CN105109035A - 一种半导体激光同步焊接装置及其工作方式 - Google Patents
一种半导体激光同步焊接装置及其工作方式 Download PDFInfo
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Abstract
本发明公开一种半导体激光同步焊接装置及其工作方式,包括:上模夹具和下模夹具,所述下模夹具具有定位装置,所述上模夹具具有若干光纤输出端,若干所述光纤输出端正对所述待焊接装置的焊接区域。首先,将所述待焊接装置放置于所述下模夹具内,通过所述定位装置固定;然后,所述升降装置驱动所述下模夹具靠近连接所述上模夹具;最后,激光通过所述内腔反射形成被压缩的连续的均匀的光斑,以此照射于所述待焊接装置的焊接区域,使其表面熔化。使用本发明一种半导体激光同步焊接装置及其工作方式,采用激光同步焊接,焊接速度快,焊接区域的焊缝宽度恒定,一次成型,而且有效地提高焊接的质量和牢固能力,无需任何附加的助焊剂。
Description
技术领域
本发明涉及一种加工设备的技术领域,尤其涉及一种半导体激光同步焊接装置。
背景技术
焊接是一种以加热、高温或者高压的方式接合金属或其他热塑性材料如塑料的制造工艺及技术。现有的焊接方法采用热板焊接、超声波焊接和激光焊接,但热板焊接和超声波焊接的焊接速度、牢固性及焊接美观远不及激光焊接。而激光焊接为不同步焊接,只有一束激光沿着焊接区域焊接,这种方法不能实现一次性焊接,如对于车灯焊接,在焊接过程中会在不同方向产生应力,不能保证焊接的一致性,焊接速度也较为低下。
发明内容
针对现有的激光焊接存在的上述问题,现提供一种旨在实现同步焊接、具有焊接快速、稳定和牢固的半导体激光同步焊接装置,用于解决超声波焊接技术中焊接过程中出现异物,焊接条缝不美观,成本高等的问题。
具体技术方案如下:
一种半导体激光同步焊接装置,包括:上模夹具;下模夹具,所述下模夹具可与所述上模夹具匹配连接;其中,所述下模夹具具有用于固定待焊接装置的定位装置;所述上模夹具具有若干光纤输出端,若干所述光纤输出端同时输出的激光经所述上模夹具的内腔的反射正对所述待焊接装置的焊接区域。
上述的一种半导体激光同步焊接装置,其中,若干所述光纤输出端安装于所述上模夹具的边缘。
上述的一种半导体激光同步焊接装置,其中,所述上模夹具沿其边缘开设一圈内凹的所述内腔,若干所述光纤输出端安装于所述内腔中。
上述的一种半导体激光同步焊接装置,其中,所述内腔的内侧壁面为反射面。
上述的一种半导体激光同步焊接装置,其中,所述反射面为镀金。
上述的一种半导体激光同步焊接装置,其中,每一所述光纤输出端连接一光纤,每一所述光纤连接半导体激光发射器。
上述的一种半导体激光同步焊接装置,其中,所述定位装置包括若干定位块,若干所述定位块分别安装于所述下模夹具的边缘。
上述的一种半导体激光同步焊接装置,其中,所述半导体激光发射器的激光波长为980nm。
上述的一种半导体激光同步焊接装置,其中,每一所述光纤输出端对应的所述内腔的截面宽度为3mm。
上述的一种半导体激光同步焊接装置,其中,还包括:机座;所述上模夹具固定安装于所述机座的上端;所述下模夹具安装于所述机座的下端,并且所述下模夹具正对所述上模夹具;升降装置,所述升降装置与所述下模夹具连接,驱动所述下模夹具靠近连接所述上模夹具。
