CN105047654B - Stereo luminous filament, processing technology and LED light device - Google Patents
Stereo luminous filament, processing technology and LED light device Download PDFInfo
- Publication number
- CN105047654B CN105047654B CN201510448270.3A CN201510448270A CN105047654B CN 105047654 B CN105047654 B CN 105047654B CN 201510448270 A CN201510448270 A CN 201510448270A CN 105047654 B CN105047654 B CN 105047654B
- Authority
- CN
- China
- Prior art keywords
- substrate
- encapsulating structure
- stereo luminous
- flip chip
- led flip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of stereo luminous filament, processing technology and LED light device.It solves the problems such as existing design is unreasonable.This stereo luminous filament includes the substrate for being in strip and being made up of transparent material or light transmissive material, pad is respectively equipped with the two ends of substrate, substrate one side provided with least two two ends be connected respectively with described pad and setting parallel with one another bent conductive wire road, the LED flip chip for being respectively equipped with some LED flip chips on every bent conductive wire road and being arranged in differently curved conducting wire is located along the same line, and encapsulating structure is circumferentially with substrate.The processing technology of stereo luminous filament includes A, positioning, B, pre-bending, C, riveting, D, paster, E, encapsulation.This LED light device includes bearing substrate, provided with least one stereo luminous filament on bearing substrate.The advantage of the invention is that：Luminosity is uniform and to improve production efficiency, service life long.
Description
Technical field
The invention belongs to technical field of lighting fixtures, more particularly, to a kind of stereo luminous filament, processing technology and LED
Lighting device.
Background technology
Traditional filament is wire and mostly thin tungsten filament, and also useful iridium or their alloy, can directly send out during energization
Light, heating, or electron radiation, ultraviolet, formation high electric field or generation high-energy ray equal excitation fluorescent material, rare gas
Or plasma etc. is formed, produce a variety of colors visible ray.Although the filament of this traditional structure its with more than it is many excellent
Also at least there is following defect in point, still, this filament：Luminosity is poor and brightness is uneven.For example, Chinese patent literature
Disclose a kind of LED filament [application number：201320674278.8], including：Substrate, the multiple chips being fixed on substrate, bag
Enclose the protective layer of chip and substrate；The chip includes substrate, the first gallium nitride, luminescent layer and the second nitrogen successively from bottom to top
Change gallium, the material of the substrate is light transmissive material；Substrate is used into light transmissive material, then can allow the light penetration base of luminescent layer
Plate, can realize the luminous of 360 ° of Omnibearing evens；When substrate is light transmissive material, then without using reflecting layer, without making
With patterning LED substrate, therefore production technology is greatly simplified, reduce production cost.In addition, Chinese patent literature is also public
A kind of LED filament [application number is opened：201320859050.6], including：It is provided with the U-shaped or vertical bar type bar of transmittance section and pin
Shape substrate, it is fixedly arranged on the bar shaped substrate and by the LED luminescence chip groups of the pin powered, and is wrapped in bar shaped base
Plate and the fluorescent colloid of LED luminescence chip groups periphery, the transmittance section is the loophole set on bar shaped substrate, the LED hairs
Optical chip group is fixedly arranged on the region that the bar shaped substrate is not provided with loophole.So, due to being provided with transmittance section and base on substrate
Plate is in bar shaped so that LED luminescence chips can pass through transmittance section light extraction, so as to expand the lighting angle of LED filament, improve
The luminescent properties of LED encapsulating products.Further, since fluorescent colloid bag is simplified glimmering located at substrate and LED luminescence chip groups periphery
The moulding process and its accuracy of optical cement body, improve the yields of fluorescent colloid shaping efficiency and LED encapsulating products.
Although above-mentioned scheme each has multiple advantages above, this several scheme but also at least exists following
Defect：Luminosity is uneven and luminance difference, the wider width of filament and complicated, and secondly, the processing technology of filament is complicated
And it is less efficient.
The content of the invention
Regarding the issue above, the present invention provides a kind of design is more reasonable, luminosity is uniform and filament width
Narrower stereo luminous filament.
Second object of the present invention is in view of the above-mentioned problems, to provide a kind of technique simple and can improve the vertical of production efficiency
The processing technology of body light-emitting filament.
Third object of the present invention is that luminosity is uniform and ties in view of the above-mentioned problems, providing one kind designs more reasonable
The simple LED illumination device of structure.
To reach above-mentioned purpose, present invention employs following technical proposal：This stereo luminous filament include in strip and
The substrate being made up of transparent material or light transmissive material, pad is respectively equipped with the two ends of substrate, is provided with extremely in the one side of substrate
Few two two ends be connected respectively with described pad and setting parallel with one another bent conductive wire road, on every bent conductive wire road
On be respectively equipped with some LED flip chips and the LED flip chip that is arranged in differently curved conducting wire is located at same straight line
On, in the encapsulating structure that is circumferentially with of substrate, encapsulating structure is by described LED flip chip encapsulation and when LED flip chip is led to
Project to the brightness of encapsulating structure to project to encapsulation knot from substrate another side away from LED flip chip one side from substrate after electricity
More than the 30% of the brightness of structure.
In above-mentioned stereo luminous filament, described encapsulating structure include respectively can by the both sides covering of substrate and
By the first encapsulated layer of the LED flip chip encapsulation located at substrate side, set in the one side of the remote LED flip chip of substrate
There is the second encapsulated layer, and the brightness projected after LED flip chip is powered from the second encapsulated layer is projected from the first encapsulated layer
Brightness more than 30%, the light projected from the first encapsulated layer and the second encapsulated layer is white light and both colour temperatures are identical.
In above-mentioned stereo luminous filament, the first described encapsulated layer includes the component of following mass fraction：Green is glimmering
8.5~10 parts of light powder；1.8~2.5 parts of red fluorescence powder；35~40 parts of A glue；17.5~20 parts of B glue；Described green fluorescence
Powder, red fluorescence powder, A glue and B glue are uniformly mixed and made into the first described encapsulated layer.
