CN105080877A - 一种用于湿法刻蚀的清洁*** - Google Patents

一种用于湿法刻蚀的清洁*** Download PDF

Info

Publication number
CN105080877A
CN105080877A CN201510325938.5A CN201510325938A CN105080877A CN 105080877 A CN105080877 A CN 105080877A CN 201510325938 A CN201510325938 A CN 201510325938A CN 105080877 A CN105080877 A CN 105080877A
Authority
CN
China
Prior art keywords
cleaning
air knife
unit
wet etching
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510325938.5A
Other languages
English (en)
Inventor
刘小宁
郑载润
王世凯
金童燮
耿军
李登涛
梁渲祺
黄腾飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201510325938.5A priority Critical patent/CN105080877A/zh
Publication of CN105080877A publication Critical patent/CN105080877A/zh
Priority to US15/131,259 priority patent/US20160365259A1/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02Cleaning by the force of jets, e.g. blowing-out cavities
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H01L27/1244Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1262Multistep manufacturing methods with a particular formation, treatment or coating of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

本发明涉及显示技术领域,具体涉及一种用于湿法刻蚀的清洁***。该清洁***包括清洁单元以及依次连通的刻蚀区间、缓冲区间及清洗区间;在所述清洗区间的入口设有气刀单元,所述清洁单元与所述气刀单元对应设置,用于清洗所述气刀单元。该清洁***通过清洁单元有效地去除附着在气刀刀口及周边的刻蚀液结晶和灰尘颗粒;该清洁***能够代替人工对气刀的清洁,提高设备的稼动率,且在确保清洁效果的同时,最大限度的减少人力浪费,同时能避免因长时间打开设备腔室而造成设备内颗粒增加,影响产品的良率。

