CN105024126A - Vertical coaxial-microstrip switching circuit - Google Patents
Vertical coaxial-microstrip switching circuit Download PDFInfo
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- CN105024126A CN105024126A CN201510350394.8A CN201510350394A CN105024126A CN 105024126 A CN105024126 A CN 105024126A CN 201510350394 A CN201510350394 A CN 201510350394A CN 105024126 A CN105024126 A CN 105024126A
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Abstract
The invention provides a vertical coaxial-microstrip switching circuit. A radio frequency-side ground is added to the side surface at a microstrip line interconnection end, and the radio frequency-side ground is communicated with a coaxial line ground and a microstrip line ground. From the aspect of microwave circuit impedance matching, the introduced radio frequency-side ground, the coaxial line inner conductor extension part and an interaction metal strip form an air microstrip, high resistance inductance of the former coaxial line inner conductor extension part and the interaction metal strip is switched into microstrip low resistance, broadband matching between the coaxial transmission line and the microstrip transmission line can be met easily, echo losses of the switching circuit can be reduced, and mismatch is reduced. From the aspect of electromagnetic wave propagation, the introduced radio frequency-side ground realizes TEM-quasi TEM-quasi TEM continuous gradient propagation, and compared with the existing TEM-inductive reactance radiation-quasi TEM propagation mode, the switching circuit of the invention eliminates radiation losses caused by inductive reactance. According to the specific process of the invention, a conductive adhesive coating mode is adopted for introducing the radio frequency ground, the realization method is simple and reliable, and the product consistency is good.
Description
Technical field
The present invention relates to microwave passive technical field, particularly a kind of vertical-type coaxial-microstrip transitions circuit.
Background technology
In order to improve integrated level and the degree of miniaturization of Microwave Active modular circuit, inside circuit usually adopts and is easy to the microstrip circuit form interconnected with MMIC (microwave monolithic integrated circuit), and system interface is generally coaxial or waveguide form, the therefore generally input of modular circuit, output interface all need design coaxial-microstrip transitions circuit.
Extensively adopt in engineering coaxial-microstrip transitions circuit horizontal type is as shown in Figure 1 coaxial-microstrip transitions circuit, in figure, 1 is coaxial line, 2 is microstrip line, and the inner wire of coaxial line directly interconnect with microstrip line conduction band, and this horizontal type change-over circuit has technique realization simply and the advantage such as available bandwidth is large.But due to the restriction of the factors such as layout in satellite communication cabin, usually require that signal is for flowing vertically to, now interface circuit must select the vertical-type shown in Fig. 2 coaxial-microstrip transitions circuit.This vertical-type is coaxial-microstrip transitions circuit comprises coaxial line 1, gold ribbon 3 and microstrip line 2, gold ribbon 3 for connecting the outward extending inner wire of coaxial line 1 and microstrip line 2, its corresponding in kind, transmission electromagnetic field mode and characteristic impedance as shown in table 1.As can be seen from Table 1, insulator lead extension and gold ribbon will introduce stray inductance, seriously can limit the application of this change-over circuit at high band.
The existing vertical-type of table 1 is coaxial-homologue of microstrip transitions circuit, transmission electromagnetic field mode and characteristic impedance list
| Numbering | Transmission line type | Corresponding in kind | Transmission electromagnetic field mode | Transmission line characteristic impedance |
| 1 | Coaxial line | RF isolation | TEM | 50Ω |
| 2 | Inductance | The sub-lead extension of RF isolation | / | Induction reactance-high resistant |
| 3 | Inductance | Interconnection gold ribbon | / | Induction reactance-high resistant |
| 4 | Microstrip line | Potsherd circuit | Accurate TEM | About 50 Ω |
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, there is provided a kind of vertical-type coaxial-microstrip transitions circuit, this circuit adds radio frequency ground in the interconnect side of microstrip line, this radio frequency ground is communicated with the ground of microstrip line with coaxial line, coaxial inner conductor extension and interconnection gold ribbon can be made to form microstrip line with it, thus expanded the available band bandwidth of this change-over circuit and reduced the return loss of change-over circuit.
