CN104972118A - Three-dimensional molding equipment and method for manufacturing three-dimensional shaped molding object - Google Patents
Three-dimensional molding equipment and method for manufacturing three-dimensional shaped molding object Download PDFInfo
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- CN104972118A CN104972118A CN201510017266.1A CN201510017266A CN104972118A CN 104972118 A CN104972118 A CN 104972118A CN 201510017266 A CN201510017266 A CN 201510017266A CN 104972118 A CN104972118 A CN 104972118A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/30—Process control
- B22F10/36—Process control of energy beam parameters
- B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/44—Radiation means characterised by the configuration of the radiation means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/44—Radiation means characterised by the configuration of the radiation means
- B22F12/45—Two or more
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/40—Radiation means
- B22F12/49—Scanners
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B1/00—Producing shaped prefabricated articles from the material
- B28B1/001—Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/0063—Control arrangements
- B28B17/0081—Process control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
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Abstract
Three-dimensional molding equipment configured to alternately repeat a laminating process of forming a powder layer by powder supply equipment and a sintering process of radiating a light beam or an electron beam to the powder layer by a light beam or an electron beam scanning equipment (20) and further moving a radiated location with a respective predetermined moving unit set by a central control unit, namely, a computer related to control of a controller, to sinter the powder layer, wherein a plurality of the light beam or electron beam scanning equipments (20) are provided, and a plurality of the light beams or electron beams by the plurality of light beam or electron beam scanning equipments (20) are radiated on the same powder layer, and further the locations radiated by the plurality of the light beam or electron beam scanning equipments (20) are synchronously moved in increments of the moving unit.
Description
Technical field
The present invention relates to dusty material is stacked and sintering manufacture the three-dimensional moulding device of the moulder of 3D shape and the manufacture method of three dimensional structure.
Background technology
In the past, in this invention, by repeatedly carrying out forming the operation of powder bed from powder feeding device supply dusty material and the presumptive area illumination beam of the powder bed formed by this operation or electron beam being sintered to the operation of the powder of described presumptive area, manufacture the moulder of the 3D shape comprising a large amount of sinter layer.
But in described prior art, in order to illumination beam or electron beam, the normal galvanometer that uses scans (ガ Le バ ノ ス ス キ ャ Na) device.Such as, in the invention described in patent document 1, make the light beam that penetrates from laser oscillator (20) or reflecting electron beam to single galvanometer scanning means (scanner 22), and its reflection direction is changed irradiate powder bed.According to such structure, the irradiation position high-speed mobile of light beam or electron beam can be made by galvanometer scanning means, there is the effect shortening the moulding time.
But, in order to sintered powder material, need high energy radiation, need to collect light beam or electron beam.Usually, the light beam that sintering uses or electron beam are 200W laser, and optically focused becomes below 0.1mm until irradiate diameter, carries out high energy quantification.Minimum etc. owing to irradiating diameter as described, when the moulder that comparison is large, even if use galvanometer scanning means also very spended time become problem.
In addition, in common three-D moulding object, require the hardness and the density that improve surface, but the hardness of inside and density usually can be lower.Therefore, in the prior art, in order to shorten the moulding time, when sintering is positioned at the powder bed of the private side of moulder, increase irradiation diameter etc. and carry out the decrease of power density, only when sintering is positioned at the powder bed of gabarit side of moulder, reduces and irradiate diameter to improve energy density.
But, in such prior art, increase owing to needing to switch the scan pattern irradiating diameter and/or realized by independent galvanometer scanning means, exist and control to become complicated tendency.
Prior art document
Patent document 1: Japanese Unexamined Patent Publication 2005-336547 publication
Summary of the invention
The present invention completes in view of described existing situation, and its problem is to provide and can improves the three-dimensional moulding device of moulding efficiency and the manufacture method of three dimensional structure.
For solving the basic comprising of the present invention of above-mentioned problem, comprising:
(1) a kind of three-dimensional moulding device, alternate repetition carries out lamination process and sintering circuit, in described lamination process, powder bed is formed by powder feeding device, in described sintering circuit, by light beam or electron beam scanning unit to described powder bed illumination beam or electron beam, and this irradiation position is moved by each Moving Unit, sinter described powder bed, in described three-dimensional moulding device, be provided with multiple described light beam or electron beam scanning unit, by multiple light beam of being produced by these multiple light beams or electron beam scanning unit or electron beam irradiation in same powder layer, and in the movement of the irradiation position of these multiple light beams or electron beam scanning unit, make each Moving Unit synchronous.
