾(催化剂)加入反应槽搅拌至混合均匀后;将10克BTDA及90克OPDA的酸酐依序加入反应槽内,于25至50℃下搅拌反应约4小时后,冷却至室温,得到聚酰亚胺树脂PI-1-1。合成产物以GPC量测数量平均分子量,并以上述合成产物聚酰亚胺树脂:溶剂为35:65的重量比例测试溶解度,以目视法观察是否有不溶物,若完全溶解以○表示,若无法完全溶解以X表示。
制造例1-2至1-6(合成本发明所述的聚酰亚胺树脂)
制造方法如同上述制造例1-1,不同之处仅在于改变合成反应物中MDEA及D-2000的二胺化合物的相对重量比例,并于反应约4小时后添加0.05克AMP于反应槽,并升温至200至210℃维持1小时后,冷却至室温,得到聚酰亚胺树脂PI-1-2至PI-1-6。合成产物以GPC量测数量平均分子量,并以目视法观察是否有不溶物。
制造例1-5以FTIR进行官能基分析,其FTIR光谱图如图1所示,显示原于3600至3200cm-1的一级N-H stretching的分岔特征吸收峰已消失,并在约1780cm-1(C=Osymmetrical stretching of imide)、约1720cm-1(C=Oasymmetrical stretching ofimide)及约1390cm-1(C-N stretching of aromatic imide)出现酰亚胺的特征吸收峰,可证实本发明已成功合成聚酰亚胺树脂。
制造例1-7至1-8(合成比较例的聚酰亚胺树脂)
制造方法如同上述制造例1-1至1-6,不同之处仅在于将合成反应物中MDEA及D-2000的二胺化合物以TPE-R取代,得到聚酰亚胺树脂PI-1-7至PI-1-8,合成产物以GPC量测数量平均分子量,并以目视法观察是否有不溶物。
将上述制造例1的合成反应物的组成比例及产物量测结果,列表于表一中。
制造例2(合成本发明所述的预聚化马来酰亚胺树脂)
将360克BMI-2300、100克MDEA及500g DMAC,置于玻璃搅拌反应槽内搅拌,并将温度设定于105℃反应12小时,得到兼容化树脂A-1。
将440克BMI-5100、100克MDEA及500g DMAC,置于玻璃搅拌反应槽内搅拌,并将温度设定于105℃反应12小时,得到兼容化树脂A-2。
将340克BMI-1700、100克MDEA及500g DMAC,置于玻璃搅拌反应槽内搅拌,并将温度设定于105℃反应12小时,得到兼容化树脂A-3。
将570克KI-80、100克MDEA及500g DMAC,置于玻璃搅拌反应槽内搅拌,并将温度设定于105℃反应12小时,得到兼容化树脂A-4。
实施例1-1(E1-1)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-1(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例1-2(E1-2)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-2(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例1-3(E1-3)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-3(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例1-4(E1-4)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-4(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例1-5(E1-5)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例1-6(E1-6)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-6(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例2(E2)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)15重量份的A-2(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例3(E3)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)7.5重量份的A-3(预聚化双马来酰亚胺树脂);
