CN105108251A - Composite machining method for micro-die - Google Patents
Composite machining method for micro-die Download PDFInfo
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- CN105108251A CN105108251A CN201510526489.0A CN201510526489A CN105108251A CN 105108251 A CN105108251 A CN 105108251A CN 201510526489 A CN201510526489 A CN 201510526489A CN 105108251 A CN105108251 A CN 105108251A
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Abstract
The invention relates to a composite machining method for a micro-die. According to the method, a mechanical cutting mode is adopted in a peripheral area of a graph of the micro-die for removing unnecessary materials and defining the outline of the graph area, and the high-quality machining surface is obtained; for the graph area of the micro-die, a tungsten tool electrode prepared through a plasma etching technology is utilized, a micro electrical discharge machining mode is adopted, accurate graph transferring is achieved, and machining precision and efficiency are ensured. According to the method, the technological advantage of precision machining and the technological advantage of micro electrical discharge machining are combined, the mechanical cutting mode is adopted for removing the unnecessary materials of the periphery of the graph of the micro-die, the electrical discharge area of follow-up micro electrical discharge machining can be reduced, aggregation of excessive electrically-corroded products is avoided, the stability of the electrical discharge process is improved, and the size precision and the surface quality of micro electrical discharge machining are ensured; meanwhile, the electrical discharge area is reduced, time for micro electrical discharge machining can be shortened, the machining efficiency is improved, and the requirement for the fast market response can be met.
Description
Technical field
The invention belongs to Micrometer-Nanometer Processing Technology field, be specifically related to a kind of combined machining method of micro-mould.
Background technology
Along with the development of modern science and technology, microminaturization has become the main trend of production development.At present, the fields such as semi-conductor industry, fiber optic communication, Aero-Space, bioengineering and medical industry are increasing for the demand of microminiature product, for the complexity of its 26S Proteasome Structure and Function and reliability requirement also more and more higher.Therefore, make micro-mould by Micrometer-Nanometer Processing Technology, then prepare minor items by micro-mould is shaping, have batch production, the advantages such as economy is reliable are the important development directions of preparing microminiature product on a large scale.
Wherein, micro-mould is the core of technology, and its surface roughness and machining accuracy directly determine the quality of forming part, and the production cost of micro-mould and service life are also affect its key factor produced in enormous quantities.The preparation method of current micro-mould has several as follows:
1. plasma etching, utilizes MEMS technology, is realized the preparation of micro-nano structure, has high accuracy, the advantages such as mass by photoetching and plasma etching.Can be divided into silica-based and non-silicon-based micro-mould preparation according to the difference of base material, for silica-based micro-mould, silicon is a kind of hard brittle material, easily occurs fatigue damage and causes breakage, and this can have a strong impact on the service life of silica-based micro-mould; And non-silicon-based micro-mould take tungsten as representative, its hardness is high, intensity is large, be suitable as micro-mould material, but in tungsten etching process, sidewall profile is very large by the impact of etching parameters, and when etching darker, bottom surface roughness is difficult to ensure, these all govern the application of plasma etching technology in micro-mould preparation.
2. LIGA-like technology, the synchronous X-ray used due to LIGA technique is very expensive, and LIGA-like technology adopts laser or ultraviolet exposure, and obtain micro-mould by electroforming after development, its advantage to prepare the complicated shape of high-aspect-ratio.But, by the restriction of electroforming material, micro-mould material prepared by this method based on copper and mickel, simultaneously due to the restriction of electroforming process self and the non-uniform Distribution of electric field, it is more loose that the structure that electroforming obtains compares hot worked metallic body materials, and be difficult to avoid the defects such as cavity.
3. precision optical machinery processing, machine cut processing can obtain high-quality finished surface, its roughness can reach several nanometer, but compare with LIGA-like technology with the plasma etching based on photoetching process, precision machined characteristic size is limited, and the price of processing micron level characteristic size lathe is extremely expensive, working (machining) efficiency is very low simultaneously.In addition, by the restriction of cutter, can there is R angle in the bending place of graphics processing, cannot form sharp-pointed transition (shown in accompanying drawing 8), its least radius can only reach four or five ten microns, can not meet the requirement of microfabrication.
