CN105017542A - Preparation method of reinforced organosilicon heat-conducting fin - Google Patents
Preparation method of reinforced organosilicon heat-conducting fin Download PDFInfo
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- CN105017542A CN105017542A CN201510452217.0A CN201510452217A CN105017542A CN 105017542 A CN105017542 A CN 105017542A CN 201510452217 A CN201510452217 A CN 201510452217A CN 105017542 A CN105017542 A CN 105017542A
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Abstract
The invention discloses a preparation method of a reinforced organosilicon heat-conducting fin, which comprises the following steps: coating a bonding accelerator on glass cloth to obtain a substrate layer, wherein the bonding accelerator comprises hydrogen-containing organopolysiloxane; and mixing components of a silicone rubber composition comprising vinyl-containing organopolysiloxane, a crosslinking agent, a heat-conducting filler and a platinum catalyst, carrying out calendering compounding with the substrate layer, and curing to obtain the reinforced organosilicon heat-conducting fin. By carrying out pretreatment on the glass cloth reinforcing material, the interlayer binding force between the silicone rubber composition and glass cloth is effectively enhanced, and the durability and reliability of the fin are improved.
Description
Technical field
The invention belongs to organosilicon material technical field, relate to a kind of preparation method of organosilicon conducting strip of enhancing.
Technical background
Organosilicon material has high-low temperature resistant, electric insulation, resistance to oxidation stability, weathering resistance, difficult combustion, the excellent specific property such as corrosion-resistant, be used widely at chemical field, especially, in heat conduction technical field, be main thermally conductive material kind containing organosilyl heat-conducting interface material.Organosilicon heat-conducting interface material to be mainly used in electric installation between heating position and heat radiation position, play thermal conduction, sealing and insulation function, product form comprises silicone grease and silica gel piece, wherein silica gel piece generally comprises layer of silica gel containing thermally conductive material and substrate layer, silica gel piece is made to have the performances such as anti-puncture, anti tear, insulation by substrate layer, improve insulativity, also easy to use and maintenance.At present, usually pass through substrate layer coated with coupling agent or caking agent in silica gel piece and other organosilicon heat-conducting composite sheets, with the bond strength improving layer of silica gel and strengthen between base material, layer of silica gel is prevented to be separated with substrate layer, improve silica gel piece reliability in the application and weather resistance, but the raising of this mode to differing materials interlayer bounding force is limited.
Summary of the invention
For above-mentioned the deficiencies in the prior art, the invention provides a kind of preparation method of organosilicon conducting strip of enhancing, method of the present invention prepares the organosilicon conducting strip of enhancing by the base material after special processing and layer of silica gel compound, base material and silica gel inter-layer bonding force are improved, and then improves sheet material reliability in actual applications and weather resistance.
Object of the present invention is achieved through the following technical solutions:
The invention provides a kind of preparation method of organosilicon conducting strip of enhancing, comprise the following steps:
A, be coated on woven fiber glass by adhesion promoters, obtain substrate layer, described adhesion promoters comprises hydrogeneous organopolysiloxane;
B, the component mixing that will comprise containing the rubber composition of the organopolysiloxane of vinyl, linking agent, heat conductive filler and platinum catalyst, obtain mixture, mixture and substrate layer rolled compound, the organosilicon conducting strip be enhanced after solidification.
In described step B, after mixture and substrate layer are rolled compound, lamelliform rubber composition is made to be applied to the single or double of substrate layer, and adhesion promoters is distributed in the single or double of woven fiber glass and can wraps up glass fibre in substrate layer, lamelliform rubber composition is contacted with adhesion promoters.