(C)7.5重量份的A-4(预聚化双马来酰亚胺树脂);
(D)6重量份的NC-3000H(联苯环氧树脂);
(E)4重量份的HP-5000(含萘环氧树脂);
(F)50重量份的BTP-6020(氰酸酯树脂);
(G)60重量份的8010(阻燃剂);
(H)0.5重量份的TPP-S(苯基膦催化剂);
(I)0.1重量份的DCP(过氧化物);
(J)50重量份的甲苯(溶剂);
(K)20重量份的丁酮(溶剂)。
实施例4(E4)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)30重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例5(E5)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)6重量份的NC-3000H(联苯环氧树脂);
(C)4重量份的HP-5000(含萘环氧树脂);
(D)50重量份的BTP-6020(氰酸酯树脂);
(E)60重量份的SPB-100(磷腈化合物);
(F)0.5重量份的TPP-S(苯基膦催化剂);
(G)0.1重量份的DCP(过氧化物);
(H)50重量份的甲苯(溶剂);
(I)20重量份的丁酮(溶剂)。
实施例6(E6)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)50重量份的BTP-6020(氰酸酯树脂);
(D)60重量份的SPB-100(磷腈化合物);
(E)0.5重量份的TPP-S(苯基膦催化剂);
(F)0.1重量份的DCP(过氧化物);
(G)50重量份的甲苯(溶剂);
(H)20重量份的丁酮(溶剂)。
实施例7(E7)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)15重量份的NC-3000H(联苯环氧树脂);
(D)15重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例8(E8)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)10重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例9(E9)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)100重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
实施例10(E10)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)10重量份的A-1(预聚化双马来酰亚胺树脂);
(C)10重量份的HP-5000(含萘环氧树脂);
(D)60重量份的BTP-6020(氰酸酯树脂);
(E)10重量份的OPE-2st(聚苯醚树脂);
(F)5重量份的Phenoxy(苯氧树脂);
(G)60重量份的SPB-100(磷腈化合物);
(H)5重量份的Ricon257(聚烯烃树脂);
(I)10重量份的R-45vt(聚烯烃树脂);
(J)10重量份的Ricon184MA6(聚烯烃树脂);
(K)0.5重量份的TPP-S(苯基膦催化剂);
(L)0.1重量份的DCP(过氧化物);
(M)5重量份的525(二氧化硅填充物)
(N)50重量份的甲苯(溶剂);
(O)20重量份的丁酮(溶剂)。
实施例11(E11)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)20重量份的A-1(预聚化双马来酰亚胺树脂);
(C)10重量份的NC-3000H(联苯环氧树脂);
(D)5重量份的HP-5000(含萘环氧树脂);
(E)80重量份的BTP-6020(氰酸酯树脂);
(F)10重量份的SA-9000(聚苯醚树脂);
(G)5重量份的Phenoxy(苯氧树脂);
(H)60重量份的8010(阻燃剂);
(I)10重量份的Ricon257(聚烯烃树脂);
(J)5重量份的R-45vt(聚烯烃树脂);
