CN105058807A - Selective micro hot-melting shaping device with thick-film thermal print head - Google Patents
Selective micro hot-melting shaping device with thick-film thermal print head Download PDFInfo
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- CN105058807A CN105058807A CN201510547940.7A CN201510547940A CN105058807A CN 105058807 A CN105058807 A CN 105058807A CN 201510547940 A CN201510547940 A CN 201510547940A CN 105058807 A CN105058807 A CN 105058807A
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- film thermal
- thick film
- printing head
- thermal printing
- powder feeding
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Abstract
The invention provides a selective micro hot-melting shaping device with a thick-film thermal print head. The device comprises a heater for preheating; a work table device with a shaping area; a powder supply device for supplying powder to the shaping area; the thick-film thermal print head with a plurality of hot-melting points, wherein the thick-film thermal print head is arranged to make the heat agglomerating range of at least one hot-melting point of the thick-film thermal print head cover one part of the shaping area. The heat agglomerating range of at least one hot-melting point of the thick-film thermal print head covers one part of the shaping area, so as to agglomerate the powder through controlling the heating of the hot-melting point, and finally parts are formed.
Description
Technical field
The present invention relates to a kind of selective fine hot melt molding equipment with thick film thermal printing head, can optionally agglomerated material powder constituent parts.
Background technology
The increasing material manufacture of part or claim Quick-forming, 3 D-printing has very large advantage in the shaping of parts with complex structures and the shaping of special material.This technique adopts high-power electron beam or laser beam as thermal source usually, and successively sintering or molten material, make material successively stack shaping.Typical technique has selective laser sintering (SelectiveLaserSintering, SLS), selective laser fusing (SelectiveLaserMelting, SLM) and electron beam selective melting (ElectronBeamSelectiveMelting, EBSM) etc.
Summary of the invention
The present invention is intended to solve one of technical problem in correlation technique at least to a certain extent.
For this reason, one object of the present invention is to propose the selective fine hot melt molding equipment with thick film thermal printing head whether a kind of heating by controlling heat fusion joint realizes the sintering of powder.
According to the selective fine hot melt molding equipment with thick film thermal printing head of the present invention, comprising: for the heater of preheating;
Table device, described table device has shaped region;
Powder feeding device, described powder feeding device is used for powder feeding to described shaped region;
There is the thick film thermal printing head of multiple heat fusion joint, described thick film thermal printing head be arranged so that described thick film thermal printing head at least one described in the heat-agglomerating scope of heat fusion joint cover the part of described shaped region;
Described heater is placed in the top of described table device, described powder feeding device is placed in the side of described table device, and described thick film thermal printing head is placed in the offside of relatively described powder feeding device or the sides adjacent with described powder feeding device of described table device.
According to the selective fine hot melt molding equipment with thick film thermal printing head of the present invention, described at least one of described thick film thermal printing head, the heat-agglomerating scope of heat fusion joint covers a part for described shaped region, the sintering of powder whether is realized with the heating realized by controlling heat fusion joint, and final constituent parts.
In addition, the selective fine hot melt molding equipment with thick film thermal printing head according to the above embodiment of the present invention can also have following additional technical characteristic:
According to an example of the present invention, the heat-agglomerating scope of described multiple heat fusion joint covers whole described shaped region.
According to an example of the present invention, described table device is removable, to expand the heat-agglomerating scope of described thick film thermal printing head.
According to an example of the present invention, described powder comprises plastic powders and/or nylon powder.
According to an example of the present invention, described table device comprises: workbench, and described shaped region is arranged on described workbench; Lowering or hoisting gear, described lifting is arranged under described workbench to be elevated described workbench.
According to an example of the present invention, described powder feeding device comprises: powder feeding device, described powder feeding device by described powder feeding to described workbench upper surface on; Powder laying device, described powder laying device to be arranged on described workbench and described powder can be pushed in described shaped region and to pave.
According to an example of the present invention, the sintering diameter of each described heat fusion joint is 0.1-0.2mm.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the selective fine hot melt molding equipment according to an embodiment of the invention with thick film thermal printing head.
Fig. 2 is the schematic diagram of the thick film thermal printing head of the selective fine hot melt molding equipment according to an embodiment of the invention with thick film thermal printing head.
