CN105006297A - Method for preparing conductive powder material based on soft silicon - Google Patents
Method for preparing conductive powder material based on soft silicon Download PDFInfo
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- CN105006297A CN105006297A CN201510335028.5A CN201510335028A CN105006297A CN 105006297 A CN105006297 A CN 105006297A CN 201510335028 A CN201510335028 A CN 201510335028A CN 105006297 A CN105006297 A CN 105006297A
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- soft silicon
- silver compound
- conductive powder
- powder material
- silver
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Abstract
The invention provides a method for preparing a conductive powder material based on soft silicon and relates to the field of new material and composite material. The method comprises the following steps of: dissolving a decomposable silver compound in water to form a uniform silver compound aqueous solution; mixing the acquired silver compound aqueous solution with soft silicon according to a ratio of (1 to 9) to 10, performing stirring in order to enable the soft silicon to fully absorb the silver compound aqueous solution; after the soft silicon fully absorbs the silver compound aqueous solution, heating the soft silicon in order that the silver compound is decomposed to form elementary substance and to be adsorbed in the duct and on the surface of the soft silicon, wherein heating temperature is between 450 and 500 degrees centigrade; and drying and dispersing acquired powder so as to obtain the conductive powder material. The conductive powder material prepared by the method is internally communicated and may form a good conductive path.
Description
Technical field
The present invention relates to new material and field of compound material, be specifically related to a kind of preparation method of the conductive powder material based on soft silicon.
Background technology
Along with the high speed development of modern industry, conductive powder material is widely used as a kind of specific function material.Conductive powder material is one independently functional material inherently, and it is mainly applied to macromolecular material with the form of conductive filler at present, makes it have conductivity, antistatic, function such as shielding electromagnetic wave etc.Conventional conductive powder body is metal-oxide powder after metal system powder, carbon system powder, doping and conducting polymer composite.Metal-powder conductivity is strong, but expensive, oxidizable, corrosion-resistant.And metallic conduction powder density is large, easily sinks to the bottom caking thus dispersed bad in the base.The conductivity of silver system is the highest, and volume resistance can reach 10-4 ~ 10-5 Ω cm
3, there is excellent shielding properties, but due to expensive, except except the field of particular/special requirement, general application is few.
At present, composite conductive powder material obtains and pays close attention to widely.Composite conductive powder material not only possesses the various performances of conductive powder material, and greatly reduces cost.But in reality processing, there will be composite material and be separated or can not the problems such as path be formed between conductive particle, cause the limitation of application.
Summary of the invention
Technical problem to be solved by this invention is the defect overcoming prior art, proposes a kind of preparation method of the conductive powder material based on soft silicon further.
Technical problem to be solved by this invention realizes by the following technical solutions:
Based on a preparation method for the conductive powder material of soft silicon, it is characterized in that, comprise the steps:
(1) decomposable silver compound is dissolved, form homogeneous silver compound solution;
(2) silver compound solution of gained is pressed (1 ~ 9) with soft silicon: the mass ratio of 10 mixes, stir and make soft silicon fully absorb silver compound solution, the quality of silver compound solution is in silver;
(3) after soft silicon fully absorbs silver compound solution, heat treated is carried out to soft silicon, silver compound is decomposed, form silver-colored simple substance, and in the duct being adsorbed in soft silicon and surperficial, heating-up temperature is 450 ~ 600 DEG C;
(4) gained powder is dried, broken up and obtain conductive powder material;
Described soft silicon is the porous silica powder body material of a kind of particle diameter in 0.1 ~ 30 micrometer range.
Soft silicon is a kind of novel silicon dioxide split material, and English name siliesoft, particle diameter can control in 0.1-30 micrometer range.Soft silicon has the feature of loose structure, and duct internal mutual is connected, and pore volume reaches 1cm
3/ g, specific area reaches 240m
2/ g, these characteristics determine the excellent absorption property of soft silicon.In addition, the features such as soft silicon also has light specific gravity, and fusing point is low, good fluidity, uniform particles, and hardness is low.The fields such as machinery, daily-use chemical industry, biological medicine, building, Aero-Space, agricultural can be widely used in.Utilize soft silicon as carrier, labile silver compound is the source of elemental silver, is infiltrated on soft silicon hole road and surface, is decomposed into silver-colored simple substance under certain condition, thus forms a kind of special conductive powder material.
Further, the conductive powder material obtained to step (4) repeats the step of (2), (3), (4), and one or many, to obtain the different product of silver content.
As preferably, described decomposable silver compound is AgI or AgNO
3.
Described silver compound solution comprises the solution of the silver salt that all can decompose, as AgI, AgNO
3, C
2h
3o
2ag etc., and the complex compound of some silver, as silver ammino solution etc.
The method preparing conductive powder material of the present invention is also applicable to utilize Cu, Sn and compound thereof to be metal source.
Beneficial effect of the present invention is:
The invention provides a kind of preparation method of the conductive powder material based on soft silicon, obtained conductive powder material, inside communicates, and can form good conductive path.The fields such as electronics, electrical equipment, aviation, coating, chemical industry, printing, packaging, boats and ships, military project can be widely used in, be applicable to produce electrically-conducting paint, antistatic coating, conductive plastics, conductive rubber, conductive electrostatic paper, electronic component, electrical equipment shell, printed circuit board etc.
Accompanying drawing explanation
Fig. 1 is the SEM picture of 4 microns of soft silicon;
Fig. 2 is the SEM picture that soft silicon adsorbs the complex conductive particle of twice silver compound solution formation.
