CN105023868A - Fluid transmission device - Google Patents
Fluid transmission device Download PDFInfo
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- CN105023868A CN105023868A CN201510335380.9A CN201510335380A CN105023868A CN 105023868 A CN105023868 A CN 105023868A CN 201510335380 A CN201510335380 A CN 201510335380A CN 105023868 A CN105023868 A CN 105023868A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention discloses a fluid transmission device, which comprises a bearing plate, electronic control valves, and a supporting plate, wherein a plurality of through holes are arranged in the bearing plate, the through holes comprise first round through holes and second square through holes, and the first round through holes and the second square through holes are communicated; the electronic control valves comprise first valve parts and second valve parts, the shape of each first valve part is corresponding to that of each first round through hole of the bearing plate, and the shape of each second valve part is corresponding to that of each second square through hole of the bearing plate; the supporting plate is fixed on the second valve parts of the electronic control valves, the first valve parts of the electronic control valves extend out of the first round through holes, and the second valve parts and the supporting plate are clamped in the second square through holes. Compared with the prior art, as the supporting plate is arranged below the second valve parts of the electronic control valves, the electronic control valves can be firmly clamped in the bearing plate, and disassembly is easy.
Description
[technical field]
The present invention relates to semiconductor applications, particularly relate to a kind of device for transferring fluid.
[background technology]
Current integrated circuit is applied in a lot of field gradually, such as computer, communication, Industry Control and consumer electronics etc.The manufacturing industry of integrated circuit, has become important basic industry the same as iron and steel.
Wafer is the carrier producing used in integrated circuits.In actual production, need the wafer prepared to have surface that is smooth, ultra-clean, and two kinds can be divided into for the preparation of the existing method of ultra-clean wafer surface: the wet treatment process of such as submergence and spraying technique, and such as based on the dry process process of chemical gaseous phase and plasma technology.Wherein wet treatment process is that prior art adopts method comparatively widely, and wet treatment process generally includes the succession of steps composition adopting suitable chemical solution submergence or spray wafer.
But the equipment of general existing preparation ultra-clean wafer surface generally has following shortcoming: 1, structure is very complicated, volume is huger, and cost is also higher; 2, these equipment are once break down, and the general production needing to stop producing line of fixing a breakdown, affects output; 3 once after installation, not easily carries out adjustment and the change of function and aspect, position; 4, carrying is inconvenient.Along with constantly reducing of dimensions of semiconductor devices, the wafer size manufacturing semiconductor device used constantly increases, and production process of semiconductor needs to update, and device therefor also and then needs adjustment or changes.
Therefore, be necessary that proposing a solution solves the problems referred to above.
[summary of the invention]
The technical problem to be solved in the present invention is to provide the semiconductor processing device that a kind of small volume, structure are simple, assembly is easy to replacing, conveniently carries.
In order to solve the problem, according to an aspect of the present invention, the invention provides a kind of device for transferring fluid, it comprises:
Loading plate, it offers several through holes, and described through hole comprises the first manhole and the second square through hole, and described first manhole is connected with the second square through hole;
Electronic control valve, it comprises the first valve portion and the second valve portion, and the shape in described first valve portion is corresponding with the first manhole of described loading plate, and the shape in described second valve portion is corresponding with the second square through hole of described loading plate;
Supporting plate, it is fixed in the second valve portion of described electronic control valve,
Described first manhole is stretched out in first valve portion of described electronic control valve, and the second valve portion and supporting plate snap in described second square through hole.
As the present invention's preferred embodiment, it also comprises base plate, the placer be positioned on base plate, be arranged at one or more pump on described base plate and tank plate,
Described loading plate is vertically installed in described base plate and is positioned at the side of described placer, and described tank plate is vertically sticked on described loading plate.
As the present invention's preferred embodiment, described first valve portion is cylindrical, has multiple opening in columniform side;
Described second valve portion is prism-shaped, and its end is connected with electrical cable.
As the present invention's preferred embodiment, several the first screw holes are offered in a side of described second valve portion prism-shaped, on described supporting plate, the position of corresponding described first screw hole offers the second screw hole, is attached on described electronic control valve by described supporting plate by the first screw hole and the second screw hole.
As the present invention's preferred embodiment, the length in described second valve portion is greater than the length of described second square through hole, and the thickness summation of described second valve portion and supporting plate and the height of described second square through hole adapt.
As the present invention's preferred embodiment, the diameter of described first manhole is less than described second square entire widths, and the length of described first manhole is less than the length of described second square through hole.