4. Micro-EDM Machining Technology, the pulse feature spark discharge between tool-electrode and workpiece is utilized to carry out ablation material, realize the complementation transfer of figure from electrode to workpiece, be applicable to various high rigidity, the difficult-to-machine material (as mould steel, carbide alloy etc.) of high-wearing feature and corrosion resistance.Wherein, the preparation of micro tool electrode is crucial, it is reported, Micro-EDM Machining Technology based on tungsten etching electrode can prepare the micro-mould of complicated shape, simultaneously, this method can solve the characteristic size restriction and R angle problem that occur in precision optical machinery processing, R angular radius is reduced to micron order, but because micro EDM surface is made up of countless galvanic corrosion small rut, its surface roughness is minimum can only reach hundred nano-scale, for this formed in mould product of follow-up use, as micro-fluidic chip, higher surface roughness will have a strong impact on bonding sealing-in and the detection of product.
Summary of the invention
For above various problem, the present invention proposes a kind of combined machining method of micro-mould, and the method can prepare the micro-mould with high-quality surface.
The technical solution used in the present invention is as follows:
A combined machining method for micro-mould, its step comprises:
1) for the outer peripheral areas of micro-mould figure, adopt machine cut processing mode, remove excess stock, and define graphics field profile, realize high-quality finished surface;
2) for micro-mould graphics field, utilize tungsten tool-electrode, adopt micro EDM mode, realize the accurate transfer of figure, ensure machining accuracy and efficiency.
Further, step 1) first utilize mechanical Milling Process to remove the excess stock of micro-mould graphics peripheral fast, then carry out mechanical grinding processing to improve surface quality.
Further, in step 1) carry out machine cut processing while, utilize plasma etching technology to prepare the tungsten micro-electrode with micro-mould pattern complementary, carry out by machine cut processing and tungsten micro-electrode preparation technology the manufacturing cycle shortening micro-mould simultaneously.
Further, step 2) using plasma lithographic technique prepares described tungsten tool-electrode, and its step is as follows:
A) hard mask is sputtered at tungsten substrate surface;
B) on hard mask, apply photoresist, and photoresist is exposed and develops, complete the graphical of photoresist;
C) using photoresist as mask, dry etching is carried out to hard mask, realizes the transfer of mask pattern;
D) remove the photoresist on hard mask, using plasma deep etching method (DRIE) carries out the deep etching of tungsten electrode;
E) remove hard mask, obtain tungsten micro-electrode.
Further, step 2) after carrying out micro EDM, utilize the mode of grinding to improve the surface quality in micro EDM region.
Compared with prior art, beneficial effect of the present invention is as follows:
1. the technical advantage of the processing of this combine with technique precision optical machinery and micro EDM, high-quality finished surface can be obtained, micron-sized complex micro structure can be prepared again, and reduce R angular radius (as shown in Figure 8), thus realize the preparation of high-quality micro-mould.
2. this combined machining method can any high rigidity of parallel fabrication, the conductive material of high-wearing feature, and as mould steel, carbide alloy etc., these materials can improve the service life of micro-mould greatly, reduce the cost of mass production.
3. due to the own characteristic of micro EDM, its micro-mould structure prepared presents positive rake, thus forms good draft angle, is conducive to the knockout course in subsequent forming processing (as injection moulding, impression etc.).
4. mechanical processing process and MEMS technology prepare tungsten electrode separately, avoid two kinds of incompatible cross pollutions caused of technique, affect micro-mould crudy.In addition, two kinds of techniques are carried out simultaneously, can shorten the manufacturing cycle of micro-mould, enhance productivity.
5. adopt machine cut processing mode to remove micro-mould graphics peripheral excess stock, the machining area of follow-up fine electric spark can be reduced, avoid gathering of too much galvanic corrosion product, improve the stability of discharge process, ensure dimensional accuracy and the surface quality of micro EDM, machining area reduces simultaneously, can shorten the micro EDM time, improve working (machining) efficiency, meet market respond fast.