In above-mentioned stereo luminous filament, the second described encapsulated layer includes the component of following mass fraction：Green is glimmering
2~2.3 parts of light powder；0.3~0.4 part of red fluorescence powder；35~40 parts of A glue；17.5~20 parts of B glue；Described green emitting phosphor,
Red fluorescence powder, A glue and B glue are uniformly mixed and made into the second described encapsulated layer.
In above-mentioned stereo luminous filament, described LED flip chip is blue light or purple light chip, and the ripple of the chip
A length of 365-470nm.The wavelength of blue chip is 440-460nm, and the wavelength of purple light chip is 365-470nm.
In above-mentioned stereo luminous filament, described encapsulating structure it is circumferential by encapsulating structure described after substrate package and
Substrate is connected to form cylindrical structure；Or encapsulating structure is circumferential by encapsulating structure and substrate phase described after substrate package
Even formed is in flat laminated structure.
In above-mentioned stereo luminous filament, described pad is arranged on the one side of substrate, also distinguishes at the two ends of substrate
Provided with the metal connecting piece being electrically connected with pad.
In above-mentioned stereo luminous filament, described metal connecting piece is made up of sheet material, and described metal connecting piece is
Any one in iron nickel-plated metal connector, iron silver plated metals connector and copper silver plated metals connector.
In above-mentioned stereo luminous filament, described metal connecting piece one end is provided with, and there is opening to be in open positioning
The attachment structure of groove, described substrate two ends are each inserted in described locating slot and locating slot and bore at open communication are small
In the external diameter of substrate, and described encapsulating structure blocks the opening of locating slot.
In above-mentioned stereo luminous filament, described attachment structure includes being separately positioned on metal connecting piece one end both sides
And symmetrically arranged bending compressed part, formed between described bending compressed part it is above-mentioned with opening in open locating slot
Attachment structure.
In above-mentioned stereo luminous filament, it is additionally provided with described metal connecting piece for preventing described undue substrate
It is inserted in the position limiting structure in locating slot.
In above-mentioned stereo luminous filament, described position limiting structure includes being arranged on metal connecting piece one side and positioned at fixed
The shaping of position groove outer end is raised；Have and the raised corresponding contoured depressions of described shaping in the another side of metal connecting piece.
The processing technology of this stereo luminous filament comprises the following steps：
A, positioning：By at least two and one group of metal connecting piece being correspondingly arranged is fixed two-by-two, set in one group two-by-two correspondence
The corresponding one end both sides of the metal connecting piece put are respectively equipped with symmetrically arranged bent compressed part；
B, pre-bending：Symmetrically arranged two bent compressed parts are symmetrically set to opposite side bending so as to form two
It is in open cell body that opening is formed between the pre-bend compressed part put, and two pre-bend compressed parts；
C, riveting：The two ends difference for the substrate that at least one piece is made in strip and by transparent material or light transmissive material
Opening is inserted in in open cell body, pad is respectively equipped with the one side two ends of every piece of substrate, is printed between two pads
There is the bent conductive wire road of at least two and setting parallel with one another, two pre-bend compressed parts are then made by riveting processing mode
To opposite side bending so as to form the bending compressed part being press respectively against on substrate；
D, paster：Every bent conductive wire road being printed on every piece of substrate is fixed with some LED by conducting resinl respectively
The flip-chip and LED flip chip being arranged in differently curved conducting wire is located along the same line, that is, be made to be packaged half
Finished product；
E, encapsulation：Semi-finished product to be packaged are fixed in shaping mold cavity, then into shaping mold cavity, injection is mixed with fluorescence
The packaging plastic of powder is so that the circumference of substrate is covered with encapsulating structure, and described LED flip chip is encapsulated and worked as by encapsulating structure
It is another from substrate that LED flip chip is projected to the brightness of encapsulating structure after being powered from substrate away from LED flip chip one side
Face is projected to more than the 30% of the brightness of encapsulating structure, equal from each orientation light for being arranged on the circumferential encapsulating structure injection of substrate
Colour temperature for white light and each orientation light is identical, that is, stereo luminous filament finished product is made.
In the processing technology of above-mentioned stereo luminous filament, in above-mentioned step A, described metal connecting piece is by plate
Material punch forming, and one group of metal connecting piece being correspondingly arranged is molded over the inner side edge of punching press clout housing respectively two-by-two, in punching
Some one group of metal connecting pieces for being correspondingly arranged two-by-two are formed on discard material housing inner side edge.
In the processing technology of above-mentioned stereo luminous filament, in above-mentioned step C, some outside punching press clout
Inframe side and in described substrate is respectively equipped between one group of metal connecting piece two-by-two, prepares when by riveting processing mode
Make two pre-bend compressed parts to opposite side bend when, first on metal connecting piece and positioned at two pre-bend compressed parts it
Between conducting resinl is set, then by the pad at substrate two ends be individually positioned on the conducting resinl of respective metal connecting piece and substrate outside
Unnecessary conducting resinl is forced to enter in the pre-bend compressed part of substrate both sides in the presence of active force.
In the processing technology of above-mentioned stereo luminous filament, opening is formed in open between two bending compressed parts
Locating slot, substrate inserts in locating slot and positions external diameter of the bore less than substrate of channel opening, when described bending pressing section
Melt conducting resinl by Reflow Soldering after not being pressed on substrate and bending compressed part is connected with substrate.
In the processing technology of above-mentioned stereo luminous filament, in above-mentioned D steps, the outer inframe of punching press clout is arranged on
The substrate of side is arranged at intervals, if every bent conductive wire road being printed on every piece of substrate is fixed with by conducting resinl respectively
The LED flip chip done LED flip chip and be arranged in differently curved conducting wire is located along the same line, that is, being made has
The justifying unit to be packaged of some semi-finished product to be packaged.Justifying unit to be packaged can improve production efficiency and reduction is produced into
This.