(2) a kind of manufacture method of three dimensional structure, alternate repetition carries out lamination process and sintering circuit, in described lamination process, supply dusty material forms powder bed, in described sintering circuit, to described powder bed illumination beam, and this irradiation position is moved, sinters described powder bed, in described sintering circuit, by multiple light beam irradiation in same powder layer, and make the movement of the irradiation position of these multiple light beams synchronous.
For the mode of the best carried out an invention
In described basic comprising, a kind of three-dimensional moulding device, alternate repetition carries out lamination process and sintering circuit, in described lamination process, powder bed is formed by powder feeding device, in described sintering circuit, by light beam or electron beam scanning unit to described powder bed illumination beam or electron beam, and this irradiation position is moved by each Moving Unit, sinter described powder bed, described each Moving Unit is by CCU, namely the computer settings controlled is participated in controller, in described three-dimensional moulding device, be provided with multiple described light beam or electron beam scanning unit, described three-dimensional moulding device is arranged to: by multiple light beam of being produced by these multiple light beams or electron beam scanning unit or electron beam irradiation in same powder layer, and make each Moving Unit in the movement of the irradiation position of these multiple light beams or electron beam scanning unit synchronous.
According to this structure, because multiple light beam that will be produced by multiple light beam or electron beam scanning unit or electron beam irradiation are in same powder layer, and make each Moving Unit in the movement of this irradiation position synchronous, therefore, it is possible to improve sintering efficiency and moulding efficiency.
In the 1st embodiment, it is characterized in that, control described multiple light beam or electron beam scanning unit, to make in described multiple light beam or electron beam cover under the state in a precalculated position of described powder bed, this irradiation position is moved (with reference to Fig. 2).
According to this structure, owing to making multiple light beam or electron beam concentrate on precalculated position, therefore at this concentrated part, can high-energy sintering be carried out, shorten the moulding time.
In the 2nd embodiment, it is characterized in that, control described multiple light beam or electron beam scanning unit, to make the irradiation position of described multiple light beam or electron beam while maintain the state arranged on same line along the scanning pattern preset, this scanning pattern of an edge moves (with reference to Fig. 3).
According to this structure, multiple light beam or electron beam can sequentially through same points.Therefore, in described same point, sinter and gently promoted, compared with irradiating the situation of high-octane single light beam or electron beam, thermal shock is little, can obtain the three dimensional structure of high-quality.
In the 3rd embodiment, it is characterized in that, control described multiple light beam or electron beam scanning unit, to make the irradiation position of described multiple light beam or electron beam while maintain the state that the same line that intersects with the scanning pattern preset arranges, this scanning pattern of an edge moves (with reference to Fig. 4).
According to this structure, can irradiate by multiple light beam or electron beam the region that on powder bed, scope is larger simultaneously, and then can effectively improve moulding efficiency.
In the 4th embodiment, it is characterized in that, as described multiple light beam or electron beam scanning unit, possessing: one or more large-diameter areas light beam or electron beam scanning unit, it forms large footpath irradiation area on the surface of described powder bed; With path region light beam or electron beam scanning unit, its surface at same powder bed forms the diameter one or more path irradiation areas less than described large footpath irradiation area,
Be controlled to: the mode being contained in the position of the central authorities of described large footpath irradiation area with described path irradiation area forms described path irradiation area, with when maintaining this formation state, after forming described large footpath irradiation area, realize the mode of the formation of described path irradiation area, described large-diameter area light beam or electron beam scanning unit and described path region light beam or electron beam scanning unit are moved along the surface of described powder bed (with reference to Fig. 5).
According to this structure, when large footpath irradiation area and path irradiation area move simultaneously, first, by part near the periphery of large footpath irradiation area, preheating is applied to the surface of powder bed.Then, the part that path irradiation area has been preheated by this, heats this part thus further.
Thereby, it is possible to heated by the surface step of powder bed by large footpath irradiation area and path irradiation area, and then compared with irradiating the situation of high-octane single light beam or electron beam, thermal shock is little, can obtain the three dimensional structure of high-quality.
