CN105070677A - 一种硅片pn扩散用碳化硅舟 - Google Patents

一种硅片pn扩散用碳化硅舟 Download PDF

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Publication number
CN105070677A
CN105070677A CN201510576289.6A CN201510576289A CN105070677A CN 105070677 A CN105070677 A CN 105070677A CN 201510576289 A CN201510576289 A CN 201510576289A CN 105070677 A CN105070677 A CN 105070677A
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Prior art keywords
boat
diffusion
boat body
silicon carbide
slot
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CN201510576289.6A
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陈许平
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NANTONG GAOXIN ELECTRONICS CO Ltd
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NANTONG GAOXIN ELECTRONICS CO Ltd
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Priority to CN201510576289.6A priority Critical patent/CN105070677A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明涉及硅片PN扩散积层用存放工装，具体涉及一种硅片PN扩散用碳化硅舟。它包括舟体、圆形隔板、圆形隔块，舟体是长方体状，舟体中间开有一个长方形孔，长方形孔内两侧对应开有若干卡槽，长方形孔两侧卡槽之间的舟体设计成坡面，圆形隔板装在卡槽内，最两端圆形隔板之间装有圆形隔块。优点是设计简单，使用方便，结构合理，适合于待扩散硅片积层放置用工装，其特点是：纯度高，硬度大，耐碱腐蚀；因为经过硅片PN扩散后有残留的杂质源沾在工装表面上，必须以强碱液去除，所以新型工装必须耐碱腐蚀。

Description

一种硅片PN扩散用碳化硅舟
技术领域
本发明涉及硅片PN扩散积层用存放工装，具体涉及一种硅片PN扩散用碳化硅舟。
背景技术
高压二极芯片核心是PN结，它是由原始单晶片两面分别涂上P源、N源，然后将若干片涂源后的硅片置于专用工装上夹紧进行积层，再放入高温扩散炉中进行扩散，扩散温度一般在1250℃以上，时间超过40H，因此对积层用工装有很高的要求。目前一般硅片PN扩散用多晶硅舟，每次使用前必须用KOH溶液进行洗净，多晶硅不耐碱腐蚀，多次清冼后变形、寿命短，且对积层质量（不易积紧，表面杂质源挥发）造成影响，从而使扩散后参数变差，最终影响制品良率。
发明内容、
为了解决上述问题，本发明提出了一种硅片PN扩散用碳化硅舟，设计简单，使用方便，是一种待扩散硅片积层用工装，纯度高，硬度大，耐碱腐蚀，使用寿命长。
为了达到上述发明目的，本发明提出了以下的技术方案：
一种硅片PN扩散用碳化硅舟，它包括舟体、圆形隔板、圆形隔块，舟体是长方体状，舟体中间开有一个长方形孔，长方形孔内两侧对应开有若干卡槽，长方形孔两侧卡槽之间的舟体设计成坡面，圆形隔板装在卡槽内，最两端圆形隔板之间装有圆形隔块。
所述的舟体两端还开有推拉孔。
所述的舟体整体呈板状，横向中间凸起状。
所述的长方形孔两侧卡槽之间的舟体设计成坡面，即长方形孔两侧长边设计成坡面，两侧坡面相配合形成托面。
所述的舟体采用碳化硅制作一体成型。
本发明的优点是设计简单，使用方便，结构合理，适合于待扩散硅片积层放置用工装，其特点是：纯度高，硬度大，耐碱腐蚀。因为经过硅片PN扩散后有残留的杂质源沾在工装表面上，必须以强碱液去除，所以新型工装必须耐碱腐蚀。
由原多晶硅舟改为碳化硅舟（高纯）。可解决以上问题。碳化硅纯度高，扩散时不导入其它杂质污染；与碱液无任何作用，耐腐蚀；熔点高于多晶硅，耐高温性能更优；硬度大，积层紧硅片不易变形。
碳化硅舟因其耐碱腐，熔点高，其使用寿命远高于多晶硅舟。多晶硅舟寿命为积层扩散30次，碳化硅则达到150次左右。碳化硅舟积层扩散后的硅片无翘曲变形,硅片表面附着杂质源不易挥发,扩散后硅片表面浓度均一性好。制成品良率高于多晶硅舟2.5%。
附图说明
图1是本发明的示意图。
图2是本发明的舟体的示意图。
具体实施方式
为了对本发明进一步的说明，下面结合说明书附图来介绍：
参照附图，一种硅片PN扩散用碳化硅舟，它包括舟体1、圆形隔板2、圆形隔块3，舟体1是长方体状，舟体1中间开有一个长方形孔3，长方形孔3内两侧对应开有若干卡槽4，长方形孔两侧卡槽4之间的舟体1设计成坡面6，圆形隔板2装在卡槽4内，最两端圆形隔板2之间装有圆形隔块3。
所述的舟体1两端还开有推拉孔5。
所述的舟体1整体呈板状，横向中间凸起状。
所述的长方形孔3两侧卡槽4之间的舟体设计成坡面6，即长方形孔两侧长边设计成坡面6，两侧坡面6相配合形成托面7。
所述的舟体1采用碳化硅制作一体成型。
本发明的使用时，先把若干圆形隔板插在舟体上在卡槽内，然后把两端圆形隔块放在最两端圆形隔板之间，圆形隔块下端坐在托面上，其他隔板之间舟体上端托面上放置硅片8，本碳化硅舟用于积层三英寸扩散硅片8,每舟可积层硅片数量为500片。圆形隔块用来两端防护压紧中间的积层硅片8，圆形隔块通过两端的圆形隔板固定夹紧，如果之间有松动，圆形隔块与圆形隔板之间继续插状圆形隔板，保证夹紧。