In the processing technology of above-mentioned stereo luminous filament, in above-mentioned E steps, will have some to be packaged half into
The justifying unit to be packaged of product is fixed in shaping mold cavity, then into shaping mold cavity injection be mixed with the packaging plastic of fluorescent material from
And making the circumferential covered with encapsulating structure of each piece of substrate, encapsulating structure encapsulates described LED flip chip and when LED upside-down mounting cores
Piece projects to the brightness of encapsulating structure to project to envelope from substrate another side from substrate after being powered away from LED flip chip one side
More than the 30% of the brightness of assembling structure, i.e., being made in punching press clout housing has some stereo luminous filaments, then passes through punching
Mode makes punching press clout housing be separated with metal connecting piece, i.e., some stereo luminous filament finished products are once made.
This LED light device includes bearing substrate, provided with least one stereo luminous filament on bearing substrate, and every is stood
Body light-emitting filament includes the substrate for being in strip and being made up of transparent material or light transmissive material respectively, distinguishes at the two ends of substrate
Provided with pad, the one side of substrate be connected respectively with described pad provided with least two two ends and setting parallel with one another bending
Conducting wire, some LED flip chips are respectively equipped with every bent conductive wire road and differently curved conducting wire is arranged on
On LED flip chip be located along the same line, in the encapsulating structure that is circumferentially with of substrate, encapsulating structure falls described LED
Cartridge chip is encapsulated and projected after LED flip chip is powered from substrate away from LED flip chip one side to the light of encapsulating structure
Spend to project to more than the 30% of the brightness of encapsulating structure from substrate another side.
In above-mentioned LED light device, the lampshade that described bearing substrate includes lamp holder and is connected on lamp holder, in lamp
Head is provided with the filament fixed mount that inserts in lampshade, described filament fixed mount be distributed provided with some even circumferentials and respectively with
The stereo luminous filament that lamp holder is electrically connected.
Compared with prior art, the advantage of the invention is that：1st, design more reasonable, luminosity is uniform and brightness is high,
The LED flip chip being arranged in differently curved conducting wire, which is located along the same line, can further reduce the width of substrate,
The practicality of filament can further be improved.2nd, technique is simple and can improve luminosity uniformity, improves production efficiency.3、
Illuminator structure is simple and luminosity is uniform, and brightness is high and practical, secondly, small volume.4th, it is simple in construction and be easy to
Manufacture, service life is long.
Brief description of the drawings
The filamentray structure schematic diagram that Fig. 1 provides for the present invention.
Fig. 2 is the unencapsulated structural representation of the filament of the invention provided.
Fig. 3 does not paste the structural representation of chip for the filament that the present invention is provided.
Fig. 4 is that Fig. 2 removes the structural representation after metal connecting piece.
The filament lateral cross section structural representation that Fig. 5 provides for the present invention.
The structural representation that Fig. 6 is not connected with for the substrate that the present invention is provided with metal connecting piece.
Fig. 7 be connected for the substrate that provides of the present invention with metal connecting piece after structural representation.
Structural representation during non-for the bent compressed part of metal connecting piece that provides of the present invention bendings of Fig. 8.
The structural representation of pre-bend compressed part is formed after the bent compressed part bending that Fig. 9 provides for the present invention.
Figure 10 is the pre-bend compressed part of the invention provided by the structural representation after riveting.
Figure 11 is placed on the structural representation on metal connecting piece for the substrate two ends that the present invention is provided.
Figure 12 is the structural representation that Figure 11 removes metal connecting piece.
Punching press clout housing and the integrally formed structural representation of metal connecting piece that Figure 13 provides for the present invention.
Figure 14 provides the structural representation placed on metal connecting piece after substrate for the present invention.
The illuminator structure schematic diagram that Figure 15 provides for the present invention.
The structural representation of embodiment two that Figure 16 provides for the present invention.
Figure 17 is A-A in Figure 16 to section view mplifying structure schematic diagram.
In figure, substrate 1, pad 11, bent conductive wire road 12, LED flip chip 2, encapsulating structure 3, the first encapsulated layer 31,
Second encapsulated layer 32, metal connecting piece 4, attachment structure 41, locating slot 41a, position limiting structure 42, shaping projection 42a, contoured depressions
42b, bent compressed part 4a, bending compressed part 4b, pre-bend compressed part 4c, punching press clout housing 5, bearing substrate 6, lamp holder
61st, lampshade 62, filament fixed mount 63, stereo luminous filament a.
Embodiment
Specific embodiment the following is invention and with reference to accompanying drawing, is further described to technical scheme, but
The present invention is not limited to these embodiments.
Embodiment one
As shown in Fig. 1-4 and Figure 12, this stereo luminous filament is included in strip and by transparent material or light transmissive material
The substrate 1 being made, pad 11 is respectively equipped with the two ends of substrate 1, substrate 1 one side provided with least two two ends respectively with institute
The pad 11 stated be connected and setting parallel with one another bent conductive wire road 12, if being respectively equipped with every bent conductive wire road 12
The LED flip chip 2 done LED flip chip 2 and be arranged in differently curved conducting wire 12 is located along the same line, and LED falls
Cartridge chip 2 is blue light or purple light chip, and the wavelength of the chip is 365-470nm.When for blue chip, the wavelength of chip is
440-460nm.When for purple light chip, the wavelength of chip is 365-470nm.The bent conductive wire road 12 being arranged in parallel combines and set
Production system can be greatly reduced by putting the structure that the LED flip chip 2 in differently curved conducting wire 12 is located along the same line
The cost made, meanwhile, it is easy to manufacture and using control.
As shown in Figure 1 and Figure 5, encapsulating structure 3 is circumferentially with substrate 1, prioritization scheme, encapsulating structure 3 is circumferential by base
The encapsulating structure 3 described after encapsulating of plate 1 and substrate 1 are connected to form cylindrical structure.Columned structural volume is small and makes
Cause low, so that suitable for various lighting apparatus.Encapsulating structure 3 encapsulates described LED flip chip 2 and when LED upside-down mountings
Chip 2 from substrate 1 away from the brightness that LED flip chip 2 is simultaneously projected to encapsulating structure 3 is from the another side of substrate 1 after being powered
Project to more than the 30% of the brightness of encapsulating structure 3.The structure ensure that the uniformity of luminosity, so as to improve practicality
Property.After LED flip chip 2 is powered from substrate 1 away from LED flip chip 2 simultaneously project to encapsulating structure 3 brightness be from
The another side of substrate 1 projects the 30%-100% of the brightness to encapsulating structure 3.