In steps A, the coating method be coated on by adhesion promoters on woven fiber glass includes but not limited to dip-coating, brushing, spraying etc., makes adhesion promoters form the coating of homogeneous thinner thickness on the surface at one or two of woven fiber glass by coating.In order to the coating enabling adhesion promoters form homogeneous thinner thickness on woven fiber glass, when the viscosity of adhesion promoters is higher, preferably first dissolved with solvent, obtain treatment solution, again treatment solution is coated on woven fiber glass, dry except desolventizing, the homogeneous and coating of thinner thickness can be obtained.Described solvent includes but not limited to octyl group silicone oil, lower molecular weight methyl-silicone oil, toluene, Virahol, tetracol phenixin, ethyl acetate etc.
It is described that to carry out mixture and substrate layer rolling compound can be roll compound with mixture at the one or both sides of substrate layer simultaneously.Described calendering compound can adopt the modes such as mold pressing, roll-in, curtain coating.
Described solidification is not particularly limited.Preferably, the condition of described solidification is solidification value 65 ~ 95 DEG C, set time 5 ~ 15min.
Described hydrogeneous organopolysiloxane is the organopolysiloxane containing two or more hydrogen bases be connected with silicon, the position of the hydrogen base be connected with silicon can be on side chain, molecular end or be simultaneously positioned on molecular end and side chain, the position of the hydrogen base be preferably connected with silicon is in molecular end or be positioned on molecular end and side chain simultaneously, and containing at least 3 hydrogen bases be connected with silicon.Preferably, the hydrogen content of described hydrogeneous organopolysiloxane is 0.3-1% (quality), is 10-1000mPas at the viscositys of 25 DEG C.Described hydrogeneous organopolysiloxane is more preferably 10 ~ 500mPas at the viscosity of 25 DEG C, most preferably is 10 ~ 300mPas.
Preferably, hydrogeneous organopolysiloxane is selected from the polymethyl hydrogen siloxane of trimethylsiloxy group end-blocking, the methyl hydrogen siloxane of trimethylsiloxy group end-blocking and the multipolymer of dimethyl siloxane, the methyl hydrogen siloxane of dimethyl hydrogen siloxy end-blocking and the multipolymer of methylphenyl siloxane, the methyl hydrogen siloxane of dimethyl hydrogen siloxy end-blocking and the multipolymer of dimethyl siloxane, the polydimethylsiloxane of dimethyl hydrogen siloxy end-blocking, the methyl hydrogen siloxane of trimethylsiloxy group end-blocking and the multipolymer of methylphenyl siloxane, the methyl hydrogen siloxane of trimethylsiloxy group end-blocking and methyl (3, 3, 3-trifluoro propyl) multipolymer of siloxanes, one or more in Cyclic methyl hydrogen polysiloxanes or four (dimethyl hydrogen silicon alkoxyl group) silane.
Preferably, the organopolysiloxane of described adhesion promoters also containing hydroxyl or the organopolysiloxane containing vinyl.
Concrete, the organopolysiloxane of described hydroxyl is the organopolysiloxane containing two or more hydroxyls be connected with silicon, the position of hydroxyl can be on side chain, molecular end or be simultaneously positioned on molecular end and side chain, the position of preferred hydroxyl is molecule two ends or is positioned on molecule two ends and side chain simultaneously.Preferably, the hydroxy radical content of the organopolysiloxane of described hydroxyl is 0.6-8% (quality), is 10-1000mPas at the viscositys of 25 DEG C.
Preferably, the organopolysiloxane of hydroxyl is selected from one or more in the multipolymer of the polydimethylsiloxane of dimethyl hydroxyl siloxy end-blocking, the methylphenyl siloxane of dimethyl hydroxyl siloxy end-blocking and the multipolymer of dimethyl siloxane, the methylhydroxy siloxanes of trimethylsiloxy group end-blocking and methylphenyl siloxane.
Preferably, described adhesion promoters contains the organopolysiloxane of hydroxyl, and in the organopolysiloxane of described hydroxyl, the molar weight of hydroxyl is 0.3-0.7 with the ratio of the molar weight of hydrogen base in hydrogeneous organopolysiloxane.
