CN105117763B - The manufacturing method of smart card and smart card - Google Patents
The manufacturing method of smart card and smart card Download PDFInfo
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- CN105117763B CN105117763B CN201510502431.2A CN201510502431A CN105117763B CN 105117763 B CN105117763 B CN 105117763B CN 201510502431 A CN201510502431 A CN 201510502431A CN 105117763 B CN105117763 B CN 105117763B
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Abstract
The invention discloses a kind of smart card, smart card includes insulating substrate, antenna and chip, and antenna is set on insulating substrate, and chip is set in the chip hole on insulating substrate or on insulating substrate；Chip includes the first conduction region and the second conduction region for being located at chip both ends；Corresponding first conduction region is equipped with the first conductive sheet on smart card, and corresponding second conduction region is equipped with the second conductive sheet on smart card；The first end of antenna is contacted with the first conductive sheet, and the first conduction region is contacted with the first conductive sheet；The second end of antenna is contacted with the second conductive sheet, and the second conduction region is contacted with the second conductive sheet；The invention also discloses the manufacturing methods of above-mentioned smart card；By making antenna and chip be indirectly connected with to form a closed circuit by the first conductive sheet and the second conductive sheet, efficiently solve the problems, such as that smart card architecture is single in current smart card production.
Description
Technical field
The present invention relates to technical field of intelligent card, in particular to the manufacturing method of a kind of smart card and smart card.
Background technique
Smart card is widely used in life, in industry when the middle material of production of intelligent card, is generally generated by ultrasonic wave
Antenna being partially etched on middle material PVC in addition to both ends is allowed to fixed by energy；Chip with conductive region is fixed on middle material
On PVC；Then the conductive region at antenna ends and chip both ends is directly welded into conducting, so that antenna and chip is formed one and is closed back
Road is further encapsulated as smart card finished product, and still, smart card production at present is mainly above-mentioned form, smart card architecture mistake
In single.
Summary of the invention
The main object of the present invention is to provide a kind of smart card, it is intended to solve the problems, such as that smart card architecture is single.
To achieve the above object, the present invention proposes that a kind of smart card, the smart card include insulating substrate, antenna and core
Piece, the antenna are set on the insulating substrate, and the chip is set on the insulating substrate or on the insulating substrate
In chip hole；The chip includes the first conduction region and the second conduction region for being located at chip both ends；On the smart card
Corresponding first conduction region is equipped with the first conductive sheet, and it is conductive equipped with second that second conduction region is corresponded on the smart card
Piece；The first end of the antenna is contacted with first conductive sheet, and first conduction region is contacted with first conductive sheet；Institute
The second end for stating antenna is contacted with second conductive sheet, and second conduction region is contacted with second conductive sheet.
Preferably, the first end of the antenna contacts to form first contact point with first conductive sheet, the chip
First conduction region is contacted with part of first conductive sheet other than the first contact point；The second end of the antenna with
Second conductive sheet contacts to form the second contact point, and the second conduction region of the chip is with second conductive sheet in addition to described
Part contact other than second contact point.
Preferably, the first contact point is the first pad, and second contact point is the second pad.
Preferably, the one side away from the first contact point of the first conduction region of the chip and first conductive sheet
Contact；The face contact away from second contact point of second conduction region of the chip and second conductive sheet.
Preferably, the chip further includes the integrated circuit for being spaced apart first conduction region with second conduction region
Module, the integrated circuit modules have opposite the first face and the second face, wherein the first face is led with the first conduction region and second
The surface thereof flush in electric area, the second face protrude from another surface of first conduction region Yu second conduction region；Institute
It states the first conductive sheet and the second conductive sheet part is set on the insulating substrate of the chip hole two sides, the chip is set to the core
In film perforation, and the second face of the integrated circuit modules deviates from first conductive sheet and the second conductive sheet direction；Described
One conductive sheet a part is contacted with the first conduction region of the chip, and another part is contacted with insulating substrate；Described second is conductive
Piece a part is contacted with the second conduction region of the chip, and another part is contacted with insulating substrate.
Preferably, the chip further includes the integrated circuit for being spaced apart first conduction region with second conduction region
Module, the integrated circuit modules have opposite the first face and the second face, wherein the first face is led with the first conduction region and second
The surface thereof flush in electric area, the second face protrude from another surface of first conduction region and second conduction region；
The chip is set on the insulating substrate and the second face of integrated circuit modules deviates from the insulating substrate, and described first is conductive
Piece is contacted with another surface of the first conduction region, and second conductive sheet is contacted with another surface of the second conduction region.