(K)15重量份的Ricon184MA6(聚烯烃树脂);
(L)0.5重量份的TPP-S(苯基膦催化剂);
(M)0.1重量份的DCP(过氧化物);
(N)10重量份的525(二氧化硅填充物)
(O)50重量份的甲苯(溶剂);
(P)20重量份的丁酮(溶剂)。
实施例12(E12)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)25重量份的A-1(预聚化双马来酰亚胺树脂);
(C)15重量份的HP-5000(含萘环氧树脂);
(D)60重量份的BTP-6020(氰酸酯树脂);
(E)10重量份的BA-3000(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)5重量份的R-45vt(聚烯烃树脂);
(H)10重量份的Ricon184MA6(聚烯烃树脂);
(I)0.5重量份的TPP-S(苯基膦催化剂);
(J)0.1重量份的DCP(过氧化物);
(K)10重量份的525(二氧化硅填充物)
(L)50重量份的甲苯(溶剂);
(M)20重量份的丁酮(溶剂)。
比较例1(C1)
一种树脂组合物,包含以下组成:
(A)100重量份的V-8000(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
比较例2(C2)
一种树脂组合物,包含以下组成:
(A)100重量份的HR-16NN(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
比较例3(C3)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)15重量份的BMI-2300(双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
比较例4(C4)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-5(聚酰亚胺树脂);
(B)15重量份的KI-80(双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
比较例5(C5)
一种树脂组合物,包含以下组成:
(A)50重量份的V-8000(聚酰亚胺树脂);
(B)50重量份的HR-16NN(聚酰亚胺树脂);
(C)15重量份的BMI-2300(双马来酰亚胺树脂);
(D)6重量份的NC-3000H(联苯环氧树脂);
(E)4重量份的HP-5000(含萘环氧树脂);
(F)50重量份的BTP-6020(氰酸酯树脂);
(G)10重量份的OPE-2st(聚苯醚树脂);
(H)40重量份的SPB-100(磷腈化合物);
(I)0.5重量份的TPP-S(苯基膦催化剂);
(J)0.1重量份的DCP(过氧化物);
(K)50重量份的甲苯(溶剂);
(L)20重量份的丁酮(溶剂)。
比较例6(C6)
一种树脂组合物,包含以下组成:
(A)50重量份的PI-1-5(聚酰亚胺树脂);
(B)50重量份的V-8000(聚酰亚胺树脂);
(C)15重量份的BMI-2300(双马来酰亚胺树脂);
(D)6重量份的NC-3000H(联苯环氧树脂);
(E)4重量份的HP-5000(含萘环氧树脂);
(F)50重量份的BTP-6020(氰酸酯树脂);
(G)10重量份的HPC-8000-65T(聚酯树脂);
(H)0.5重量份的TPP-S(苯基膦催化剂);
(I)0.1重量份的DCP(过氧化物);
(J)50重量份的甲苯(溶剂);
(K)20重量份的丁酮(溶剂)。
比较例7(C7)
一种树脂组合物,包含以下组成:
(A)50重量份的PI-1-5(聚酰亚胺树脂);
(B)50重量份的HR-16NN(聚酰亚胺树脂);
(C)15重量份的BMI-2300(双马来酰亚胺树脂);
(D)6重量份的NC-3000H(联苯环氧树脂);
(E)4重量份的HP-5000(含萘环氧树脂);
(F)50重量份的BTP-6020(氰酸酯树脂);
(G)10重量份的HPC-8000-65T(聚酯树脂);
(H)0.5重量份的TPP-S(苯基膦催化剂);
(I)0.1重量份的DCP(过氧化物);
(J)50重量份的甲苯(溶剂);
(K)20重量份的丁酮(溶剂)。