In the 5th embodiment, it is characterized in that, as described multiple light beam or electron beam scanning unit, possessing: outer surface side light beam or electron beam scanning unit, its be controlled as in the surface irradiating described powder bed by the region near the profile of sculpted zone; With private side light beam or electron beam scanning unit, its be controlled as irradiate than region in the inner part, described region, described outer surface side light beam or electron beam scanning unit different from the exposure of described private side light beam or electron beam scanning unit.(with reference to Fig. 6).
According to this structure, can with different density sinter in short time corresponding with moulder outer surface by the profile of sculpted zone and with moulder inner corresponding by inside, sculpted zone.
In the 6th embodiment, it is characterized in that, by the region near the profile of moulder in the surface of described powder bed, adopt the control of the 1st embodiment or the 2nd embodiment, than in region in the inner part, described region, adopt the control of the 3rd embodiment.
Accompanying drawing explanation
Fig. 1 is the stereogram of the example that the three-dimensional moulding device that the present invention relates to schematically is shown.
Fig. 2 is the stereogram of an example of the scan mode that multiple light beam or electron beam are schematically shown.
Fig. 3 is the stereogram of another example of the scan mode that multiple light beam or electron beam are schematically shown.
Fig. 4 is the stereogram of another example of the scan mode that multiple light beam or electron beam are schematically shown.
Fig. 5 is the stereogram of another example of the scan mode that multiple light beam or electron beam are schematically shown.
Fig. 6 is the stereogram of another example of the scan mode that multiple light beam or electron beam are schematically shown.
Description of reference numerals
10: banker
20: light beam or electron beam scanning unit
20S: path region light beam or electron beam scanning unit
20L: large-diameter area light beam or electron beam scanning unit
20T: outer surface side light beam or electron beam scanning unit
20U: private side light beam or electron beam scanning unit
30: controller
40: powder feeding device
E: by sculpted zone
S: path irradiation area
L: large footpath irradiation area
T: face side irradiation area
U: private side irradiation area
Detailed description of the invention
Then, to the preferred embodiment with above-mentioned feature, be described in detail based on accompanying drawing.
Below, illustrate with reference to embodiment.
As shown in Figure 1, this three-dimensional moulding device 1 possesses: the banker 10 that can be elevated; The multiple light beam arranged at the upper side of this banker 10 or electron beam scanning unit 20; Controller 30, it controls the lifting of banker 10 and/or the action etc. of each light beam or electron beam scanning unit 20; With powder feeding device 40, it supplies dusty material on banker 10, carry out lamination process and sintering circuit to manufacture three dimensional structure described three-dimensional moulding device 1 alternate repetition, in described lamination process, supply dusty material forms powder bed, in described sintering circuit, powder bed described in light beam or electron beam irradiation is made this irradiation position move by each Moving Unit to sinter described powder bed.
Banker 10 is platforms that upper surface is formed as flat condition, is configured to be elevated by not shown elevating mechanism.
This banker 10, after repeatedly carrying out the sintering of the formation of powder bed and the local of this powder bed by powder feeding device 40 described later and light beam or electron beam scanning unit 20, just moves scheduled volume downwards.
In addition, as another example, this banker 10 also can be set to be fixed as can not be elevated and make the structure that powder feeding device 40 is elevated.
Light beam or electron beam scanning unit 20 make the light beam that sends from light beam or electron beam oscillation device (not shown) or reflecting electron beam irradiate the upper surface of the powder bed banker 10 and make this irradiation position to the galvanometer scanning means of the twin axle of in-plane movement by two speculums 21,21.
Each light beam or electron beam scanning unit 20, according to the operational order carrying out self-controller 30, the independent rotation of two speculums 21,21 is made respectively by motor 22,22, by this rotation, by the light beam that irradiates in powder bed upper surface or electron beam, be initial point with the reference position on the banker 10 of being made a video recording by the camera heads such as CCD camera (not shown) and to XY scanning direction.
In addition, in Fig. 1, mark 23 is that the control voltage of controller 30 is amplified the amplifier supplied to each light beam or electron beam scanning unit 20.
In addition, described light beam or electron beam oscillation device are following structure: such as, possesses the LASER Light Source that the quantity of number ratio light beam or electron beam scanning unit 20 is few, by the laser light splitting that the Optical devices such as prism, lens will penetrate from this LASER Light Source, and the speculum 21 of respective light to light beam or electron beam scanning unit 20 is irradiated.In addition, as another example of light beam or electron beam launcher, also each of multiple light beam or electron beam scanning unit 20 LASER Light Source can be possessed.