Preferably, described adhesion promoters contains the organopolysiloxane containing vinyl, should be the organopolysiloxane containing two or more vinyl be connected with silicon containing the organopolysiloxane of vinyl, the position of vinyl can be on side chain, molecular end or be simultaneously positioned on molecular end and side chain, the position of preferred vinyl is on side chain or is positioned on molecule two ends and side chain simultaneously.Preferably, the contents of ethylene of the described organopolysiloxane containing vinyl is 0.3-5% (quality), is more preferably 0.5-2% (quality).The described organopolysiloxane containing vinyl is preferably 50-1000mPas at the viscosity of 25 DEG C.
More preferably, one or more in the multipolymer of the multipolymer of the Polymethyl methacrylate of trimethylsiloxy group end-blocking, the dimethyl siloxane of trimethylsiloxy group end-blocking and methyl vinyl silicone, the polydimethylsiloxane of dimethyl ethenyl siloxy end-blocking, the methylphenyl siloxane of dimethyl ethenyl siloxy end-blocking and methyl vinyl silicone, the methyl vinyl silicone of trimethylsiloxy group end-blocking and the multipolymer of methylphenyl siloxane are selected from containing the organopolysiloxane of vinyl.
Preferably, described adhesion promoters contains the organopolysiloxane containing vinyl, in described adhesion promoters, is 0.3-0.7 containing the molar weight of the organopolysiloxane medium vinyl of vinyl with the ratio of the molar weight of hydrogen base in hydrogeneous organopolysiloxane.
Described woven fiber glass is preferably alkali-free glass cloth, design parameter is not particularly limited, the woven fiber glass that general selection thickness is 0.03-0.15mm, tabby weave is weaved, can select 2113 cloth of Guangzhou Ka Ben matrix material company limited, 2116 cloth or 1080 cloth, or the trade mark that Sichuan glass fibre limited liability company produces is the woven fiber glass of EW25C, EW30, EW40 or EW60.When adopting the above woven fiber glass, the adhesion promoters of every 100g woven fiber glass coating 2 ~ 6g obtains substrate layer, make adhesion promoters be distributed in the single or double of woven fiber glass and wrap up fiber wherein, lamelliform rubber composition is contacted with adhesion promoters, can the present invention be realized.
Preferably, the shore OO hardness of the organosilicon conducting strip of described enhancing is 25-90.The shore OO hardness of the organosilicon conducting strip that the present invention strengthens is tested according to standard A STM D2240.
Preferably, the thickness of the organosilicon conducting strip of described enhancing is 0.15-5mm.
In described rubber composition, the organopolysiloxane containing vinyl is the organopolysiloxane containing two or more vinyl be connected with silicon in molecule, and the position of vinyl can be side base or be positioned on molecular end and side chain simultaneously.Preferably, the described organopolysiloxane medium vinyl content containing vinyl is 0.03-5%, and the viscosity of 25 DEG C is 50-50000mPas.
Organopolysiloxane containing vinyl described in rubber composition can enumerate α, the polydimethylsiloxane of ω-divinyl polydimethylsiloxane, methyl phenyl vinyl siloxy end-blocking, the PSI of dimethyl ethenyl siloxy end-blocking, the methylphenyl siloxane of dimethyl ethenyl siloxy end-blocking and the multipolymer of dimethyl siloxane.
Described linking agent is hydrogeneous organopolysiloxane, has at least three si-h bonds in its molecule, and the position of si-h bond can be side base or be positioned on molecular end and side chain simultaneously, is preferably placed on side chain.Preferably linking agent hydrogen content is 0.01%-0.3% (quality), and in the present invention, hydrogen content is the mass percent of hydrogen atom in linking agent si-h bond, is 10-1000mPas, is more preferably 30-300mPas at the viscositys of 25 DEG C.
Linking agent can enumerate the multipolymer of the multipolymer of the polymethyl hydrogen siloxane of trimethylsiloxy group end-blocking, the methyl hydrogen siloxane of trimethylsiloxy group end-blocking and dimethyl siloxane, the methyl hydrogen siloxane of dimethyl hydrogen siloxy end-blocking and methylphenyl siloxane, the methyl hydrogen siloxane of dimethyl hydrogen siloxy end-blocking and the multipolymer etc. of dimethyl siloxane.