Description

一种用于湿法刻蚀的清洁***
技术领域
本发明涉及显示技术领域,尤其涉及一种用于湿法刻蚀的清洁***。
背景技术
随着九十年代TFT-LCD(英文名称为ThinFilmTransistor-LiquidCrystalDisplay,中文名称为薄膜场效应晶体管-液晶显示器)技术的成熟,液晶显示面板因其在亮度、对比度、功耗、寿命、体积和重量等综合性能的优势,得到了飞速的发展。
近年来,TFT-LCD逐渐朝着大尺寸和高分辨率方向快速发展,金属线的电阻显得尤为重要,因为它是引起电阻电容(RC)信号延迟的重要因素。金属线采用铜代替传统的铝具有低电阻、高膜层均一度和高开口率等优势,目前铜工艺已成为三星、LG等主要面板供应商开发的热点,京东方B5针对铜工艺做了大量的开发工作。
湿法刻蚀是利用刻蚀液将玻璃基板上未被光刻胶覆盖的部分刻蚀掉,从而形成所需的金属图案。在实际工艺中,设备的清洗单元入口安装了气刀,用于截留刻蚀液,减少刻蚀液带入清洗区间,以免清洗单元受到污染,提高过滤器的使用寿命。在铜工艺开发过程中,发现铜刻蚀液极易结晶,结晶颗粒和灰尘颗粒附着在气刀刀口及周边。
目前,如图1所示,玻璃基板从刻蚀区间完成刻蚀后经缓冲区间3进入清洗区间4;若气刀刀口和周边(第一气刀5和第二气刀6周围位置)有刻蚀液结晶和灰尘颗粒附着,在气流的作用下,结晶颗粒和灰尘颗粒冲击玻璃基板表面,造成光刻胶损伤,从而被光刻胶覆盖的金属线在后工序(干刻、二次湿刻)被刻蚀,造成断线不良(简称PR型DOP)。
当前为降低这类PR型DOP的发生率,刻蚀设备清洗区间入口气刀由工程师每12小时清洁一次,该措施使得此类PR型DOP从开发初期接近10%的发生率降低到如今0.3%以内,效果十分明显。但是,该方法也面临现实的问题,一是每次清洁将由一名工程师耗时约30min,加上由此造成的设备停滞时间,每次清洁耗时约60min,每天占用设备8.3%的稼动率;二是,因设备较宽,设备中间位置不易清洁,工程师作业比较困难;三是,长时间敞开设备腔室,易造成设备灰尘颗粒增加,影响产品良率。
发明内容
(一)要解决的技术问题
本发明要解决的技术问题是提供了一种用于湿法刻蚀的清洁***,使得能够代替人工对气刀的清洁,提高设备稼动率,且在确保清洁效果的同时,最大限度的减少人力浪费,同时能避免因长时间打开设备腔室而造成设备内颗粒增加,影响产品良率。
(二)技术方案
为了解决上述技术问题,本发明提供一种用于湿法刻蚀的清洁***,其包括:清洁单元以及依次连通的刻蚀区间、缓冲区间及清洗区间;在所述清洗区间的入口设有气刀单元,所述清洁单元与所述气刀单元对应设置,用于清洗所述气刀单元。
其中,所述清洁单元包括喷头和清洗管道;所述清洗管道位于缓冲区间内,且与所述喷头连接;所述喷头方向朝向所述气刀单元。
其中,所述清洗管道通过底座位于缓冲区间内,所述底座与所述清洗管道之间为转动连接。
其中,所述喷头的数量为多个,多个所述喷头间隔设置于清洗管道上。
其中,在所述清洗管道上设有阀门组,所述阀门组包括自动阀和手动阀,所述手动阀为常开状态,所述自动阀与控制单元连接。
其中,所述气刀单元包括自上而下相对设置的第一气刀和第二气刀,在所述第一气刀与第二气刀之间设有使基板通过的间隙;所述喷头方向朝向所述第一气刀。
其中,所述第一气刀与第二气刀分别连接有供气管道,在所述供气管道上连接有水洗管道,且在所述水洗管道上设有控制阀。
其中,所述清洗区间内设有多个第二喷淋头,所述多个第二喷淋头均连接于供水管路,所述清洗管道与供水管路连接。
其中,所述刻蚀区间内设有多个第一喷淋头,所述多个第一喷淋头均连接于药液管路。
本发明还提供一种用于湿法刻蚀的清洁***,在所述缓冲区间、刻蚀区间及清洗区间的下方设有用于搬送基板的传动装置。
(三)有益效果
本发明的上述技术方案具有以下有益效果:本发明要解决的技术问题是提供了一种用于湿法刻蚀的清洁***,通过清洁单元有效地去除附着在气刀刀口及周边的刻蚀液结晶和灰尘颗粒,防止因结晶和颗粒在高压气流的作用下冲击玻璃基板表面,造成光刻胶损伤并导致该位置的金属层被刻蚀掉。该清洁***能够代替人工对气刀的清洁,提高设备稼动率,且在确保清洁效果的同时,最大限度的减少人力浪费,同时能避免因长时间打开设备腔室而造成设备内颗粒增加,影响产品良率。
附图说明
图1为现有湿法刻蚀设备的管路连接示意图;
图2为本发明实施例清洁单元与气刀单元的位置关系示意图;
图3为本发明实施例用于湿法刻蚀的清洁***的整体示意图;
图4为本发明实施例用于湿法刻蚀的清洁***的管路连接示意图;
图5为本发明实施例气刀单元的管路连接示意图。
其中,1:清洁单元;2:刻蚀区间;3:缓冲区间;4:清洗区间;5:第一气刀;6:第二气刀;7:水洗管道;8:控制阀;9:传动装置;10:基板;11:喷头;12:清洗管道;13:自动阀;14:手动阀;15:供气管道;21:第一喷淋头;41:第二喷淋头;42:供水管路。
具体实施方式
下面结合附图和实施例对本发明的实施方式作进一步详细描述。以下实施例用于说明本发明,但不能用来限制本发明的范围。
