CN105086909A - High temperature-resistant epoxy glue solution ratio - Google Patents
High temperature-resistant epoxy glue solution ratio Download PDFInfo
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- CN105086909A CN105086909A CN201410792049.5A CN201410792049A CN105086909A CN 105086909 A CN105086909 A CN 105086909A CN 201410792049 A CN201410792049 A CN 201410792049A CN 105086909 A CN105086909 A CN 105086909A
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- high temperature
- resistant epoxy
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- epoxy glue
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Abstract
The invention discloses a high temperature-resistant epoxy glue solution ratio. The high temperature-resistant epoxy glue solution ratio is characterized in that a mass ratio of bismaleimide, allyl bisphenol A, bisphenol A diglycidyl ether, 4,4'-diaminodiphenylmethane, dibutyl phthalate, alumina powder, titanium dioxide to a diluent of 100: 22: 42: 12.6: 8.2: 33: 95: 26.5. The high temperature-resistant epoxy glue has the smallest shear strength of 8.9MPa at a work temperature of 180 DEG C, has excellent heat resistance and solves the problem that the common epoxy glue has poor viscidity and flexibility at a high temperature.
Description
Technical field
The present invention relates to one and relate to a kind of sizing agent, especially a kind of epoxy adhesive.
Background technology
The liquid state that epoxy adhesive is made up of epoxy resin, solidifying agent, promotor, properties-correcting agent etc. or solid-state sizing agent.Because epoxy resin contains various polarity group and active very large epoxy group(ing), thus with various polarity materials such as metal, glass, cement, timber, plastics, there is very strong cohesive force, the cohesive strength of curable epoxide thing is also very large simultaneously, so consolidation strength is very high.Epoxy resin adhesive is widely used in industry and sphere of life with the over-all properties of its excellence.The temperature tolerance of development to sizing agent of the modern science and technology such as Aeronautics and Astronautics, electronics is had higher requirement.Such as, some significant points of Generator Set, Nuclear power plants will use the insulation sizing agent of heatproof 180 ~ 200 DEG C; The cementing needs of vehicular clutch friction plate, brake strap can at the structural adhesive of 250 ~ 350 DEG C of work; The cementing of some parts of rocket engine needs ability 200 DEG C, can reach the high temperature of 400 ~ 500 DEG C instantaneously; Spot welding glue requires the high temperature of ability about 240 DEG C.Therefore traditional epoxy adhesive can not meet the demand.
Summary of the invention
The object of the invention is to solve traditional epoxy adhesive and stick that to there is curable epoxide thing under agent exists high temperature operating conditions crisp, shock resistance is poor, the problem of resistance to elevated temperatures difference.
The technical solution used in the present invention is: a kind of fire resistant epoxy gluing agent glue proportioning, comprise component bismaleimides, allyl group dihydroxyphenyl propane, bisphenol A diglycidyl ether, 4,4 '-diaminodiphenylmethane, dibutyl phthalate, aluminum oxide powder, titanium dioxide and thinner, each component in the ratio of quality is: 100:22:42:12.6:8.2:33:95:26.5;
Configuration step:
(1) 4,4 '-diaminodiphenylmethane thinner is stirred 30min in the reactor, obtained solution X;
(2) bismaleimides and bisphenol A diglycidyl ether are added in reactor be warming up to 85-95 DEG C, add aluminum oxide powder, titanium dioxide and dibutyl phthalate, open dispersion motor 55HZ and emulsification motor 45HZ, reactor constant temperature stirs 1.5h, open recirculation water and be cooled to 40-50 DEG C, then add solution X, allyl group dihydroxyphenyl propane, open dispersion motor 45HZ and emulsification motor 35HZ and stir 1h i.e. obtained product.
As a further improvement on the present invention, thinner is the one or more kinds of mixtures in acetone, toluene, methylethylketone, dimethyl formamide, N,N-DIMETHYLACETAMIDE and dimethyl sulfoxide (DMSO).
The invention has the beneficial effects as follows: this sizing agent minimum shearing resistance when working temperature 180 DEG C is 8.9MPa, has excellent resistance toheat, and overcome the problem of common epoxy adhesive at high temperature its bond performance and flexility difference.
Embodiment
Embodiment 1:
(1) by 12.6kg4,4 '-diaminodiphenylmethane 26.5kg thinner stirs 30min in the reactor, obtained solution X;
(2) 100kg bismaleimides and 42kg bisphenol A diglycidyl ether are added in reactor be warming up to 85-95 DEG C, add 33kg aluminum oxide powder, 95kg titanium dioxide and 8.2kg dibutyl phthalate, open dispersion motor 55HZ and emulsification motor 45HZ, reactor constant temperature stirs 1.5h, open recirculation water and be cooled to 40-50 DEG C, then add solution X, 22kg allyl group dihydroxyphenyl propane, open dispersion motor 45HZ and emulsification motor 35HZ and stir 1h i.e. obtained product.