Accompanying drawing explanation
Fig. 1. the mould steel workpiece schematic diagram of surface finish;
Fig. 2. the micro-mould schematic diagram after mechanical Milling Process;
Fig. 3. the micro-mould schematic diagram after mechanical grinding processing;
Fig. 4. tungsten fine electric spark tool-electrode schematic diagram;
Fig. 5. the aligning schematic diagram in instrument and region, piece pole microchannel;
Fig. 6. micro EDM process schematic;
Fig. 7. Micro-fluidic chip die schematic diagram;
Fig. 8. the schematic top plan view at precision optical machinery processing R angle.
Illustrate: the size marked in figure is only signal, because each size has big difference, do not press actual ratio and draw.
Detailed description of the invention
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, and below by specific embodiments and the drawings, the present invention will be further described.
For Micro-fluidic chip die, micro-fluidic chip is basic network by microchannel, connect Micropump, micro-liquid storage tank, microelectrode, micro-detecting element etc. and there are components and parts that are optical, electrical and fluid conveying function, to greatest extent function i ntegration such as sampling, dilution, reaction, separation and detections on a microchip, there is print consumption little, the biological respinse advantage such as rapidly and efficiently, is widely used in the fields such as biomedical research, clinical diagnosis, judicial diagnosis.For micro-fluidic chip, the width of microchannel and the degree of depth are micron order, and the size of chip is generally Centimeter Level, the present invention adopts following combined machining method to realize the preparation of high-quality Micro-fluidic chip die, wherein, micro-fluidic chip is designed to (see Fig. 6, Fig. 7, because each size has big difference, do not draw by actual ratio): appearance and size is long 10cm, wide 3cm, microchannel depth is 40 μm, and width is 20 μm.
1. workpiece material selects the mould steel (as shown in Figure 1) of surface finish, first according to the border in region, microchannel, utilizes mechanical Milling Process to remove peripheral excess stock fast, definition microchannel region contour, as shown in Figure 2.Specifically, utilize CNC milling machine, according to the requirement of machining accuracy and surface roughness, determine the speed of mainshaft, feed speed and back engagement of the cutting edge, allowance should be less than 0.5mm, here for 0.3mm.
2. the surface quality due to mechanical Milling Process is not high, then mechanical grinding processing is carried out, according to the requirement of micro-fluidic chip surface roughness, determine abrasive type, abrasive particle size and grinding speed, and then obtain low roughness, high-quality finished surface, as shown in Figure 3, the degree of depth after grinding should be consistent with the degree of depth of microchannel.
3., while mechanical milling and grinding, utilize plasma etching technology to prepare the tungsten micro-electrode with microchannel pattern complementary, as shown in Figure 4, appearance and size is consistent with mould steel workpiece.
4. after, tungsten micro-electrode is fixed on the main shaft of Micro-EDM Machine, horizontal alignment, then regulates the displacement of major axis X and Y-direction, make tungsten tool-electrode and the alignment of mould steel edge of work profile, and then realize the aligning in region, microchannel, as shown in Figure 5.Then, according to surface roughness and the depth requirements of Micro-fluidic chip die, select suitable machined parameters, carry out micro EDM, as shown in Figure 6, finally obtain Micro-fluidic chip die, as shown in Figure 7.The ratio accounting for the micro-fluidic chip gross area due to region, microchannel is very little, and therefore the surface roughness of this part micro EDM does not affect the integral surface quality of Micro-fluidic chip die.In addition, the mode of grinding also can be utilized to improve the surface quality in micro EDM region.
Said method combines the technical advantage of precision optical machinery processing and micro EDM, can obtain high-quality finished surface, can prepare micron-sized complex micro structure again, and reduce R angular radius, as shown in Figure 8.