Embodiment
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with specific embodiment, set forth the present invention further, but following embodiment being only the preferred embodiments of the present invention, and not all.Based on the embodiment in execution mode, those skilled in the art under the prerequisite not making creative work obtain other embodiment, all belong to the protection range of this patent.
Embodiment 1
The soft silicon of 4um, AgI crystal, KI crystal, deionized water.
The KI aqueous solution of preparation 10%;
Be dissolved in by AgI in the KI aqueous solution, the obtained AgI-KI aqueous solution, containing 20g AgI in every 10g solution.
The ratio of the AgI-KI aqueous solution of above-mentioned concentration and soft silicon 2:5 ~ 7:10 is in mass ratio mixed, adsorbs under stirring;
The soft silicon composite granule having adsorbed AgI solution, broke up 250 mesh sieves, and sieve was broken up again and sieves, until sieve completely;
To the soft silicon composite granule sieved be broken up, and put into electric furnace and be heated to 500 DEG C, insulation 1h;
Go out electric furnace, put cool.
Also can by produce a product according to said process, carry out secondary, three times ... absorption, can obtain the product of silver content different size.
Because AgI is difficult to the aqueous solution forming desired concn, therefore utilize the similar principle that mixes, be mixed with AgI-KI solution, then adsorb.
Embodiment 2
The AgNO of preparation mass fraction 75%
3solution;
Get the AgNO of above-mentioned concentration
3the ratio of solution and soft silicon 2:5 ~ 7:10 in mass ratio mixes, and adsorbs under stirring;
Complete for absorption composite granule is put into electric furnace and is heated to 450 DEG C, insulation 1h;
Go out electric furnace, put cool.
Also can by produce a product according to said process, carry out secondary, three times ... absorption, can obtain the product of silver content different size.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification is only preference of the present invention; be not used for limiting the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (3)
1. based on a preparation method for the conductive powder material of soft silicon, it is characterized in that, comprise the steps:
(1) decomposable silver compound is dissolved, form homogeneous silver compound solution;
(2) silver compound solution of gained is pressed (1 ~ 9) with soft silicon: the mass ratio of 10 mixes, stir and make soft silicon fully absorb silver compound solution, the quality of silver compound solution is in silver;
(3) after soft silicon fully absorbs silver compound solution, heat treated is carried out to soft silicon, silver compound is decomposed, form silver-colored simple substance, and in the duct being adsorbed in soft silicon and surperficial, heating-up temperature is 450 ~ 600 DEG C;
(4) gained powder is dried, broken up and obtain conductive powder material;
Described soft silicon is the porous silica powder body material of a kind of particle diameter in 0.1 ~ 30 micrometer range.
2. according to claim 1 based on the preparation method of the conductive powder material of soft silicon, it is characterized in that: the conductive powder material obtained to step (4) repeats the step of (2), (3), (4), one or many, to obtain the different product of silver content.
3. according to claim 1 based on the preparation method of the conductive powder material of soft silicon, it is characterized in that: described decomposable silver compound is AgI or AgNO
3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510335028.5A CN105006297A (en) | 2015-06-12 | 2015-06-12 | Method for preparing conductive powder material based on soft silicon |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510335028.5A CN105006297A (en) | 2015-06-12 | 2015-06-12 | Method for preparing conductive powder material based on soft silicon |
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|---|---|
| CN105006297A true CN105006297A (en) | 2015-10-28 |
Family
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005330535A (en) * | 2004-05-19 | 2005-12-02 | Mitsui Mining & Smelting Co Ltd | Silver compound-covered copper powder, method for producing the silver compound-covered copper powder, method for storing the silver compound-covered copper powder and conductive paste using the silver compound-covered copper powder |
| CN1735562A (en) * | 2003-01-17 | 2006-02-15 | 西巴特殊化学品控股有限公司 | A process for the production of porous inorganic materials or a matrix material containing nanoparticles |
| CN103633305A (en) * | 2013-12-10 | 2014-03-12 | 苏州宇豪纳米材料有限公司 | Silicon composite anode material of lithium ion battery and preparation method of silicon composite anode material |
| CN103889898A (en) * | 2011-08-29 | 2014-06-25 | 地方独立行政法人东京都立产业技术研究中心 | Process for producing particles held in porous silica, porous silica, and particles held in porous silica |
-
2015
- 2015-06-12 CN CN201510335028.5A patent/CN105006297A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1735562A (en) * | 2003-01-17 | 2006-02-15 | 西巴特殊化学品控股有限公司 | A process for the production of porous inorganic materials or a matrix material containing nanoparticles |
| JP2005330535A (en) * | 2004-05-19 | 2005-12-02 | Mitsui Mining & Smelting Co Ltd | Silver compound-covered copper powder, method for producing the silver compound-covered copper powder, method for storing the silver compound-covered copper powder and conductive paste using the silver compound-covered copper powder |
| CN103889898A (en) * | 2011-08-29 | 2014-06-25 | 地方独立行政法人东京都立产业技术研究中心 | Process for producing particles held in porous silica, porous silica, and particles held in porous silica |
| CN103633305A (en) * | 2013-12-10 | 2014-03-12 | 苏州宇豪纳米材料有限公司 | Silicon composite anode material of lithium ion battery and preparation method of silicon composite anode material |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151028 |
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| WD01 | Invention patent application deemed withdrawn after publication |