Claims (5)

1.一种硅片PN扩散用碳化硅舟，它包括舟体、圆形隔板、圆形隔块，其特征是舟体是长方体状，舟体中间开有一个长方形孔，长方形孔内两侧对应开有若干卡槽，长方形孔两侧卡槽之间的舟体设计成坡面，圆形隔板装在卡槽内，最两端圆形隔板之间装有圆形隔块。
2.根据权利要求1所述的一种硅片PN扩散用碳化硅舟，其特征是所述的舟体两端还开有推拉孔。
3.根据权利要求1所述的一种硅片PN扩散用碳化硅舟，其特征是所述的舟体整体呈板状，横向中间凸起状。
4.根据权利要求1所述的一种硅片PN扩散用碳化硅舟，其特征是所述的长方形孔两侧卡槽之间的舟体设计成坡面，即长方形孔两侧长边设计成坡面，两侧坡面相配合形成托面。
5.根据权利要求1所述的一种硅片PN扩散用碳化硅舟，其特征是所述的舟体采用碳化硅制作一体成型。
CN201510576289.6A 2015-09-11 2015-09-11 一种硅片pn扩散用碳化硅舟 Pending CN105070677A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5657879A (en) * 1996-02-05 1997-08-19 Seh America, Inc. Combination wafer carrier and storage device
CN2743968Y (zh) * 2004-07-12 2005-11-30 西安希朗材料科技有限公司 传输承载晶片的高纯碳化硅平板形部件
US20080237157A1 (en) * 2007-03-30 2008-10-02 Chee Keong Chin Wafer transport system
JP2008277619A (ja) * 2007-05-01 2008-11-13 Shin Etsu Handotai Co Ltd ウエーハ支持治具およびこれを備えた縦型熱処理用ボートならびにウエーハ支持治具の製造方法
CN202217694U (zh) * 2011-09-06 2012-05-09 湖州奥博石英科技有限公司 一种石英舟

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5657879A (en) * 1996-02-05 1997-08-19 Seh America, Inc. Combination wafer carrier and storage device
CN2743968Y (zh) * 2004-07-12 2005-11-30 西安希朗材料科技有限公司 传输承载晶片的高纯碳化硅平板形部件
US20080237157A1 (en) * 2007-03-30 2008-10-02 Chee Keong Chin Wafer transport system
JP2008277619A (ja) * 2007-05-01 2008-11-13 Shin Etsu Handotai Co Ltd ウエーハ支持治具およびこれを備えた縦型熱処理用ボートならびにウエーハ支持治具の製造方法
CN202217694U (zh) * 2011-09-06 2012-05-09 湖州奥博石英科技有限公司 一种石英舟

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Application publication date: 20151118