As the present invention's preferred embodiment, the length of described first manhole is 1/1 to five/6th of described second square through hole length.
Compared with prior art, the present invention arranges supporting plate in the below in the second valve portion of described electronic control valve, can firmly be snapped on described loading plate by described electronic control valve, and is easy to dismounting.
About other objects of the present invention, feature and advantage, describe in detail in a specific embodiment below in conjunction with accompanying drawing.
[accompanying drawing explanation]
In conjunction with reference accompanying drawing and ensuing detailed description, the present invention will be easier to understand, the structure member that wherein same Reference numeral is corresponding same, wherein:
Fig. 1 is the structural representation of modularized semiconductor processing unit of the present invention;
Fig. 2 is the fluid carrying module perspective view in one embodiment in Fig. 1;
Fig. 3 A is the device support device planar structure schematic diagram in one embodiment in the present invention;
Fig. 3 B is the plane left view of the device support device in Fig. 3 A;
Fig. 4 is the cross section structure schematic diagram of a kind of section bar that the device support device in the present invention uses;
Fig. 5 A is the cross section structure schematic diagram of the another kind of section bar that the device support device in the present invention uses;
Fig. 5 B is the cross section structure schematic diagram of the section bar shown in Fig. 5 A;
Fig. 6 is the device support device 100 assembling perspective view in one further embodiment in the present invention;
Fig. 7 A is the planar structure schematic diagram of the plate that the device support device in the present invention uses;
Fig. 7 B is the left TV structure schematic diagram of the plate shown in Fig. 7 A;
Fig. 8 is the structural representation of fluid delivery module of the present invention;
Fig. 9 is the part-structure schematic diagram of fluid delivery module of the present invention;
The main TV structure schematic diagram that Figure 10 is loading plate described in Fig. 8;
The backsight structural representation that Figure 11 is loading plate described in Figure 10;
Figure 12 is the structural representation of the plate of tank described in Fig. 8;
Figure 13 is the structural representation that described tank plate is sticked in described loading plate;
Figure 14 is the structural representation of electronic control valve described in Fig. 8;
Figure 15 is the structural representation of supporting plate of the present invention;
Figure 16 is the structural representation that the supporting plate of Figure 15 is fixed on electronic control valve;
Figure 17 is the structural representation that electronic control valve of the present invention is sticked on described loading plate.
[embodiment]
For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, and below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Alleged herein " embodiment " or " embodiment " refers to that the special characteristic relevant to described embodiment, structure or characteristic at least can be contained at least one implementation of the present invention.Different local in this manual " in one embodiment " occurred be non-essential all refers to same embodiment, must not be yet with other embodiments mutually exclusive separately or select embodiment." multiple ", " some " in the present invention represent two or more."and/or" in the present invention represents " with " or "or".
Refer to Fig. 1, it is the structural representation of modularized semiconductor processing unit of the present invention.As shown in Figure 1, described semiconductor processing equipment 1 comprises semiconductor processing module 10, fluid delivery module 20, fluid carrying module 30 and control module 40.
Described semiconductor processing module 10 comprises one for holding and process the micro chamber of semiconductor crystal wafer, and described micro chamber comprises one or more confession process fluid and enters the entrance of described micro chamber and one or more outlet for micro chamber described in process fluid expulsion.Described micro chamber comprises the portion of upper chamber forming upper working surface and the lower chambers portion forming lower working surface, portion of described upper chamber and described lower chambers portion can under the driving of a drive unit load and/or remove this semiconductor crystal wafer open position and one for hold this semiconductor crystal wafer off-position between relative movement.When portion of upper chamber or described lower chambers portion in the closed position time, semiconductor crystal wafer is installed between described upper working surface and lower working surface.Owing to adopting the structure of micro chamber, the volume of described semiconductor processing module 10 becomes very little.
Described fluid carrying module 30 is for carrying chemicals, ultra-clean water or other fluids (can be referred to as and not use fluid) of the described semiconductor crystal wafer of various process and/or carrying the fluid of use processing described semiconductor crystal wafer, described fluid can be liquid, also can be gas.Refer to Fig. 2, it is the fluid carrying module perspective view in one embodiment in Fig. 1.As shown in Figure 2, it illustrates an embodiment of described fluid carrying module 30, described fluid carrying module 30 comprises carriage 31 and is positioned over the multiple containers 32 in described carriage 31, and described container can hold not use fluid for the treatment of various required for described semiconductor crystal wafer and/or processed the various of described semiconductor crystal wafer and uses fluid.Contain ultra-clean water in a such as container, fill the chemical pretreatment solution for the treatment of described crystal column surface in another container, then reclaim the waste liquid obtained after separately having the interior Sheng of a container to utilize the water-treated described semiconductor crystal wafer of ultra-clean.Certain waste liquid also can directly be discharged by predetermined fluid discharge line, and is not positioned in the container 32 of described fluid carrying module 30.In one embodiment, fluid by the real-time feed of predetermined fluid service, now can arrange fluid carrying module 30 to carry various fluid specially.