Specifically, the encapsulating structure 3 of the present embodiment includes to cover and will be located at substrate 1 by the both sides of substrate 1 respectively
The first encapsulated layer 31 that LED flip chip 2 simultaneously is encapsulated, is provided with the in the one side of remote the LED flip chip 2 of substrate 1
Two encapsulated layers, and the brightness projected after LED flip chip 2 is powered from the second encapsulated layer 32 is projected from the first encapsulated layer 31
Brightness more than 30%, the light projected from the first encapsulated layer 31 and the second encapsulated layer 32 is white light and both colour temperature phases
Together.Further, the first encapsulated layer 31 here includes the component of following mass fraction：8.5~10 parts of green emitting phosphor；It is red
1.8~2.5 parts of fluorescent material；35~40 parts of A glue；17.5~20 parts of B glue；Described green emitting phosphor, red fluorescence powder, A glue and B
Glue is uniformly mixed and made into the first described encapsulated layer 31.Second encapsulated layer 32 includes the component of following mass fraction：Green fluorescence
2~2.3 parts of powder；0.3~0.4 part of red fluorescence powder；35~40 parts of A glue；17.5~20 parts of B glue；It is described green emitting phosphor, red
Color fluorescent material, A glue and B glue are uniformly mixed and made into the second described encapsulated layer 32.
Prioritization scheme, first encapsulated layer 31 of the present embodiment includes the component of following mass fraction：10 parts of green emitting phosphor；
2.5 parts of red fluorescence powder；40 parts of A glue；20 parts of B glue；Described green emitting phosphor, red fluorescence powder, A glue and B glue is uniformly mixed
The first described encapsulated layer 31 is made.Second encapsulated layer 32 includes the component of following mass fraction：2 parts of green emitting phosphor；It is red
0.3 part of fluorescent material；40 parts of A glue；20 parts of B glue；Described green emitting phosphor, red fluorescence powder, A glue and B glue is uniformly mixed
The second described encapsulated layer 32.
For the ease of installing, as shown in figures 1 to 6, the pad 11 of the present embodiment is arranged on the one side of substrate 1, in substrate 1
Two ends further respectively have the metal connecting piece 4 being electrically connected with pad 11.Metal connecting piece 4 is made up of sheet material, and described metal connects
Fitting 4 is any one in iron nickel-plated metal connector, iron silver plated metals connector and copper silver plated metals connector.
Secondly, as shown in Fig. 2-3, Fig. 7 and Fig. 9-10, being provided with the one end of metal connecting piece 4 has opening in open
Locating slot 41a attachment structure 41, the described two ends of substrate 1 are each inserted in described locating slot 41a and locating slot 41a is with opening
The bore of mouth connectivity part is less than the external diameter of substrate 1, and described encapsulating structure 3 blocks locating slot 41a opening.The structure energy
It is enough further to prevent locating slot 41a outward opening from expanding, extend service life.Attachment structure includes being separately positioned on metal
Formed between one end both sides of connector 4 and symmetrically arranged bending compressed part 4b, described bending compressed part 4b it is above-mentioned have open
Mouth is in open locating slot 41a, and opening ensure that in open locating slot 41a to be installed in place, and can prevent two bendings
End thereof contacts opposite compressed part 4b cause to install not in place.The structure ensure that packaging efficiency, meanwhile, in locating slot 41a
Conducting resinl is provided between substrate 1, to strengthen electric conductivity.
In addition, as shown in Figure 2 and Figure 6, being additionally provided with metal connecting piece 4 for preventing described substrate 1 to be excessively inserting
Position limiting structure 42 in locating slot 41a.Position limiting structure 42 includes being arranged on the one side of metal connecting piece 4 and positioned at locating slot 41a
The shaping projection 42a of outer end；Have the shaping corresponding with described shaping projection 42a recessed in the another side of metal connecting piece 4
Fall into 42b.The structure ensure that the stability of assembling quality, it is to avoid what is repeated does over again.
The processing technology of this stereo luminous filament comprises the following steps：
A, positioning：As shown in figure 8, the metal connecting piece 4 that at least two and two-by-two one group are correspondingly arranged is fixed, two-by-two
One group of corresponding one end both sides of the metal connecting piece 4 being correspondingly arranged is respectively equipped with symmetrically arranged bent compressed part 4a；Can
Bend compressed part 4a bendings when by folding line of the side of metal connecting piece 4 point；
B, pre-bending：As shown in figure 9, by symmetrically arranged two bent compressed part 4a to opposite side bending so as to shape
It is in open groove into opening is formed between two symmetrically arranged pre-bend compressed part 4c, and two pre-bend compressed part 4c
Body；The depth of cell body is more than the thickness of substrate 1, is easy to the insertion of substrate 1；
C, riveting：As shown in figure 9, the substrate that at least one piece is made in strip and by transparent material or light transmissive material
1 two ends insert in opening in open cell body respectively, pad 11 are respectively equipped with the one side two ends of every piece of substrate 1, two
The bent conductive wire road 12 of at least two and setting parallel with one another is printed between individual pad 11, such as Fig. 3, Fig. 7 and Figure 10 and
With reference to shown in Fig. 9, then make two pre-bend compressed part 4c to opposite side bending to be formed by riveting processing mode
It is press respectively against the bending compressed part 4b on substrate 1；
D, paster：As shown in Fig. 2 every bent conductive wire road 12 being printed on every piece of substrate 1 is respectively by conducting resinl
The LED flip chip 2 for being fixed with some LED flip chips 2 and being arranged in differently curved conducting wire 12 is located at same straight line
On, that is, semi-finished product to be packaged are made；
E, encapsulation：As shown in Figure 1 and Figure 5, semi-finished product to be packaged are fixed in shaping mold cavity, then into shaping mold cavity
Injection be mixed with the packaging plastic of fluorescent material so that substrate 1 it is circumferential covered with encapsulating structure 3, encapsulating structure 3 is by described LED
Flip-chip 2 is encapsulated and simultaneously projected to encapsulating structure 3 away from LED flip chip 2 from substrate 1 after LED flip chip 2 is powered
Brightness to project more than 30% of the brightness to encapsulating structure 3 from the another side of substrate 1, it is circumferential from substrate 1 is arranged on
Each orientation light that encapsulating structure 3 is projected is that the colour temperature of white light and each orientation light is identical, that is, stereo luminous filament finished product is made.