Preferably, described heat conductive filler is one or more in magnesium oxide, aluminum oxide, ferric oxide, calcium oxide, titanium oxide, silicon-dioxide, aluminium nitride, boron nitride and silicon nitride, and the particle diameter of described heat conductive filler is not particularly limited.Described heat conductive filler partly or entirely can replace with fire-retardant filler, extending fillers etc., to meet property requirement.
Described platinum catalyst is not particularly limited, platinum micro mist, platinum black, Platinic chloride, Tetrachloroplatinum, the platinum complex of alkene, the platinum complex of carbonyl or the thermoplasticity organic resin powder containing above platinum group catalyst can be enumerated, be preferably platinum catalyst or Platinic chloride.
Preferably, in described rubber composition, in linking agent, the molar weight of hydrogen base is 0.6 ~ 1 with the ratio of the molar weight of the organopolysiloxane medium vinyl containing vinyl.
Preferably, described rubber composition comprises the following component counted by weight:
Preferred, described rubber composition comprises the following component counted by weight:
It may be noted that the viscosity of 25 DEG C of the present invention is the kinetic viscosity value of material at 25 DEG C.
The invention has the beneficial effects as follows: the present invention, by carrying out special pre-treatment to woven fiber glass strongthener, makes rubber composition solidify plunger bond strength that is rear and woven fiber glass strongthener and significantly improves, and then improve weather resistance and the reliability of sheet material.
Embodiment
Provide the specific embodiment of the organosilicon conducting strip of the present invention's enhancing and preparation method thereof below.
In embodiment 1 ~ 3 for the preparation of the consumption of material in the adhesion promoters of organosilicon conducting strip strengthened and rubber composition and comparative example for the preparation of the consumption of material in the rubber composition of comparison sheet in table 1, unit is mass fraction.
Table 1
Embodiment 1
In the adhesion promoters of the present embodiment, hydrogeneous organopolysiloxane is Methyl Hydrogen Polysiloxane Fluid, 25 DEG C of viscositys are 700mPas, hydrogen content is 0.3% (quality), the organopolysiloxane of hydroxyl is α, alpha, omega-dihydroxy polydimethyl siloxane, the mass percentage of hydroxyl is 0.6%, 25 DEG C of viscositys is 1000mPas.
In rubber composition, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane, is 100mPas at 25 DEG C of viscositys, and the mass percentage of vinyl is 2.5%; Heat conductive filler to be median size the be aluminum oxide of 30 μm; Linking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 100mPas, and hydrogen content is 0.2% (quality), and platinum catalyst is platinum catalyst.
The preparation method of the organosilicon conducting strip strengthened is:
A is by the Methyl Hydrogen Polysiloxane Fluid in adhesion promoters and α, and alpha, omega-dihydroxy polydimethyl siloxane mixes, and adds 1000 parts of toluene and dissolves, obtain treatment solution;
Label is the woven fiber glass (0.06mm of EW60 by B, Sichuan glass fibre limited liability company) impregnated in 10min in treatment solution, remove toluene at 60 DEG C of dry 30min after taking-up, obtain substrate layer, sampling weighing learns that every 100g woven fiber glass is coated with 2g adhesion promoters;
The component that rubber composition comprises by C fully mixes, obtain mixture, with roll squeezer, mixture and substrate layer are rolled compound, mixture is made to form thin layer in a side of substrate layer, then at 80 DEG C of solidification 15min, the organosilicon conducting strip be enhanced, thickness is 1.0mm, and testing its shore OO hardness with sclerometer according to testing standard ASTM D2240 is 70.