Preferably, the chip further includes the integrated circuit for being spaced apart first conduction region with second conduction region
Module, the integrated circuit modules have opposite the first face and the second face, wherein the first face is led with the first conduction region and second
The surface thereof flush in electric area, the second face protrude from another surface of first conduction region and second conduction region；
First conductive sheet and the second conductive sheet are set on the insulating substrate of the chip hole two sides, the chip integrated circuit module
Be thicker than the first conduction region and the part of the second conduction region is set in the chip hole, first end, the second end of the antenna
It is set on insulating substrate, another surface of first conduction region is contacted with first conductive sheet, second conduction region
Another surface contacted with second conductive sheet.
Preferably, the chip further includes the integrated circuit for being spaced apart first conduction region with second conduction region
Module, the integrated circuit modules have opposite the first face and the second face, wherein the first face is led with the first conduction region and second
The surface thereof flush in electric area, the second face protrude from another surface of first conduction region and second conduction region；
First conductive sheet and the second conductive sheet are set on the insulating substrate, and the chip is set to the first conductive sheet and the
On two conductive sheets and the second face of the integrated circuit modules deviates from insulating substrate, first conduction region and first conduction
Piece contact, second conduction region are contacted with second conductive sheet；First end, the second end of the antenna are set to insulation base
On material.
Preferably, the chip further includes the integrated circuit for being spaced apart first conduction region with second conduction region
Module, the integrated circuit modules have opposite the first face and the second face, wherein the first face is led with the first conduction region and second
The surface thereof flush in electric area, the second face protrude from another surface of first conduction region and second conduction region；
First conductive sheet and the second conductive sheet part are set on the insulating substrate of the chip hole two sides, and the chip is set to described
In chip hole, and the second face of the integrated circuit modules is towards first conductive sheet and the second conductive sheet direction；It is described
First conductive sheet a part is contacted with another surface of the first conduction region of the chip, and another part is contacted with insulating substrate；
Described second conductive sheet a part is contacted with another surface of the second conduction region of the chip, and another part connects with insulating substrate
Touching.
Preferably, the one side with first contact point of the first conduction region of the chip and the first conductive sheet removes first
Part contact other than contact point；Second conduction region of the chip and the one side with the second contact point of the second conductive sheet,
Part contact in addition to the second contact point.
Preferably, the chip further includes the integrated circuit for being spaced apart first conduction region with second conduction region
Module, the integrated circuit modules have opposite the first face and the second face, wherein the first face is led with the first conduction region and second
The surface thereof flush in electric area, the second face protrude from another surface of first conduction region and second conduction region；
First conduction region and second conduction region are contacted with the insulating substrate, so that the integrated circuit modules are thicker than
The part of first conduction region and second conduction region is set in the chip hole；First conductive sheet is set to first and leads
In the surface thereof in electric area, second conductive sheet is set in the surface thereof of the second conduction region.
Preferably, the chip further includes the integrated circuit for being spaced apart first conduction region with second conduction region
Module, the integrated circuit modules have opposite the first face and the second face, wherein the first face is led with the first conduction region and second
The surface thereof flush in electric area, the second face protrude from another surface of first conduction region and second conduction region；
First conductive sheet and the second conductive sheet are set on the insulating substrate of the chip hole two sides, the thickness of the integrated circuit modules
It is set in the chip hole in the part of the first conduction region and second conduction region, another table of first conduction region
Face is contacted with first conductive sheet, and another surface of second conduction region is contacted with second conductive sheet.
Preferably, the chip further includes the integrated circuit for being spaced apart first conduction region with second conduction region
Module, the integrated circuit modules have opposite the first face and the second face, wherein the first face is led with the first conduction region and second
The surface thereof flush in electric area, the second face protrude from another surface of first conduction region and second conduction region；
First conductive sheet and the second conductive sheet are set on the insulating substrate, and the chip is set to the first conductive sheet and the
On two conductive sheets, and the second face deviates from the insulating substrate, and first conduction region contacts with first conductive sheet, and described the
Two conduction regions are contacted with second conductive sheet.
Preferably, the upper and lower surface of first conductive sheet and second conductive sheet has tin coating.
Preferably, the smart card includes material and protective film in smart card, and material includes the insulation base in the smart card
Material, the antenna, the chip, first conductive sheet and second conductive sheet；The protective film wraps up the intelligence
Expect in card.
Preferably, the size of first conductive sheet is greater than the size of first conduction region, second conductive sheet
Size is greater than the size of second conduction region.
The present invention also proposes that a kind of manufacturing method of smart card, the manufacturing method include the following steps:
Chip is set in the chip hole on insulating substrate or on insulating substrate；
First conductive sheet is contacted with the first conduction region of chip, and the second conductive sheet is contacted with the second conduction region of chip；
Part of the antenna with first end and second end other than the first end and the second end is set to exhausted
On edge substrate；
The first end of the antenna is contacted with the first conductive sheet, by the second end of the antenna and second conductive sheet
Contact.