一种半导体激光同步焊接装置的工作方式,其中,包括一种半导体激光同步焊接装置;步骤一:将所述待焊接装置放置于所述下模夹具内,并通过定位装置固定;步骤二:所述升降装置驱动所述下模夹具靠近连接所述上模夹具,使得所述上模夹具的若干所述光纤输出端正对所述待焊接装置的焊接区域;步骤三:所述半导体激光发射器发出的激光通过若干所述光纤输出端传导至所述上模夹具的所述内腔内,激光通过所述内腔反射形成被压缩的连续的均匀的光斑,以此照射于所述待焊接装置的焊接区域,使其表面熔化。
上述的一种半导体激光同步焊接装置的工作方式,其中,在步骤三激光持续的照射过程中,所述下模夹具通过所述升降装置与所述上模夹具持续施加压力。
上述技术方案与现有技术相比具有的积极效果是:
(1)若干光纤输出端同步输出的激光,在上模夹具的镀金内腔内经反射照射于焊接区域,同时,通过上模夹具与下模夹具的持续施加压力,有效地使得焊接区域融化,并牢固的结合。
(2)采用激光同步焊接,焊接速度快,焊接区域的焊缝宽度恒定,一次成型,而且有效地提高焊接的质量和牢固能力,无需任何附加的助焊剂。
(3)采用光纤输出端传递激光实现激光同步焊接,相比于传统焊接,具有最小的机械应力,最小的热应力,稳定的焊接过程和极大的焊接灵活性,而且设备无需大的使用空间。
附图说明
图1为本发明的一种半导体激光同步焊接装置的示意图;
图2为本发明的一种半导体激光同步焊接装置中下模夹具的定位装置的示意图;
图3为本发明的一种半导体激光同步焊接装置中激光焊接的示意图;
图4为图3中激光焊接的剖视图。
附图中:1、上模夹具;11、内腔;2、下模夹具;3、光纤输出端;4、光纤;5、定位块;6、车灯主壳体;7、车灯上盖;8、机座;81、上模夹具板;82、下模夹具板;83、底板;9、升降装置;10、支撑杆。
具体实施方式
下面结合附图和具体实施例对本发明作进一步说明,但不作为本发明的限定。
图1为一种半导体激光同步焊接装置的示意图,请参见图1所示。示出了一种较佳实施例的半导体激光同步焊接装置,其包括有上模夹具1和下模夹具2,下模夹具2可与上模夹具1匹配连接,即下模夹具2可以通过移动靠近连接上模夹具1,或者上模夹具1可以通过移动靠近连接下模夹具2。当然,还包括有机座,机座用于固定安装上模夹具1和下模夹具2,下面会对机座有具体描述。
另外,下模夹具2上设置有定位装置,通过定位装置以此将待焊接装置固定安装在下模夹具2内。
此外,上模夹具1安装有若干光纤输出端3,若干光纤输出端3连接有激光发射器(图中未示出),并且若干光纤输出端3正对下模夹具2内的待焊接装置的焊接区域,激光发射器通过若干光纤输出端3同时输出的激光经过上模夹具1的内腔的反射照射于待焊接装置的焊接区域,从而保证待焊接装置的焊接区域牢固焊接。
以上所述的上模夹具和下模夹具仅为本发明较佳的实施例,并非因此限制本发明的实施方式及保护范围。
图3为本发明的一种半导体激光同步焊接装置中激光焊接的示意图,图4为图3中激光焊接的剖视图,请参见图1、图3和图4所示。固定安装于下模夹具2内的待焊接装置的焊接区域为边缘附近,则在一种较佳实施例中,示出了若干光纤输出端3安装于上模夹具1的边缘,以此使得若干光纤输出端3正对待焊接装置的焊接区域。
当然,以上所述的光纤输出端3的安装位置仅为本发明较佳的实施例,并非因此限制本发明的实施方式及保护范围。
或者,作为优选的实施例中,上模夹具1沿上模夹具1的边缘开设一圈向内凹陷的内腔11,若干光纤输出端3相互均匀地安装于内腔11中,如图3和图4所示。