Embodiment 2
In the adhesion promoters of the present embodiment, hydrogeneous organopolysiloxane is Methyl Hydrogen Polysiloxane Fluid, 25 DEG C of viscositys are 20mPas, hydrogen content is 0.8% (quality), the organopolysiloxane of hydroxyl is α, alpha, omega-dihydroxy polydimethyl siloxane, the mass percentage of hydroxyl is 2%, 25 DEG C of viscositys is 300mPas.
In rubber composition, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane, is 40000mPas at 25 DEG C of viscositys, and the mass percentage of vinyl is 0.2%; Heat conductive filler to be median size the be aluminum oxide of 3 μm and median size be 50 μm aluminum oxide in mass ratio 2:4 be mixed to get; Linking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 1000mPas, and hydrogen content is 0.03% (quality), and platinum catalyst is platinum catalyst.
The preparation method of the organosilicon conducting strip strengthened is:
A is by the Methyl Hydrogen Polysiloxane Fluid in adhesion promoters and α, and alpha, omega-dihydroxy polydimethyl siloxane mixes, and adds 300 parts of Virahols and dissolves, obtain treatment solution;
Label is woven fiber glass (the thickness 0.06mm of EW60 by B, Sichuan glass fibre limited liability company) impregnated in 10min in treatment solution, remove Virahol at 60 DEG C of dry 30min after taking-up, obtain substrate layer, sampling weighing learns that every 100g woven fiber glass is coated with 3g adhesion promoters;
The component that rubber composition comprises by C fully mixes, obtain mixture, with roll squeezer, mixture and substrate layer are rolled compound, mixture is made to form thin layer in a side of substrate layer, then at 85 DEG C of solidification 15min, the organosilicon conducting strip be enhanced, thickness is 1.0mm, and testing its shore OO hardness with sclerometer according to testing standard ASTM D2240 is 75.
Embodiment 3
In the adhesion promoters of the present embodiment, hydrogeneous organopolysiloxane is Methyl Hydrogen Polysiloxane Fluid, 25 DEG C of viscositys are 200mPas, hydrogen content is 0.4% (quality), organopolysiloxane containing vinyl is the dimethyl siloxane of trimethylsiloxy group end-blocking and the multipolymer of methyl vinyl silicone, the mass percentage of vinyl is 0.9%, 25 DEG C of viscositys is 300mPas.
In rubber composition, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane, is 1000mPas at 25 DEG C of viscositys, and the mass percentage of vinyl is 0.5%; Heat conductive filler to be median size the be aluminium nitride of 20 μm; Linking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 300mPas, and hydrogen content is 0.07% (quality), and platinum catalyst is platinum catalyst.
The preparation method of the organosilicon conducting strip strengthened is:
A mixes by the hydrogeneous organopolysiloxane in adhesion promoters with containing the organopolysiloxane of vinyl, adds 600 parts of octyl group silicone oil (Jiangxi Hito Chemical Co., Ltd., the trade mark is H-034) and dissolves, obtain treatment solution;
Label is woven fiber glass (the thickness 0.05mm of 1080 by B, Guangzhou Ka Ben matrix material company limited) impregnated in 10min in treatment solution, remove octyl group silicone oil at 80 DEG C of dry 30min after taking-up, obtain substrate layer, sampling weighing learns that every 100g woven fiber glass is coated with 4g adhesion promoters;
The component that rubber composition comprises by C fully mixes, obtain mixture, with roll squeezer, mixture and substrate layer are rolled compound, mixture is made to form thin layer in a side of substrate layer, then at 85 DEG C of solidification 15min, the organosilicon conducting strip be enhanced, thickness is 1.0mm, and testing its shore OO hardness with sclerometer according to testing standard ASTM D2240 is 80.
Embodiment 4
In the adhesion promoters of the present embodiment, hydrogeneous organopolysiloxane is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 50mPas, and hydrogen content is 0.6% (quality).
In rubber composition, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane, is 5000mPas at 25 DEG C of viscositys, and the mass percentage of vinyl is 0.35%; Heat conductive filler to be median size the be aluminium nitride of 20 μm; Linking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 500mPas, and hydrogen content is 0.06% (quality), and platinum catalyst is platinum catalyst.
