CN105019006A - 电镀槽 - Google Patents
电镀槽 Download PDFInfo
- Publication number
- CN105019006A CN105019006A CN201510425517.XA CN201510425517A CN105019006A CN 105019006 A CN105019006 A CN 105019006A CN 201510425517 A CN201510425517 A CN 201510425517A CN 105019006 A CN105019006 A CN 105019006A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- conduit
- plated
- plating tank
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 18
- 239000007788 liquid Substances 0.000 claims abstract description 38
- 238000007747 plating Methods 0.000 claims description 37
- 210000005056 cell body Anatomy 0.000 claims description 22
- 239000012530 fluid Substances 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 12
- 230000008676 import Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000010349 pulsation Effects 0.000 description 3
- 239000013589 supplement Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 235000015170 shellfish Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510425517.XA CN105019006B (zh) | 2015-07-17 | 2015-07-17 | 电镀槽 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510425517.XA CN105019006B (zh) | 2015-07-17 | 2015-07-17 | 电镀槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105019006A true CN105019006A (zh) | 2015-11-04 |
CN105019006B CN105019006B (zh) | 2017-11-21 |
Family
ID=54409292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510425517.XA Expired - Fee Related CN105019006B (zh) | 2015-07-17 | 2015-07-17 | 电镀槽 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105019006B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106350841A (zh) * | 2016-10-18 | 2017-01-25 | 东莞宇宙电路板设备有限公司 | 一种电镀装置 |
CN106376181A (zh) * | 2016-10-18 | 2017-02-01 | 东莞宇宙电路板设备有限公司 | 一种水刀组件及清洗装置 |
CN108642549A (zh) * | 2018-07-18 | 2018-10-12 | 惠州市捷成机电设备有限公司 | 一种电镀槽阴极滚轮配喷淋导电装置 |
CN111850635A (zh) * | 2019-04-24 | 2020-10-30 | 矽磐微电子(重庆)有限公司 | 电镀***及电镀方法 |
CN112708920A (zh) * | 2019-10-24 | 2021-04-27 | 亚洲电镀器材有限公司 | 流体输送***及电镀工件的方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002129381A (ja) * | 2000-10-26 | 2002-05-09 | Hideyuki Kobayashi | メッキ装置の流量調整可能なメッキ液噴出ノズルシステム |
EP1533400A1 (en) * | 2003-11-20 | 2005-05-25 | Process Automation International Limited | A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus |
CN201180159Y (zh) * | 2008-01-18 | 2009-01-14 | 佳辉设备(东莞)有限公司 | 混流喷嘴 |
CN201753367U (zh) * | 2010-06-08 | 2011-03-02 | 佳辉设备(东莞)有限公司 | 电路板电镀喷射装置之喷管的排布结构 |
CN102121126A (zh) * | 2011-01-19 | 2011-07-13 | 俊杰机械(深圳)有限公司 | 一种带导轮架的pcb电镀装置 |
CN203007457U (zh) * | 2012-11-30 | 2013-06-19 | 东莞市富默克化工有限公司 | 一种pcb电镀槽 |
CN103305882A (zh) * | 2012-03-07 | 2013-09-18 | 深南电路有限公司 | Pcb板电镀方法及装置 |
-
2015
- 2015-07-17 CN CN201510425517.XA patent/CN105019006B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002129381A (ja) * | 2000-10-26 | 2002-05-09 | Hideyuki Kobayashi | メッキ装置の流量調整可能なメッキ液噴出ノズルシステム |