在本发明的描述中,需要说明的是,除非另有说明,“多个”的含义是两个或两个以上;术语“上”、“下”、“左”、“右”、“内”、“外”、“前端”、“后端”、“头部”、“尾部”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”、“第三”等仅用于描述目的,而不能理解为指示或暗示相对重要性。
在本发明的描述中,还需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连。对于本领域的普通技术人员而言,可视具体情况理解上述术语在本发明中的具体含义。
如图2-4所示,本实施例提供的用于湿法刻蚀的清洁***,其包括:清洁单元1以及依次连通的刻蚀区间2、缓冲区间3及清洗区间4,在缓冲区间3、刻蚀区间2及清洗区间4的下方设有用于搬送基板10的传动装置9,通过传动装置9带动基板10移动,使基板10从刻蚀区间2完成刻蚀后经缓冲区间3进入清洗区间4;在清洗区间4的入口(清洗区间4与缓冲区间3相连的位置)设有气刀单元,气刀单元用于截留刻蚀液,以减少刻蚀液带入清洗区间4,使其免受到污染。而且,清洁单元1与气刀单元对应设置,清洁单元1用于清洗气刀单元。
该清洁***主要针对现有铜工艺湿法刻蚀设备中气刀刀口及周边刻蚀液结晶和灰尘颗粒造成的工艺不良,对当前刻蚀设备进行改造,通过增加的清洁单元1有效地去除附着在气刀刀口及周边的刻蚀液结晶和灰尘颗粒。值得说明是,该清洁单元1的结构与位置并不局限,只要满足能够对气刀单元进行清洗即可。
如图4所示,该清洁单元1包括喷头11和清洗管道12;清洗管道12位于缓冲区间3内,且与喷头11连接,清洗管道12用于传输高压水,为喷头11提供水源;同时,喷头11方向朝向气刀单元,以保证从喷头11喷出的液体可以到达气刀单元所在的位置,从而实现对气刀单元的清洗作用。
其中,喷头11的数量可根据实际需要灵活设置,可以为一个也可为多个。当喷头11的数量为多个时,多个喷头11间隔设置于清洗管道12上,可对多个气刀单元进行清洗作业。
而且,清洗管道12通过底座位于缓冲区间3内,且清洗管道12与底座之间为转动连接,也就是说,清洗管道12可在底座上沿其周向(清洗管道12外缘的圆周方向)进行转动,从而方便调整喷头11的喷射角度。
此外,在清洗管道12上还设有阀门组,阀门组包括自动阀13和手动阀14,其中,手动阀14为常开状态,保持清洗管道12的通畅,自动阀13与控制单元连接,控制单元用于自动控制自动阀13的启闭。
当设备处于未工作状态时,在控制单元的作用下,清洁单元1的自动阀13会自动打开,高压水从喷头11喷出以冲洗气刀单元,从而清除附着的刻蚀液和灰尘颗粒;当有基板10进行刻蚀时,自动阀13自动关闭,停止清洗。自动阀13的控制通过控制单元(例如:PLC控制器)完成。
如图2所示,本实施例气刀单元包括:自上而下相对设置的第一气刀5和第二气刀6,即,第一气刀5位于上方,其刀口向下;第二气刀6位于下方,其刀口向上且与第一气刀5的刀口相对;在第一气刀5与第二气刀6之间设有使玻璃基板通过的间隙,用于截留基板10上的刻蚀液;对应的,清洁单元1的喷头11方向朝向第一气刀5(上方的气刀),这样保证在对上部的第一气刀5清洗完成后,液体自动流下的同时也能对下部的第二气刀6进行清洗。
如图4、图5所示,在第一气刀5与第二气刀6上还分别连通有水洗管道7。具体的,为了清洁气刀单元内部的灰尘颗粒和刻蚀液结晶,第一气刀5与第二气刀6分别连接有供气管道15,且在该供气管道15上各增加一个水洗管道7,利用水洗管道7可实现对气刀单元内部的清洗。而且,在水洗管道7上还设有控制阀8。
当然,在供气管道15上还设有过滤器及手动阀。过滤器用于对供气管道15中的气体进行过滤。
当对气刀单元定期清理时,关闭供气管道15上的手动阀,打开水洗管道7上的手动阀(控制阀8),从而实现自动对气刀内部进行清洁。当清洁完成后,关闭水洗管道7上的手动阀,打开供气管道15上的手动阀,然后再对气刀内部进行干燥。该清理方式与清洁单元1配合使用,可以实现对气刀单元的内、外部全面的清洁。
本实施例中,在清洗区间4内设有多个第二喷淋头41,其中,每个第二喷淋头41均连接于供水管路42,供水管路42用于为第二喷淋头41提供高压水。当然,供水管路42必然会连接水源。对应的,清洁单元1的清洗管道12与供水管路42连接,其可作为供水管路42的支路,这样方便改造,可在原有结构的基础上稍加改动即可完成,从而利于推广与应用。
同时,在刻蚀区间2内设有多个第一喷淋头21,多个第一喷淋头21均连接于药液管路,药液管路用于为第一喷淋头21提供刻蚀液。
综上所述,本发明要解决的技术问题是提供了一种用于湿法刻蚀的清洁***,通过清洁单元有效地去除附着在气刀刀口及周边的刻蚀液结晶和灰尘颗粒,防止因结晶和颗粒在高压气流的作用下冲击玻璃基板表面,造成光刻胶损伤并导致该位置的金属层被刻蚀掉。该清洁***能够代替人工对气刀的清洁,提高设备稼动率,且在确保清洁效果的同时,最大限度的减少人力浪费,同时能避免因长时间打开设备腔室而造成设备内颗粒增加,影响产品良率。
本发明的实施例是为了示例和描述起见而给出的,而并不是无遗漏的或者将本发明限于所公开的形式。很多修改和变化对于本领域的普通技术人员而言是显而易见的。选择和描述实施例是为了更好说明本发明的原理和实际应用,并且使本领域的普通技术人员能够理解本发明从而设计适于特定用途的带有各种修改的各种实施例。