Described fluid delivery module 20 is connected by the entrance and exit of pipeline with described micro chamber, by the fluid communication in pipeline and described fluid carrying module 30, it is for being urged to described micro chamber by the various fluids that do not use that are interior for fluid carrying module 30 or that supplied by predetermined fluid service by the entrance of pipeline and described micro chamber.Described fluid processes described semiconductor crystal wafer in described micro chamber, such as utilize ultra-clean water to carry out surface clean to described semiconductor crystal wafer, described in the delivery of pressure, gravity or gas is ordered about, use contaminated-fluid to send in corresponding container in described fluid carrying module 30 or predetermined fluid discharge line via the outlet of described micro chamber and pipeline afterwards.
In one embodiment, described semiconductor processing module 10, fluid delivery module 20, fluid carrying module 30 and control module 40 are all arranged on a kind of assembly type device support device.
Fig. 3 A shows the device support device planar structure schematic diagram in one embodiment in the present invention, and Fig. 3 B is the plane left view of the device support device in Fig. 3 A.
Incorporated by reference to reference to shown in figure 3A to Fig. 3 B, described device support device 100 comprises four montants, 110, two top first cross bars, 120, two top second cross bars, 130, two bottom first cross bars 140 and two bottom second cross bars 150.
Described four montant 110 vertical spacings placement is also parallel to each other.Described two top first cross bars 120 are vertical and parallel to each other with described montant 110, the two ends of each top first cross bar 120 respectively with the top end face of two montants 110 against and be connected.Described two top second cross bars 130 are vertical and parallel to each other with described montant 110 and described top first cross bar 120, the two ends of each top second cross bar 130 respectively with the side of one end of two top first cross bars 120 against and be connected.Described two bottom first cross bars 140 are vertical with described montant 110 and parallel with top first cross bar 120, the two ends of each bottom first cross bar 140 respectively with the bottom face of two montants 110 against and be connected.Described two bottom second cross bars 150 are parallel with described montant 110 and described top second cross bar 130, the two ends of each bottom second cross bar 150 respectively with the side of one end of two bottom first cross bars 140 against and be connected.
Like this, described device support device 100 just defines a cuboid framework (or being called cuboid framework), four montants 110 form the vertical edge of described cuboid framework, four the first cross bars 120 and 140 form the first horizontal edge of described cuboid framework, and four the second cross bars 130 and 150 form the second horizontal edge of described cuboid framework.Be positioned at top first cross bar 120 of the same side of described cuboid framework, two montants 110 and bottom first cross bar 140 form a side of described cuboid framework, be positioned at top second cross bar 130 of the same side of described cuboid framework, two montants 110 and bottom second cross bar 150 form a side of described cuboid framework, two top first cross bars 120 and two top second cross bars 130 form the end face of described cuboid framework, two bottom first cross bars 130 and two bottom second cross bars 150 form the bottom surface of described cuboid framework.
For described cuboid framework, described montant 110 in the vertical direction can provide strong support to top first cross bar 120 and top second cross bar 130, makes the section components end face of described cuboid framework can placed in heavier crystal column surface treatment facility.Also the section components in crystal column surface treatment facility can be placed in described cuboid framework.
Described device support device 100 also comprises two the first support bars 160 and two the second support bars 170, described two the first support bars 160 parallel, described two the first support bars 160 lay respectively at the outside of described top first cross bar 120 and bottom first cross bar 140 and are connected with described top first cross bar 120 and bottom first cross bar 140 respectively, described two the second support bars 170 parallel, described two the second support bars 170 are between bottom second cross bar 150 and first support bar 160 and be connected with the lateral surface of described bottom first cross bar 140, the upper side of described second support bar 170 and bottom first cross bar 140 forms the inside bottom surface of described cuboid framework jointly.Described semiconductor processing module 10 can be placed in this inside bottom surface.Meanwhile, the first support bar 160 also can play certain reinforcement effect to whole device support device 100.