Fig. 3 is the upward view of Fig. 2.
In figure, T-C represents that temperature controls, and P-C represents that thick film thermal printing head controls.
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the present invention, and can not limitation of the present invention be interpreted as.
Below with reference to the accompanying drawings describe in detail according to the selective fine hot melt molding equipment with thick film thermal printing head of the present invention.
As shown in Figure 1 to Figure 3, according to the selective fine hot melt molding equipment with thick film thermal printing head of the present invention, comprising: table device 10, powder feeding device 20, heater 30 and thick film thermal printing head 60.
Specifically, table device 10 comprises: workbench 110 and lowering or hoisting gear 120.Workbench 110 has shaped region 111.Lifting arranges 120 under workbench 110 with lifting working platform 110.Workpiece 40 is at shaped region 111 internal shaping.
Powder feeding device 20 for by powder feeding to shaped region 111.Such as, powder feeding device 20 comprises: powder feeding device 210 and powder laying device 220.Powder feeding device 210 by powder feeding on the upper surface of workbench 110.Powder laying device 220 to be arranged on workbench 110 and powder can be pushed in shaped region 111 and to pave.
Heater 30 is for pre-heating powder, and make thick film thermal printing head 60 before agglomerated material, material temperature rises to certain limit, shortens the sintering time of material.
Thick film thermal printing head 60 has multiple heat fusion joint 601.Thick film thermal printing head 60 is arranged so that the part in the heat-agglomerating scope drape forming region 111 of at least one heat fusion joint 601 of thick film thermal printing head 60.The sintering radius of each heat fusion joint can be 0.25mm.
Here it should be noted that, thick film thermal printing head adopts serigraphy, and high temperature sintering carrys out film forming.According to different product to resistance value, the different requirements of resistance to electric power, select the model of resistance slurry and appropriate proportioning, according to the thickness of resistive element, fabric width specification determines the ratio adding diluent, through mixing, adopts the mode of serigraphy or description to form resistive element after deaeration, resistive element, after suitable temperature sintering, becomes the semiconductor with certain resistance value.Resistive element is in printing, and after having sintered thick film protective layer, the characteristic that after utilizing resistive element to apply pulse, resistance reduces, is adjusted to the pointwise of resistive element resistance in target zone.
In other words, workpiece 40 to be formed is divided into from top to bottom multilayer (such as, the thickness of every one deck can be set to 0.05-0.25mm).
When the selective fine hot melt molding equipment with thick film thermal printing head according to the present invention is started working, such as plastic powders and/or nylon powder are supplied on the upper surface of workbench 110 by powder feeding device 210.These powder to push in shaped region 111 and pave by powder laying device 220.At least one heat fusion joint 601 of thick film thermal printing head 60 carries out thermal sintering at least partially to the powder paved in shaped region 111.
After above-mentioned steps completes, lifting arranges 120 makes workbench 110 decline a floor height (such as, decline 0.25mm), repeats above-mentioned steps, until workpiece 40 has been shaped.
According to the selective fine hot melt molding equipment with thick film thermal printing head of the present invention, described at least one of described thick film thermal printing head, the heat-agglomerating scope of heat fusion joint covers a part for described shaped region, the sintering of powder whether is realized with the heating realized by controlling heat fusion joint, and final constituent parts.
As shown in Figure 1, according to an example of the present invention, the heat-agglomerating scope of multiple heat fusion joint 601 can cover whole shaped region 111.Advantageously, table device 10 is removable with the heat-agglomerating scope expanding thick film thermal printing head 60.Such as, table device 10 can left and right translation.
Here it should be noted that, according to the selective fine hot melt molding equipment with thick film thermal printing head of the present invention, automatic control can be realized by computer 50.Such as, for table device 10, powder feeding device 20, heater 30 and thick film thermal printing head 60 provide power, power supply etc., automatically control the lifting of table device, automatically control powder feeding device 20 and supply powder to shaped region 111, automatically control the sintering time of thick film thermal printing head 60, sintering region etc.This is understandable to those skilled in the art.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", " counterclockwise ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this description, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this description or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and describe embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, and those of ordinary skill in the art can change above-described embodiment within the scope of the invention, revises, replace and modification.