In above-mentioned step A, as shown in figure 13, described metal connecting piece 4 is molded by plate stamping, and one group two-by-two
The metal connecting piece 4 being correspondingly arranged is molded over the inner side edge of punching press clout housing 5 respectively, on the inner side edge of punching press clout housing 5
Form some one group of metal connecting pieces 4 for being correspondingly arranged two-by-two.The structure can improve production efficiency, i.e. once may be used
To manufacture multiple metal connecting pieces 4.
In above-mentioned step C, as shown in Fig. 9 and Figure 14, some located at the inner side edge of punching press clout housing 5 and in two-by-two
Described substrate 1 is respectively equipped between one group of metal connecting piece 4, when preparing to make two pre-bending crimpings by riveting processing mode
Tight portion 4c to opposite side bend when, first set on metal connecting piece 4 and between two pre-bend compressed part 4c and lead
The intermediate projections of electric glue, such as Fig. 9 are conducting resinl, and two arrows represent conducting resinl flow direction, then by the pad at the two ends of substrate 1
11 are individually positioned on the conducting resinl of respective metal connecting piece 4 and substrate 1 forces unnecessary conduction in the presence of outer active force
Glue is entered on the pre-bend compressed part 4c of the both sides of substrate 1.Bend compressed part 4b L-shaped.Shape between two bending compressed part 4b
It is in open locating slot 41a into opening, substrate 1 inserts in the bore that in locating slot 41a and locating slot 41a is open and is less than substrate 1
External diameter, melt conducting resinl by Reflow Soldering after described bending compressed part 4b is press respectively against on substrate 1 and press bending
Tight portion 4b is connected with substrate 1.The structure can further enhance electric conductivity, prevent from causing product can not due to loose contact
Use.
In above-mentioned D steps, as shown in Figure 14 combinations Fig. 2, the substrate 1 of the inner side of punching press clout housing 5 is arranged on
It is arranged at intervals, every bent conductive wire road 12 being printed on every piece of substrate 1 is fixed with some LED upside-down mountings by conducting resinl respectively
The chip 2 and LED flip chip 2 being arranged in differently curved conducting wire 12 is located along the same line, that is, be made have it is some
The justifying unit to be packaged of semi-finished product to be packaged.Justifying unit to be packaged can improve the steady quality of production efficiency and product
Property, it is to avoid the low technical problem of single production efficiency.
It is as shown in Figure 14 combinations Fig. 1, the justifying with some semi-finished product to be packaged is to be packaged in above-mentioned E steps
Unit is fixed in shaping mold cavity, and then into shaping mold cavity, injection is mixed with the packaging plastic of fluorescent material so that each piece of substrate 1
It is circumferential covered with encapsulating structure 3, encapsulating structure 3 encapsulates described LED flip chip 2 and after LED flip chip 2 is powered
Simultaneously project to the brightness of encapsulating structure 3 to project to encapsulation knot from the another side of substrate 1 away from LED flip chip 2 from substrate 1
More than the 30% of the brightness of structure 3, i.e., being made in punching press clout housing 5 has some stereo luminous filaments, then by punching side
Formula makes punching press clout housing 5 be separated with metal connecting piece 4, i.e., some stereo luminous filament finished products are once made.
As shown in Fig. 1-7 and Figure 15, this lighting device includes bearing substrate 6, vertical provided with least one on bearing substrate 6
Body light-emitting filament a, every stereo luminous filament a include the base for being in strip and being made up of transparent material or light transmissive material respectively
Plate 1, pad 11 is respectively equipped with the two ends of substrate 1, substrate 1 one side provided with least two two ends respectively with described pad
11 be connected and settings parallel with one another bent conductive wire road 12, on every bent conductive wire road 12 being respectively equipped with some LED falls
The cartridge chip 2 and LED flip chip 2 being arranged in differently curved conducting wire 12 is located along the same line, in the circumference of substrate 1
Provided with encapsulating structure 3, encapsulating structure 3 encapsulates described LED flip chip 2 and after LED flip chip 2 is powered from substrate 1
Simultaneously project to the brightness of encapsulating structure 3 to project to the light of encapsulating structure 3 from the another side of substrate 1 away from LED flip chip 2
More than the 30% of brightness.
Bearing substrate 6 includes lamp holder 61 and the lampshade 62 being connected on lamp holder 61, is provided with lamp holder 61 and inserts in lampshade 62
Interior filament fixed mount 63, what described filament fixed mount 63 was distributed provided with some even circumferentials and was electrically connected respectively with lamp holder 61
Stereo luminous filament a.LED light device includes any one in bulb lamp, fluorescent tube, Lawn lamp.
Embodiment two
As shown in figs. 16-17, the structure and principle of the present embodiment be the same as Example one are essentially identical, Gu therefore not to repeat here,
And different place is：The encapsulating structure 3 described after circumferentially substrate 1 is encapsulated of encapsulating structure 3 and substrate 1 are connected to form and are in
Flat laminated structure.
Embodiment three
The structure and principle of the present embodiment be the same as Example one are essentially identical, though therefore not to repeat here, different place
It is：First encapsulated layer 31 includes the component of following mass fraction：8.5 parts of green emitting phosphor；1.8 parts of red fluorescence powder；A glue 35
~40 parts；17.5~20 parts of B glue；Described green emitting phosphor, red fluorescence powder, A glue and B glue is uniformly mixed and made into described the
One encapsulated layer 31.
