CN105070818B - A kind of morphological control method of LED package lens - Google Patents
A kind of morphological control method of LED package lens Download PDFInfo
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- CN105070818B CN105070818B CN201510516022.8A CN201510516022A CN105070818B CN 105070818 B CN105070818 B CN 105070818B CN 201510516022 A CN201510516022 A CN 201510516022A CN 105070818 B CN105070818 B CN 105070818B
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000000877 morphologic effect Effects 0.000 title claims abstract description 15
- 229920000642 polymer Polymers 0.000 claims abstract description 51
- CCEKAJIANROZEO-UHFFFAOYSA-N sulfluramid Chemical group CCNS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F CCEKAJIANROZEO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 10
- 238000012546 transfer Methods 0.000 claims abstract description 10
- 238000007711 solidification Methods 0.000 claims abstract description 6
- 230000008023 solidification Effects 0.000 claims abstract description 6
- 238000001704 evaporation Methods 0.000 claims abstract description 5
- 230000008020 evaporation Effects 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004425 Makrolon Substances 0.000 claims description 2
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 235000011187 glycerol Nutrition 0.000 claims description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 230000001737 promoting effect Effects 0.000 claims description 2
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- LEDRCCVNHBPBAG-UHFFFAOYSA-N benzene;prop-2-enenitrile Chemical compound C=CC#N.C1=CC=CC=C1 LEDRCCVNHBPBAG-UHFFFAOYSA-N 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 5
- 230000003287 optical effect Effects 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000012856 packing Methods 0.000 abstract description 2
- 238000004904 shortening Methods 0.000 abstract description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 2
- 239000010703 silicon Substances 0.000 abstract description 2
- 238000001000 micrograph Methods 0.000 description 6
- 238000005286 illumination Methods 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 229960001866 silicon dioxide Drugs 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Lenses (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of morphological control method of LED package lens, including：Step 1, using spot gluing equipment by the polymer for preparing lens or or melten glass be transferred to LED module, and cover LED chip；Step 2, using spot gluing equipment or micro-syringe by the droplet transfer immiscible with polymer to polymer surfaces；Step 3, using heating solidification polymer, evaporation drop, the lens for having volcano mouth shaped gab are obtained.The present invention is while reducing processing cost, shortening the process-cycle, also greatly improve the surface smoothness of lens, so as to improve LED product optical property, suitable for the various LED packing forms including stent-type, chip on board, array, system encapsulation, printed circuit board (PCB) encapsulation and silicon based package.
Description
Technical field
The invention belongs to LED encapsulation technologies field, more particularly, to a kind of morphological control method of LED package lens.
Background technology
LED (Light Emitting Diode) is that one kind is based on semiconductor light emitting made of P-N junction electroluminescent principle
Device, there is electro-optical efficiency height, service life length, environmental protection and energy saving, small volume, be described as 21 century green illumination
Light source.LED, which such as can apply to traditional lighting field, will obtain very significant energy-saving effect, and this is becoming tight in global energy day
It is current significant.With the breakthrough using nitride as the third generation semiconductor material technology of representative, based on high-power and high-luminance
The semiconductor lighting industry of light emitting diode (LED) is rapidly growing in the whole world, just as the new economy of semi-conductor photoelectronic industry
Growth point, and triggered a revolution in traditional lighting field.LED is had begun in many necks due to its unique superiority
Domain is used widely, and the main direction of development of following lighting engineering is considered by industry, has huge market potential.
The lens light shape control device main as LED illumination, can not only produce convergent beam, while can also produce diverging
Light beam, and the light for all angles that can be sent to LED control effectively, and design freedom is big, implementation is flexible.
Especially with the rise of LED illumination free-form surface lens in recent years, the design of various not rounded symmetrical hot spots becomes cleverer
It is living with it is convenient.Therefore, lens have obtained increasing application in LED illumination, turn into an important means of optical design,
And lens are manufactured as one of key link of LED encapsulation.
To ensure machining accuracy, free-form surface lens generally require to use the accurate Multi-axis Machining with micron order machining accuracy
System is processed.However, in actual volume manufacturing process, to improve production efficiency, cost is reduced, often using compression molding
Method produces free-form surface lens.The pattern and roughness of lens are determined by the shape and quality of mould completely, to die surface
Required precision it is very high.Mould processing is relatively difficult, and cost is higher, and the manufacturing cycle is again long, and easily abrasion, is used for multiple times rear mold
Lens are easily damaged when scrapping, and being stripped, residual stress problem can also influence lens use.In addition, temperature, pressure during molding
Power, viscosity of polymer fluid etc. may influence the surface topography of free-form surface lens, so as to influence its optical property with shining
Obvious results fruit.It can know that traditional moulded lens processing method has wretched insufficiency from the discussion above.Therefore lens pattern control
The improvement of method is that current LED illumination industrial quarters realizes the subject matter that low cost, bloom performance products face.