The organosilicon conducting strip preparation method strengthened is:
Methyl Hydrogen Polysiloxane Fluid even application is on the woven fiber glass (thickness 0.05mm, Guangzhou Ka Ben matrix material company limited) of 1080 to label by A, obtains substrate layer, and sampling weighing learns that every 100g woven fiber glass is coated with 5g adhesion promoters;
The component that rubber composition comprises by B fully mixes, obtain mixture, with roll squeezer, mixture and substrate layer are rolled compound, mixture is made to form thin layer in a side of substrate layer, then at 85 DEG C of solidification 15min, the organosilicon conducting strip be enhanced, thickness is 1.0mm, and testing its shore OO hardness with sclerometer according to testing standard ASTM D2240 is 80.
Comparative example
Preparation contrast conducting strip, wherein, the organopolysiloxane containing vinyl is α, ω-divinyl polydimethylsiloxane, is 4000mPas at 25 DEG C of viscositys, and the mass percentage of vinyl is 0.5%; Heat conductive filler to be median size the be aluminum oxide of 3 μm and median size be 50 μm aluminum oxide in mass ratio 2:3 be mixed to get; Linking agent is Methyl Hydrogen Polysiloxane Fluid, and 25 DEG C of viscositys are 300mPas, and hydrogen content is 0.07% (quality), and platinum catalyst is platinum catalyst.
The preparation method of contrast conducting strip is the mixing of the component that comprised by the rubber composition of comparative example, obtain mixture, be the woven fiber glass (0.06mm of EW60 by mixture and label with roll squeezer, Sichuan glass fibre limited liability company) carry out calendering compound, mixture is made to form thin layer in a side of woven fiber glass, 15min is cured at 85 DEG C, obtain contrasting composite sheet, thickness is 1.0mm, and testing its shore OO hardness with sclerometer according to testing standard ASTM D2240 is 75.
Testing example
Performance test is carried out to organosilicon conducting strip prepared by embodiment 1 ~ 4 and comparative example, comprise thermal conductivity, tensile strength, tear strength, voltage breakdown, test and performance data are in table 2, and test the bond strength of silastic-layer and woven fiber glass on organosilicon conducting strip, testing method is: carry out 180 DEG C of stripping tests with reference to JIS K6259 and measure bonding strength, sample size is 25mm*200mm, and for the organosilicon conducting strip of enhancing of the present invention, the woven fiber glass reserving 10mm at the end to be held of sample does not carry out pre-treatment and the conducting strip prepared, so that test, test data is in table 2.
The organosilicon conducting strip performance data that table 2 strengthens
From table 2 data, the present invention is by carrying out special pre-treatment to woven fiber glass strongthener, carry out compound again and solidification obtains conducting strip, in this conducting strip, base material and layer of silica gel are combined by adhesion promoters, and bond strength significantly improves, and effectively can improve weather resistance and the reliability of conducting strip, meet the requirement to the heat conduction of heat dissipation interface material, mechanical property and reliability in practical application, over-all properties is given prominence to, and preparation method is simple, and application prospect is wide.
Finally it should be noted that above embodiment only in order to technical scheme of the present invention to be described but not limiting the scope of the invention.It will be understood by those of skill in the art that and can carry out some deductions or equivalent replacement to technical scheme of the present invention, and do not depart from essence and the scope of technical solution of the present invention.
Claims (9)
1. a preparation method for the organosilicon conducting strip strengthened, comprises the following steps:
A, be coated on woven fiber glass by adhesion promoters, obtain substrate layer, described adhesion promoters comprises hydrogeneous organopolysiloxane;
B, the component mixing that will comprise containing the rubber composition of the organopolysiloxane of vinyl, linking agent, heat conductive filler and platinum catalyst, obtain mixture, mixture and substrate layer rolled compound, the organosilicon conducting strip be enhanced after solidification.