Claims (10)

1.一种用于湿法刻蚀的清洁***,其特征在于,包括:清洁单元以及依次连通的刻蚀区间、缓冲区间及清洗区间;在所述清洗区间的入口设有气刀单元,所述清洁单元与所述气刀单元对应设置,用于清洗所述气刀单元。
2.根据权利要求1所述的用于湿法刻蚀的清洁***,其特征在于,所述清洁单元包括喷头和清洗管道;所述清洗管道位于缓冲区间内,且与所述喷头连接;所述喷头方向朝向所述气刀单元。
3.根据权利要求2所述的用于湿法刻蚀的清洁***,其特征在于,所述清洗管道通过底座位于缓冲区间内,所述底座与所述清洗管道之间为转动连接。
4.根据权利要求2所述的用于湿法刻蚀的清洁***,其特征在于,所述喷头的数量为多个,多个所述喷头间隔设置于清洗管道上。
5.根据权利要求2所述的用于湿法刻蚀的清洁***,其特征在于,在所述清洗管道上设有阀门组,所述阀门组包括自动阀和手动阀,所述手动阀为常开状态,所述自动阀与控制单元连接。
6.根据权利要求2所述的用于湿法刻蚀的清洁***,其特征在于,所述气刀单元包括自上而下相对设置的第一气刀和第二气刀,在所述第一气刀与第二气刀之间设有使基板通过的间隙;所述喷头方向朝向所述第一气刀。
7.根据权利要求6所述的用于湿法刻蚀的清洁***,其特征在于,所述第一气刀与第二气刀分别连接有供气管道,在所述供气管道上连接有水洗管道,且在所述水洗管道上设有控制阀。
8.根据权利要求2所述的用于湿法刻蚀的清洁***,其特征在于,所述清洗区间内设有多个第二喷淋头,所述多个第二喷淋头均连接于供水管路,所述清洗管道与供水管路连接。
9.根据权利要求1所述的用于湿法刻蚀的清洁***,其特征在于,所述刻蚀区间内设有多个第一喷淋头,所述多个第一喷淋头均连接于药液管路。
10.根据权利要求1-9中任一项所述的用于湿法刻蚀的清洁***,其特征在于,在所述缓冲区间、刻蚀区间及清洗区间的下方设有用于搬送基板的传动装置。
CN201510325938.5A 2015-06-11 2015-06-11 一种用于湿法刻蚀的清洁*** Pending CN105080877A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201510325938.5A CN105080877A (zh) 2015-06-11 2015-06-11 一种用于湿法刻蚀的清洁***
US15/131,259 US20160365259A1 (en) 2015-06-11 2016-04-18 System for wet etching