Embodiment 2:
(1) by 16.5kg4,4 '-diaminodiphenylmethane 26.5kg thinner stirs 30min in the reactor, obtained solution X;
(2) 100kg bismaleimides and 48kg bisphenol A diglycidyl ether are added in reactor be warming up to 85-95 DEG C, add 36kg aluminum oxide powder, 105kg titanium dioxide and 10.7kg dibutyl phthalate, open dispersion motor 55HZ and emulsification motor 45HZ, reactor constant temperature stirs 1.5h, open recirculation water and be cooled to 40-50 DEG C, then add solution X, 26kg allyl group dihydroxyphenyl propane, open dispersion motor 45HZ and emulsification motor 35HZ and stir 1h i.e. obtained product.
Embodiment 3:
(1) by 21.3kg4,4 '-diaminodiphenylmethane 26.5kg thinner stirs 30min in the reactor, obtained solution X;
(2) 100kg bismaleimides and 54kg bisphenol A diglycidyl ether are added in reactor be warming up to 85-95 DEG C, add 39kg aluminum oxide powder, 115kg titanium dioxide and 13.1kg dibutyl phthalate, open dispersion motor 55HZ and emulsification motor 45HZ, reactor constant temperature stirs 1.5h, open recirculation water and be cooled to 40-50 DEG C, then add solution X, 31kg allyl group dihydroxyphenyl propane, open dispersion motor 45HZ and emulsification motor 35HZ and stir 1h i.e. obtained product.
Above embodiments of the present invention are described, but the invention is not restricted to above-mentioned embodiment, in the ken that art those of ordinary skill possesses, can also make a variety of changes under the prerequisite not departing from present inventive concept.
Claims (2)
1. a fire resistant epoxy gluing agent glue proportioning, it is characterized in that comprising component bismaleimides, allyl group dihydroxyphenyl propane, bisphenol A diglycidyl ether, 4,4 '-diaminodiphenylmethane, dibutyl phthalate, aluminum oxide powder, titanium dioxide and thinner, each component in the ratio of quality is: 100:22:42:12.6:8.2:33:95:26.5;
Configuration step:
(1) 4,4 '-diaminodiphenylmethane thinner is stirred 30min in the reactor, obtained solution X;
(2) bismaleimides and bisphenol A diglycidyl ether are added in reactor be warming up to 85-95 DEG C, add aluminum oxide powder, titanium dioxide and dibutyl phthalate, open dispersion motor 55HZ and emulsification motor 45HZ, reactor constant temperature stirs 1.5h, open recirculation water and be cooled to 40-50 DEG C, then add solution X, allyl group dihydroxyphenyl propane, open dispersion motor 45HZ and emulsification motor 35HZ and stir 1h i.e. obtained product.
2. a kind of fire resistant epoxy gluing agent glue proportioning according to claim 1, is characterized in that described thinner is the one or more kinds of mixtures in acetone, toluene, methylethylketone, dimethyl formamide, N,N-DIMETHYLACETAMIDE and dimethyl sulfoxide (DMSO).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410792049.5A CN105086909A (en) | 2014-12-19 | 2014-12-19 | High temperature-resistant epoxy glue solution ratio |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410792049.5A CN105086909A (en) | 2014-12-19 | 2014-12-19 | High temperature-resistant epoxy glue solution ratio |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105086909A true CN105086909A (en) | 2015-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410792049.5A Pending CN105086909A (en) | 2014-12-19 | 2014-12-19 | High temperature-resistant epoxy glue solution ratio |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102838962A (en) * | 2012-09-24 | 2012-12-26 | 云南云天化股份有限公司 | Epoxy resin adhesive and preparation method thereof |
| WO2013015469A1 (en) * | 2011-07-28 | 2013-01-31 | Protavic Korea Co., Ltd. | Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive |
-
2014
- 2014-12-19 CN CN201410792049.5A patent/CN105086909A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013015469A1 (en) * | 2011-07-28 | 2013-01-31 | Protavic Korea Co., Ltd. | Flexible bismaleimide, benzoxazine, epoxy-anhydride adduct hybrid adhesive |
| CN102838962A (en) * | 2012-09-24 | 2012-12-26 | 云南云天化股份有限公司 | Epoxy resin adhesive and preparation method thereof |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151125 |