Above-mentioned purpose of the present invention is realized by following scheme:
A kind of vertical-type is coaxial-microstrip transitions circuit, comprise coaxial line, interconnection gold ribbon, microstrip line, interconnection gold ribbon connects coaxial inner conductor extension and microstrip circuitry part, it is characterized in that: on the radio frequency ground of the interconnect lateral leadin setting height H of microstrip line, described radio frequency ground is communicated with the ground of microstrip line with coaxial line, wherein H>0.
Above-mentioned vertical-type coaxial-microstrip transitions circuit in, be the radio frequency ground of H by the following method at the interconnect lateral leadin height of microstrip line: coated with conductive glue in the end side surface of microstrip line, the coating zone of described conducting resinl is connected with the ground of microstrip line, described peak width is identical with described microstrip line end face width, and the height in described region is H.
Above-mentioned vertical-type coaxial-microstrip transitions circuit in, the height H on radio frequency ground adjusts according to the coaxially-available band of microstrip transitions circuit, return loss, and concrete method of adjustment is as follows:
(1), first set up in HFSS software vertical-type coaxial-simulation model of microstrip transitions circuit, the elemental height on setting radio frequency ground is h
0;
(2), the initialization frequency band of described change-over circuit is set in simulation software;
(3), simulation analysis obtains the return loss of described change-over circuit in working band, if the return loss obtained is greater than the minimum echo loss L of setting
0, then adjust the height on radio frequency ground and repeat step (3), if the return loss that simulation analysis obtains is less than or equal to the minimum echo loss L of setting
0, then step (4) is entered;
(4), the working band of expansion change-over circuit, and return step (3), wherein, if cannot realize by the height on adjustment radio frequency ground the minimum echo loss L that return loss is less than or equal to setting after expansion working band
0, then the minimum echo loss L will meeting return loss in upper one group of working band and be less than or equal to setting
0radio frequency ground level be recorded as final radio frequency ground level settings H
opt;
(5), process change-over circuit in kind, in the interconnect side of microstrip line, coating is highly H
optconducting resinl.
The present invention compared with prior art, has the following advantages:
(1), the present invention introduces radio frequency ground on the interconnect side of microstrip line, is communicated with the ground of microstrip line with coaxial line to this radio frequency side.Angle from microwave circuit impedance coupling: the radio frequency side ground of this introducing forms air microstrip with coaxial inner conductor extension and the gold ribbon that interconnects, change the high resistant induction reactance of former coaxial inner conductor extension and interconnection gold ribbon into micro-band low-resistance, be content with very little Broadband Matching that is coaxial and microstrip transmission line, reduce the return loss of change-over circuit, reduce mismatch; From Electromagnetic Wave Propagation angle: the continuous gradation achieving " the accurate TEM of the accurate TEM-of TEM-" is propagated the radio frequency of this introducing, relative to " TEM-induction reactance radiation-accurate TEM " circulation way of existing change-over circuit, change-over circuit of the present invention eliminates the radiation loss that induction reactance is brought;
(2), concrete technology feasibility of the present invention is strong, and adopt conductive glue mode to introduce radio frequency ground, implementation method is simple, reliable.