The present invention in the smart card architecture and manufacturing method by using increasing by the first conductive sheet and second lead
Electric piece contacts the first end of antenna with the first conductive sheet, and the second end of antenna is contacted with the second conductive sheet, then by the of chip
One conduction region is contacted with the first conductive sheet, and the second conduction region is contacted with the second conductive sheet, so that antenna is led with chip by first
Electric piece and the second conductive sheet are indirectly connected with to form a closed circuit, efficiently solve the problems, such as that current smart card architecture is single.
Detailed description of the invention
The six of one of Figure 1A, Figure 1B, Fig. 1 C, Fig. 1 D, Fig. 1 E, the manufacturing method that Fig. 1 F is smartcard embodiment one of the present invention
The simplification example of a step；
Fig. 2 is schematic cross-sectional view of Fig. 1 F along A-A；
Fig. 3 is the structural schematic diagram of the chip of smart card of the present invention；
Fig. 4 is the schematic cross-sectional view of smartcard embodiment two of the present invention, wherein the section view in section view position and Fig. 1 F
Position is identical；
Fig. 5 is the schematic cross-sectional view of smartcard embodiment three of the present invention, wherein the section view in section view position and Fig. 1 F
Position is identical；
Fig. 6 is the schematic cross-sectional view of smartcard embodiment four of the present invention, wherein the section view in section view position and Fig. 1 F
Position is identical；
Fig. 7 is the schematic cross-sectional view of smartcard embodiment five of the present invention, wherein the section view in section view position and Fig. 1 F
Position is identical；
Fig. 8 is the schematic cross-sectional view of smartcard embodiment six of the present invention, wherein the section view in section view position and Fig. 1 F
Position is identical；
Fig. 9 is the schematic cross-sectional view of smartcard embodiment seven of the present invention, wherein the section view in section view position and Fig. 1 F
Position is identical；
Figure 10 is the schematic cross-sectional view of smartcard embodiment eight of the present invention, wherein the section view in section view position and Fig. 1 F
Position is identical；
Figure 11 is the schematic cross-sectional view of smartcard embodiment nine of the present invention, wherein the section view in section view position and Fig. 1 F
Position is identical.
Drawing reference numeral explanation:
| 100 are expected in smart card | Insulating substrate 110 | Antenna 120 | Chip 130 |
| First conductive sheet 140 | Second conductive sheet 150 | First end 121 | Second end 122 |
| First conduction region 131 | Second conduction region 132 | Integrated circuit modules 133 | Chip hole 134 |
| First contact point 141 | Second contact point 151 | Third pad 142 | 4th pad 152 |
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
With reference to the accompanying drawing and specific embodiment is described further with regard to technical solution of the present invention.It should be appreciated that this
Locate described specific embodiment to be only used to explain the present invention, be not intended to limit the present invention.
The present invention proposes a kind of smart card.
F, Fig. 2 and Fig. 3 referring to Fig.1, the present invention propose a kind of smart card, in the embodiment of the present invention one, smart card packet
Include insulating substrate 110, antenna 120, chip 130, the first conductive sheet 140 and the second conductive sheet 150 with chip hole 134；It
Part of the line 120 in addition to first end 121 and second end 122 is set on insulating substrate 110, and chip 130 is set to chip hole
In 134；Chip 130 includes the first conduction region 131 and the second conduction region 132 for being located at chip both ends；First conductive sheet
140 contact with the first conduction region 131, and the second conductive sheet 150 is contacted with the second conduction region 132；The first end 121 of antenna and first
Conductive sheet 140 contacts；The second end 122 of antenna is contacted with the second conductive sheet 150.
By using increasing the first conductive sheet 140 and the second conductive sheet 150, the first end of antenna in smart card architecture
121 contact with the first conductive sheet 140, and the second end 122 of antenna is contacted with the second conductive sheet 150, the first conduction region of chip 130
131 contact with the first conductive sheet 140, and the second conduction region 132 is contacted with the second conductive sheet 150, so that antenna 120 and chip 130
It is indirectly connected with by the first conductive sheet 140 and the second conductive sheet 150 and to form a closed circuit, efficiently solve current smart card
The single problem of structure.
Chip 130 is located in chip hole 134, when preventing from expecting 100 laminating packaging in subsequent smart card, causes to chip 130
Damage.It can choose ground, chip 130 also can be set on the surface of insulating substrate 110.
Specifically, the first end 121 of antenna 120 and the first conductive sheet 140 contact connectio form first contact point 141, core
First conduction region 131 of piece 130 is contacted with part of first conductive sheet 140 other than the first contact point 141；Antenna
Second end 122 and the second conductive sheet 150, which connect, forms the second contact point 151, the second conduction region 132 of chip 130 and the
Part contact of two conductive sheets 150 other than second contact point 151.