EP1533400A1 (en) * | 2003-11-20 | 2005-05-25 | Process Automation International Limited | A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus |
CN201180159Y (zh) * | 2008-01-18 | 2009-01-14 | 佳辉设备(东莞)有限公司 | 混流喷嘴 |
CN201753367U (zh) * | 2010-06-08 | 2011-03-02 | 佳辉设备(东莞)有限公司 | 电路板电镀喷射装置之喷管的排布结构 |
CN102121126A (zh) * | 2011-01-19 | 2011-07-13 | 俊杰机械(深圳)有限公司 | 一种带导轮架的pcb电镀装置 |
CN103305882A (zh) * | 2012-03-07 | 2013-09-18 | 深南电路有限公司 | Pcb板电镀方法及装置 |
CN203007457U (zh) * | 2012-11-30 | 2013-06-19 | 东莞市富默克化工有限公司 | 一种pcb电镀槽 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106350841A (zh) * | 2016-10-18 | 2017-01-25 | 东莞宇宙电路板设备有限公司 | 一种电镀装置 |
CN106376181A (zh) * | 2016-10-18 | 2017-02-01 | 东莞宇宙电路板设备有限公司 | 一种水刀组件及清洗装置 |
CN108642549A (zh) * | 2018-07-18 | 2018-10-12 | 惠州市捷成机电设备有限公司 | 一种电镀槽阴极滚轮配喷淋导电装置 |
CN111850635A (zh) * | 2019-04-24 | 2020-10-30 | 矽磐微电子(重庆)有限公司 | 电镀***及电镀方法 |
CN111850635B (zh) * | 2019-04-24 | 2022-03-25 | 矽磐微电子(重庆)有限公司 | 电镀***及电镀方法 |
CN112708920A (zh) * | 2019-10-24 | 2021-04-27 | 亚洲电镀器材有限公司 | 流体输送***及电镀工件的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105019006B (zh) | 2017-11-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105019006A (zh) | 电镀槽 | |
CN103305882B (zh) | Pcb板电镀方法及装置 | |
CN203007457U (zh) | 一种pcb电镀槽 | |
CN106167913B (zh) | 电镀槽装置 | |
CN104313657A (zh) | Hdi印制线路板通孔的电沉积装置 | |
WO2023123912A1 (zh) | 电镀装置 | |
CN112410852A (zh) | 纳米复合电镀设备及电镀工艺 | |
CN208762590U (zh) | 一种新型电镀装置 | |
CN108745012A (zh) | 一种可模块化组合的微型文丘里式气泡发生装置 | |
CN117165978B (zh) | 一种利用多孔结构调控气泡的电解槽、电解装置与方法 | |
TWM572375U (zh) | Gas mixing device for electroplating system | |
CN208667890U (zh) | 一种金刚石线锯上砂槽搅拌装置 | |
CN104328465A (zh) | Hdi印制线路板高均匀性通孔电镀装置 | |
CN202705535U (zh) | 一种线路板电镀镀铜装置 | |
CN202954124U (zh) | 一种水平工件电化学沉积设备 | |
CN201753368U (zh) | 一种用于多层刚挠结合板的微孔电镀装置 | |
CN205710979U (zh) | Hdi板精细化镀铜装置 | |
CN202297813U (zh) | 电镀液稳压分流装置 | |
KR101593378B1 (ko) | Pcb 도금액 분사장치 | |
TWI663293B (zh) | 電鍍系統之氣體攪拌裝置 | |
CN203440489U (zh) | 填孔电镀线的改良结构 | |
CN202658079U (zh) | 一种单面多片式的玻璃薄化设备 | |
CN207891454U (zh) | 一种用于电镀槽的搅拌装置 | |
CN202626322U (zh) | 一种水刀式电镀槽喷洒装置 | |
CN105917033A (zh) | 电镀装置及收容槽 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180626 Address after: 301600 Jinhai Road 26, Jinghai Economic Development Zone, Jinghai District, Tianjin. Patentee after: MYRSKY ELECTRONIC SCIENCE AND TECHNOLOGY (TIANJIN) Inc. Address before: 518000 second buildings in Heping Village and Yuyi Industrial Zone, Fuyong Town, Baoan District, Shenzhen, Guangdong Co-patentee before: SHENZHEN HUAXIANGRONGZHENG ELECTRONIC Co.,Ltd. Patentee before: SHENZHEN HUAXIANG CIRCUIT TECH. Co.,Ltd. Co-patentee before: JIUJIANG HUAXIANG TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171121 |
|
CF01 | Termination of patent right due to non-payment of annual fee |