Accompanying drawing explanation
Fig. 1 be existing horizontal type coaxial-microstrip transitions circuit;
Fig. 2 be existing vertical-type coaxial-microstrip transitions circuit;
Fig. 3 be the vertical-type taking broadband compensation of the present invention coaxial-microstrip transitions circuit;
Fig. 4 be in embodiment 1 vertical-type coaxial-the return loss simulation result of microstrip transitions circuit;
Fig. 5 is different-thickness Microstrip Interconnection circuit in embodiment 2;
Fig. 6 is the return loss simulation result of different-thickness Microstrip Interconnection circuit in embodiment 2;
Fig. 7 be in embodiment 3 back-to-back vertical-type coaxial-microstrip transitions circuit;
Fig. 8 be the vertical-type that embodiment 3 middle width strip compensates coaxial-microstrip transitions circuit return loss measured value;
Fig. 9 be do not do in embodiment 3 vertical-type that compensates coaxial-microstrip transitions circuit return loss measured value;
Figure 10 is that embodiment 3 middle width strip compensates and do not do the change-over circuit return loss measured value comparison compensated.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
The invention provides a kind of vertical-type coaxial-microstrip transitions circuit, in Microwave Active modular circuit, realize the low loss interconnection between microstrip circuit and coaxial interface.As shown in Figure 3 coaxial-connection diagram of microstrip transitions circuit, vertical-type of the present invention is coaxial-and microstrip transitions circuit comprises coaxial line 1, gold ribbon 3 and microstrip line 2, wherein, coaxial line comprises outer conductor 11 and inner wire 12, the upper surface sputtering of microstrip line has metallic film as microstrip circuitry 21, and its lower surface is the ground 22 of microstrip line.Gold ribbon 3 is for connecting coaxial inner conductor 12 extension and microstrip circuitry 21, the interconnect side of microstrip line is introduced the radio frequency ground 23 having setting height H, this radio frequency ground 23 and the ground of coaxial line are also that coaxial outer conductor 11 is communicated with the ground 22 of microstrip line, wherein H>0.
In Practical Project realizes, sputtering technology-microstrip transitions circuit coaxial at vertical-type cannot introduce above-mentioned radio frequency ground, by polytechnic screening and a large amount of tests, last the present invention achieves the introducing on radio frequency ground by the mode of coated with conductive glue on the interconnect side of microstrip line.Wherein the coating zone of conducting resinl is connected with the ground of microstrip line and coaxial ground, and glue bearing areas width is identical with microstrip line end face width and be highly H.This height H uses frequency range and return loss to adjust according to the expection of coaxial-microstrip transitions circuit, and concrete method of adjustment is as follows:
(1), first set up in HFSS software vertical-type coaxial-simulation model of microstrip transitions circuit, the elemental height on setting radio frequency ground is h
0;
(2), the initialization frequency band of described change-over circuit is set in simulation software; Such as arranging initialization frequency band is 1GHz ~ 30GHz;
(3), simulation analysis obtains the return loss of described change-over circuit in working band, if the return loss obtained is greater than the minimum echo loss L of setting
0, then adjust the height on radio frequency ground and repeat step (3), if the return loss that simulation analysis obtains is less than or equal to the minimum echo loss L of setting
0, then step (4) is entered;
(4), expansion change-over circuit working band, such as working band is expanded to 1GHz ~ 35GHz; And return step (3), wherein, if cannot realize by the height on adjustment radio frequency ground the minimum echo loss L that return loss is less than or equal to setting after expansion working band
0, then the minimum echo loss L will meeting return loss in upper one group of working band and be less than or equal to setting
0radio frequency ground level be recorded as final radio frequency ground level settings H
opt;
(5), process change-over circuit in kind, in the interconnect side of microstrip line, coating is highly H
optconducting resinl.
Adopt the method increasing radio frequency side ground in the interconnect side of microstrip line, can carry out bandwidth compensation to traditional change-over circuit, the type of each transmission line after compensation is as shown in table 2.
The vertical-type of table 2 broadband compensation of the present invention is coaxial-microwave change-over circuit in the characteristic impedance list of each transmission line
| Numbering | Transmission line type | Corresponding in kind | Transmission electromagnetic field mode | Transmission line characteristic impedance |
| 1. | Coaxial line | RF isolation | TEM | 50Ω |
| 2. | Microstrip line | The sub-lead extension of RF isolation | Accurate TEM | About 50 Ω need to optimize |
| 3. | Microstrip line | Interconnection gold ribbon | Accurate TEM | About 50 Ω need to optimize |
| 4. | Microstrip line | Potsherd circuit | Accurate TEM | About 50 Ω |
As can be seen from result listed by table 2, the continuous gradation achieving " the accurate TEM of the accurate TEM-of TEM-" is propagated the radio frequency that the present invention introduces, relative to " TEM-induction reactance radiation-accurate TEM " circulation way of existing change-over circuit, change-over circuit of the present invention eliminates the radiation loss inserting induction reactance and bring.Be applied in the Ku frequency range balanced Low Noise Amplifier first sample based on HEMT (high electron mobility field effect transistor) tube core matching technique of certain star, qualification part and positive sample product, products noise coefficient function admirable, and each good product consistency.