比较例8(C8)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-7(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
比较例9(C9)
一种树脂组合物,包含以下组成:
(A)100重量份的PI-1-8(聚酰亚胺树脂);
(B)15重量份的A-1(预聚化双马来酰亚胺树脂);
(C)6重量份的NC-3000H(联苯环氧树脂);
(D)4重量份的HP-5000(含萘环氧树脂);
(E)50重量份的BTP-6020(氰酸酯树脂);
(F)60重量份的SPB-100(磷腈化合物);
(G)0.5重量份的TPP-S(苯基膦催化剂);
(H)0.1重量份的DCP(过氧化物);
(I)50重量份的甲苯(溶剂);
(J)20重量份的丁酮(溶剂)。
上述制造例、实施例及比较例使用的化学品名如下。
MDEA:4,4’-二胺基-3,3’,5,5’-四乙基二苯基甲烷,购自Lonza公司。
D-2000:聚氧丙烯二胺,购自Huntsman公司。
AMP:4-氨基苯酚,购自TCI America公司。
BTDA:3,3’,4,4’-二苯甲酮四甲酸二酐,购自TCI America公司。
OPDA:4,4’-氧二邻苯二甲酸酐,购自TCI America公司。
TPE-R:1,3-双(4-胺基苯氧基)苯,购自TCI America公司。
BAPP:2,2-双[4-(4-胺基苯氧基)苯基]丙烷,购自TCI America公司。
V-8000:聚酰亚胺树脂,购自DIC公司。
HR-16NN:聚酰亚胺树脂,购自东洋纺绩。
BMI-2300、BMI-5100、BMI-1700:双马来酰亚胺树脂,购自大和化成公司。
KI-80:双马来酰亚胺树脂,购自KI化学公司。
NC-3000H:联苯环氧树脂,购自日本化药公司。
HP-5000:含萘环氧树脂,购自DIC公司。
BTP-6020、BA-3000:氰酸酯树脂,购自Lonza公司。
OPE-2st:末端乙烯苄基醚的联苯聚苯醚树脂,购自三菱瓦斯化学公司
SA-9000:末端甲基丙烯酸酯的双酚A聚苯醚树脂,购自Sabic公司。
HPC-8000-65T:聚酯树脂,购自DIC公司。
Phenoxy:苯氧树脂,购自勤裕公司。
8010:十溴二苯醚阻燃剂,购自Albemarle公司。
SPB-100:磷腈化合物,购自大冢化学。
Ricon257:苯乙烯-丁二烯-二乙烯基苯共聚物,购自Cray Valley公司。
R-45vt:乙烯基-聚丁二烯-聚胺基甲酸酯寡聚物,购自Cray Valley公司。
Ricon184MA6:苯乙烯-丁二烯-马来酸酐共聚物,购自Cray Valley公司。
TPP-S:三苯基膦催化剂,购自六和公司。
DCP:过氧化二异丙苯,购自Lonza公司。
525:熔融二氧化硅,购自Sibelco公司。
将上述实施例1至12的树脂组合物列表于表二中,比较例1至9的树脂组合物列表于表四中。
将上述实施例1至12及比较例1至9的树脂组合物,分批于搅拌槽中混合均匀。分别将实施例1至12及比较例1至9的各溶液取出少量(约50克溶液)置于玻璃瓶内,静置一天后,以目视观察成胶(Varnish,即混合溶液)是否有双马来酰亚胺析出,若于瓶底析出淡黄色物质即为双马来酰亚胺析出。再分别将上述均匀混合溶液于涂布机上涂布于PET膜上,使树脂组合物均匀附着于PET膜上,再进行加热烘烤成半固化态而得树脂膜。其中,实施例1至12与比较例3及4于160℃烘烤4分钟,比较例1、2、5、6、7、8及9于120℃烘烤4分钟。
将上述实施例1至12及比较例1至9所制作的树脂膜,以目视法观察其表面成膜性,成膜性依较好(◎)、普通(○)及较差(X)评价,其中树脂膜表面具有些微的针孔(Pin hole,或称鱼眼,表面有晕开现象)状则评价为普通,较多针孔为较差,表面平坦无针孔为较好。另将上述实施例1至12及比较例1至9的树脂膜分别弯曲180度角观察其耐挠折性(即耐碎裂性)。其中耐挠折性依较好(◎)、普通(○)及较差(X)评价,树脂膜完全无碎裂代表较好,些微碎裂代表普通,较多严重碎裂代表较差。
此外,将上述实施例1至12及比较例1至9的树脂组合物,分批加入搅拌槽中搅拌至混合均匀,再将均匀混合溶液于涂布机上涂布于铜箔(HTE copper foil,half ounce)上,再进行加热烘烤成半固化态而得背胶铜箔(resin coated copper)。其中,实施例1至12与比较例3及4于160℃烘烤4分钟,比较例1、2、5、6、7、8及9于120℃烘烤4分钟。上述制造方法为背胶铜箔的实施方式,其与树脂膜的制造方法类似,但以下测试以上述树脂膜为主。