进一步的,作为优选的实施例中,为了使得由光纤输出端3输出的激光能够反射至下模夹具2的待焊接装置上,上模夹具1的内腔11的内侧壁面为反射面,以此使得激光通过内腔11的反射面反射形成被压缩的连续的均匀的光斑,而且光斑的宽度与待焊接装置的焊接区域的宽度一致。
具体的,在一种优选的实施例中,内腔11的内侧壁面采用镀金处理,以此能够对激光具有高效的反射率。
进一步的,作为较佳的实施例中,每一光纤输出端3连接一光纤4,每一光纤4连接半导体激光发射器(图中未示出),由半导体激光发射器通过光纤4传递激光,并由光纤输出端3输出激光。
图2为一种半导体激光同步焊接装置中下模夹具的定位装置的示意图,请参见图1和图2所示。在优选的实施例中,定位装置包括若干定位块5,若干定位块5分别安装于下模夹具2的边缘。
具体的,作为较佳的实施例中,该半导体激光同步焊接装置用于车灯的焊接。将车灯主壳体6放置于下模夹具2内,然后再将车灯上盖7放置于车灯主壳体6上,并通过若干定位块5使得两者贴合,保证车灯主壳体6和车灯上盖7的固定。
此外,上模夹具1和下模夹具3的形状按照车灯的轮廓进行设计制作。
请参见图3和图4所示,进一步的,作为较佳的实施例中,半导体激光发射器的激光波长为980nm。当然,半导体激光发射器的激光波长仅为本发明较佳的实施例,并非因此限制本发明的实施方式及保护范围。根据实际的焊接需求,也可通过调整激光的输出功率来实现焊接时车灯焊接晶的融化速度。
进一步的,作为较佳的实施例中,每一光纤输出端3对应的内腔11的截面宽度为3mm,以此使得激光最终输出的光斑的宽度也为3mm,与待焊接装置的焊接区域的宽度一致。
请参见图1所示。此外,在一种较佳实施例中,还示出了半导体激光同步焊接装置包括有机座8,上模夹具1固定安装于机座8的上端,下模夹具2安装于机座8的下端,并且下模夹具2正对上模夹具1。同时,还包括升降装置9,升降装置9与下模夹具2连接,以此通过升降装置9驱动下模夹具2靠近连接上模夹具1。
具体的,作为较佳的实施例中,机座8包括上模夹具板81、下模夹具板82和底板83,上模夹具1安装于上模夹具板81的下端面,下模夹具2安装于下模夹具板82的上端面,并且上模夹具板81的下端面通过若干支撑杆10贯穿下模夹具板82并与底板83的上端面固定连接,同时,升降装置9贯穿底板83与下模夹具板82的下端面连接,以此升降装置9驱动下模夹具板82沿着支撑杆10靠近上模夹具板81,使得下模夹具2靠近连接上模夹具1。
进一步的,作为较佳的实施例中,升降装置9为顶升气缸。
接下来,说明下半导体激光同步焊接装置的一种较佳实施例的工作方式,以车灯主壳体6和车灯上盖7为例:
请继续参见图1至图4所示。
步骤一:将车灯主壳体6放置于下模夹具2内,使其贴合于下模夹具2内,然后再将透明或者半透明的车灯上盖7放置于车灯主壳体6上,并通过若干定位块5使得两者贴合,保证车灯主壳体6和车灯上盖7的固定。
步骤二:升降装置9顶升下模夹具板82使其沿着支撑杆10靠近上模夹具板81,下模夹具2靠近连接上模夹具1,使得上模夹具1的若干光纤输出端3正对焊接区域,并使其完全重合。
步骤三:半导体激光发射器发出的激光通过若干光纤输出端3传导至上模夹具1的内腔11内,使得激光通过内腔11的镀金反射面反射形成被压缩的连续的均匀的光斑,透过透明或者半透明的车灯上盖7,到达车灯主壳体6的焊接区域,使其表面熔化。同时,在激光持续的照射过程中,上模夹具1与下模夹具2通过升降装置9持续施加压力,使得车灯上盖7也出现一定程度的融化,最终将两部分牢固的结合在一起。