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510325938.5A CN105080877A (zh) 2015-06-11 2015-06-11 一种用于湿法刻蚀的清洁***

Publications (1)

Publication Number Publication Date
CN105080877A true CN105080877A (zh) 2015-11-25

Family

ID=54562734

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510325938.5A Pending CN105080877A (zh) 2015-06-11 2015-06-11 一种用于湿法刻蚀的清洁***

Country Status (2)

Country Link
US (1) US20160365259A1 (zh)
CN (1) CN105080877A (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107597687A (zh) * 2017-10-26 2018-01-19 武汉华星光电技术有限公司 一种湿法蚀刻机的水刀清洗装置及方法
CN107649438A (zh) * 2017-09-26 2018-02-02 武汉华星光电技术有限公司 蚀刻机风刀的清洗机构及其控制方法
CN108212883A (zh) * 2017-12-29 2018-06-29 深圳市华星光电技术有限公司 用于清洁湿法蚀刻机的缓冲单元的快门的装置和方法
CN110614245A (zh) * 2019-09-27 2019-12-27 南京中电熊猫液晶材料科技有限公司 一种返修设备制程腔的风刀防结晶装置及其工作方法
CN113552042A (zh) * 2021-07-21 2021-10-26 乐金显示光电科技(中国)有限公司 一种湿法刻蚀设备及其管理方法
CN115254789A (zh) * 2022-08-22 2022-11-01 赫曼半导体技术(深圳)有限公司 湿法制程基板处理装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109212793A (zh) * 2018-09-30 2019-01-15 惠科股份有限公司 一种用于显示面板的制造设备和清洗方法
US11266287B2 (en) * 2019-05-29 2022-03-08 Irobot Corporation Control of autonomous mobile robots

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004148224A (ja) * 2002-10-31 2004-05-27 Advanced Display Inc エアーナイフの洗浄方法、エアーナイフ及びウェットエッチング装置
CN1840341A (zh) * 2005-04-01 2006-10-04 三星电子株式会社 喷墨头清洗***及喷墨头清洗方法
WO2011010584A1 (ja) * 2009-07-23 2011-01-27 シャープ株式会社 ウエットエッチング装置およびウエットエッチング方法
CN202277990U (zh) * 2011-10-26 2012-06-20 常州天合光能有限公司 风刀清洗装置
CN102602152A (zh) * 2011-01-20 2012-07-25 富士胶片株式会社 喷嘴板的清洁方法
CN103031507A (zh) * 2011-09-29 2013-04-10 上海梅山钢铁股份有限公司 一种刀唇擦拭装置
CN203339121U (zh) * 2013-06-17 2013-12-11 京东方科技集团股份有限公司 一种湿刻装置和湿刻设备
CN203850324U (zh) * 2014-04-24 2014-09-24 上饶光电高科技有限公司 一种链式酸制绒机碱洗槽的风刀

