CN105019596A - Double-layer heat preservation wallboard - Google Patents

Double-layer heat preservation wallboard Download PDF

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Publication number
CN105019596A
CN105019596A CN201410170602.1A CN201410170602A CN105019596A CN 105019596 A CN105019596 A CN 105019596A CN 201410170602 A CN201410170602 A CN 201410170602A CN 105019596 A CN105019596 A CN 105019596A
Authority
CN
China
Prior art keywords
layer
double
heat preservation
preservation wallboard
layer heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410170602.1A
Other languages
Chinese (zh)
Inventor
周长荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YANGZHOU YINFAN ENERGY SAVING TECHNOLOGY Co Ltd
Original Assignee
YANGZHOU YINFAN ENERGY SAVING TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YANGZHOU YINFAN ENERGY SAVING TECHNOLOGY Co Ltd filed Critical YANGZHOU YINFAN ENERGY SAVING TECHNOLOGY Co Ltd
Priority to CN201410170602.1A priority Critical patent/CN105019596A/en
Publication of CN105019596A publication Critical patent/CN105019596A/en
Pending legal-status Critical Current

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Abstract

The invention relates to the technical field of cooling equipment, in particular to a double-layer heat preservation wallboard. An existing heat preservation wallboard is of a two-layer type and is poor in quality, low in strength, poor in high-temperature resisting effect and easy to deform. The double-layer heat preservation wallboard comprises protection layers which are arranged at two sides and a sandwich layer which is arranged at the middle part; each layer is formed in a pressing way through a bonding layer; the bonding layer is a ceramic tile cementing mortar layer; the protection layers are rigid foam polyurethane heat preservation layers; the sandwich layer is a steel wire mesh cement picking foam layer. According to the improved double-layer heat preservation wallboard disclosed by the invention, the strength is high, double-layer heat preservation is realized, and heat cannot be transferred after the exposure in sunshine, so that the temperature difference effect in a tower is not influenced.

Description

Double-layer heat insulation wallboard
Technical field
The present invention relates to cooling device technical field, especially a kind of double-layer heat insulation wallboard.
Background technology
Existing heat-insulation wall plate, has bond techniques and the large class of foaming technique two.Bond techniques room refers to that binding agent is bonded to decoration panel on heat preservation plate material, as expanded polystyrene (EPS), vegetable oil rigid poly urethanes foaming plate, because binding agent quality is unstable, or manual operation is improper, so cause bonding quality defect, decoration panel easily falls down, and expanded polystyrene (EPS) and extruded polystyrene and metal finish combine, when temperature is too high, heat insulating material will dissolve, be out of shape, and causes whole warming plate to be out of shape; Foaming technique refers to the back side at decoration panel, direct spraying or perfusion foam glue, and foam glue becomes foaming gelatinous layer through foaming, and foaming gelatinous layer has certain thickness, can play insulation effect, but intensity is low.Above two kinds of composite boards are all two-layer, and of poor quality, intensity is low, and high-temperature resistant result is poor, yielding.
Summary of the invention
In order to overcome existing above-mentioned deficiency, the invention provides a kind of double-layer heat insulation wallboard.
The technical solution adopted for the present invention to solve the technical problems is: a kind of double-layer heat insulation wallboard, comprises the topping on both sides and middle interlayer, and each layer is formed by tack coat compacting, and described tack coat is ceramic tile cementing mortar layer.
According to another embodiment of the invention, comprising described topping is further hard-foam polyurethane insulation layer.
According to another embodiment of the invention, comprising described interlayer is further that cement foam layer adopted by gauze wire cloth.
The invention has the beneficial effects as follows, intensity is high, and double-layer heat insulation does not conduct heat after exposure in sunshine, thus does not affect the temperature difference effect in tower.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is structural representation of the present invention;
1. toppings, 2. interlayer, 3. tack coat in figure.
Detailed description of the invention
If Fig. 1 is structural representation of the present invention; a kind of double-layer heat insulation wallboard; comprise the topping 1 on both sides and middle interlayer 2; each layer is formed by tack coat 3 compacting, and described tack coat 3 is ceramic tile cementing mortar layer, also serves the effect of thermal insulation while playing fine cementation; described topping 1 is hard-foam polyurethane insulation layer; high insulating effect, described interlayer 2 adopts cement foam layer for gauze wire cloth, and intensity is high.
Double-layer heat insulation wallboard intensity after improvement is high, and double-layer heat insulation, does not conduct heat after exposure in sunshine, thus does not affect the temperature difference effect in tower.

Claims (3)

1. a double-layer heat insulation wallboard, comprises the topping (1) on both sides and middle interlayer (2), it is characterized in that, each layer is formed by tack coat (3) compacting, and tack coat (3) is ceramic tile cementing mortar layer.
2. double-layer heat insulation wallboard according to claim 1, is characterized in that, described topping (1) is hard-foam polyurethane insulation layer.
3. double-layer heat insulation wallboard according to claim 1, is characterized in that, described interlayer (2) adopts cement foam layer for gauze wire cloth.
CN201410170602.1A 2014-04-26 2014-04-26 Double-layer heat preservation wallboard Pending CN105019596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410170602.1A CN105019596A (en) 2014-04-26 2014-04-26 Double-layer heat preservation wallboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410170602.1A CN105019596A (en) 2014-04-26 2014-04-26 Double-layer heat preservation wallboard

Publications (1)

Publication Number Publication Date
CN105019596A true CN105019596A (en) 2015-11-04

Family

ID=54409863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410170602.1A Pending CN105019596A (en) 2014-04-26 2014-04-26 Double-layer heat preservation wallboard

Country Status (1)

Country Link
CN (1) CN105019596A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108661213A (en) * 2018-07-27 2018-10-16 山东地平线建筑节能科技有限公司 A kind of assembled integral concrete works exterior wall non-dismantling formwork material
CN113262672A (en) * 2021-04-15 2021-08-17 泉州市天发食品机械有限公司 Heat-preservation type pulping barrel and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108661213A (en) * 2018-07-27 2018-10-16 山东地平线建筑节能科技有限公司 A kind of assembled integral concrete works exterior wall non-dismantling formwork material
CN113262672A (en) * 2021-04-15 2021-08-17 泉州市天发食品机械有限公司 Heat-preservation type pulping barrel and manufacturing method thereof

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20151104

WD01 Invention patent application deemed withdrawn after publication