Second encapsulated layer 32 includes the component of following mass fraction：2.3 parts of green emitting phosphor；0.4 part of red fluorescence powder；A
35~40 parts of glue；17.5~20 parts of B glue；Described green emitting phosphor, red fluorescence powder, A glue and B glue is uniformly mixed described
The second encapsulated layer 32.
Specific embodiment described herein is only to spirit explanation for example of the invention.Technology neck belonging to of the invention
The technical staff in domain can be made various modifications or supplement to described specific embodiment or be replaced using similar mode
Generation, but without departing from the spiritual of the present invention or surmount scope defined in appended claims.
Although more having used substrate 1, pad 11, bent conductive wire road 12, LED flip chip 2, encapsulating structure herein
3rd, the first encapsulated layer 31, the second encapsulated layer 32, metal connecting piece 4, attachment structure 41, locating slot 41a, position limiting structure 42, shaping
Raised 42a, contoured depressions 42b, bent compressed part 4a, bending compressed part 4b, pre-bend compressed part 4c, punching press clout housing 5,
The terms such as bearing substrate 6, lamp holder 61, lampshade 62, filament fixed mount 63, stereo luminous filament a, but be not precluded from using other arts
The possibility of language.It is used for the purpose of more easily describing and explaining the essence of the present invention using these terms；It is construed as
The additional limitation of any one is all disagreed with spirit of the present invention.
Claims (19)
1. a kind of stereo luminous filament, it is characterised in that this filament is included in strip and by transparent material or light transmissive material
The substrate (1) being made, pad (11) is respectively equipped with the two ends of substrate (1), and at least two two ends are provided with the one side of substrate (1)
Be connected respectively with described pad (11) and setting parallel with one another bent conductive wire road (12), on every bent conductive wire road
(12) LED flip chip that some LED flip chips (2) are respectively equipped with and are arranged in differently curved conducting wire (12)
(2) it is located along the same line, encapsulating structure (3) is circumferentially with substrate (1), encapsulating structure (3) is by described LED upside-down mounting cores
Piece (2) is encapsulated and projected after LED flip chip (2) is powered from substrate (1) away from LED flip chip (2) one side to encapsulation knot
The brightness of structure (3) is to project more than 30% of the brightness to encapsulating structure (3) from substrate (1) another side；
Described encapsulating structure (3) includes the both sides of substrate (1) can be covered to and will be located at the LED of substrate (1) one side respectively
The first encapsulated layer (31) of flip-chip (2) encapsulation, is provided with second in the one side of the remote LED flip chip (2) of substrate (1)
Encapsulated layer, and the brightness projected after LED flip chip (2) is powered from the second encapsulated layer (32) is from the first encapsulated layer (31)
More than the 30% of the brightness of injection, the light projected from the first encapsulated layer (31) and the second encapsulated layer (32) be white light and both
Colour temperature is identical.
2. stereo luminous filament according to claim 1, it is characterised in that described the first encapsulated layer (31) includes following
The component of mass fraction：8.5~10 parts of green emitting phosphor；1.8~2.5 parts of red fluorescence powder；35~40 parts of A glue；B glue 17.5~
20 parts；Described green emitting phosphor, red fluorescence powder, A glue and B glue is uniformly mixed and made into described the first encapsulated layer (31).
3. stereo luminous filament according to claim 1, it is characterised in that described the second encapsulated layer (32) includes following
The component of mass fraction：2~2.3 parts of green emitting phosphor；0.3~0.4 part of red fluorescence powder；35~40 parts of A glue；B glue 17.5~
20 parts；Described green emitting phosphor, red fluorescence powder, A glue and B glue is uniformly mixed and made into described the second encapsulated layer (32).
4. the stereo luminous filament according to claim 1 or 2 or 3, it is characterised in that described LED flip chip (2) is
Blue light or purple light chip, and the wavelength of the chip is 365-470nm.
5. the stereo luminous filament according to claim 1 or 2 or 3, it is characterised in that described encapsulating structure (3) is circumferential
Described encapsulating structure (3) and substrate (1) are connected to form cylindrical structure after substrate (1) is encapsulated；Or encapsulating structure
(3) encapsulating structure (3) described after the circumferential encapsulation by substrate (1) and substrate (1) are connected to form in flat laminated structure.
6. the stereo luminous filament according to claim 1 or 2 or 3, it is characterised in that described pad (11) is arranged on base
The one side of plate (1), the metal connecting piece (4) being electrically connected with pad (11) is further respectively had at the two ends of substrate (1).
7. stereo luminous filament according to claim 6, it is characterised in that described metal connecting piece (4) is by sheet material system
Into described metal connecting piece (4) is in iron nickel-plated metal connector, iron silver plated metals connector and copper silver plated metals connector
Any one.
8. stereo luminous filament according to claim 7, it is characterised in that described metal connecting piece (4) one end is provided with
It is in the attachment structure (41) of open locating slot (41a) with opening, described substrate (1) two ends, which are each inserted in, described determines
Bore in position groove (41a) and at locating slot (41a) and open communication is less than the external diameter of substrate (1), and described encapsulating structure
(3) opening of locating slot (41a) is blocked.
9. stereo luminous filament according to claim 8, it is characterised in that described attachment structure includes being separately positioned on
Formed between metal connecting piece (4) one end both sides and symmetrically arranged bending compressed part (4b), described bending compressed part (4b)
It is above-mentioned that there is opening to be in open locating slot (41a).
10. stereo luminous filament according to claim 9, it is characterised in that be additionally provided with described metal connecting piece (4)
For preventing described substrate (1) to be excessively inserting the position limiting structure (42) in locating slot (41a).
11. stereo luminous filament according to claim 10, it is characterised in that described position limiting structure (42) includes setting
In metal connecting piece (4) one side and positioned at the shaping projection (42a) of locating slot (41a) outer end；In the another of metal connecting piece (4)
Face has the contoured depressions (42b) corresponding with described shaping raised (42a).