In one embodiment, the outside of described cuboid framework is also connected with second framework (not shown), this second framework comprises the 3rd support bar (not shown), described 3rd support bar and the parallel connection of described first support bar, be connected described cuboid framework with the second framework with the connection of the 3rd support bar by the first support bar.Described second framework can place described control module 40.
Please consult shown in Fig. 3 A and Fig. 3 B by emphasis, each cross bar stretches out and forms the epitaxy part of the lateral surface exceeding the montant be connected with this cross bar, described epitaxy part is that the epitaxy part of two cross bars that forward surface is right is oppositely arranged from a side of described cross bar along the groove formed that the Width of this side stretches out.
Specifically, each top first cross bar 120 stretches out and forms the epitaxy part 121 of the lateral surface 111 exceeding the montant 110 be connected with this top first cross bar 120, and described epitaxy part 121 is along the groove formed that the Width of this side stretches out from a side of described top first cross bar 120.Each bottom first cross bar 140 stretches out and forms the epitaxy part 141 of the lateral surface 111 exceeding the montant 110 be connected with the first cross bar 140 bottom this, and described epitaxy part 141 is along the groove formed that the Width of this side stretches out from a side of described bottom second cross bar 150.Each top second cross bar 130 stretches out and forms the epitaxy part 131 of the lateral surface 111 exceeding the montant 110 be connected with this top second cross bar 130, and described epitaxy part 131 is along the groove formed that the Width of this side stretches out from a side of described top second cross bar 130.Each bottom second cross bar 150 stretches out and forms the epitaxy part 151 of the lateral surface 111 exceeding the montant 110 be connected with the second cross bar 150 bottom this, and described epitaxy part 151 is along the groove formed that the Width of this side stretches out from a side of described bottom second cross bar 150.The epitaxy part 141 of bottom first cross bar 140 that the epitaxy part 121 of each top first cross bar 120 is right with forward surface is oppositely arranged, same, the epitaxy part 121 of top first cross bar 120 that the epitaxy part 141 of each bottom first cross bar 140 is right with forward surface is oppositely arranged.The epitaxy part 151 of bottom second cross bar 150 that the epitaxy part 131 of each top second cross bar 130 is right with forward surface is oppositely arranged, same, the epitaxy part 131 of top second cross bar 130 that the epitaxy part 151 of each bottom second cross bar 150 is right with forward surface is oppositely arranged.
Described montant, described first cross bar, described second cross bar, the first support bar and the second support bar are made up of section bar.Refer to Fig. 4, it is the cross section structure schematic diagram of a kind of section bar 200 that the device support device can applied in the present invention uses.Described first cross bar and described second cross bar are made up of the first section bar.Described first section bar 200 comprises main part 210 and epitaxy part 220, and described epitaxy part 220 is along the groove 230 formed that the Width of this side stretches out from a side of described first section bar 200 main part 210.Described main part 210 is roughly cuboid, and its length can set as required, and the cross section of described main part 210 is roughly square, and the height of its main part 210 cross section is H1, and length is L1, and wherein L1 equals H1.The depth H 2 of 220 grooves 230 formed of described epitaxy part is the half of described main part 210 height H 1.In one embodiment, the length of described epitaxy part 220 is slightly larger than the length of described main part 210, can, against living the epitaxy part perpendicular with this plate, plate be made to be unlikely to skid off groove when plate 400 (see Fig. 7 A and Fig. 7 B) inserts in groove.
Other three sides adjacent with the one side with groove 230 on the main part 210 of described first section bar 200 are provided with first and pass through groove 240, and on three sides first passes through groove 240 is divided into the first connecting portion 250 being positioned at center and the first terminal part 260 being positioned at four corners by described first section bar 200.Described first terminal part 260 and described first connecting portion 250 are all the structure of hollow.In other embodiments, it is inconsistent that the size of H1 and L1 also can design, and can design the value of H1 and L1 as required.In this embodiment, two the first terminal parts 260 being positioned at a side of groove 230 link together.
Refer to the cross section structure schematic diagram that Fig. 5 A and Fig. 5 B, Fig. 5 A is the another kind of section bar that the device support device in the present invention uses, Fig. 5 B is the cross section structure schematic diagram of the section bar shown in Fig. 5 A.As fig. 5 a and fig. 5b, described montant, the first support bar and the second support bar are made up of the second section bar.The cross section of described second section bar 300 is roughly square, and the height of its cross section is H3, and length is L3, and wherein L3 equals H3.Each side of described second section bar 300 is provided with to be run through second of this side and passes through groove 310, four second on four sides pass through groove 310 and described second section bar 300 are divided into the second connecting portion 330 being positioned at center and the second terminal part 320 being positioned at four corners, and described second terminal part 320 and described second connecting portion 330 are all the structure of hollow.