As described in previous step 3, the present invention adopts tungsten as fine electrospark electrode.The fusing point of tungsten reaches 3422 DEG C, is the metal that fusing point is the highest, and its elevated temperature strength is also the highest in common metal.In addition, in common electrode material, the wear resistant coefficient of tungsten is also the highest.Therefore, in micro EDM, the loss of tungsten electrode and deformation are all very little, are desirable tool-electrode materials.In the present invention, tungsten electrode can utilize DRIE technique to prepare, and its method is:
1) sputter hard mask at tungsten substrate surface, hard mask can adopt the hard mask of the materials such as Al, AlN, Cr, Ni, Cu, Ti;
2) on hard mask, apply photoresist, and photoresist is exposed and develops, complete the graphical of photoresist;
3) using photoresist as mask, dry etching is carried out to hard mask, realizes the transfer of mask pattern;
4) remove the photoresist on hard mask, using plasma deep etching method (DRIE, DeepReactiveIonEtching, also referred to as " deep reaction ion etching ") carries out the deep etching of tungsten electrode;
5) remove hard mask, obtain tungsten micro-electrode.
Above embodiment is only in order to illustrate technical scheme of the present invention but not to be limited; those of ordinary skill in the art can modify to technical scheme of the present invention or equivalent replacement; and not departing from the spirit and scope of the present invention, protection scope of the present invention should be as the criterion with described in claims.
Claims (8)
1. a combined machining method for micro-mould, is characterized in that, comprises the steps:
1) for the outer peripheral areas of micro-mould figure, adopt machine cut processing mode to remove excess stock, and define graphics field profile;
2) for micro-mould graphics field, utilize tungsten tool-electrode to carry out micro EDM, realize the accurate transfer of micro-mould figure.
2. the method for claim 1, is characterized in that, step 1) first utilize mechanical Milling Process to remove the excess stock of micro-mould graphics peripheral fast, then carry out mechanical grinding processing to improve surface quality.
3. the method for claim 1, it is characterized in that, in step 1) carry out machine cut processing while, utilize plasma etching technology to prepare the tungsten micro-electrode with micro-mould pattern complementary, carry out by machine cut processing and tungsten micro-electrode preparation technology the manufacturing cycle shortening micro-mould simultaneously.
4. the method for claim 1, is characterized in that, step 2) described tungsten tool-electrode using plasma lithographic technique preparation, its step is as follows:
A) hard mask is sputtered at tungsten substrate surface;
B) on hard mask, apply photoresist, and photoresist is exposed and develops, complete the graphical of photoresist;
C) using photoresist as mask, dry etching is carried out to hard mask, realizes the transfer of mask pattern;
D) remove the photoresist on hard mask, using plasma deep etching method carries out the deep etching of tungsten electrode;
E) remove hard mask, obtain tungsten micro-electrode.
5. method as claimed in claim 4, is characterized in that, the material of step a) described hard mask is the one in Al, AlN, Cr, Ni, Cu, Ti.
6. the method for claim 1, is characterized in that, step 2) after carrying out micro EDM, utilize the mode of grinding to improve the surface quality in micro EDM region.
7. the method for claim 1, is characterized in that, the material of described micro-mould is metal or alloy material, comprises mould steel or carbide alloy.
8. the micro-mould that according to any one of claim 1 ~ 7 prepared by method.
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Cited By (3)
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| CN109228053A (en) * | 2018-08-28 | 2019-01-18 | 清华大学天津高端装备研究院 | A kind of combined machining method of micro-fluidic chip injection mold mold core |
| CN109848649A (en) * | 2019-01-28 | 2019-06-07 | 东莞星晖真空镀膜塑胶制品有限公司 | A kind of plastic mould method for fine finishing |
| CN110191399A (en) * | 2019-05-23 | 2019-08-30 | 深圳市伊声声学科技有限公司 | Waterproof ventilated membrane and its mold and manufacturing method and loudspeaker |
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Effective date of registration: 20230925 Address after: 100871, Peking University, 5 the Summer Palace Road, Beijing, Haidian District Patentee after: Peking University Address before: Room A7-504, Bionano Park, No. 218 Xinghu Street, Industrial Park, Suzhou City, Jiangsu Province, 215125 Patentee before: HICOMP MICROTECH(SUZHOU) CO.,LTD. |
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