Antenna 120 and chip 130 are indirectly connected with the second conductive sheet 150 by the first conductive sheet 140, in intelligence
During blocking is made, being conducive to makes chip 130 and antenna 120 form a closed circuit is conducive in smart card use process
The reception and transmission of data.
Preferably, the first end 121 of antenna 120 and the first conductive sheet 140 are welded to connect the first pad of formation and (scheme not
Show), the first conduction region 131 of chip 130 welds to be formed with part of first conductive sheet 140 other than first pad
Third pad 142/ forms the first welding surface (not indicating)；The second end 122 of antenna and the welding of the second conductive sheet 150 connect
It connects to form the second pad (not shown), the second conduction region 132 and the second conductive sheet 150 of chip 130 are in addition to second weldering
It welds to form the 4th pad 152/ or form the second welding surface (not indicating) in part other than contact.
Specifically, the first conduction region 131 of the chip 130 and first conductive sheet 140 connect away from described first
One face contact of contact 141；Second conduction region 132 of the chip 130 deviates from described second with second conductive sheet 150
One face contact of contact point 151.
Preferably, the upper and lower surface of the first conductive sheet 140 and the second conductive sheet 150 has tin coating (not shown).
First conductive sheet 140 and 150 surface of the second conductive sheet have a tin coating, under the conditions of high temperature hot pressing, conductive sheet surface
Tin coating fusing, if being heated in the first conductive sheet 140 and 150 surface certain point of the second conductive sheet, after tin liquor solidification,
First conductive sheet 140 connect to form third pad 142 with the first conduction region 131, the second conductive sheet 150 and the second conduction region
132 connections form the 4th pad 152；If adding in a face manner in the first conductive sheet 140 and 150 surface of the second conductive sheet
Heat, then after tin liquor solidifies, the first conductive sheet 140 is connect with the first conduction region 131 forms the first welding surface, the second conductive sheet
150 connect the second welding surface of formation with the second conduction region 132.
Specifically, chip 130 further includes the integrated circuit die for being spaced apart the first conduction region 131 with the second conduction region 132
Block 133, the integrated circuit modules 133 have opposite the first face (not indicating) and the second face (not indicating), wherein the first face
Flush (is not indicated) with the surface thereof of the first conduction region 131 and the second conduction region 132, and the second face protrudes from described first and leads
Another surface (not indicating) in electric area 131 and second conduction region 132.
Antenna 120 with the first conduction region 131 of chip 130 and the second conduction region 132 by connecting, so that antenna
120 are connected with the integrated circuit modules 133 of chip 130, facilitate subsequent smart card using when smart card in data launch or
Smart card receives read-write.
Specifically, first conductive sheet 140 is set to the exhausted of 134 two sides of chip hole with 150 part of the second conductive sheet
On edge substrate 110, the chip 130 is set in the chip hole 134, and the second face of the integrated circuit modules 133 deviates from
150 direction of first conductive sheet 140 and the second conductive sheet；Described first conductive sheet, 140 a part and the chip 130
The contact of first conduction region 131, another part are contacted with insulating substrate 110；Described second conductive sheet, 150 a part and the chip
130 the second conduction region 132 contact, another part are contacted with insulating substrate 110.
Specifically, smart card further includes material 100 and protective film (not shown) in smart card, and material 100 includes institute in smart card
State insulating substrate 110, the antenna 120, the chip 130, first conductive sheet 140 and second conductive sheet 150；
Protective film, which wraps up in the smart card, expects 100；After material 100 has made within a smart card, expected within a smart card by hot pressing process
About 100 two sides hot pressing protective films, can be completed the production of smart card finished product.
Preferably, to contact or welding with the first conductive sheet 140 and the second conductive sheet 150 convenient for antenna 120, first is led
Electric piece 140 and the second conductive sheet 150 contact or weld shape with the first conduction region 131 of chip 130 and the second conduction region 132
At contact point or pad or welding surface and have good conductive property；The size of first conductive sheet 140 is greater than institute
The size of the first conduction region 131 is stated, the size of second conductive sheet 150 is greater than the size of second conduction region 132.
Specifically, pass through the seam between chip 130 and chip hole 134 after filling chip 130 in the chip hole 134
Glue (not shown) is perfused in gap to connect chip 130 with insulating substrate 110 and keep chip 130 fixed.
Specifically, 133 region of integrated circuit modules and the insulation base of adhesive tape (not shown) adhering chip 130 can also be used
Material 110, and then it connect chip 130 with insulating substrate 110.