The content of the invention
In view of the deficienciess of the prior art, the invention provides a kind of morphological control method of LED package lens.
The present invention is based on fluid die method, and lens shaped is realized using the immiscible effect for evaporating drop and polymer surfaces
The accuracy controlling of looks, while reducing processing cost, improving processing efficiency, it is also ensured that the surface smoothness of lens.
In order to solve the above technical problems, the present invention adopts the following technical scheme that：
A kind of morphological control method of LED package lens, including：
Step 1, using spot gluing equipment by the polymer for preparing lens or or melten glass be transferred to LED module, and cover
Firmly LED chip；
Step 2, using spot gluing equipment or micro-syringe by the droplet transfer immiscible with polymer to polymer surfaces；
Step 3, using heating solidification polymer, evaporation drop, the lens for having volcano mouth shaped gab are obtained.
The above-mentioned polymer for preparing lens be silica gel, epoxy resin, makrolon, polymethyl methacrylate, acrylonitrile-
SB or polyvinyl chloride.
The above-mentioned and immiscible drop of polymer is water, alcohol, ethylene glycol, cyclohexanol, propane diols or glycerine.
Preferably, in step 2, the droplet size for being transferred to polymer surfaces is not more than 20 microlitres.
Preferably, after by the droplet transfer immiscible with polymer to polymer surfaces, using the company of hydrophilic material
Take over the baton and contact drop and advance downwardly, by the size for promoting deep-controlled lens volcano mouth shaped gab.
Described pitman is copper rod or iron staff.
The termination of described pitman contact drop is rounded head.
Compared to the prior art, the present invention has following features and beneficial effect：
1st, the present invention utilizes the interaction of immiscible drop and polymer surfaces, realizes the accuracy controlling of lens pattern,
Alternative traditional lens processing method based on compression molding method.
2nd, the present invention is easy and effective, while reducing processing cost, shortening the process-cycle, also greatly improves lens
Surface smoothness, so as to improve LED product optical property.
3rd, lens morphological control method of the present invention is applied to include stent-type, chip on board, array, system encapsulation, print
Printed circuit board encapsulates and the various LED packing forms including silicon based package.
Brief description of the drawings
Fig. 1 is dispensing process schematic in embodiment 1；
Fig. 2 be embodiment 1 in immiscible droplet transfer to polymer surfaces schematic diagram；
Fig. 3 is the structural representation of lens prepared by the method for embodiment 1；
Fig. 4 is the vertical view micrograph after immiscible droplet transfer to polymer surfaces in embodiment 1；
Fig. 5 is the side micrograph after immiscible droplet transfer to polymer surfaces in embodiment 1；
Fig. 6 is the lens pattern prepared in embodiment 1 using 5 microlitres of immiscible drops；
Fig. 7 is the lens pattern prepared in embodiment 1 using 10 microlitres of immiscible drops；
Fig. 8 is the lens pattern prepared in embodiment 1 using 15 microlitres of immiscible drops；
Fig. 9 is the lens pattern prepared in embodiment 1 using 20 microlitres of immiscible drops；
Figure 10 is the side micrograph of lens pattern prepared by the method for embodiment 1；
Figure 11 is the micro- enlarged drawing in lens volcano mouth shaped gab shown in Figure 10；
Figure 12 is the central cross-section curve of lens prepared by the method for embodiment 1, wherein, figure (a) is that lens centre section is bent
Line, figure (b) are the volcano mouth shaped gab sectional curve and fourth-degree polynomial curve comparison diagram of lens in figure (a)；
Figure 13 is the curve of light distribution of the gained lens of embodiment 1；
Figure 14 be lens prepared by the method for embodiment 1 side surface roughness, RaIt is to take for profile arithmetic average error
The arithmetic mean of instantaneous value of sample length Internal periphery offset distance absolute value；
Figure 15 be lens prepared by the method for embodiment 1 top end surface roughness, RaFor profile arithmetic average error, be
The arithmetic mean of instantaneous value of sample length Internal periphery offset distance absolute value；
Figure 16 be lens prepared by the method for embodiment 1 volcano mouth shaped gab inside surface roughness, RaPut down for profile arithmetic
Equal deviation, it is the arithmetic mean of instantaneous value in sample length Internal periphery offset distance absolute value；
Figure 17 is the use schematic diagram of pitman in embodiment 2；
In figure：1-LED modules, 2- polymer, 3- spot gluing equipments, 4- micro-syringes, the immiscible drops of 5-, 6- pitmans,
7- hot plates, 8-LED chips, 9- supports, 10- volcanoes mouth shaped gab.