Embodiment 1:
Set up in HFSS software vertical-type coaxial-simulation model of microstrip transitions circuit.Wherein, the inner wire diameter of coaxial line is 0.3mm, outer conductor diameter is 1.60mm, and the partial-length that coaxial inner conductor extends out relative to outer conductor is 0.7mm, dielectric constant=4.0 of filled media between inner and outer conductor; Dielectric constant=9.9 of microstrip line medium, thickness are 25mil.
The present embodiment carries out simulation analysis and contrast to the return loss that above change-over circuit is introduced before and after radio frequency ground, and result as shown in Figure 3.As can be seen from the simulation result shown in Fig. 3, do not introduce radio frequency ground, namely do not carry out in the change-over circuit of bandwidth compensation, the top usable frequency that return loss is better than 14dB is 15GHz, and after change-over circuit of the present invention compensates with introducing radio frequency, its top usable frequency is 30GHz, and return loss improves 2 ~ 3dB.
Embodiment 2:
In the present embodiment, utilize compensation method of the present invention, in the microstrip interconnection circuit that dielectric thickness is different, the stray inductance in the microstrip interconnection end side surface that thickness is large with introducing radio frequency to reduce interconnection gold ribbon.
Wherein, in micro-belt substrate passive interconnect circuit as shown in Figure 5, comprise thick micro-belt substrate 4, interconnection gold ribbon 3 and Bao Wei belt substrate 5, wherein, gold ribbon 3 connects two microstrip circuits, and wherein thick micro-belt substrate 4 is 25mil ceramic substrate, thin micro-belt substrate 5 is 15mil ceramic substrate.In this change-over circuit, because the thickness drop of two substrate parts is large, thus cause interconnection gold ribbon long, introduce larger stray inductance.
In HFSS software, set up the simulation model of as above change-over circuit, return loss emulation is carried out to the circuit before and after compensating.Wherein, the circuit after compensation is that this radio frequency ground interconnects with two microstrip line ground on thick micro-belt substrate interconnect lateral leadin radio frequency ground.As shown in Figure 6, if be better than-15dB for criterion with return loss, simulation result shows that compensating the forward and backward available band upper limit is 22GHz, more than 35GHz respectively to simulation result.
Embodiment 3:
Fig. 7 be back-to-back vertical-type coaxial-microstrip transitions circuit, namely this circuit containing a pair vertical-type coaxial-microstrip transitions circuit, the change-over circuit on the right comprises coaxial line 1, gold ribbon 3 and microstrip line 2, and the change-over circuit on the left side is with the change-over circuit on the right.Input, output are coaxially, and this is in order to convenient test, and its coaxial line and microstrip line parameter characteristic are as embodiment 1.By this mould processing 10 circuit material objects, wherein 5 adopt the inventive method carry out broadband compensation, be experimental group, other 5 as a control group, do not compensate.
The present embodiment provides experimental group and control group test result, respectively as shown in Figure 8,9, often organizes 5 measured data consistency in kind good.As seen from Figure 8, the change-over circuit return loss of broadband compensation is better than the top usable frequency of 10dB is 30-35GHz; Fig. 9 shows: not doing the top usable frequency that the change-over circuit return loss compensated is better than 10dB is 20-25GHz; Therefore available frequency band is not done the circuit compensated by the change-over circuit of broadband compensation extends about 10GHz, and return loss improves 2 ~ 3dB, as shown in Figure 10.
The above; be only the present invention's embodiment, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.The content be not described in detail in specification of the present invention belongs to the known technology of professional and technical personnel in the field.