The invention also discloses the manufacturing method of above-mentioned smart card, the manufacturing method includes the following steps:
Chip 130 is set in the chip hole 134 on insulating substrate 110 or on insulating substrate 110；
First conductive sheet 140 is contacted with the first conduction region 131 of chip 130, and the of the second conductive sheet 150 and chip 130
The contact of two conduction regions 132；
By the antenna 120 with first end 121 and second end 122 in addition to the first end 121 and the second end 122 with
Outer part is set on insulating substrate 110；
The first end 121 of the antenna 120 is contacted with the first conductive sheet 140, by the second end 122 of the antenna 120
It is contacted with second conductive sheet 150.
The sequence of above-mentioned each step of manufacture method of intelligent cards can be exchanged arbitrarily, resulting all smart cards after any exchange
Manufacturing method be within the scope of the invention.
A, Figure 1B, Fig. 1 C, Fig. 1 D, Fig. 1 E and Fig. 1 F referring to Fig.1, they are the implementation of embodiment according to the present invention one
The simplification example of the step of one of method.
A kind of manufacturing method of smart card, the manufacturing method include the following steps:
Chip 130 is set in the chip hole 134 on insulating substrate 110 or on insulating substrate 110；
This step specifically, may is that the punching chip hole 134 on insulating substrate 110；Chip 130 is set to chip hole
In 134, and the second of 130 integrated circuit modules 133 of chip faces and is arranged away from 134 opening direction of chip hole, chip 130
It is fixed with insulating substrate 110.
First conductive sheet 140 is contacted with the first conduction region 131 of chip 130, and the of the second conductive sheet 150 and chip 130
The contact of two conduction regions 132.
By the antenna 120 with first end 121 and second end 122 in addition to the first end 121 and the second end 122 with
Outer part is set on insulating substrate 110.
The first end 121 of the antenna 120 is contacted with the first conductive sheet 140, by the second end 122 of the antenna 120
It is contacted with second conductive sheet 150；
This step specifically, may is that the first end 121 of antenna 120 is contacted to formation first with the first conductive sheet 140 to be connect
Contact 141, the second end 122 of antenna 120 is contacted with the second conductive sheet 150 forms the second contact point 151；Preferably, this step
It may is that and the first end 121 of antenna 120 and the welding of the first conductive sheet 140 are formed into the first pad, the second end of antenna 120
122 and second conductive sheet 150 welding formed the second pad.
Preferably, the manufacturing method further include: the first conductive sheet 140 and the welding of the first conduction region 131 are formed into third
Second conductive sheet 150 and the welding of the second conduction region 132 are formed the 4th pad 152 by pad 142.
Specifically, there are many modes that chip 130 and insulating substrate 110 are fixed, and can use in chip 130 and chip hole
Glue is perfused in gap between 134, or uses adhesive tape by 133 region of integrated circuit modules of chip 130 and insulating substrate 110
It connects and keeps chip 130 fixed；Preferably, pass through adhesive tape bonding in 130 integrated circuit modules of chip, 133 second face.
Embodiment two
Referring to Fig. 4, the present embodiment smart card architecture and the difference of embodiment one are, can be on the insulating substrate 110
It is not provided with chip hole, chip 130 is directly arranged on insulating substrate 110, and the second face of integrated circuit modules 133 is away from insulation
Substrate 110；First conductive sheet 140 is located on the first conduction region 131 to be contacted with another surface of the first conduction region 131, and second leads
Electric piece 150 is located on the second conduction region 132 to be contacted with another surface of the second conduction region 132；First conductive sheet 140 and second
Conductive sheet 150 is not contacted with insulating substrate 110.
Specifically, the size of the first conductive sheet 140 described in this embodiment is greater than the size of first conduction region 131,
The size of second conductive sheet 151 is greater than the size of second conduction region 132.
Embodiment three
Referring to Fig. 5, the present embodiment smart card architecture and the difference of embodiment one are, can be on the insulating substrate 110
It is not provided with chip hole, chip 130 is directly arranged on insulating substrate 110, and the second face of integrated circuit modules 133 is away from insulation
Substrate 110；First conductive sheet 140 is located on the first conduction region 131 to be contacted with another surface of the first conduction region 131, and first
Conductive sheet 140 is not more than first conduction region 131, and the second conductive sheet 150 is located on the second conduction region 132 and the second conduction region
132 another surface contact, and the second conductive sheet 150 is not more than second conduction region 132, the first conductive sheet 140 and the
Two conductive sheets 150 are not contacted with insulating substrate 110；The first contact point 141 is located at the first conductive sheet with third pad 142
The corresponding same position of 140 upper and lower surfaces, second contact point 151 and the 4th pad 152 are located at the second conductive sheet 150
The corresponding same position of upper and lower surface.