Fig. 6 is the device support device 100 assembling perspective view in one further embodiment in the present invention, Fig. 7 A is the planar structure schematic diagram of the plate that the device support device in the present invention uses, and Fig. 7 B is the left TV structure schematic diagram of the plate shown in Fig. 7 A.Device support device 100 in Fig. 6 is compared with the device support device described in Fig. 3 A, and it also includes side plate 400, and in this embodiment, this plate has four.Shown in composition graphs 3A and Fig. 3 B, each side plate 400 is dismountable to be plugged between the corresponding epitaxy part of a top cross bar and the groove of the epitaxy part of a bottom bar, the top edge of each side plate 400 is contained in the groove of the epitaxy part of described top cross bar, and the lower limb of each side plate 400 is contained in the raceway groove of the epitaxy part of described bottom bar.
Please continue to refer to Fig. 7 A and Fig. 7 B, the end 420 that described plate 400 comprises pars intermedia 410 and extends to both sides from pars intermedia 410.In this embodiment, the thickness of the end 420 of described plate 400 is corresponding with the groove 230 of the epitaxy part of described first section bar 200, and the end 420 of described plate 400 can correspondence be inserted in the groove 230 of described first section bar 200.
Concrete, between the epitaxy part 121 having two side plates 400 to be plugged in corresponding top first cross bar 120 respectively and the epitaxy part 141 of bottom first cross bar 140, the top edge of these two side plates 400 is contained in the groove 230 of the epitaxy part 121 of described top first cross bar 120, and its lower limb is contained in the groove 230 of the epitaxy part 141 of described bottom first cross bar 140.Between the epitaxy part 131 having two side plates 400 to be plugged in corresponding top second cross bar 130 respectively and the epitaxy part 151 of bottom second cross bar 150, the top edge of these two side plates 400 is contained in the groove 230 of the epitaxy part 131 of described top second cross bar 130, and its lower limb is contained in the groove 230 of the epitaxy part 151 of described bottom second cross bar 150.
Described side plate 400 provides certain semienclosed spatial accommodation can to the semiconductor processing module in described device support device 100.Like this, both can protect the semiconductor processing module in it, and also can prevent the semiconductor processing module in it from breaking down after (such as occurring unexpected leak of liquid or sprinkling) and have influence on external environment condition.In addition, described side plate also makes the outward appearance of whole device support device more attractive in appearance.
In one embodiment, the montant 110 in the device support device 100 in the present invention, cross bar 120,130,140 and 150, and support bar 160 and 170 can adopt normally used standard sections.
In the present invention, when adjacent two section bars are linked together, by direct on section bar perforate adopt the parts that are spirally connected section bar to be connected into the device support device of stereo structure, the parts that are spirally connected can also be used by the perforation on outer connector (not shown) by relative with profiled bars for outer connector fixing.Material bar can be connected at an arbitrary position as required.In one embodiment, the parts that are spirally connected can also be used by the perforation on interconnecting piece (not shown) by relative with profiled bars for interconnecting piece fixing.Material bar can be connected at an arbitrary position as required.Further again, in order to reach special intensity or fixed effect, available solder or other method carry out connection profile.
The section bar of the present invention that described device support device 100 of the present invention adopts, assembles by simply and just can assemble, and very convenient equally during dismounting, the section bar after dismounting can also reuse again, saving resource, reduces rubbish, is conducive to environmental protection.
Those of ordinary skill in affiliated field should be appreciated that; the description about device support device 100 in embodiment is only exemplary, make under the prerequisite not departing from true spirit of the present invention and scope change and all should belong to protection scope of the present invention.As space is limited, the embodiment that part is changed only is listed below.
In certain embodiments, the pattern of the described section bar that the device support device 100 shown in Fig. 3 A adopts is not limited in this, as long as this section bar can be built into the structure shown in Fig. 3 A, such as this section bar only has 1 or 2 sides to have the groove etc. running through this side.