Controller 30 is the control circuits possessing storage part, CPU and the input/output interface etc. that store procedure and process data, such as, is made up of microcomputer and/or Programmable Logic Controller and other electronic circuits.
At this controller 30, input the data of the irradiation output of the irradiation diameter of three-dimensional data (such as, STL formatted data etc.), light beam or the electron beam generated by not shown CAD/CAM system, light beam or electron beam etc.Then, controller 30 carries out calculation process based on the procedure being previously stored with described data, and according to its result, control light beam or the elevating mechanism (not shown) of electron beam oscillation device (not shown) and/or banker 10, multiple light beam or electron beam scanning unit 20 etc.
Change the unit of the irradiation diameter of light beam or electron beam, possess the aperture device that can change beam diameter in the light path of light beam or electron beam.This aperture device is such as set to following structure: possess the mask plate with the different multiple diaphragm holes of diameter, and this mask plate is moved, and optionally makes described multiple diaphragm hole move in the light path of light beam or electron beam.
In addition, powder feeding device 40 is by moving horizontally the dusty material that supplies metal or nonmetal system in plane and extruding, formed the known device of the powder bed of general planar shape.This powder feeding device 40 is set in the approximate horizontal movement of the upper side of banker 10, banker 10 upper surface formed powder bed, or on this powder bed further stacked powder bed.
Then, the order manufacturing three dimensional structure by described three-dimensional moulding device 1 is described in detail.
First, controller 30, based on the procedure prestored, makes powder feeding device 40 action, banker 10 forms powder bed.Then, controller 30 makes multiple light beam or electron beam scanning unit 20 action, to upper surface illumination beam or the electron beam of described powder bed.
Specifically bright, controller 30 as shown in Figure 2, on banker 10, sets by sculpted zone E based on described three-dimensional data etc.
By sculpted zone E, corresponding with the cross section cutting off the three dimensional structure manufactured by this three-dimensional moulding device 1 with the plane being parallel to banker 10, according to the shape of described three dimensional structure, sometimes become different shapes at every one deck of multiple powder bed, sometimes become same shape etc.
Then, controller 30 as shown in Figure 2, by multiple light beam of being produced by multiple light beam or electron beam scanning unit 20 or electron beam, cover in same powder layer by the precalculated position on the E of sculpted zone, and to make this concentrated part x1 along the mode of the moulding path movement preset, make the action of multiple light beam or electron beam scanning unit 20 synchronous.Described concentrated part x1 is the instantaneous region irradiating multiple light beam or electron beam on powder bed, has the irradiation diameter that be have adjusted by described aperture device.
Described moulding path is the scanning pattern of light beam or electron beam, to be preset and be stored in predetermined storage area by controller 30 based on described three-dimensional data etc.
In this moulding path, existing for making light beam or electron beam along by the vector moulding path of the profile scan of sculpted zone E with for to these the two kinds of paths, grating moulding path being made light beam or electron beam scanning by the mode of the region hatching of the inner side of sculpted zone E, being set by each powder bed respectively.
Specifically bright, described grating moulding path, such as be set to alternate repetition linearity scanning pattern and the path returning scanning pattern, described linearity scanning pattern is from by the path of the end side in the E of sculpted zone towards another side under light beam or electron beam on-state, described in return scanning pattern be path towards the position that the described end side from described linearity scanning pattern is biased under light beam or electron beam closed condition.In addition, this grating moulding path can be set to other patterns beyond described pattern.
If carry out the scanning of light beam or electron beam along described moulding path, then being sintered by the heat of light beam or electron beam by sculpted zone E of powder bed upper surface.Then, controller 30 makes banker 10 decline the amount of thickness of powder bed, for comprising by the upper surface of the powder bed of sculpted zone E, forms new powder bed by powder feeding device 40.
Then, controller 30 is in the same manner as the above-mentioned processing to initial powder bed, set by sculpted zone E at the upper surface of described new powder bed, by multiple light beam of being produced by multiple light beam or electron beam scanning unit 20 or electron beam, cover in described new powder bed by the precalculated position on the E of sculpted zone, and to make this concentrated part x1 along the mode of described moulding path movement, make the action of multiple light beam or electron beam scanning unit 20 synchronous.Thus, sinter new powder bed by sculpted zone E, and the sintering sectoral integration of this sintering part and powder bed before.