将前述分批制得的树脂膜,取同一批的两张树脂膜(厚度约50μm)、两张18μm铜箔及一核心基板(Core laminate,4mil厚度基板,表面具有半盎司铜箔制成的3/3mil线宽/线距的线路,基板上具有孔径0.8mm的通孔)。之后依铜箔、树脂膜、核心基板、树脂膜、铜箔的顺序进行迭合,其中树脂膜单面迭合后需移除其另一表面的PET膜,再进行另一面的迭合,迭合完成后的结构称为迭合结构1。另取同一批的单张树脂膜(厚度约50μm)及两张18μm铜箔,依铜箔、树脂膜、铜箔的顺序进行迭合,其中单张树脂膜单面迭合后需移除另一表面的PET膜,再进行另一面的迭合,迭合完成后的结构称为迭合结构2。分别将迭合结构1及迭合结构2置于压合机器中,于真空条件下经由200℃压合2小时形成铜箔基板,其中迭合结构1的两张树脂膜固化形成铜箔与核心基板间的绝缘层,迭合结构2的单张树脂膜固化形成两张铜箔间的绝缘层。
分别将上述迭合结构1压合后的基板将表面铜箔蚀刻后,以目视观察其树脂绝缘层表面是否形成干板,干板代表基板表面织纹显露或是基板切片后以电子显微镜观察其内部有空泡。再将上述基板切片取样至SEM仪器内观察通孔内填胶性,若通孔内无空洞(void)代表填胶性较好,若通孔内空洞多代表填胶性较差。
分别将上述迭合结构2压合后的含铜箔基板,取样3英寸×3英寸大小的含铜基板,量测浸锡耐热性(S/D,solder dipping,含铜基板于288℃锡炉中浸入10秒,移出观察是否有爆板,若无再浸入10秒,测耐热回数,若绝缘层中产生***或绝缘层与铜箔接触面分离等分层现象代表爆板)。
将上述含铜基板的表面铜箔蚀刻后的不含铜基板做以下特性量测,特性量测项目包含玻璃转化温度(Tg,TMA仪器)、介电常数(dielectric constant,Dk,以微波诱电分析仪量测2GHz的Dk值,Dk值越低越好,Dk值差异0.1即为本领域明显差异)、介电损耗(dissipation factor,Df,以微波诱电分析仪量测2GHz的Df值,Df值越低越好,Df值差异0.001即为本领域明显差异)、耐燃性(flaming test,依UL94测试方法,其中等级排列V-0比V-1好,基板完全燃烧为记录为burn)。其中实施例1至12的树脂组合物制作的基板物性量测结果列表于表四中,比较例1至9的树脂组合物制作的基板物性量测结果列于表五中。由表四及表五,综合比较实施例及比较例可发现,显示未以MDEA及D-2000作为二胺所合成的聚酰亚胺树脂的基板,其Dk及Df值明显较高。另由实施例1至12及比较例1及2可发现,使用预聚化双马来酰亚胺树脂不会造成成胶中双马来酰亚胺树脂析出。
由比较例8及9可以发现,以现有技术1及2所使用的二胺类(TPE-R及BAPP)作为聚酰亚胺树脂的合成反应物,所合成的聚酰亚胺树脂的流动性差,导致无法填胶,且不适用于150至200℃的基板压程温度,且基板的Dk值较高。
由制造例1-2至1-6的结果,显示增加聚酰亚胺树脂合成时的MDEA的含量,可提升聚酰亚胺树脂的分子量;由实施例1-2至1-6可发现,增加聚酰亚胺树脂合成时的MDEA的含量,可提升基板的Tg。由实施例1-5及2,比对比较例1、2及5的数据可发现,使用一般商业化的聚酰亚胺树脂(不含MDEA及D-2000),会造成基板的Df较高,且通孔填胶性较差(具有空洞),压合流动性也较差(干板)。
因此,由上述实施例及比较例的测试结果,显示本发明通过包含特定结构二胺所合成的聚酰亚胺树脂及经预聚化的马来酰亚胺树脂,可制作成树脂膜或半固化胶片,以使可达到低介电常数、低介电损耗、高耐热性及高接着性等电路基板特性。
如上所述,本发明完全符合专利三要素:新颖性、创造性和实用性。以新颖性和创造性而言,本发明的树脂组合物可达到低介电常数、低介电损耗、高耐热性及高接着性等电路基板特性;就实用性而言,利用本发明所衍生的产品,当可充分满足目前市场的需求。
本发明在上文中已以优选实施例揭露,但是本领域技术人员应理解的是,该实施例仅用于描绘本发明,而不应解读为限制本发明的范围。应注意的是,凡是与该实施例等效的变化与置换,均应设为涵盖于本发明的权利要求范围内。因此,本发明的保护范围当权利要求书中所界定的范围为准。
Claims (14)
1.一种树脂组合物,其包含:
(A)100重量份的聚酰亚胺树脂;
(B)10至50重量份的预聚化马来酰亚胺树脂;