Example IV
Referring to Fig. 6, the present embodiment smart card architecture and the difference of one smart card architecture of embodiment are: described first is conductive
Piece 140 and the second conductive sheet 150 are set on the insulating substrate 110 of 134 two sides of chip hole, the integrated circuit modules 133
Be thicker than the first conduction region 131 and the part of the second conduction region 132 is set in the chip hole 134, first conduction region
131 another surface is contacted with first conductive sheet 140, and another surface of second conduction region 132 is led with described second
Electric piece 150 contacts；The first end 121 and second end 122 of the antenna 120 are located on insulating substrate 110.
Embodiment five
Referring to Fig. 7, this smart card architecture and the difference of embodiment one are: can not set on the insulating substrate 110
Chip hole is set, first conductive sheet 140 and the second conductive sheet 150 are set on the insulating substrate 110, the chip 130
It is set on the first conductive sheet 140 and the second conductive sheet 150 and the second face of the integrated circuit modules 133 is away from insulation base
Material 110, the surface thereof of first conduction region 131 are contacted with first conductive sheet 140, second conduction region 132
Surface thereof is contacted with second conductive sheet 150, and the first end 121 and second end 122 of the antenna 120 are located at insulation base
On material 110.
Embodiment six
Referring to Fig. 8, this embodiment smart card architecture and the difference of embodiment one are, the integrated circuit modules 133
Second face is set in chip hole 134 towards first conductive sheet 140 and 150 direction of the second conductive sheet；Described first is conductive
A part of piece 140 is contacted with another surface of first conduction region 131, and another part is contacted with insulating substrate 110；It is described
A part of second conductive sheet 150 is contacted with another surface of second conduction region 132, another part and insulating substrate 110
Contact.
Embodiment seven
Referring to Fig. 9, this embodiment smart card architecture and the difference of embodiment one are, first conduction region 131 and
Second conduction region 132 is contacted with the insulating substrate 110, so that the integrated circuit modules 133 are thicker than the first conduction
Area 131 and the part of second conduction region 132 are set in the chip hole 134；First conductive sheet 140 is set to the
It is contacted in the surface thereof of one conduction region 131 and with the first conduction region 131, the first conductive sheet 140 is contacted with the first conduction region 131
The same face be equipped with first contact point 141, second conductive sheet 150 be set to the second conduction region 132 surface thereof on and
It is contacted with the second conduction region 132, the same face that the second conductive sheet 150 is contacted with the second conduction region 132 is equipped with the second contact point
151, first conductive sheet 140 and the second conductive sheet 150 are not contacted with insulating substrate 110.
Embodiment eight
Referring to Fig.1 0, this embodiment smart card architecture and the difference of embodiment one are, first conductive sheet 140 and
Two conductive sheets 150 are set on the insulating substrate 110 of 134 two sides of chip hole, and the integrated circuit modules 133 are thicker than first
The part of conduction region 131 and second conduction region 132 is set in the chip hole 134, first conduction region 131
Another surface is contacted with first conductive sheet 140, is set on the same face that the first conductive sheet 140 is contacted with the first conduction region 131
There is first contact point 141, another surface of second conduction region 132 is contacted with second conductive sheet 150, the second conductive sheet
150 the same faces contacted with the second conduction region 132 are equipped with the second contact point 151.
Embodiment nine
Referring to Fig.1 1, this smart card architecture and the difference of embodiment one are: first conductive sheet 140 and second leading
Electric piece 150 is set on the insulating substrate 110, and the chip 130 is set to the first conductive sheet 140 and the second conductive sheet 150
On, and the second face of integrated circuit modules 133 deviates from the insulating substrate 110, first conduction region 131 is led with described first
Electric piece 140 contacts, and the same face that the first conductive sheet 140 is contacted with the first conduction region 131 is equipped with first contact point 141, institute
The second conduction region 132 is stated to contact with second conductive sheet 150, and the second conductive sheet 150 contacted with the second conduction region 132 it is same
It is equipped with the second contact point 151 on one side.
It it should be noted that the technical solution of each embodiment of the invention can be combined with each other, but must be with this
Based on the technical staff in field can be realized, when the combination of technical solution occur it is conflicting or when cannot achieve should people recognize
Combination for this technical solution is not present, also not the present invention claims protection scope within.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all utilizations
Equivalent structure transformation made by description of the invention and accompanying drawing content is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (16)
1. a kind of smart card, the smart card includes insulating substrate, antenna and chip, and the antenna is set to the insulating substrate
On, the chip is set in the chip hole on the insulating substrate or on the insulating substrate；The chip includes difference position
The first conduction region and the second conduction region in chip both ends；It is characterized in that, it is conductive to correspond to described first on the smart card
Area is equipped with the first conductive sheet, and second conduction region is corresponded on the smart card equipped with the second conductive sheet；First conductive sheet
It is set on the insulating substrate with the second conductive sheet or part is set on the insulating substrate of the chip hole two sides；The antenna
First end is contacted with first conductive sheet, and first conduction region is contacted with first conductive sheet；The second of the antenna
End is contacted with second conductive sheet, and second conduction region is contacted with second conductive sheet.