In certain embodiments, first cross bar 120 and 140 can be positioned at the outside of the second cross bar 130 and 150, that is, the second cross bar 130 directly leans with the terminal surface of montant with 150 and is connected, and the first cross bar 120 leans and is connected with the side of the second cross bar 130 and 150 with 140 respectively.Certainly, the position relationship between the first cross bar 120 and the second cross bar 130 can also be exchanged as required, also can exchange the position relationship between the first cross bar 140 and the second cross bar 150 as required.
" top " is relative with " end " herein, if one of them is " top ", so its relative is exactly " end ".
It should be noted that, cuboid framework of the present invention has multilayer, and wherein, semiconductor processing module 10 is arranged on this layer as Fig. 3 A.Described fluid delivery module 20 is placed on lower one deck framework (not shown) of semiconductor processing module 10, device for transferring fluid is connected by pipeline with the semiconductor processing module on its upper strata, lower one deck framework of described delivery module 20 is placed with fluid carrying module 30, and described control module 40 is arranged on the lateral frame of described fluid delivery module 20 and fluid carrying module 30.
Refer to Fig. 8, it is the structural representation of fluid delivery module of the present invention.As shown in Figure 8.Described fluid delivery module comprises base plate 510, be positioned at placer 520 on base plate 510 and, be vertically installed in described base plate 510 and the one or more pumps 560 being positioned at the loading plate 530 of described placer 520 side, the tank plate 540 be sticked on described loading plate 530, electronic control valve 550 and being arranged on described base plate 510.
Refer to Fig. 9, it is the part-structure schematic diagram of fluid delivery module of the present invention.As shown in Figure 8 and Figure 9.Described base plate 510, it is provided with the pump seat 570 of " mountain " font, and the surrounding of described pump seat 570 offers several the first circular holes 511.Described pump seat 570 has the first arm 571, second arm 572 and the 3rd arm 573, and described first arm 571 is relative with on the second arm 572 offers the first draw-in groove 574, and described second arm 572 is relative with on the 3rd arm 573 offers the second draw-in groove 575.Described pump 560 can be slidably mounted on described base plate 510 by described first draw-in groove 574 and the second draw-in groove 575.
Described placer 520, it is set up in the top of described first circular hole 511, described placer 520 offers the second circular hole 521, described second circular hole 521 and the first circular hole 511 corresponding.First circular hole 511 of the present invention and the corresponding setting of the second circular hole 521 and be separated with preset distance between described first circular hole 511 and the second circular hole 521, filter (not shown) is then inserted in described first circular hole 511 and the second circular hole 521, thus ensure that the stability of filter.
Please continue to refer to Fig. 8.Described loading plate 530, it is installed vertically on institute's base plate 510 by groove seat 580, and described groove seat 580 upwards extends to form from the surface of described base plate 510.Wherein, the width of the first groove 581 of described groove seat 580 is corresponding with the thickness of described loading plate 530, described loading plate 530 firmly can be sticked on described base plate 510 by this first groove 581.The present invention by offering the first groove 581 on groove seat 580, and it can not only conveniently engage loading plate 530, and be easy to dismounting or change different types of loading plate, and it is applied widely.In this embodiment, described groove seat 580 is integrated with described base plate 510.In other embodiments, for the ease of dismounting and maintenance, described groove seat 580 can also be fixed on described base plate 510 by securing member.
Refer to Figure 10 and Figure 11, the main TV structure schematic diagram that Figure 10 is loading plate described in Fig. 8, Figure 11 is the backsight structural representation of described loading plate.As shown in Figure 10 and Figure 11, described loading plate 530 offers several through holes 531 and be positioned at the conduit 532 in loading plate 530 front.Described through hole 531 comprises the first manhole 5311 and the second square through hole 5312, and described first manhole 5311 is connected with the second square through hole 5312, and the diameter of described first manhole 5311 is less than described second square through hole 5312 width.The length of described first manhole 5311 is less than the length of described second square through hole 5312, and in one embodiment, the length of described first manhole 5311 is about 1/1 to five/6th of described second square through hole 5312 length.In this embodiment, several through holes 531 described are uniformly distributed at equal intervals on loading plate 530.In other embodiments, several through holes 531 described distribution situation on loading plate 530 is not limited, can adjust according to actual needs and determine.