(C)10至150重量份的热固性树脂;以及
(D)15至150重量份的阻燃剂;
其中,该聚酰亚胺树脂的合成反应物包含酸酐及二胺,该二胺包含4,4’-二胺基-二苯基甲烷类化合物及聚醚二胺类化合物;
其中,所述4,4’-二胺基-二苯基甲烷类化合物选自下列组中的至少一种:4,4’-二胺基-3,3’,5,5’-四乙基二苯基甲烷、4,4’-二胺基-3,3’,5,5’-四甲基二苯基甲烷、4,4’-二胺基-3,3’-二甲基二苯基甲烷及4,4’-二胺基-3,3’-二乙基二苯基甲烷。
2.根据权利要求1所述的组合物,其中,所述聚醚二胺类化合物具有二个末端一级胺,其高分子主链包含氧化乙烯嵌段、氧化丙烯嵌段或同时包含二者。
3.根据权利要求2所述的组合物,其中,所述聚醚二胺类化合物的数量平均分子量为100至5,000。
4.根据权利要求1所述的组合物,其中,所述酸酐选自下列组中的至少一种:均苯四甲酸二酐、3,3’,4,4’-二苯甲酮四甲酸二酐、双酚A二苯二甲酸酐及4,4’-氧二邻苯二甲酸酐。
5.根据权利要求1所述的组合物,其中,所述聚酰亚胺树脂的合成反应物进一步包含封端化合物,所述封端化合物选自下列组中的至少一种:4-氨基苯酚、邻苯二甲酸酐、马来酸酐、纳迪克酸酐、对甲苯胺、对甲氧基苯胺及对苯氧基苯胺。
6.根据权利要求1-5任一项所述的组合物,其中,所述预聚化马来酰亚胺树脂的合成反应物包含马来酰亚胺与二胺类化合物。
7.根据权利要求1-5任一项所述的组合物,其中,所述热固性树脂选自下列组中的至少一种:环氧树脂、氰酸酯树脂、聚苯醚树脂、聚酯树脂及苯氧树脂。
8.根据权利要求1-5任一项所述的组合物,其中,所述阻燃剂是含磷阻燃剂或溴化阻燃剂。
9.根据权利要求1-5任一项所述的组合物,其进一步包含选自下列组中的至少一种:无机填充物、热塑性树脂、硬化促进剂、硅烷偶合剂、增韧剂及溶剂。
10.一种树脂膜,由权利要求1-9任一项所述的树脂组合物所制得。
11.一种背胶铜箔,由权利要求1-9任一项所述的树脂组合物所制得。
12.一种半固化胶片,由权利要求1-9任一项所述的树脂组合物所制得。
13.一种金属积层板,由权利要求10所述的树脂膜、权利要求11所述的背胶铜箔或权利要求12所述的半固化胶片所制得。
14.一种印刷电路板,其包含根据权利要求13所述的金属积层板。
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TWI646142B (zh) * | 2012-12-21 | 2019-01-01 | 台光電子材料股份有限公司 | Resin composition and copper foil substrate and printed circuit board using same |
CN106190004B (zh) * | 2016-07-20 | 2020-05-15 | 律胜科技(苏州)有限公司 | 一种具有高频特性的接着剂组合物及其用途 |
JP6922167B2 (ja) * | 2016-07-20 | 2021-08-18 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
CN106498557B (zh) * | 2016-09-19 | 2018-10-26 | 中山职业技术学院 | 一种改性纳米纤维薄膜的制备方法 |
TWI595045B (zh) * | 2016-09-23 | 2017-08-11 | 適用於軟硬結合板之樹脂組成物及其應用 | |
US11166370B2 (en) * | 2017-01-26 | 2021-11-02 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
JP7212626B2 (ja) * | 2017-10-10 | 2023-01-25 | 三井金属鉱業株式会社 | プリント配線板用樹脂組成物、樹脂付銅箔、銅張積層板、及びプリント配線板 |
JP2020090570A (ja) * | 2018-12-03 | 2020-06-11 | 味の素株式会社 | 樹脂組成物 |
CN109777103A (zh) * | 2019-01-30 | 2019-05-21 | 腾辉电子(苏州)有限公司 | 一种低流胶半固化片及其制备方法 |