进一步的,下模夹具2通过升降装置9对上模夹具1产生的压力能够有效地抑制焊接过程中出现气泡,从而达到焊接强度与焊接条缝的美观。
以上所述仅为本发明较佳的实施例,并非因此限制本发明的实施方式及保护范围,对于本领域技术人员而言,应当能够意识到凡运用本发明说明书及图示内容所作出的等同替换和显而易见的变化所得到的方案,均应当包含在本发明的保护范围内。
Claims (12)
1.一种半导体激光同步焊接装置,包括:
上模夹具(1);
下模夹具(2),所述下模夹具(2)可与所述上模夹具(1)匹配连接;其特征在于,
所述下模夹具(2)具有用于固定待焊接装置的定位装置;
所述上模夹具(1)具有若干光纤输出端(3),若干所述光纤输出端(3)同时输出的激光经所述上模夹具(1)的内腔(11)的反射正对所述待焊接装置的焊接区域。
2.根据权利要求1所述半导体激光同步焊接装置,其特征在于,
若干所述光纤输出端(3)安装于所述上模夹具(1)的边缘。
3.根据权利要求1所述半导体激光同步焊接装置,其特征在于,
所述上模夹具(1)沿其边缘开设一圈内凹的所述内腔(11),若干所述光纤输出端(3)安装于所述内腔(11)中。
4.根据权利要求3所述半导体激光同步焊接装置,其特征在于,
所述内腔(11)的内侧壁面为反射面。
5.根据权利要求4所述半导体激光同步焊接装置,其特征在于,
所述反射面为镀金。
6.根据权利要求1所述半导体激光同步焊接装置,其特征在于,
每一所述光纤输出端(3)连接一光纤(4),每一所述光纤(4)连接半导体激光发射器。
7.根据权利要求1所述半导体激光同步焊接装置,其特征在于,
所述定位装置包括若干定位块(5),若干所述定位块(5)分别安装于所述下模夹具(2)的边缘。
8.根据权利要求6所述半导体激光同步焊接装置,其特征在于,
所述半导体激光发射器的激光波长为980nm。
9.根据权利要求3所述半导体激光同步焊接装置,其特征在于,
每一所述光纤输出端(3)对应的所述内腔(11)的截面宽度为3mm。
10.根据权利要求1所述半导体激光同步焊接装置,其特征在于,还包括:
机座(8);
所述上模夹具(1)固定安装于所述机座(8)的上端;
所述下模夹具(2)安装于所述机座(8)的下端,并且所述下模夹具(2)正对所述上模夹具(1);
升降装置(9),所述升降装置(9)与所述下模夹具(2)连接,驱动所述下模夹具(2)靠近连接所述上模夹具(1)。
11.一种半导体激光同步焊接装置的工作方式,其特征在于,包括权利要求1至10中任意一项所述半导体激光同步焊接装置;
步骤一:将所述待焊接装置放置于所述下模夹具(2)内,并通过所述定位装置固定;
步骤二:所述升降装置(9)驱动所述下模夹具(2)靠近连接所述上模夹具(1),使得所述上模夹具(1)的若干所述光纤输出端(3)正对所述待焊接装置的焊接区域;
步骤三:所述半导体激光发射器发出的激光通过若干所述光纤输出端(3)传导至所述上模夹具(1)的所述内腔(11)内,激光通过所述内腔(11)反射形成被压缩的连续的均匀的光斑,以此照射于所述待焊接装置的焊接区域,使其表面熔化。
12.根据权利要求11所述半导体激光同步焊接装置的工作方式,其特征在于,
在步骤三激光持续的照射过程中,所述下模夹具(2)通过所述升降装置(9)与所述上模夹具(1)持续施加压力。
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