Figure 12 is the structural representation of the plate of tank described in Fig. 8, and Figure 13 is the structural representation that described tank plate is sticked in described loading plate.As shown in Fig. 8 to Figure 13.Described tank plate 540 comprises tank 541, be positioned at first of tank both sides along arm 542 and second along arm 543, described first is less than described second along the width of arm 543 along the width of arm 542, described second is corresponding with the degree of depth of described tank 541 along the width of arm 543, and described tank plate 540 can be made like this can be firmly sticked in the conduit 532 of described loading plate 530.Wherein, described tank plate 540 is vertically sticked in the conduit 532 of described loading plate 530, and the liquid flowed out from described through hole 531 enters tank 541.Tank plate 540 of the present invention is mobilizablely sticked in the groove of loading plate, do not need joint outer part, easily dismantle, and is easy to safeguard.The present invention arranges a tank plate 540 in the below of described loading plate 530, for collecting the liquid spilt from the opening 553 of described electronic control valve 550, avoids impacting miscellaneous part.
Please continue to refer to Figure 14, it is the structural representation of electronic control valve described in Fig. 8.As shown in Fig. 8 and Figure 14.Described electronic control valve 550, it comprises the first valve portion 551 and the second valve portion 552, the shape in described first valve portion 551 is corresponding with the shape of the first manhole 5311 of described loading plate 530, and the shape in described second valve portion 552 is corresponding with the shape of the second square through hole 5312 of described loading plate 530.
Described first valve portion 551 is cylindrical, has multiple opening 553 in columniform side, and according to external control, two opening 553 can optionally be communicated with by electronic control valve 550.One end of described pump 560 is provided with one and sucks the suction inlet (not shown) of liquid and the outlet (not shown) of a discharge liquid.Described second valve portion 552 is in prism-shaped, and its end is connected with electrical cable (not shown), offers the first screw hole 554 in a side of prism-shaped.In this embodiment, the quantity of described first screw hole 554 is three.
Please continue to refer to Fig. 8.In use, pipeline can be utilized to be communicated with by the fluid of the outlet (not shown) of the entrance (not shown) of the opening 553 of the outlet of the suction inlet of described pump 560, described pump 560, described electronic control valve 550, described micro chamber, described micro chamber and/or described fluid carrying module 30.Like this, under the driving of pump 560, the fluid of described fluid carrying module 30 can be delivered to described micro chamber by pipeline and/or described electronic control valve 550, the fluid flowed out from described micro chamber is delivered in described fluid carrying module 30 or predetermined fluid discharge line by pipeline and/or described electronic control valve 550.
Please continue to refer to Fig. 8.Described base plate 510 offers the under shed 590 being communicated with described fluid space, and this under shed 221 pipeline for connection passes.For example, if shown in position relationship Fig. 1 of modules 10,20,30 and 40, the pipeline so passed from described under shed 221 will be communicated to described fluid carrying module 30.
Refer to Figure 15, it is the structural representation of supporting plate of the present invention, and Figure 16 is the structural representation that the supporting plate of Figure 15 is fixed on electronic control valve.As shown in Figure 14 to 16.Described electronic control valve also comprises supporting plate 610, on described supporting plate 610, the position of corresponding described first screw hole 554 offers the second screw hole 611, is fixed in the first valve portion 551 of described electronic control valve 550 by described supporting plate 610 by described first screw hole 554 and the second screw hole 611.Figure 17 is the structural representation that electronic control valve of the present invention is sticked on described loading plate.As shown in Figure 10,11 and Figure 17, described electronic control valve 550 snaps in from one end of described second square through hole 5312 and stretches out described first manhole 5311, make the first valve portion 551 of described electronic control valve 550 stretch out described first manhole 5311, second valve portion 552 to snap in and in the second square through hole 5312 described in supporting plate 610.In the present invention, the length in described second valve portion 552 is much larger than the length of described second square through hole 5312, the thickness summation of described second valve portion 552 and supporting plate 610 and the height of described second square through hole 5312 adapt, by described supporting plate 610 being attached to the second valve portion 552 of described electronic control valve and then being fixed on described loading plate 530 by electronic control valve 550.Supporting plate 610 of the present invention, it snaps in the second square through hole 5312 of described loading plate 530 with described electronic control valve 550 together, and then a supporting role is played to described electronic control valve 550, described electronic control valve 550 is made can be firmly sticked on described loading plate 530, when described electronic control valve 550 unloads from described loading plate 530 by needs, only need the second valve portion 552 of the manually described electronic control valve 550 of contact to be communicated with supporting plate 562 to extract from described second square through hole 5312 together, not only facilitated but also not fragile each parts.
A feature of the electronic control valve in the present invention or advantage are: arrange supporting plate 610 in the below in the second valve portion 552 of described electronic control valve 550, can firmly be snapped on described loading plate 530 by described electronic control valve 550, and are easy to dismounting.
