CN105015884A - 防水盒结构及其制造方法 - Google Patents
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Abstract
本发明揭示一种防水盒结构及其制造方法,该防水盒结构包含一复合板材及一外框。复合板材包含相互贴附的一化学硬化层以及一热塑性树脂层,热塑性树脂层的其中一面贴附化学硬化层,热塑性树脂层的外缘延伸凸出化学硬化层的外缘。外框以包覆射出成形的方式形成在复合板材的外缘,外框的内缘包覆热塑性树脂层的外缘且与热塑性树脂层相结合。通过移除化学硬化层的外缘而使热塑性树脂层裸露形成一凸缘以供外框融合连接,其不但构造简单,且能够通过模具成型,因此制作简易。
Description
【技术领域】
本发明有关于防水盒,尤指一种构造简单且易于制作的防水盒结构及其制造方法。
【背景技术】
防水盒为用于保护一行动电子装置的配件,其能够包覆行动电子装置以阻隔外界的水汽及尘粒,借以避免水汽及尘粒损伤其内的行动电子装置。
防水盒一般会设有一强化玻璃,强化玻璃对应行动电子装置的显示器的位置配置以供用户通过强化玻璃观看显示器所显示的内容。而且防水盒一般还会设有一外框环绕在强化玻璃的周缘。强化玻璃一般为复合板材所制成,当软质组件设置在强化玻璃时,需要压迫外框上其与强化玻璃的连接处,借此以确保此连接处的水密性。其结构复杂,因此加工的良率也不佳。
有鉴于此,本发明人遂针对上述现有技术,特潜心研究并配合学理的运用,尽力解决上述的问题点,即成为本发明人改良的目标。
【发明内容】
本发明的主要目的,在于提供一种构造简单且易于制作的防水盒结构及其制造方法。
为了达成上述的目的,本发明提供一种防水盒结构,其包含一复合板材及一外框。复合板材包含相互贴附的一化学硬化层以及一热塑性树脂层,热塑性树脂层的其中一面贴附化学硬化层,热塑性树脂层的外缘延伸凸出化学硬化层的外缘。外框以包覆射出成形的方式形成在复合板材的外缘,外框的内缘包覆热塑性树脂层的外缘且与热塑性树脂层相结合。
为了达成上述的目的,本发明另提供一种用防水盒结构的制造方法,其包含:提供一复合板材,其复合板材包含相互贴附的一化学硬化层以及一热塑性树脂层;开设一通孔于复合板材上,其通孔贯穿化学硬化层及热塑性树脂层;移除通孔内缘处的化学硬化层而使热塑性树脂层在通孔内缘处向通孔内凸出而形成一凸缘;形成一外框遮蔽通孔而使外框的外缘包覆凸缘且与凸缘相结合。
相较于现有技术,本发明的防水盒结构通过移除化学硬化层的外缘而使热塑性树脂层裸露形成一凸缘以供外框融合连接,其不但构造简单,且能够通过模具成型,因此制作简易。
为让本发明的上述特征和优点能更明显易懂,下文特举实施例,并配合所附图式作详细说明如下。
【附图说明】
图1为本发明的防水盒结构的立体示意图。
图2为本发明的防水盒结构的复合板材的立体示意图。
图3为本发明的防水盒结构的复合板材的剖视图。
图4为本发明的防水盒结构的外框的剖视图。
图5为本发明的防水盒结构的一使用状态示意图。
图6为本发明的防水盒结构的另一使用状态示意图。
图7为图6中本发明的防水盒结构的剖视图。
图8为本发明的防水盒结构的制造方法的流程图。
【具体实施方式】
请参阅图1所示,其为本发明的防水盒结构的立体示意图,本发明的第一实施提供一种用防水盒结构,其包含一复合板材100及一外框200。
请参阅图2所示,其为本发明的防水盒结构的复合板材的立体示意图以及图3所示本发明的防水盒结构的复合板材的剖视图,复合板材100为一化学硬化层110以及一热塑性树脂层120相互贴附结合而构成。热塑性树脂层120的其中一面贴附在化学硬化层110的其中一面,热塑性树脂层120的外缘向外延伸凸出化学硬化层110的外缘,因此而形成一凸缘121。热塑性树脂层120的其余另一面开设有一沟槽122,其沟槽122较佳地延伸于凸缘121上且环绕热塑性树脂层120的外缘。化学硬化层110的外缘环绕该化学硬化层110。
请参阅图4所示,其为本发明的防水盒结构的外框的剖视图,外框200以包覆射出成形的方式形成在该复合板材100的外缘,外框200的内缘包覆热塑性树脂层120的外缘且与热塑性树脂层120相结合。外框200以包覆射出成型方式成型在复合板材100的外缘,借此使得外框200与复合板材100相结合。外框200的内缘对应前述的沟槽122延伸形成凸出的凸肋210,凸肋210的形状及位置与沟槽122相配合,且凸肋210填充在沟槽122内。外框200通过其凸肋210咬合复合板材100上的沟槽122而使得外框200稳固结合于复合板材100上。
请参阅图5至图7所示,其为本发明的防水盒结构的使用状态示意图,本发明的防水盒结构应用于如图5所示的一防水盒10。如图6所示,此防水盒10用于包覆一行动电子装置20,而使得行动电子装置20密封在防水盒10之内,借以阻挡水份侵入行动电子装置20而损害行动电子装置20。且复合板材100的化学硬化层110表面配置在防水盒10的外侧借以抵抗外物磨损,热塑性树脂层120表面则位于防水盒10的内侧。外框200包覆行动电子装置20的侧缘,且复合板材100与外框200通过前述的结构而密合连接。
本发明的第二实施提供一种防水盒结构的制造方法,其包含步骤以及步骤的较佳的施作顺序详述如后,但本发明不限定步骤的施作顺序:
请参阅图2、图3及图8,图2及图3如同第一实施例所述,图8为本发明的防水盒结构的制造方法的流程图。于图8所示的步骤a中提供如图2所示的一复合板材100,其复合板材100如图3所示包含相互贴附结合的一化学硬化层110以及一热塑性树脂层120。较佳地,热塑性树脂层120的其中一面贴附化学硬化层110的其中一面。
