CN105004476B - A kind of pressure sensor systems - Google Patents
A kind of pressure sensor systems Download PDFInfo
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- CN105004476B CN105004476B CN201510444782.2A CN201510444782A CN105004476B CN 105004476 B CN105004476 B CN 105004476B CN 201510444782 A CN201510444782 A CN 201510444782A CN 105004476 B CN105004476 B CN 105004476B
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Abstract
The invention provides a kind of pressure sensor systems.The pressure sensor systems include：First supporting plate；Pressure sensor module, it is fixed in first supporting plate；And temperature control heating module, it is fixed in the first supporting plate, for detecting the operating temperature of pressure sensor block and being heated to it, it is maintained a constant operating temperature.Method of the invention by increasing hardware cost, pressure sensor block is set to maintain a constant operating temperature, so as to greatly simplify the demarcation of pressure sensor and temperature compensation.
Description
Technical field
The present invention relates to sensor technical field, more particularly to a kind of pressure sensor systems.
Background technology
Pressure sensor has been widely used for the fields such as consumer electronics, Industry Control, weather monitoring, and its technology of preparing is
Through very ripe.But current pressure sensor all has algorithm complexity in terms of demarcation and temperature, the problem of wasting time and energy.
By taking the ST piezoresistive pressure sensors LPS25HB that consumer electronics field is commonly used as an example, it is demarcated and temperature-compensating
Journey is completed, it is necessary to be demarcated under three temperature spots and two pressure points, is quite simplified, but still more complicated.Industry control
The demarcation of system and meteorological field pressure sensor is with temperature-compensating with regard to more complicated.In order to be obtained in a wide temperature range
Preferable barometric surveying precision, pressure resistance type baroceptor are needed under each 10 degree or smaller temperature interval, test
1100hPa, 1013hPa, 950hPa, 900hPa, 850hPa equipressure strong point, to obtain a good two-dimentional matched curve.
The content of the invention
(1) technical problems to be solved
In view of above-mentioned technical problem, the invention provides a kind of pressure sensor systems, are pressed with being simplified by hardware mode
The demarcation of force snesor and temperature compensation.
(2) technical scheme
Pressure sensor systems of the present invention include：First supporting plate 7；Pressure sensor module 2, it is fixed on described first
On fagging 7；And temperature control heating module 3, it is fixed in the first supporting plate 7, for detecting the operating temperature of pressure sensor block 2
And it is heated, it is maintained a constant operating temperature.
(3) beneficial effect
It can be seen from the above technical proposal that pressure sensor systems of the present invention are made by increasing the method for hardware cost
Pressure sensor block maintains a constant operating temperature, is mended so as to greatly simplify the demarcation of pressure sensor and temperature
Compensation method.
Brief description of the drawings
Fig. 1 is the structural representation according to piezoresistive pressure sensor system of the embodiment of the present invention.
【Main element】
1- thermally insulating housings；
101- heat resistant materials；
2- pressure sensor modules；
201- pressure outer package housings；202- pressure-sensing devices；
3- temperature control heating modules；
301- adding thermal resistances；302- temperature-adjusting circuits；303- organic gels；
4- microcontroller detection modules；5- power modules；
6- circuit connecting poles；The printed circuit board (PCB)s of 7- first；
The printed circuit board (PCB)s of 8- second.
Embodiment
Pressure sensor systems of the present invention are appropriate by increasing the complexity of system, that is, in pressure sensor systems
Position increase heating module, and make pressure sensor core parts pressure sensitive portion as in hot box, pass pressure
Sense device working is final to realize that pressure sensor calibrating process be completed by only demarcating two pressure points under a stationary temperature
Target.
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with specific embodiment, and reference
Accompanying drawing, the present invention is described in more detail.
In one exemplary embodiment of the present invention, there is provided a kind of piezoresistive pressure sensor system.According to Fig. 1
The structural representation of piezoresistive pressure sensor system of the embodiment of the present invention.As shown in figure 1, the present embodiment pressure drag type pressure senses
Device system includes：Thermally insulating housing 1, it forms a heat-insulated cavity；Printed circuit board (PCB) group, including the first printed circuit board (PCB) 7 and second
Printed circuit board (PCB) 8, both are connected by circuit connecting pole 6, wherein, the second printed circuit board (PCB) 8 is fixed on the following table of heat-insulated cavity
Face；Pressure sensor module 2, it is fixed on the upper surface of the first printed circuit board (PCB) 7；Temperature control heating module 3, it is fixed on the first printing
The lower surface of circuit board 7；Microcontroller detection module 4, it is fixed on the second printed circuit board (PCB) 8；Power module 5, is fixed on second
On printed circuit board (PCB) 8.
Each part of the present embodiment piezoresistive pressure sensor system is described in detail below.
Heat resistant material 101, e.g. foamed material are filled with wherein in thermally insulating housing 1, so as to provide one for other elements
Stable heat-insulated environment, so that pressure sensor core parts pressure sensitive portion is placed in the heat-insulated environment.