12. a kind of processing technology of stereo luminous filament, it is characterised in that this processing technology comprises the following steps：
A, positioning：The metal connecting piece (4) that at least two and two-by-two one group are correspondingly arranged is fixed, is correspondingly arranged at one group two-by-two
The corresponding one end both sides of metal connecting piece (4) be respectively equipped with symmetrically arranged bent compressed part (4a)；
B, pre-bending：Symmetrically arranged two bent compressed parts (4a) are symmetrically set to opposite side bending so as to form two
It is in open cell body that opening is formed between the pre-bend compressed part (4c) put, and two pre-bend compressed parts (4c)；
C, riveting：The two ends difference for the substrate (1) that at least one piece is made in strip and by transparent material or light transmissive material
Opening is inserted in in open cell body, pad (11) is respectively equipped with the one side two ends of every piece of substrate (1), in two pads
(11) the bent conductive wire road (12) of at least two and setting parallel with one another is printed between, is then made by riveting processing mode
Two pre-bend compressed parts (4c) are to opposite side bending so as to form the bending compressed part being press respectively against on substrate (1)
(4b)；
D, paster：Every bent conductive wire road (12) being printed on every piece of substrate (1) is fixed with some by conducting resinl respectively
LED flip chip (2) and the LED flip chip (2) being arranged in differently curved conducting wire (12) is located along the same line, i.e.,
Semi-finished product to be packaged are made；
E, encapsulation：Semi-finished product to be packaged are fixed in shaping mold cavity, then into shaping mold cavity, injection is mixed with fluorescent material
Packaging plastic so that substrate (1) it is circumferential covered with encapsulating structure (3), encapsulating structure (3) is by described LED flip chip (2)
Encapsulate and projected after LED flip chip (2) is powered from substrate (1) away from LED flip chip (2) one side to encapsulating structure (3)
Brightness to project more than 30% of the brightness to encapsulating structure (3) from substrate (1) another side, from being arranged on substrate (1)
Each orientation light that circumferential encapsulating structure (3) is projected is that the colour temperature of white light and each orientation light is identical, that is, stereo luminous lamp is made
Silk finished product.
13. the processing technology of stereo luminous filament according to claim 12, it is characterised in that in above-mentioned step A,
Described metal connecting piece (4) is molded by plate stamping, and one group of metal connecting piece (4) being correspondingly arranged is molded over respectively two-by-two
The inner side edge of punching press clout housing (5), some one group of correspondences two-by-two are formed on punching press clout housing (5) inner side edge and are set
The metal connecting piece (4) put.
14. the processing technology of stereo luminous filament according to claim 13, it is characterised in that in above-mentioned step C,
It is some located at punching press clout housing (5) inner side edge and in one group of metal connecting piece (4) two-by-two between be respectively equipped with it is described
Substrate (1), when preparing to make two pre-bend compressed parts (4c) bend to opposite side by riveting processing mode, first in gold
Conducting resinl is set on category connector (4) and between two pre-bend compressed parts (4c), then by the pad at substrate (1) two ends
(11) be individually positioned on the conducting resinl of respective metal connecting piece (4) and substrate (1) forced in the presence of outer active force it is unnecessary
Conducting resinl enter in the pre-bend compressed part (4c) of substrate (1) both sides.
15. the processing technology of stereo luminous filament according to claim 14, it is characterised in that two bending compressed parts
It is in open locating slot (41a) that opening is formed between (4b), and substrate (1) is inserted in locating slot (41a) and locating slot (41a) is opened
The bore of mouth is less than the external diameter of substrate (1), by Reflow Soldering after described bending compressed part (4b) is press respectively against on substrate (1)
Melt conducting resinl and bending compressed part (4b) is connected with substrate (1).
16. the processing technology of the stereo luminous filament according to claims 14 or 15, it is characterised in that walked in above-mentioned D
In rapid, it is arranged on the substrate (1) on the inside of punching press clout housing (5) and is arranged at intervals, be printed on every on every piece of substrate (1)
Bent conductive wire road (12) is fixed with some LED flip chips (2) by conducting resinl respectively and is arranged on differently curved conductor wire
LED flip chip (2) on road (12) is located along the same line, that is, the justifying with some semi-finished product to be packaged is made to be packaged
Unit.
17. the processing technology of stereo luminous filament according to claim 16, it is characterised in that in above-mentioned E steps,
Justifying unit to be packaged with some semi-finished product to be packaged is fixed in shaping mold cavity, then injects mixed into shaping mold cavity
The packaging plastic for having fluorescent material is closed so that the circumference of each piece of substrate (1) is covered with encapsulating structure (3), encapsulating structure (3) will be described
LED flip chip (2) encapsulation and simultaneously penetrated from the remote LED flip chip (2) of substrate (1) when LED flip chip (2) is powered after
It is to project more than 30% of the brightness to encapsulating structure (3) from substrate (1) another side to go out to the brightness of encapsulating structure (3),
I.e. punching press clout housing (5) be made have some stereo luminous filaments, then by punching mode make punching press clout housing (5) with
Metal connecting piece (4) is separated, i.e., some stereo luminous filament finished products are once made.
18. the LED light device that a kind of stereo luminous filament of utilization claim 1-11 any one is made, it is characterised in that
This lighting device includes bearing substrate (6), provided with least one stereo luminous filament (a), every solid on bearing substrate (6)
Light-emitting filament (a) includes the substrate (1) for being in strip and being made up of transparent material or light transmissive material respectively, in substrate (1)
Two ends are respectively equipped with pad (11), are connected respectively with described pad (11) provided with least two two ends in the one side of substrate (1)
And the bent conductive wire road (12) of setting parallel with one another, it is respectively equipped with some LED upside-down mountings on every bent conductive wire road (12)
Chip (2) and the LED flip chip (2) being arranged in differently curved conducting wire (12) is located along the same line, in substrate (1)
Be circumferentially with encapsulating structure (3), encapsulating structure (3) encapsulates described LED flip chip (2) and when LED flip chip (2)
It is another from substrate (1) to be projected after energization from substrate (1) away from LED flip chip (2) one side to the brightness of encapsulating structure (3)
Project more than 30% of the brightness to encapsulating structure (3) in face.
