CN105047790A - 一种实用的大功率led封装结构 - Google Patents
一种实用的大功率led封装结构 Download PDFInfo
- Publication number
- CN105047790A CN105047790A CN201510498407.6A CN201510498407A CN105047790A CN 105047790 A CN105047790 A CN 105047790A CN 201510498407 A CN201510498407 A CN 201510498407A CN 105047790 A CN105047790 A CN 105047790A
- Authority
- CN
- China
- Prior art keywords
- wire
- copper
- layer
- power led
- encapsulation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 13
- 239000011733 molybdenum Substances 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 10
- 230000004888 barrier function Effects 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000002196 Pyroceram Substances 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000009826 distribution Methods 0.000 abstract description 6
- 238000000605 extraction Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 2
- 239000002241 glass-ceramic Substances 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510498407.6A CN105047790B (zh) | 2015-08-14 | 2015-08-14 | 一种实用的大功率led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510498407.6A CN105047790B (zh) | 2015-08-14 | 2015-08-14 | 一种实用的大功率led封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105047790A true CN105047790A (zh) | 2015-11-11 |
CN105047790B CN105047790B (zh) | 2018-01-12 |
Family
ID=54454173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510498407.6A Active CN105047790B (zh) | 2015-08-14 | 2015-08-14 | 一种实用的大功率led封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105047790B (zh) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1111567A (zh) * | 1993-12-28 | 1995-11-15 | 日本电解株式会社 | 敷铜箔层压板,多层印刷电路板及其处理方法 |
US5998043A (en) * | 1996-02-05 | 1999-12-07 | Sumitomo Electric Industries, Ltd. | Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same |
CN1707782A (zh) * | 2004-06-10 | 2005-12-14 | 佶鸿电子股份有限公司 | 一种散热基板及其制法 |
CN101418938A (zh) * | 2007-10-23 | 2009-04-29 | 株式会社日立制作所 | 光源模块 |
CN102194968A (zh) * | 2010-03-19 | 2011-09-21 | 佛山市奇明光电有限公司 | 发光二极管 |
CN202018960U (zh) * | 2010-12-10 | 2011-10-26 | 奉化市匡磊半导体照明有限公司 | 绝缘底板发光芯片封装结构 |
CN102412361A (zh) * | 2010-09-21 | 2012-04-11 | 佳胜科技股份有限公司 | 层叠散热基板以及使用此层叠散热基板的电子组装结构 |
-
2015
- 2015-08-14 CN CN201510498407.6A patent/CN105047790B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1111567A (zh) * | 1993-12-28 | 1995-11-15 | 日本电解株式会社 | 敷铜箔层压板,多层印刷电路板及其处理方法 |
US5998043A (en) * | 1996-02-05 | 1999-12-07 | Sumitomo Electric Industries, Ltd. | Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same |
CN1707782A (zh) * | 2004-06-10 | 2005-12-14 | 佶鸿电子股份有限公司 | 一种散热基板及其制法 |
CN101418938A (zh) * | 2007-10-23 | 2009-04-29 | 株式会社日立制作所 | 光源模块 |
CN102194968A (zh) * | 2010-03-19 | 2011-09-21 | 佛山市奇明光电有限公司 | 发光二极管 |
CN102412361A (zh) * | 2010-09-21 | 2012-04-11 | 佳胜科技股份有限公司 | 层叠散热基板以及使用此层叠散热基板的电子组装结构 |
CN202018960U (zh) * | 2010-12-10 | 2011-10-26 | 奉化市匡磊半导体照明有限公司 | 绝缘底板发光芯片封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN105047790B (zh) | 2018-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Wang Yonghui Inventor before: He Bei |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171212 Address after: 241300 Anhui province Wuhu city Nanling County Economic Development Zone, Tianjing science and technology incubator 2018 room Applicant after: Nanling Wangke Intellectual Property Management Co.,Ltd. Address before: 241300 Anhui City, Wuhu province Nanling County town, Zhongshan District, building 3, unit 302, room 1 Applicant before: He Bei |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180809 Address after: 529080 the 2 floor of 4 building, No. 33 Minghui Road, Jianghai District, Jiangmen, Guangdong (self compiled 03 rooms) Patentee after: JIANGMEN ZHONGLIANG OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 241300 room 2018, Tianjing science and technology incubator, Nanling County Economic Development Zone, Wuhu, Anhui Patentee before: Nanling Wangke Intellectual Property Management Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Practical Packaging Structure of High Power LED Effective date of registration: 20221101 Granted publication date: 20180112 Pledgee: Jiangmen Rural Commercial Bank Co.,Ltd. Jianghai central sub branch Pledgor: JIANGMEN ZHONGLIANG OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2022980020328 |