The pressure sensor module 2 includes：Pressure outer package housing 201 and pressure-sensing device 202.Wherein, pressure is quick
Sensing unit 202 is located in the space that pressure outer package housing 201 is limited.In the present embodiment, pressure-sensing device 202 is pressure drag
Formula pressure sensor, but the present invention is not limited thereto, the pressure-sensing device be alternatively capacitance pressure transducer, or other
Pressure sensor.
First printed circuit board 7 and the second printed circuit board 8 are universal printed plate, and both pass through circuit connecting pole 6
Connection.Printed circuit board (PCB) and circuit connecting pole are universal component in the art, are no longer described in detail herein.
Temperature control heating module 3 includes：Adding thermal resistance 301, temperature-adjusting circuit 302 and organic gel 303.Adding thermal resistance 301 is logical
With high-power low value resistance, it fits in the lower surface of the first printed circuit board (PCB) 7.Temperature-adjusting circuit 302 for it is general can thermometric simultaneously
The circuit or dedicated IC chip of output control signal, organic gel 303 can be the medium hardness glue such as silicon rubber.Temperature-adjusting circuit
In, chip and circuit components are fixed on the first printed circuit board (PCB) 7, circuit connecting section shape on the second printed circuit board (PCB)
Into.Equally, adding thermal resistance 301 is also secured on the first printed circuit board (PCB) 7.Organic gel 303 is by adding thermal resistance 301 and temperature-adjusting circuit
302 are encapsulated, and isolate with miscellaneous part.
In the present embodiment, pressure sensor module 2, the printed circuit board layer 7 of temperature control heating module 3 and first are using stacking
Mode is placed.But it should be noted that in addition to the lamination order of the present embodiment, the lamination order of three can be with pressure
The first printed circuit board layers of sensor assembly 2- temperature control heating module 3- 7.
Microcontroller detection module 4 and power module 5 are welded on the second printed circuit board 8.Microcontroller detection module 4 is logical
With micro- arithmetic element.Power module 5 is multiple power source generation circuit or special chip.The power module 5 detects mould to microcontroller
Block 4 is powered with temperature control heating module 3.
The present embodiment piezoresistive pressure sensor system is in practical application, power module gives microcontroller detection module simultaneously
Powered with temperature control heating module, temperature control heating module detects pressure sensor reality of work temperature while controlling heating module
Heating amount, pressure sensor is maintained a constant operating temperature, microcontroller detection module realizes that pressure sensor is believed
Number detect and demodulate and by pid algorithm give temperature control heating module provide temperature control parameter, realize simplify pressure sensor calibrating
The simplification of compensation process, it is final to realize that the target of pressure sensor calibrating process be completed by only demarcating two pressure points.
So far, the embodiment of the present invention is described in detail combined accompanying drawing.According to above description, art technology
Personnel should have clear understanding to piezoresistive pressure sensor system of the present invention.
It should be noted that in accompanying drawing or specification text, the implementation that does not illustrate or describe is affiliated technology
Form known to a person of ordinary skill in the art, is not described in detail in field.In addition, the above-mentioned definition to each element and method is simultaneously
Various concrete structures, shape or the mode mentioned in embodiment are not limited only to, those of ordinary skill in the art can carry out letter to it
Singly change or replace.
In summary, the method for the invention by increasing some hardware costs, the mark of pressure sensor can be greatly simplified
Fixed and temperature compensation, there is the neck of the baroceptor of preferable measurement accuracy in a wide temperature range suitable for demand
Domain, such as Industry Control, weather monitoring field, there is preferable popularizing application prospect.
Particular embodiments described above, the purpose of the present invention, technical scheme and beneficial effect are carried out further in detail
Describe in detail it is bright, should be understood that the foregoing is only the present invention specific embodiment, be not intended to limit the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements done etc., it should be included in the guarantor of the present invention
Within the scope of shield.
Claims (9)
- A kind of 1. pressure sensor systems, it is characterised in that including：First supporting plate (7)；Pressure sensor module (2), it is fixed on first supporting plate (7)；AndTemperature control heating module (3), it is fixed in the first supporting plate (7), for detecting the operating temperature of pressure sensor module (2) And it is heated, it is maintained a constant operating temperature；Thermally insulating housing (1), form a heat-insulated cavity；First supporting plate (7), pressure sensor module (2) and temperature control heating module (3) are both secured in the heat-insulation chamber body.
- 2. pressure sensor systems according to claim 1, it is characterised in that：The pressure sensor module (2) and temperature control heating module (3) are both secured to the upper surface of the first supporting plate (7)；OrThe pressure sensor module (2) and temperature control heating module (3) are individually fixed in the upper surface of first supporting plate (7) And lower surface.
- 3. pressure sensor systems according to claim 1, it is characterised in that the temperature control heating module (3) includes：Add Thermal resistance (301), temperature-adjusting circuit (302) and organic gel (303)；Wherein, the adding thermal resistance (301) fits in the lower surface of the first supporting plate (7)；The temperature-adjusting circuit (302) is to survey The circuit or dedicated IC chip of temperature and output control signal；The organic gel (303) by the adding thermal resistance (301) and Temperature-adjusting circuit (302) is encapsulated in the lower surface of first supporting plate (7).