19. LED light device according to claim 18, it is characterised in that described bearing substrate (6) includes lamp holder
(61) and the lampshade (62) that is connected on lamp holder (61), provided with the filament fixed mount inserted in lampshade (62) on lamp holder (61)
(63) what, described filament fixed mount (63) was distributed provided with some even circumferentials and was electrically connected respectively with lamp holder (61) is stereo luminous
Filament (a).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510448270.3A CN105047654B (en) | 2015-07-28 | 2015-07-28 | Stereo luminous filament, processing technology and LED light device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510448270.3A CN105047654B (en) | 2015-07-28 | 2015-07-28 | Stereo luminous filament, processing technology and LED light device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105047654A CN105047654A (en) | 2015-11-11 |
| CN105047654B true CN105047654B (en) | 2017-10-17 |
Family
ID=54454071
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510448270.3A Active CN105047654B (en) | 2015-07-28 | 2015-07-28 | Stereo luminous filament, processing technology and LED light device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105047654B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106838641A (en) * | 2017-02-09 | 2017-06-13 | 上海顿格电子贸易有限公司 | A kind of all-round luminous LED |
| CN109838702B (en) * | 2017-11-29 | 2020-10-20 | 东莞市恩瑞精密电子有限公司 | Method for manufacturing three-dimensional light source and linear light source |
| CN108258109A (en) * | 2018-02-06 | 2018-07-06 | 海迪科（南通）光电科技有限公司 | A kind of CSP encapsulation LED variable color-temperature filament lamp pin connection structures and preparation method thereof |
| CN108511432A (en) * | 2018-05-18 | 2018-09-07 | 梁倩 | LED support and packaging |
| CN109538972A (en) * | 2018-12-06 | 2019-03-29 | 上海应用技术大学 | A kind of LED intention bulb lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751274A (en) * | 2012-07-18 | 2012-10-24 | 上海顿格电子贸易有限公司 | Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip |
| CN103322525A (en) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | LED (light-emitting diode) lamp and filament thereof |
| CN204067334U (en) * | 2014-03-13 | 2014-12-31 | 天贺科技股份有限公司 | Photoelectric semiconductor's lamp strip structure |
| CN204905248U (en) * | 2015-07-28 | 2015-12-23 | 浙江亿米光电科技有限公司 | Three -dimensional luminous filament and LED lighting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012031533A1 (en) * | 2010-09-08 | 2012-03-15 | 浙江锐迪生光电有限公司 | Led lamp bulb and led lighting bar capable of emitting light over 4π |
-
2015
- 2015-07-28 CN CN201510448270.3A patent/CN105047654B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751274A (en) * | 2012-07-18 | 2012-10-24 | 上海顿格电子贸易有限公司 | Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip |
| CN103322525A (en) * | 2013-06-17 | 2013-09-25 | 深圳市源磊科技有限公司 | LED (light-emitting diode) lamp and filament thereof |
| CN204067334U (en) * | 2014-03-13 | 2014-12-31 | 天贺科技股份有限公司 | Photoelectric semiconductor's lamp strip structure |
| CN204905248U (en) * | 2015-07-28 | 2015-12-23 | 浙江亿米光电科技有限公司 | Three -dimensional luminous filament and LED lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105047654A (en) | 2015-11-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105047654B (en) | Stereo luminous filament, processing technology and LED light device | |
| CN103443537B (en) | Lighting apparatus | |
| CN105485541B (en) | A kind of full light distribution type LED lamp production method | |
| CN110047823A (en) | Light-emitting diode component and production method | |
| CN204905248U (en) | Three -dimensional luminous filament and LED lighting device | |
| CN104167482B (en) | A kind of White-light LED chip and preparation method thereof | |
| CN102192424B (en) | Light-emitting device and lighting device | |
| CN105387355A (en) | Parallel-connection type light emitting diode (LED) illuminants and LED illuminating lamp | |
| CN205480335U (en) | Lighting device | |
| CN103791286A (en) | Linear LED light source, linear LED lamp and manufacturing method for linear LED light source | |
| CN106449625A (en) | Fluorescent-substrate-based inverted LED lamp filament and packaging process thereof | |
| CN105927950A (en) | LED filament with thermal radiation material and LED filament bulb | |
| CN105135383B (en) | Electric connection structure for filament | |
| CN106468404A (en) | LED filament and LEDbulb lamp | |
| CN204088313U (en) | A kind of strip omnidirectional luminous LED lamp silk | |
| EP3190328A1 (en) | A led light simulating the structure of incandescent light | |
| CN101355132A (en) | White light LED for improving facula and encapsulation method thereof | |
| CN105720048A (en) | Packaging method for bonding-wire-free high-color-rendering-index LED lamp filaments and bonding-wire-free high-color-rendering-index LED lamp filaments | |
| CN211424020U (en) | LED micro-integrated lamp filament | |
| EP3006814A1 (en) | Led bulb light with high luminous efficacy | |
| CN211017116U (en) | L packaging substrate for ED lamp strip and packaging structure containing substrate | |
| CN203892929U (en) | U-shaped LED (Light Emitting Diode) luminous body and LED illuminating lamp | |
| CN204230297U (en) | Bulb lamp silk support | |
| CN206992109U (en) | A kind of outdoor big spacing LED component and LED display | |
| CN205226920U (en) | Parallelly connected type LED luminous element and LED light |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Three dimensional luminous filament, processing technology and LED lighting device Effective date of registration: 20210205 Granted publication date: 20171017 Pledgee: Agricultural Bank of China Limited by Share Ltd. Jiashan county subbranch Pledgor: Zhejiang Emitting Optoelectronic Technology Co.,Ltd. Registration number: Y2021330000125 |