Afterwards, the decline repeatedly carrying out banker 10 successively, the sintering being formed and realized by light beam or the electron beam scanning of multiple light beam or electron beam scanning unit 20 of powder bed realized by powder feeding device 40, manufacture predetermined three dimensional structure thus.In addition, in described process, the peripheral part of sinter layer as required by not shown cutting apparatus by machining accurately.
Thus, according to the three-dimensional moulding device 1 of said structure, by multiple light beam of being produced by multiple light beam or electron beam scanning unit or electron beam, cover in same powder bed by the precalculated position in the E of sculpted zone, therefore, it is possible to carry out high-energy sintering at this concentrated part x1, and then moulding time shorten can be made.
In addition, the light beam of multiple light beam or electron beam scanning unit 20 or the concentrated part x1 of electron beam, may be used for scanning the side among described vector moulding path and described grating moulding path, also may be used for scanning both sides.Such as, if described concentrated part x1 to be used for the scanning in described vector moulding path, the light beam of not shown single light beam or electron beam scanning unit or electron beam are used for the scanning in grating moulding path, then can form highdensity sinter layer near the outer peripheral face of three dimensional structure, and form low-density sinter layer at private side.
Then, about the means making each Moving Unit in the movement of the irradiation position of multiple light beam or electron beam scanning unit 20 synchronous, other embodiments are described.In addition, embodiment shown below is the embodiment changed a part for described embodiment 1, and therefore main change for it is partly described in detail, omits the detailed description repeated.
[embodiment 2]
In the mode shown in Fig. 3, with the irradiation position x2 of multiple light beam or electron beam maintain arrange on same line along the scanning pattern preset state, this scanning pattern movement of an edge mode, make multiple light beam or electron beam scanning unit 20 synchronous.
Specifically bright, in this approach, controller 30 controls multiple light beam or electron beam scanning unit 20, arranges with separating predetermined space to make multiple irradiation position x2 of multiple light beam or electron beam scanning unit 20 on same line.And controller 30 makes the mode of these irradiation positions x2 movement to make the orientation of multiple irradiation position x2 along described moulding path, makes the action of multiple light beam or electron beam scanning unit 20 synchronous.
Each irradiation position x2 is the instantaneous region irradiating single light beam or electron beam on powder bed, has the irradiation diameter that be have adjusted by described aperture device.
Thus, the mode according to Fig. 3, by the same point in the E of sculpted zone, multiple light beam or electron beam pass through successively, gently acceleration of sintering.Therefore, compared with irradiating the situation of high-octane single light beam or electron beam, thermal shock is little, can obtain the three dimensional structure of high-quality.
[embodiment 3]
In the mode shown in Fig. 4, control described multiple light beam or electron beam scanning unit 20, to make the irradiation position x2 of multiple light beam or electron beam while maintain the state that the same line that intersects with the scanning route preset arranges, this scanning pattern of an edge moves.
Specifically bright, in this approach, controller 30 controls described multiple light beam or electron beam scanning unit 20, to make multiple irradiation position x2 of multiple light beam or electron beam scanning unit 20, relative to roughly orthogonal and arrange on same line with separating predetermined space along the scanning pattern in moulding path preset.And controller 30 maintains the mode of moulding path movement described in state one edge that arranges as described with multiple irradiation position x2, make the action of multiple light beam or electron beam scanning unit 20 synchronous.
Thus, the mode according to Fig. 4, can irradiate wider width by multiple light beam or electron beam simultaneously, therefore, it is possible to effectively improve moulding efficiency.
[embodiment 4]
In the mode shown in Fig. 5, as multiple light beam or electron beam scanning unit, possess: the large-diameter area light beam or the electron beam scanning unit 20L that form large footpath irradiation area L on the surface of powder bed; With the path region light beam or the electron beam scanning unit 20S that form the diameter path irradiation area S less than large footpath irradiation area L on the surface of same powder bed.
Each of large-diameter area light beam or electron beam scanning unit 20L and path region light beam or electron beam scanning unit 20S, use the scanning element with above-mentioned light beam or electron beam scanning unit 20 same configuration, respective light beam or electron beam are reduced by above-mentioned aperture device (not shown), form the larger large footpath irradiation area L of diameter and the diameter path irradiation area S less than this large footpath irradiation area L thus on plane of illumination.
Controller 30 is included in the position of the central authorities in large footpath irradiation area L mode with path irradiation area configures path irradiation area S, and to maintain this formation state while make these large footpath irradiation area L and path irradiation area S along the mode of predetermined moulding path movement, in the action of large-diameter area light beam or electron beam scanning unit A and described path region light beam or electron beam scanning unit B, make each Moving Unit synchronous.