Embodiment
The present invention is explained in more detail by embodiment below, but following examples are merely illustrative, it is of the invention
Protection domain is not limited to these embodiments restrictions.
Embodiment 1
The present invention forms volcano mouth shaped gab by the gravity and surface tension of immiscible drop itself in polymer surfaces,
The pattern control of lens is realized in the solidification of evaporation and polymer through immiscible drop.Volcano mouth shaped gab size is by droplet size
Control.Immiscible drop refers to the drop immiscible with polymer.
The present embodiment comprises the following steps that：
Step 1, polymer is transferred to LED module, and covers LED chip.
See Fig. 1, polymer (2) is transferred on LED module (1) with spot gluing equipment (3), and cover LED chip (8).
Using the controllable amount of polymers being transferred on LED module (1) of spot gluing equipment (3), make it that natural Lambertian state be presented.This
Polymer is silica gel in embodiment.
Step 2, by immiscible droplet transfer to polymer surfaces.
See Fig. 2, immiscible drop (5) is transferred to polymer (2) surface using micro-syringe (4).When it is implemented, can
Manual operation micro-syringe (4) makes immiscible drop (5) drop to polymer (2) surface, also can automatically will not using spot gluing equipment
The drop (5) that mixes is transferred to polymer (2) surface.The immiscible drop of polymer surfaces is dropped to by micro-syringe (4) regulation
Size, due to the effect of immiscible Surface Tension of Liquid Drops and Action of Gravity Field, polymer flow and areal deformation are driven, it is poly- so as to realize
The Morphological control on compound surface.
Step 3, solidification polymer, immiscible drop is evaporated, obtains the lens of tool volcano mouth shaped gab.
LED module (1) is heated using hot plate (7), evaporates immiscible drop (5), solidification polymer (2), finally
The lens for having volcano mouth shaped gab are obtained, see Fig. 3.
Fig. 4~5 are the immiscible droplet transfers of the present embodiment to the vertical view micrograph and side micrograph after Silica Surface.It is logical
The immiscible droplet size that micro-syringe control drops to polymer surfaces is crossed, resulting silica-gel lens are shown in Fig. 6~9, Fig. 6 respectively
~9 be the pattern that 5 microlitres, 10 microlitres, 15 microlitres and 20 microlitres of immiscible drop is dropped to lens obtained by Silica Surface respectively.
It can be seen that immiscible droplet size is different, driving polymer flow can be variant, as immiscible drop increases,
Lens height reduces.
Figure 10~11 are respectively side micrograph and the volcano of the silica-gel lens pattern obtained using the present embodiment method
The micro- enlarged drawing of mouth shaped gab.
See Figure 12, the volcano mouth shaped gab sectional curves of the made lens of the present embodiment method fits like a glove quartic polynomial song
Line.
Figure 13 is the curve of light distribution that sample is encapsulated using the LED of different-shape lens obtained by the present embodiment method, is schemed
In, 0 μ L, 2 μ L, 3 μ L, 4 μ L, 5 μ L represent to drop to the immiscible drop volume of polymer surfaces respectively.The bright the present embodiment of the chart
The lens of preparation can make LED light extractions evenly.
Figure 14~16 are respectively the surface roughness of lens diverse location prepared by the present embodiment, using AFM
Measurement obtains, surface roughness value RaLens prepared by respectively less than 4nm, i.e. the present embodiment have very high surface quality.
Embodiment 2
See Figure 17, the present embodiment and the difference of embodiment 1 are：The increase pitman above immiscible drop (5)
(6), pitman (6) is hydrophilic material, such as copper rod, iron staff.After immiscible drop (5) drops to polymer (2) surface, connection
Rod (6) contacts immiscible drop (5) upper surface, then advances downwardly pitman (6), and immiscible drop is controlled by its adhesion
(5) polymer (2) is goed deep into, so as to control the pattern of volcano mouth shaped gab.Pitman (6) contacts one end of immiscible drop (5)
For rounded head.
Pitman radius directly determines the size of its lower end absorption drop, and the big absorption drop of its radius is big, the small absorption of radius
Drop it is also small, then can change lens surface volcano mouth shaped gab size by changing pitman radius.In addition, pass through the company of control
Take over the baton the depth advanced downwardly, also can control lens surface volcano mouth shaped gab size.To sum up, by change pitman radius and
Depth is advanced downwardly, the accuracy controlling of lens pattern can be achieved.