Claims (7)
1. there is a selective fine hot melt molding equipment for thick film thermal printing head, it is characterized in that, comprising:
For the heater of preheating;
Table device, described table device has shaped region;
Powder feeding device, described powder feeding device is used for powder feeding to described shaped region;
There is the thick film thermal printing head of multiple heat fusion joint, described thick film thermal printing head be arranged so that described thick film thermal printing head at least one described in the heat-agglomerating scope of heat fusion joint cover the part of described shaped region;
Described heater is placed in the top of described table device, described powder feeding device is placed in the side of described table device, and described thick film thermal printing head is placed in the offside of relatively described powder feeding device or the sides adjacent with described powder feeding device of described table device.
2. the selective fine hot melt molding equipment with thick film thermal printing head according to claim 1, is characterized in that, the heat-agglomerating scope of described multiple heat fusion joint covers whole described shaped region.
3. the selective fine hot melt molding equipment with thick film thermal printing head according to claim 1, it is characterized in that, described table device is removable, to expand the heat-agglomerating scope of described thick film thermal printing head.
4. the selective fine hot melt molding equipment with thick film thermal printing head according to claim 1, it is characterized in that, described powder comprises plastic powders or/and nylon powder.
5. the selective fine hot melt molding equipment with thick film thermal printing head according to claim 1, it is characterized in that, described table device comprises:
Workbench, described shaped region is arranged on described workbench;
Lowering or hoisting gear, described lifting is arranged under described workbench to be elevated described workbench.
6. the selective fine hot melt molding equipment with thick film thermal printing head according to claim 1, it is characterized in that, described powder feeding device comprises:
Powder feeding device, described powder feeding device by described powder feeding to described workbench upper surface on;
Powder laying device, described powder laying device to be arranged on described workbench and described powder can be pushed in described shaped region and to pave.
7. the selective fine hot melt molding equipment with thick film thermal printing head according to claim 1, is characterized in that, the sintering diameter of each described heat fusion joint is 0.1-0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510547940.7A CN105058807A (en) | 2015-09-01 | 2015-09-01 | Selective micro hot-melting shaping device with thick-film thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510547940.7A CN105058807A (en) | 2015-09-01 | 2015-09-01 | Selective micro hot-melting shaping device with thick-film thermal print head |
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| CN105058807A true CN105058807A (en) | 2015-11-18 |
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| CN201510547940.7A Pending CN105058807A (en) | 2015-09-01 | 2015-09-01 | Selective micro hot-melting shaping device with thick-film thermal print head |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105835370A (en) * | 2016-05-18 | 2016-08-10 | 上海悦瑞三维科技股份有限公司 | Multi-printing-head fine hot-melt molding 3D printing system |
| CN105965019A (en) * | 2016-07-19 | 2016-09-28 | 梁春永 | Special processing platform for double-light-source metal powder three-dimensional printing system |
| CN112659557A (en) * | 2020-12-30 | 2021-04-16 | 无锡科技职业学院 | Novel heating system for selective thermal printing rapid prototyping equipment |
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| CN103442830A (en) * | 2011-03-17 | 2013-12-11 | 松下电器产业株式会社 | Production method for three-dimensionally shaped object and three-dimensionally shaped object |
| CN204936236U (en) * | 2015-09-01 | 2016-01-06 | 上海悦瑞电子科技有限公司 | There is the selective fine hot melt molding equipment of thick film thermal printing head |
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| CN101412323A (en) * | 2008-11-28 | 2009-04-22 | 山东华菱电子有限公司 | Thermal print head and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105835370A (en) * | 2016-05-18 | 2016-08-10 | 上海悦瑞三维科技股份有限公司 | Multi-printing-head fine hot-melt molding 3D printing system |
| CN105965019A (en) * | 2016-07-19 | 2016-09-28 | 梁春永 | Special processing platform for double-light-source metal powder three-dimensional printing system |
| CN112659557A (en) * | 2020-12-30 | 2021-04-16 | 无锡科技职业学院 | Novel heating system for selective thermal printing rapid prototyping equipment |
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Application publication date: 20151118 |