According to said structure, light beam or the electron beam of a side are only irradiated in region between the outline line of path irradiation area S and the outline line of large footpath irradiation area L, therefore heat is smaller, in the region of the inner side of the outline line of path irradiation area S, light beam or the electron beam of the light beam of one side or electron beam and the opposing party overlap, and therefore heat is larger.And if these two irradiation areas S, L move simultaneously, then by the same point in the E of sculpted zone, after the part near the periphery of large footpath irradiation area L is first passed through, the path irradiation area S then in large footpath irradiation area L near central authorities can pass through.Therefore, carry out by the part of the light beam of one or electron beam preheating, heat this steps heating by the light beam of one and the opposing party or electron beam with high heat, and then compared with the situation of the high-octane single light beam of once irradiating or electron beam, thermal shock is little, can obtain the three dimensional structure of high-quality.
[embodiment 5]
In the mode shown in Fig. 6, as described multiple light beam or electron beam scanning unit, possess: be controlled as irradiate powder bed surface in by the outer surface side light beam in the region near the profile of sculpted zone E or electron beam scanning unit 20T; Be controlled as the irradiation position irradiated than this outer surface side light beam or electron beam scanning unit 20T and lean on by the private side light beam of the position of the private side of sculpted zone E or electronic scanning units 20U, the exposure of the per unit area of outer surface side light beam or electron beam scanning unit 20T and private side light beam or electron beam scanning unit 20U is different.
Specifically bright, each of outer surface side light beam or electron beam scanning unit 20T and private side light beam or electron beam scanning unit 20U, use the scanning element with above-mentioned light beam or electron beam scanning unit 20 same configuration, respective light beam or electron beam are reduced by above-mentioned aperture device (not shown), form the smaller face side irradiation area T of diameter and the diameter private side irradiation area U larger than this face side irradiation area T thus on plane of illumination.
Controller 30, by controlling the action of outer surface side light beam or electron beam scanning unit 20T, is comprising by near the profile of the profile of sculpted zone E, configuration surface side irradiation area T.Meanwhile, controller 30, by controlling the action of private side light beam or electron beam scanning unit 20U, at specific surface side irradiation area T by by the position of the private side of sculpted zone E, configures private side irradiation area U.
And, controller 30 passes through to make each Moving Unit synchronous in the action of face side light beam or electron beam scanning unit 20T and private side light beam or electron beam scanning unit 20U outside, face side irradiation area T is made to move along vector moulding path thus, and make private side irradiation area U along being moved by the grating moulding path in the E of sculpted zone, described vector moulding path is along by the path of the profile of sculpted zone E.
Thus, the mode according to Fig. 6, can sinter in short time with the outer surface side of the density different from the private side of three dimensional structure by three dimensional structure, and then can improve moulding efficiency and manufacture the three dimensional structure of high strength.
In addition, in described mode, be set to and sintered by near the profile of sculpted zone E to high-density, and low-density ground sintering is by the private side of sculpted zone E, but by adjusting described iris apparatus to make the irradiation diameter of described two light beams or electron beam contrary respectively, also can sinter by near the profile of sculpted zone E on low-density ground, and sinter to high-density by the private side of sculpted zone E.
In addition, in described mode, as the example making means that the exposure of per unit area is different, make as described light beam or beam diameter different, but as another example, also the light quantity of light beam or electron beam can be made different by the output adjustment of light beam or electron beam oscillation device.
In addition, as another example, also can the suitably mode shown in constitutional diagram 1 ~ Fig. 6, improve moulding efficiency further, described 6th embodiment is equivalent to its typical case.
Invention effect
The present invention is configured to as described above, therefore, it is possible to effectively carry out sintering, improves moulding efficiency.
Utilizability in industry
As above embodiment and clear and definite by embodiment, the present invention of moulding efficiency can be significantly improved, in the manufacture field of three-D moulding object, the value in industry can be given full play to.