- 4. pressure sensor systems according to claim 1, it is characterised in that filled with resistance in the thermally insulating housing (1) Hot material (101).
- 5. pressure sensor systems according to claim 1, it is characterised in that also include：Second supporting plate (8), the lower section of the first supporting plate (7) is fixed on by circuit connecting pole (6)；Micro-control module (4), it is fixed on second supporting plate (8), it gives the temperature control heating module by pid algorithm (3) temperature control parameter is provided.
- 6. pressure sensor systems according to claim 5, it is characterised in that：First supporting plate (7) and second supporting plate (8) are printed circuit board (PCB)；The micro-control module (4), it is additionally operable to realize detection and the solution of the pressure sensor signal of pressure sensor module (2) output Adjust.
- 7. pressure sensor systems according to claim 5, it is characterised in that also include：Power module, it is fixed on second supporting plate (8), for for the temperature control heating module (3) and micro-control module (4) power.
- 8. pressure sensor systems according to any one of claim 1 to 7, it is characterised in that the pressure sensor Module (2) includes：Pressure outer package housing (201) and pressure-sensing device (202)；Wherein, the pressure-sensing device (202) is located in the space that the pressure outer package housing (201) is limited.
- 9. pressure sensor systems according to claim 8, it is characterised in that the pressure-sensing device (202) is pressure Resistance pressure transducer or capacitance pressure transducer,.
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| CN201510444782.2A CN105004476B (en) | 2015-07-27 | 2015-07-27 | A kind of pressure sensor systems |
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| CN201510444782.2A CN105004476B (en) | 2015-07-27 | 2015-07-27 | A kind of pressure sensor systems |
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| CN105004476A CN105004476A (en) | 2015-10-28 |
| CN105004476B true CN105004476B (en) | 2018-02-06 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107894297B (en) * | 2017-11-07 | 2020-02-18 | 无锡必创传感科技有限公司 | Pressure sensor chip and manufacturing method thereof |
| CN111060236A (en) * | 2018-10-17 | 2020-04-24 | 北京自动化控制设备研究所 | Silicon piezoresistive pressure sensor packaging assembly structure |
| US11248979B2 (en) * | 2019-09-25 | 2022-02-15 | Whirlpool Corporation | Feature in vacuum insulated structure to allow pressure monitoring |
| CN111238698B (en) * | 2020-02-27 | 2021-10-22 | 中国科学院微电子研究所 | Built-in self-testing device and testing method of MEMS piezoresistive sensor |
| CN116222668A (en) * | 2020-08-18 | 2023-06-06 | 成都一通密封股份有限公司 | Pressure sensing corrector and pressure sensing correction system thereof |
| CN112378553B (en) * | 2020-11-06 | 2023-01-17 | 北京自动化控制设备研究所 | Silicon piezoresistive pressure sensor with online temperature control calibration and temperature calibration method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202648840U (en) * | 2012-04-24 | 2013-01-02 | 阿尔法仪器(天津)有限公司 | Heating constant temperature type pressure sensor |
| CN102880203A (en) * | 2012-10-10 | 2013-01-16 | 西安北斗星数码信息股份有限公司 | Thermostat |
| CN203116908U (en) * | 2013-02-26 | 2013-08-07 | 北京阿达尔石油技术有限责任公司 | Calibration system for pressure meters |
| CN104238592A (en) * | 2014-09-15 | 2014-12-24 | 北京东方计量测试研究所 | Rapid thermostat self-adaption control method and system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8224611B2 (en) * | 2009-03-11 | 2012-07-17 | Kavlico Corporation | One pin calibration assembly and method for sensors |
| CN202393384U (en) * | 2011-12-28 | 2012-08-22 | 北京星网宇达科技股份有限公司 | Micromechanical accelerometer tilt sensor adopting temperature-controlled manner to improve measuring accuracy |
-
2015
- 2015-07-27 CN CN201510444782.2A patent/CN105004476B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202648840U (en) * | 2012-04-24 | 2013-01-02 | 阿尔法仪器(天津)有限公司 | Heating constant temperature type pressure sensor |
| CN102880203A (en) * | 2012-10-10 | 2013-01-16 | 西安北斗星数码信息股份有限公司 | Thermostat |
| CN203116908U (en) * | 2013-02-26 | 2013-08-07 | 北京阿达尔石油技术有限责任公司 | Calibration system for pressure meters |
| CN104238592A (en) * | 2014-09-15 | 2014-12-24 | 北京东方计量测试研究所 | Rapid thermostat self-adaption control method and system |
Non-Patent Citations (1)
| Title |
|---|
| 数字气压传感器的一种高效标定和补偿方法;李亮 等;《传感器与微***》;20141130;第33卷(第11期);第3节 * |
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