2. smart card as described in claim 1, which is characterized in that the first end of the antenna is contacted with first conductive sheet
Form first contact point, the first conduction region of the chip and portion of first conductive sheet other than the first contact point
Tap touching；The second end of the antenna contacts to form the second contact point with second conductive sheet, and the second of the chip is conductive
Area is contacted with part of second conductive sheet other than second contact point.
3. smart card as claimed in claim 2, which is characterized in that the first contact point be the first pad, described second
Contact point is the second pad.
4. smart card as claimed in claim 2, which is characterized in that the first conduction region of the chip and first conductive sheet
The face contact away from the first contact point；Second conduction region of the chip is with second conductive sheet away from described
One face contact of the second contact point.
5. smart card as claimed in claim 4, which is characterized in that the chip further include by first conduction region with it is described
Second conduction region integrated circuit modules spaced apart, the integrated circuit modules have opposite the first face and the second face, wherein
The surface thereof flush in the first face and the first conduction region and the second conduction region, the second face protrudes from first conduction region and institute
State another surface of the second conduction region；First conductive sheet and the second conductive sheet part are set to the insulation of the chip hole two sides
On substrate, the chip is set in the chip hole, and the second face of the integrated circuit modules deviates from first conductive sheet
And the second conductive sheet direction；Described first conductive sheet a part is contacted with the first conduction region of the chip, another part with
Insulating substrate contact；Described second conductive sheet a part is contacted with the second conduction region of the chip, another part and insulation base
Material contact.
6. smart card as claimed in claim 4, which is characterized in that the chip further include by first conduction region with it is described
Second conduction region integrated circuit modules spaced apart, the integrated circuit modules have opposite the first face and the second face, wherein
The surface thereof flush of first face and the first conduction region and the second conduction region, the second face protrude from first conduction region and
Another surface of second conduction region；First conductive sheet and the second conductive sheet are set to the insulation base of the chip hole two sides
On material, the chip integrated circuit module be thicker than the first conduction region and the part of the second conduction region is set to the chip hole
Interior, first end, the second end of the antenna are set on insulating substrate, another surface of first conduction region and described first
Conductive sheet contact, another surface of second conduction region is contacted with second conductive sheet.
7. smart card as claimed in claim 4, which is characterized in that the chip further include by first conduction region with it is described
Second conduction region integrated circuit modules spaced apart, the integrated circuit modules have opposite the first face and the second face, wherein
The surface thereof flush of first face and the first conduction region and the second conduction region, the second face protrude from first conduction region and
Another surface of second conduction region；First conductive sheet and the second conductive sheet are set on the insulating substrate, described
Chip is set on the first conductive sheet and the second conductive sheet and the second face of the integrated circuit modules is away from insulating substrate, institute
It states the first conduction region to contact with first conductive sheet, second conduction region is contacted with second conductive sheet；The antenna
First end, second end is set on insulating substrate.
8. smart card as claimed in claim 4, which is characterized in that the chip further include by first conduction region with it is described
Second conduction region integrated circuit modules spaced apart, the integrated circuit modules have opposite the first face and the second face, wherein
The surface thereof flush of first face and the first conduction region and the second conduction region, the second face protrude from first conduction region and
Another surface of second conduction region；First conductive sheet and second conductive sheet part are set to the chip hole two sides
Insulating substrate on, the chip is set in the chip hole, and the second face of the integrated circuit modules is towards described first
Conductive sheet and the second conductive sheet direction；Another surface of first conduction region of described first conductive sheet a part and the chip
Contact, another part are contacted with insulating substrate；Described second conductive sheet a part is another with the second conduction region of the chip
Surface contact, another part are contacted with insulating substrate.
9. smart card as claimed in claim 2, which is characterized in that the first conduction region of the chip and the tool of the first conductive sheet
There is the one side of first contact point, the part contact in addition to first contact point；Second conduction region of the chip and the second conduction
The one side with the second contact point of piece, the part contact in addition to the second contact point.
10. smart card as claimed in claim 9, which is characterized in that the chip further includes by first conduction region and institute
The second conduction region integrated circuit modules spaced apart are stated, the integrated circuit modules have opposite the first face and the second face,
In the surface thereof flush of the first face and the first conduction region and the second conduction region, the second face protrude from first conduction region with
And another surface of second conduction region；First conductive sheet and the second conductive sheet are set to the insulation of the chip hole two sides
On substrate, the integrated circuit modules be thicker than the first conduction region and the part of second conduction region is set to the chip
In hole, another surface of first conduction region is contacted with first conductive sheet, another surface of second conduction region with
The second conductive sheet contact.