The way of contact of drop and polymer surfaces is contact free formula in embodiment 1, drop and polymer in embodiment 2
The way of contact on surface is liquid bridge contact, using different drop contact modes by the different lens patterns of acquisition.
Described above is presently preferred embodiments of the present invention, but the present invention should not be limited to the embodiment and accompanying drawing institute
Disclosure.So every do not depart from the lower equivalent or modification completed of spirit disclosed in this invention, guarantor of the present invention is both fallen within
The scope of shield.
Claims (7)
- A kind of 1. morphological control method of LED package lens, it is characterised in that including：Step 1, the polymer for preparing lens or melten glass are transferred to by LED module using spot gluing equipment, and cover LED core Piece；Step 2, using spot gluing equipment or micro-syringe by the droplet transfer immiscible with polymer to polymer surfaces；Step 3, using heating solidification polymer, evaporation drop, the lens for having volcano mouth shaped gab are obtained.
- 2. the morphological control method of LED package lens as claimed in claim 1, it is characterised in that：The described polymer for preparing lens is silica gel, epoxy resin, makrolon, polymethyl methacrylate, acrylonitrile-benzene Ethylene-butadiene copolymer or polyvinyl chloride.
- 3. the morphological control method of LED package lens as claimed in claim 1, it is characterised in that：The described drop immiscible with polymer is water, alcohol, ethylene glycol, cyclohexanol, propane diols or glycerine.
- 4. the morphological control method of LED package lens as claimed in claim 1, it is characterised in that：In step 2, the droplet size for being transferred to polymer surfaces is not more than 20 microlitres.
- 5. the morphological control method of LED package lens as claimed in claim 1, it is characterised in that：After by the droplet transfer immiscible with polymer to polymer surfaces, drop is contacted simultaneously using the pitman of hydrophilic material Advance downwardly, by the size for promoting deep-controlled lens volcano mouth shaped gab.
- 6. the morphological control method of LED package lens as claimed in claim 5, it is characterised in that：Described pitman is copper rod or iron staff.
- 7. the morphological control method of LED package lens as claimed in claim 5, it is characterised in that：The termination of described pitman contact drop is rounded head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510516022.8A CN105070818B (en) | 2015-08-21 | 2015-08-21 | A kind of morphological control method of LED package lens |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510516022.8A CN105070818B (en) | 2015-08-21 | 2015-08-21 | A kind of morphological control method of LED package lens |
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| CN105070818A CN105070818A (en) | 2015-11-18 |
| CN105070818B true CN105070818B (en) | 2017-11-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110058332B (en) * | 2019-04-30 | 2020-09-11 | 安徽大学 | Method for manufacturing micro lens |
| CN114447197A (en) * | 2022-01-25 | 2022-05-06 | 金振华 | Preparation method of fly-eye array lens for LED integrated packaging |
| CN117276424A (en) * | 2023-11-17 | 2023-12-22 | 江西斯迈得半导体有限公司 | LED packaging method and LED packaging structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1752793A (en) * | 2004-09-20 | 2006-03-29 | 中国科学院光电技术研究所 | Micro-droplet driving continuous mirror surface active deformation reflecting mirror |
| CN101436557A (en) * | 2007-11-13 | 2009-05-20 | 香港科技大学 | Wafer level encapsulation method of LED array encapsulation and LED encapsulation device made thereby |
| CN101632030A (en) * | 2006-12-15 | 2010-01-20 | 手持产品公司 | The apparatus and method that comprise deformable lens element |
| CN103424790A (en) * | 2013-08-14 | 2013-12-04 | 东南大学 | Liquid lens and production method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080006368A9 (en) * | 2005-02-01 | 2008-01-10 | Peiqi Jiang | Process for applying a coating onto a surface of a lens substrate |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1752793A (en) * | 2004-09-20 | 2006-03-29 | 中国科学院光电技术研究所 | Micro-droplet driving continuous mirror surface active deformation reflecting mirror |
| CN101632030A (en) * | 2006-12-15 | 2010-01-20 | 手持产品公司 | The apparatus and method that comprise deformable lens element |
| CN101436557A (en) * | 2007-11-13 | 2009-05-20 | 香港科技大学 | Wafer level encapsulation method of LED array encapsulation and LED encapsulation device made thereby |
| CN103424790A (en) * | 2013-08-14 | 2013-12-04 | 东南大学 | Liquid lens and production method thereof |
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