Claims (8)
1. a three-dimensional moulding device, alternate repetition carries out lamination process and sintering circuit, in described lamination process, form powder bed by powder feeding device, in described sintering circuit, by light beam or electron beam scanning unit to described powder bed illumination beam or electron beam, and make this irradiation position move by each Moving Unit, sinter described powder bed, described each Moving Unit is by the computer settings participating in CCU, i.e. controller controlling, the feature of described three-dimensional moulding device is
Be provided with multiple described light beam or electron beam scanning unit,
Described three-dimensional moulding device is arranged to: by multiple light beam of being produced by these multiple light beams or electron beam scanning unit or electron beam irradiation in same powder layer, and make each Moving Unit in the movement of the irradiation position of these multiple light beams or electron beam scanning unit synchronous.
2. three-dimensional moulding device according to claim 1, is characterized in that,
Control described multiple light beam or electron beam scanning unit, to make in described multiple light beam or electron beam cover under the state in a precalculated position of described powder bed, this irradiation position is moved.
3. three-dimensional moulding device according to claim 1, is characterized in that,
Control described multiple light beam or electron beam scanning unit, to make the irradiation position of described multiple light beam or electron beam maintain the state arranged on same line along the scanning pattern preset, this scanning pattern of an edge moves.
4. three-dimensional moulding device according to claim 1, is characterized in that,
Control described multiple light beam or electron beam scanning unit, maintain the state that the same line intersected with the scanning pattern preset arranges to make the irradiation position of described multiple light beam or electron beam, this scanning pattern of an edge moves.
5. three-dimensional moulding device according to claim 1, is characterized in that,
As described multiple light beam or electron beam scanning unit, possess: one or more large-diameter areas light beam or electron beam scanning unit, it forms large footpath irradiation area on the surface of described powder bed; With path region light beam or electron beam scanning unit, its surface at same powder bed forms the diameter one or more path irradiation areas less than described large footpath irradiation area,
Be controlled to: the mode being contained in the position of the central authorities of described large footpath irradiation area with described path irradiation area forms described path irradiation area, with when maintaining this formation state, after forming described large footpath irradiation area, realize the mode of the formation of described path irradiation area, described large-diameter area light beam or electron beam scanning unit and described path region light beam or electron beam scanning unit are moved along the surface of described powder bed.
6. three-dimensional moulding device according to claim 1, is characterized in that,
As described multiple light beam or electron beam scanning unit, possess: outer surface side light beam or electron beam scanning unit, its be controlled as in the surface irradiating described powder bed by the region near the profile of sculpted zone; With private side light beam or electron beam scanning unit, it is controlled as and irradiates than region in the inner part, described region,
Described outer surface side light beam or electron beam scanning unit different from the exposure of described private side light beam or electron beam scanning unit.
7. three-dimensional moulding device according to claim 1, is characterized in that,
In the surface of described powder bed by the region near the profile of moulder, adopt the control of Claims 2 or 3, than in above-mentioned zone region in the inner part, adopt the control of claim 4.
8. the manufacture method of a three dimensional structure, alternate repetition carries out lamination process and sintering circuit, in described lamination process, supply dusty material forms powder bed, in described sintering circuit, to described powder bed illumination beam or electron beam, and this irradiation position is moved by each Moving Unit, sinter described powder bed, the feature of the manufacture method of described three dimensional structure is
In described sintering circuit, by multiple light beam or electron beam irradiation in same powder layer, and make each Moving Unit in the movement of the irradiation position of these multiple light beams or electron beam synchronous.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014077411 | 2014-04-04 | ||
| JP2014-077411 | 2014-04-04 |
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| CN104972118A true CN104972118A (en) | 2015-10-14 |
| CN104972118B CN104972118B (en) | 2019-09-27 |
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| CN201510017266.1A Active CN104972118B (en) | 2014-04-04 | 2015-01-13 | The manufacturing method of three-dimensional moulding device and three dimensional structure |
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| Country | Link |
|---|---|
| US (1) | US20150283612A1 (en) |
| EP (1) | EP2926925A3 (en) |
| KR (1) | KR20150115596A (en) |
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| CN113874142B (en) * | 2019-05-21 | 2023-12-12 | 株式会社荏原制作所 | AM device for producing molded article and method for testing irradiation position of light beam in AM device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104972118B (en) | 2019-09-27 |
| CA2869168C (en) | 2020-12-01 |
| EP2926925A3 (en) | 2015-10-21 |
| KR20150115596A (en) | 2015-10-14 |
| CA3009200C (en) | 2021-01-26 |
| US20150283612A1 (en) | 2015-10-08 |
| CA2869168A1 (en) | 2015-10-04 |
| EP2926925A2 (en) | 2015-10-07 |
| CA3009200A1 (en) | 2015-10-04 |
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