2. the preparation method of the organosilicon conducting strip strengthened as claimed in claim 1, it is characterized in that, the hydrogen content of described hydrogeneous organopolysiloxane is 0.3-1% (quality), is 10-1000mPas at the viscositys of 25 DEG C.
3. the preparation method of the organosilicon conducting strip strengthened as claimed in claim 1, is characterized in that, described adhesion promoters also comprises the organopolysiloxane of hydroxyl or the organopolysiloxane containing vinyl.
4. the preparation method of the organosilicon conducting strip strengthened as claimed in claim 3, it is characterized in that, described adhesion promoters comprises the organopolysiloxane of hydroxyl, in adhesion promoters, the hydroxy radical content of the organopolysiloxane of hydroxyl is 0.6-8% (quality), is 10-1000mPas at the viscositys of 25 DEG C.
5. the preparation method of the organosilicon conducting strip strengthened as claimed in claim 4, it is characterized in that, in the organopolysiloxane of described hydroxyl, the molar weight of hydroxyl is 0.3-0.7 with the ratio of the molar weight of hydrogen base in hydrogeneous organopolysiloxane.
6. the preparation method of the organosilicon conducting strip strengthened as claimed in claim 3, it is characterized in that, described adhesion promoters comprises the organopolysiloxane containing vinyl, contents of ethylene containing the organopolysiloxane of vinyl is 0.3-5% (quality), is 50-1000mPas at the viscositys of 25 DEG C.
7. the preparation method of the as claimed in claim 6 organosilicon conducting strip strengthened, is characterized in that, in adhesion promoters, is 0.3-0.7 containing the molar weight of the organopolysiloxane medium vinyl of vinyl with the ratio of the molar weight of hydrogen base in hydrogeneous organopolysiloxane.
8. the preparation method of the organosilicon conducting strip of the enhancing as described in any one of claim 1-3, is characterized in that, the shore OO hardness of the organosilicon conducting strip of described enhancing is 25-90.
9. the preparation method of the organosilicon conducting strip of the enhancing as described in any one of claim 1-3, is characterized in that, described rubber composition comprises the following component counted by weight:
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| CN109844048A (en) * | 2016-10-14 | 2019-06-04 | 信越化学工业株式会社 | Thermal conductivity composite silicone rubber piece and its manufacturing method |
| CN109844048B (en) * | 2016-10-14 | 2021-10-15 | 信越化学工业株式会社 | Heat-conductive composite silicone rubber sheet and method for producing same |
| CN107283882A (en) * | 2017-07-06 | 2017-10-24 | 东莞市森捷数控设备有限公司 | Heat conductive silica gel pad calendaring line |
| CN107471784A (en) * | 2017-08-07 | 2017-12-15 | 苏州佰旻电子材料科技有限公司 | A kind of composite glass fiber heat conductive silica gel pad |
| CN108753261A (en) * | 2018-05-16 | 2018-11-06 | 苏州矽美科导热科技有限公司 | A kind of high-k heat conduction with phase change piece and preparation method thereof |
| CN111267436A (en) * | 2020-01-17 | 2020-06-12 | 江西赛欧特科新材料有限公司 | Organosilicon sun-shading material and preparation method thereof |
| CN111267436B (en) * | 2020-01-17 | 2022-10-11 | 江西赛欧特科新材料有限公司 | Organosilicon sun-shading material and preparation method thereof |
| CN112724685A (en) * | 2020-12-28 | 2021-04-30 | 深圳市安品有机硅材料有限公司 | Organic silicon heat-conducting sheet and preparation method thereof |
| CN113429908A (en) * | 2021-08-19 | 2021-09-24 | 西安隆基绿能建筑科技有限公司 | Adhesion promoter and BIPV system |
| CN113429908B (en) * | 2021-08-19 | 2023-10-10 | 隆基乐叶光伏科技有限公司 | Adhesion promoter and BIPV system |
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