11. smart card as claimed in claim 9, which is characterized in that the chip further includes by first conduction region and institute
The second conduction region integrated circuit modules spaced apart are stated, the integrated circuit modules have opposite the first face and the second face,
In the surface thereof flush of the first face and the first conduction region and the second conduction region, the second face protrude from first conduction region with
And another surface of second conduction region；First conductive sheet and the second conductive sheet are set on the insulating substrate, institute
It states chip to be set on the first conductive sheet and the second conductive sheet, and the second face deviates from the insulating substrate, described first is conductive
Area is contacted with first conductive sheet, and second conduction region is contacted with second conductive sheet.
12. smart card as described in claim 1, which is characterized in that first conductive sheet is upper with second conductive sheet
There is tin coating in lower surface.
13. smart card as described in claim 1, which is characterized in that the smart card includes material and protective film, institute in smart card
Stating material in smart card includes the insulating substrate, the antenna, the chip, first conductive sheet and second conduction
Piece；The protective film wraps up expects in the smart card.
14. smart card as described in claim 1, which is characterized in that the size of first conductive sheet is greater than described first and leads
The size in electric area, the size of second conductive sheet are greater than the size of second conduction region.
15. a kind of smart card, the smart card includes insulating substrate, antenna and chip, and the antenna is set to the insulating substrate
On, the chip is set in the chip hole on the insulating substrate or on the insulating substrate；The chip includes difference position
The first conduction region and the second conduction region in chip both ends；It is characterized in that, it is conductive to correspond to described first on the smart card
Area is equipped with the first conductive sheet, and second conduction region correspond on the smart card and is equipped with the second conductive sheet, and the first of the antenna
End contacts to form first contact point with first conductive sheet, and the second end of the antenna contacts to be formed with second conductive sheet
Second contact point；First conduction region of the chip and the one side with first contact point of the first conductive sheet, except the first contact
Part contact other than point；Second conduction region of the chip and the one side with the second contact point of the second conductive sheet, except the
Part contact other than two contact points；The chip further includes being spaced apart first conduction region with second conduction region
Integrated circuit modules, the integrated circuit modules have opposite the first face and the second face, wherein the first face and the first conduction region
And second conduction region surface thereof flush, the second face protrudes from the another of first conduction region and second conduction region
One surface；First conduction region and second conduction region are contacted with the insulating substrate, so that the integrated circuit die
Block be thicker than the first conduction region and the part of second conduction region is set in the chip hole；First conductive sheet is set
In in the surface thereof of the first conduction region, second conductive sheet is set in the surface thereof of the second conduction region.
16. a kind of manufacturing method of smart card, which is characterized in that the manufacturing method includes the following steps:
Chip is set in the chip hole on insulating substrate or on insulating substrate；
First conductive sheet is contacted with the first conduction region of chip, and the second conductive sheet is contacted with the second conduction region of chip；
First conductive sheet and the second conductive sheet are set on the insulating substrate or part is set to the chip hole two sides
On insulating substrate；
Part of the antenna with first end and second end other than the first end and the second end is set to insulation base
On material；
The first end of the antenna is contacted with the first conductive sheet, the second end of the antenna and second conductive sheet are connect
Touching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510502431.2A CN105117763B (en) | 2015-08-14 | 2015-08-14 | The manufacturing method of smart card and smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510502431.2A CN105117763B (en) | 2015-08-14 | 2015-08-14 | The manufacturing method of smart card and smart card |
Publications (2)
| Publication Number | Publication Date |
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| CN105117763A CN105117763A (en) | 2015-12-02 |
| CN105117763B true CN105117763B (en) | 2019-01-29 |
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| CN201510502431.2A Active CN105117763B (en) | 2015-08-14 | 2015-08-14 | The manufacturing method of smart card and smart card |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2760113B1 (en) * | 1997-02-24 | 1999-06-04 | Gemplus Card Int | METHOD FOR MANUFACTURING A CONTACTLESS CARD WITH A COILED ANTENNA |
| WO2005008578A2 (en) * | 2003-07-07 | 2005-01-27 | Avery Dennison Corporation | Rfid device with changeable characteristics |
| KR101008459B1 (en) * | 2010-08-31 | 2011-01-14 | 진영범 | Mothod for fabricating a smart card |
| CN102073901A (en) * | 2010-12-20 | 2011-05-25 | 甘肃金盾信息安全技术有限公司 | RFID (radio frequency identification) ceramic-substrate card electronic tag |
| CN204883783U (en) * | 2015-08-14 | 2015-12-16 | 深圳市源明杰科技有限公司 | Smart card |
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2015
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