Above-mentioned explanation fully discloses the specific embodiment of the present invention.It is pointed out that the scope be familiar with person skilled in art and any change that the specific embodiment of the present invention is done all do not departed to claims of the present invention.Correspondingly, the scope of claim of the present invention is also not limited only to previous embodiment.
Claims (7)
1. a device for transferring fluid, is characterized in that, it comprises:
Loading plate, it offers several through holes, and described through hole comprises the first manhole and the second square through hole, and described first manhole is connected with the second square through hole;
Electronic control valve, it comprises the first valve portion and the second valve portion, and the shape in described first valve portion is corresponding with the first manhole of described loading plate, and the shape in described second valve portion is corresponding with the second square through hole of described loading plate;
Supporting plate, it is fixed in the second valve portion of described electronic control valve,
Described first manhole is stretched out in first valve portion of described electronic control valve, and the second valve portion and supporting plate snap in described second square through hole.
2. device for transferring fluid according to claim 1, is characterized in that, it also comprises base plate, the placer be positioned on base plate, be arranged at one or more pump on described base plate and tank plate,
Described loading plate is vertically installed in described base plate and is positioned at the side of described placer, and described tank plate is vertically sticked on described loading plate.
3. device for transferring fluid according to claim 1, is characterized in that, described first valve portion is cylindrical, has multiple opening in columniform side;
Described second valve portion is prism-shaped, and its end is connected with electrical cable.
4. device for transferring fluid according to claim 3, it is characterized in that, several the first screw holes are offered in a side of described second valve portion prism-shaped, on described supporting plate, the position of corresponding described first screw hole offers the second screw hole, is attached on described electronic control valve by described supporting plate by the first screw hole and the second screw hole.
5. device for transferring fluid according to claim 1, is characterized in that, the length in described second valve portion is greater than the length of described second square through hole, and the thickness summation of described second valve portion and supporting plate and the height of described second square through hole adapt.
6. device for transferring fluid according to claim 1, is characterized in that, the diameter of described first manhole is less than described second square entire widths, and the length of described first manhole is less than the length of described second square through hole.
7. device for transferring fluid according to claim 6, is characterized in that, the length of described first manhole is 1/1 to five/6th of described second square through hole length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510335380.9A CN105023868B (en) | 2015-06-16 | 2015-06-16 | Device for transferring fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510335380.9A CN105023868B (en) | 2015-06-16 | 2015-06-16 | Device for transferring fluid |
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| CN105023868A true CN105023868A (en) | 2015-11-04 |
| CN105023868B CN105023868B (en) | 2018-02-27 |
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| US20110065276A1 (en) * | 2009-09-11 | 2011-03-17 | Applied Materials, Inc. | Apparatus and Methods for Cyclical Oxidation and Etching |
| CN102437077A (en) * | 2011-10-19 | 2012-05-02 | 东莞宏威数码机械有限公司 | Equipment for linearly transmitting organic light-emitting diode (OLED) substrate |
| CN103208438A (en) * | 2012-01-12 | 2013-07-17 | 余端仁 | Etching device |
| CN104051311A (en) * | 2014-07-08 | 2014-09-17 | 深圳市华星光电技术有限公司 | Base plate conveying device and strong acid or strong base etching process suitable for wet process |
| US20150001921A1 (en) * | 2013-06-28 | 2015-01-01 | Denso Corporation | Brake system for vehicle designed to facilitate air purging during braking |
| CN204680658U (en) * | 2015-06-16 | 2015-09-30 | 无锡华瑛微电子技术有限公司 | Device for transferring fluid |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20110065276A1 (en) * | 2009-09-11 | 2011-03-17 | Applied Materials, Inc. | Apparatus and Methods for Cyclical Oxidation and Etching |
| CN102437077A (en) * | 2011-10-19 | 2012-05-02 | 东莞宏威数码机械有限公司 | Equipment for linearly transmitting organic light-emitting diode (OLED) substrate |
| CN103208438A (en) * | 2012-01-12 | 2013-07-17 | 余端仁 | Etching device |
| US20150001921A1 (en) * | 2013-06-28 | 2015-01-01 | Denso Corporation | Brake system for vehicle designed to facilitate air purging during braking |
| CN104051311A (en) * | 2014-07-08 | 2014-09-17 | 深圳市华星光电技术有限公司 | Base plate conveying device and strong acid or strong base etching process suitable for wet process |
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| CN105023868B (en) | 2018-02-27 |
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