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004148224A (ja) * 2002-10-31 2004-05-27 Advanced Display Inc エアーナイフの洗浄方法、エアーナイフ及びウェットエッチング装置
CN1840341A (zh) * 2005-04-01 2006-10-04 三星电子株式会社 喷墨头清洗***及喷墨头清洗方法
WO2011010584A1 (ja) * 2009-07-23 2011-01-27 シャープ株式会社 ウエットエッチング装置およびウエットエッチング方法
CN102602152A (zh) * 2011-01-20 2012-07-25 富士胶片株式会社 喷嘴板的清洁方法
CN103031507A (zh) * 2011-09-29 2013-04-10 上海梅山钢铁股份有限公司 一种刀唇擦拭装置
CN202277990U (zh) * 2011-10-26 2012-06-20 常州天合光能有限公司 风刀清洗装置
CN203339121U (zh) * 2013-06-17 2013-12-11 京东方科技集团股份有限公司 一种湿刻装置和湿刻设备
CN203850324U (zh) * 2014-04-24 2014-09-24 上饶光电高科技有限公司 一种链式酸制绒机碱洗槽的风刀

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107649438A (zh) * 2017-09-26 2018-02-02 武汉华星光电技术有限公司 蚀刻机风刀的清洗机构及其控制方法
CN107597687A (zh) * 2017-10-26 2018-01-19 武汉华星光电技术有限公司 一种湿法蚀刻机的水刀清洗装置及方法
CN107597687B (zh) * 2017-10-26 2020-04-14 武汉华星光电技术有限公司 一种湿法蚀刻机的水刀清洗装置及方法
CN108212883A (zh) * 2017-12-29 2018-06-29 深圳市华星光电技术有限公司 用于清洁湿法蚀刻机的缓冲单元的快门的装置和方法
CN110614245A (zh) * 2019-09-27 2019-12-27 南京中电熊猫液晶材料科技有限公司 一种返修设备制程腔的风刀防结晶装置及其工作方法
CN113552042A (zh) * 2021-07-21 2021-10-26 乐金显示光电科技(中国)有限公司 一种湿法刻蚀设备及其管理方法
CN115254789A (zh) * 2022-08-22 2022-11-01 赫曼半导体技术(深圳)有限公司 湿法制程基板处理装置

Also Published As

Publication number Publication date
US20160365259A1 (en) 2016-12-15

Similar Documents

Publication Publication Date Title
CN105080877A (zh) 一种用于湿法刻蚀的清洁***
CN203365210U (zh) 一种水样预处理***中的集成过滤装置
CN202734906U (zh) 一种具有过滤保护功能的仪表取压装置
CN205341045U (zh) 可防止阳极管结垢的湿式电除尘器
CN207439248U (zh) 一种用于凝汽器的清洗装置及凝汽器
CN203751477U (zh) 一种喷淋机
CN104167417B (zh) 一种剥离设备
CN207763269U (zh) 一种进水管排污的电热水器
CN105826224B (zh) 一种用于半导体晶圆的清洁腔
US20160158785A1 (en) Spray system and use method thereof
CN208023985U (zh) 一种可喷水的清洁装置
WO2020062365A1 (zh) 一种用于显示面板的制造设备和清洗方法
CN214396699U (zh) 一种用于建筑施工场地的节能洗轮装置
CN216483263U (zh) 便于清洁的电磁流量计
CN207763271U (zh) 一种出水管排污的电热水器
CN104607430A (zh) 一种胶杯自动清洗的方法
CN204149032U (zh) 一种抛光机抛光液管路纯水反冲装置
CN210449528U (zh) 一种电捕除焦油***
CN112922093A (zh) 具有清洗结构的无负压供水装置
CN210717608U (zh) 一种脱硫塔烟道冲洗装置
CN203022084U (zh) 在线管道疏通装置
CN208240410U (zh) 多头拉丝机退火专用的自动化氮气保护装置
CN201094956Y (zh) 半导体设备的面板清洗装置
CN204142484U (zh) 一种连铸机喷嘴检测装置
CN203333759U (zh) 用于硅太阳能电池制造工段pecvd镀膜的气路***

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20151125