图8所示的步骤b接续步骤a,通过铣刀加工移除复合板材100外缘处的化学硬化层110。借此使得热塑性树脂层120的外缘超出化学硬化层110的外缘而构成一凸缘121。且于本实施例中,凸缘121延伸环绕化学硬化层110的外缘。
图8所示的步骤d为一可选择性的步骤,其接续步骤b,在热塑性树脂层120的其余另一面上较佳地可以开设有一沟槽122。于本实施例中,沟槽122位于凸缘121内侧,且环绕热塑性树脂层120的外缘。
于本实施例中,图8所示的步骤c接续步骤d,若未执行步骤d,则步骤c接续步骤b。
若步骤c接续步骤b,将经过前述步骤加工后的复合板材100置入一射出成型模具中,以包覆射出成型方式将一外框200成型在复合板材100的外缘,外框200的内缘较佳地包覆于凸缘121且与凸缘121相结合,外框200内缘的一部份较佳地填充于沟槽122之内,借此使得外框200与复合板材100稳固结合。
本发明的防水盒结构及其制造方法中,复合板材100的化学硬化层110无法受热而再融化,因此通过铣刀加工去除复合板材100的一部份化学硬化层110而使此区块的热塑性树脂层120裸露形成凸缘121。当在模具内注入高温的材料以形成外框200时,其材料接触凸缘121致使此凸缘121能够软化。借此使凸缘121能够与外框200融接而紧密结合,因此能够确保复合板材100与外框200接合处的水密性。再者,本发明的防水盒结构,其不但构造简单且制造步骤简易。
Claims (11)
1.一种防水盒结构,其特征在于,其包含:
一复合板材,包含相互贴附的一化学硬化层以及一热塑性树脂层,该热塑性树脂层的其中一面贴附该化学硬化层,其中该热塑性树脂层的外缘延伸凸出该化学硬化层的外缘;及
一外框,以包覆射出成形的方式形成在该复合板材的外缘,该外框的内缘包覆热塑性树脂层的外缘且与该热塑性树脂层相结合。
2.如权利要求1所述的防水盒结构,其特征在于,该热塑性树脂层的其余另一面开设有一沟槽,该外框内缘的一部份填充于该沟槽之内。
3.如权利要求2所述的防水盒结构,其特征在于,该沟槽环绕该热塑性树脂层的外缘。
4.如权利要求1所述的防水盒结构,其特征在于,该热塑性树脂层的其中一面贴附该化学硬化层的其中一面。
5.如权利要求4所述的防水盒结构,其特征在于,化学硬化层的外缘环绕该化学硬化层的外缘。
6.一种用防水盒结构的制造方法,其特征在于,其包含:
提供一复合板材,其中该复合板材包含一化学硬化层以及一热塑性树脂层,且该热塑性树脂层的其中一面贴附该化学硬化层;
移除该化学硬化层的外缘而使该热塑性树脂层的外缘超出该化学硬化层的外缘;及
形成一外框在该复合板材的外缘,而使该外框的内缘包覆化学硬化层的外缘且与该热塑性树脂层相结合。
7.如权利要求6所述防水盒结构的制造方法,其特征在于,还包含
开设一沟槽于该热塑性树脂层的其余另一面;
其中,于形成该外框的步骤中,该外框内缘的一部份填充于该沟槽之内。
8.如权利要求7所述防水盒结构的制造方法,其特征在于,该沟槽环绕该热塑性树脂层的外缘。
9.如权利要求6所述防水盒结构的制造方法,其特征在于,该热塑性树脂层贴附于该化学硬化层的其中一面。
10.如权利要求6所述防水盒结构的制造方法,其特征在于,该热塑性树脂层的外缘环绕该化学硬化层的外缘。
11.如权利要求6所述防水盒结构的制造方法,其特征在于,于该形成该外框的步骤中,以包覆射出成型方式将该外框成型在该复合板材的外缘。
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TWD172866S (zh) * | 2014-08-27 | 2016-01-01 | 鴻海精密工業股份有限公司 | 行動電話保護套之部分 |
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JP2017034023A (ja) * | 2015-07-30 | 2017-02-09 | 富士通株式会社 | 電子機器 |
USD815084S1 (en) | 2016-10-07 | 2018-04-10 | Otter Products, Llc | Case for a smartphone |
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USD875727S1 (en) * | 2018-11-24 | 2020-02-18 | Shenzhen Shuntiantai Technology Co., Ltd. | Phone case |
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CN114474748A (zh) * | 2020-11-12 | 2022-05-13 | 神讯电脑(昆山)有限公司 | 激光焊接方法及其治具与封装物件 |
Also Published As
Publication number | Publication date |
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US9527645B2 (en) | 2016-12-27 |
US20150173229A1 (en) | 2015-06-18 |
CN105015884B (zh) | 2018-06-26 |
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