CN113767117B (zh) * | 2019-04-26 | 2023-08-15 | Dic株式会社 | 固化性树脂组合物 |
JP7434727B2 (ja) * | 2019-05-31 | 2024-02-21 | 株式会社レゾナック | 接着剤組成物、積層体及び接着シート |
CN111534047A (zh) * | 2020-03-30 | 2020-08-14 | 浙江华正新材料股份有限公司 | 一种黑色树脂组合物、预浸料和层压板 |
TWI725851B (zh) * | 2020-05-15 | 2021-04-21 | 台燿科技股份有限公司 | 樹脂組合物,使用該樹脂組合物所製得之預浸漬片、金屬箔積層板及印刷電路板 |
TWI762938B (zh) * | 2020-05-29 | 2022-05-01 | 台光電子材料股份有限公司 | 樹脂組合物及其製品 |
WO2022086752A1 (en) * | 2020-10-22 | 2022-04-28 | Fujifilm Electronic Materials U.S.A., Inc. | Dielectric film-forming composition |
CN114621559B (zh) * | 2020-12-09 | 2023-07-11 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及包含其的预浸料、层压板和高频电路基板 |
RU2760127C1 (ru) * | 2021-04-01 | 2021-11-22 | Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" Национального исследовательского центра "Курчатовский институт" (НИЦ "Курчатовский институт" - ВИАМ) | Теплостойкий плёночный клей |
CN114149685B (zh) * | 2021-10-28 | 2023-09-05 | 安能(广州)科学技术有限公司 | 一种含有纳米无机莫来石氧化铝中空微珠的高频高速覆铜板 |
WO2023139579A1 (en) * | 2022-01-18 | 2023-07-27 | Noga 3D Innovations Ltd | High performance thermoset resins for 3d printing |
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US7220490B2 (en) * | 2003-12-30 | 2007-05-22 | E. I. Du Pont De Nemours And Company | Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
TWI384908B (zh) | 2006-01-25 | 2013-02-01 | Mitsubishi Gas Chemical Co | 樹脂複合銅箔,印刷線路板,及其等之製造方法 |
JP2007308676A (ja) * | 2006-04-18 | 2007-11-29 | Mitsubishi Gas Chem Co Inc | 熱硬化性ポリイミド樹脂組成物及びその硬化物 |
KR20090040253A (ko) * | 2006-06-20 | 2009-04-23 | 니폰 가야꾸 가부시끼가이샤 | 프라이머 수지층을 갖는 동박 및 그것을 사용한 적층판 |
WO2010073952A1 (ja) * | 2008-12-26 | 2010-07-01 | 三菱瓦斯化学株式会社 | 樹脂複合銅箔 |
SG191864A1 (en) * | 2011-03-07 | 2013-08-30 | Mitsubishi Gas Chemical Co | Resin composition for printed-wiring board |
CN102911501B (zh) * | 2011-08-03 | 2015-02-04 | 台光电子材料股份有限公司 | 树脂组合物及其应用的基板 |
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