Claims (3)
1. a vertical-type coaxial-microstrip transitions circuit, comprise coaxial line, interconnection gold ribbon, microstrip line, interconnection gold ribbon connects coaxial inner conductor extension and microstrip circuitry part, it is characterized in that: on the radio frequency ground of the interconnect lateral leadin setting height H of microstrip line, described radio frequency ground is communicated with the ground of microstrip line with coaxial line, wherein H>0.
2. a kind of vertical-type according to claim 1 coaxial-microstrip transitions circuit, it is characterized in that: the radio frequency ground at the interconnect lateral leadin height of microstrip line being H by the following method: coated with conductive glue in the end side surface of microstrip line, the coating zone of described conducting resinl is connected with the ground of microstrip line, described peak width is identical with described microstrip line end face width, and the height in described region is H.
3. a kind of vertical-type according to claim 1 coaxial-microstrip transitions circuit, it is characterized in that: the height H on radio frequency ground adjusts according to the coaxially-available band of microstrip transitions circuit, return loss, and concrete method of adjustment is as follows:
(1), first set up in HFSS software vertical-type coaxial-simulation model of microstrip transitions circuit, the elemental height on setting radio frequency ground is h
0;
(2), the initialization frequency band of described change-over circuit is set in simulation software;
(3), simulation analysis obtains the return loss of described change-over circuit in working band, if the return loss obtained is greater than the minimum echo loss L of setting
0, then adjust the height on radio frequency ground and repeat step (3), if the return loss that simulation analysis obtains is less than or equal to the minimum echo loss L of setting
0, then step (4) is entered;
(4), the working band of expansion change-over circuit, and return step (3), wherein, if cannot realize by the height on adjustment radio frequency ground the minimum echo loss L that return loss is less than or equal to setting after expansion working band
0, then the minimum echo loss L will meeting return loss in upper one group of working band and be less than or equal to setting
0radio frequency ground level be recorded as final radio frequency ground level settings H
opt;
(5), process change-over circuit in kind, in the interconnect side of microstrip line, coating is highly H
optconducting resinl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510350394.8A CN105024126B (en) | 2015-06-23 | 2015-06-23 | A kind of vertical-type is coaxial-microstrip transitions circuit |
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|---|---|---|---|
| CN201510350394.8A CN105024126B (en) | 2015-06-23 | 2015-06-23 | A kind of vertical-type is coaxial-microstrip transitions circuit |
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| CN105024126A true CN105024126A (en) | 2015-11-04 |
| CN105024126B CN105024126B (en) | 2018-05-01 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107959107A (en) * | 2017-10-27 | 2018-04-24 | 中国船舶重工集团公司第七二三研究所 | A kind of coaxial feed millimeter wave antenna based on the conversion of thickness strip line |
| CN109417213A (en) * | 2016-06-06 | 2019-03-01 | 凯瑟琳欧洲股份公司 | For signal to be supplied to the circuit board assemblies of transmitter |
| CN109524182A (en) * | 2018-11-14 | 2019-03-26 | 北京遥感设备研究所 | A kind of vertical glass insulator interconnecting assembly applied to Ka wave band |
| CN113161705A (en) * | 2021-06-11 | 2021-07-23 | 四川斯艾普电子科技有限公司 | Radio frequency adapter plate and radio frequency adapter implementation method |
| JP2022066317A (en) * | 2016-04-26 | 2022-04-28 | ルメンタム・テクノロジー・ユーケー・リミテッド | Wireless frequency structure in electronic package |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2022066317A (en) * | 2016-04-26 | 2022-04-28 | ルメンタム・テクノロジー・ユーケー・リミテッド | Wireless frequency structure in electronic package |
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| CN109524182A (en) * | 2018-11-14 | 2019-03-26 | 北京遥感设备研究所 | A kind of vertical glass insulator interconnecting assembly applied to Ka wave band |
| CN113161705A (en) * | 2021-06-11 | 2021-07-23 | 四川斯艾普电子科技有限公司 | Radio frequency adapter plate and radio frequency adapter implementation method |
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