CN104968139B - FPC bonding structures - Google Patents
FPC bonding structures Download PDFInfo
- Publication number
- CN104968139B CN104968139B CN201510300146.2A CN201510300146A CN104968139B CN 104968139 B CN104968139 B CN 104968139B CN 201510300146 A CN201510300146 A CN 201510300146A CN 104968139 B CN104968139 B CN 104968139B
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- China
- Prior art keywords
- golden finger
- cover film
- spacer portion
- width
- golden
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of FPC bondings structures, including substrate, bonding area and non-bonding area are formed in the substrate, the bonding area includes multiple golden fingers being arranged in order, the non-bonding area is covered by cover film, and the cover film has the contact site being in contact with the end of the golden finger, and the cover film further includes multiple spacer portions extended respectively between two neighboring golden finger, there are gap between the spacer portion and golden finger, the height of spacer portion is less than the height of golden finger.Above-mentioned FPC bondings structure, cover film have the spacer portion extended between adjacent golden finger, can reduce the stress that cover film is in contact with golden finger end suffered by position, so as to prevent cover film from fractureing or tilt, avoid circuit by exposed and cause poor flow.
Description
Technical field
The present invention relates to FPC, more particularly to a kind of covered film structure in FPC bondings region.
Background technology
In FPC structures, cover film is attached to the surface of circuit, plays insulation, masking protection circuit, enhancement line energy resistant to bending
The effect of power.
As shown in Figure 1, FPC900 shapes are typically vertical shape, golden finger 910 and the screen body 800 of bonding terminal area
(ITO) after carrying out bonding, the region below of FPC bondings terminal (golden finger) directly hangs over the edge of screen body 800, is utilized after bending
Double faced adhesive tape is attached in TFT backplate, to fix the position of FPC.And in current design process, as shown in Fig. 2, wherein dotted line table
Display screen body 800, solid line represent FPC900, ACF (Anisotropic Conductive Film, respectively to different during in order to reserve bonding
Property conductive film) generate excessive glue region and need to FPC900 with screen body 800 junction carry out gluing with reinforcement FPC900
Bonding strength after bending between screen body 800, therefore the length of the golden finger 910 of FPC is needed beyond the edge 810 1 of screen body 800
Segment distance.The length of golden finger 910 is big compared with the length of the screen body electrode 820 of screen body 800 at present, and during bonding FPC900 golden hand
The upper end of finger 910 is aligned or with shielding the upper end of body electrode 820 less than 820 upper end of screen body electrode, and shields 820 lower end distance of body electrode
Shield 800 edge a distance of body, therefore golden finger 910 is beyond the edge 810 of screen body 800, i.e. golden finger 910 and cover film 920
It connects edge placement 930 and is located at 800 outside of screen body.Therefore after FPC900 bendings, golden finger 910 and 920 connection position of cover film
The place of putting is stressed directly, and this power of pullling is destroyed it is possible that being formed to the golden finger 910 of FPC900, and golden finger 910 is broken, and is influenced
Line conduction also results in cover film 920 and fractures, tilts so that the copper foil below cover film 920 is exposed in air by oxygen
Change, so as to after long-time use, be easy to cause and occur the phenomenon that blank screen after sale, defective products is main precisely due to drawing after bending
Golden finger 910 is broken and fractureed with cover film 920 by power, FPC900 is caused to open a way with shielding the connection of body 800, OLED does not work down to black
Screen.
In addition, it usually is allowed to lead with shielding the electrode of body 800 between the two using the conducting particles connection FPC900 in ACF
Logical, as shown in figure 3, after to ACF pressurizations, heating, screen body electrode 820 and golden finger 910 are oppressed simultaneously between the two contact surface
Conducting particles so that conducting particles between the two will be due to being extruded and between adjacent golden finger and adjacent electrode
It moves in gap so that the conducting particles number in gap is excessive, so as to which insulating properties of the ACF on X/Y plane is broken, causes phase
Then conducting forms short circuit for conducting particles contact between adjacent electrode, and also resulting in OLED can not show.
Invention content
Based on this, it is necessary to provide a kind of golden finger that can reduce and answering suffered by cover film is connect at edge placement with cover film
The FPC bonding structures of power.
A kind of FPC bondings structure including substrate, is formed with bonding area and non-bonding area, the bonding area in the substrate
Including multiple evenly distributed golden fingers successively, the non-bonding area is covered by cover film, and the cover film has and the gold
The contact site that the end of finger is in contact, the cover film further include multiple between extending respectively between two neighboring golden finger
Every portion, the height of the spacer portion is less than the height of the golden finger.
Above-mentioned FPC bondings structure, cover film, which has, extends to spacer portion between adjacent golden finger, can reduce cover film with
Golden finger end is in contact the stress suffered by position, so as to prevent cover film from fractureing or tilt, circuit is avoided to be caused by exposed
Poor flow.
The substrate is rectangle in one of the embodiments, the length direction of the golden finger and the width of substrate
Direction is consistent, and the multiple golden finger is arranged along the length direction of substrate.
The cover film further includes the golden finger for extending respectively into the leftmost side and the rightmost side in one of the embodiments,
The first edge portion in the outside of golden finger and second edge portion so that the both sides of the golden finger of the leftmost side be respectively described in one between
Every portion and the first edge portion, the both sides of the golden finger of the rightmost side are respectively a spacer portion and the second edge
Portion.
There are gap, the spacer portions between spacer portion golden finger adjacent thereto in one of the embodiments,
Width be 2 times of gap width.
In one of the embodiments, between the golden finger of the leftmost side and first edge portion there are gap, between described
The width of gap is equal to the 1/2 of the width of the spacer portion, there are gap between the golden finger of the rightmost side and second edge portion,
The width in the gap is equal to the 1/2 of the width of the spacer portion.
Pass through respectively between the first edge portion and second edge portion and the contact site in one of the embodiments,
Round-corner transition, the radius of the fillet are the 1/2 of the width of the spacer portion.
The edge for the contact site that the cover film is in contact with the end of the golden finger is in one of the embodiments,
Curvilinear structures, the shape of the end of the golden finger match with the shape of the curve.
The curvilinear structures include intermediate arc section and the straightway of both sides in one of the embodiments,.
The radius of the arc section is the 1/3 of the golden finger width in one of the embodiments,.
Description of the drawings
The FPC and the schematic cross-sectional view after screen body bonding that Fig. 1 is traditional technology；
The FPC and the schematic diagram after screen body bonding that Fig. 2 is traditional technology；
Fig. 3 is the schematic cross-sectional view of the FPC and other direction after screen body bonding of traditional technology；
Fig. 4 is the schematic diagram of the bonding plot structure of the FPC of the present invention；
The FPC and the schematic cross-sectional view after screen body bonding that Fig. 5 is the present invention.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " including one or more phases
The arbitrary and all combination of the Listed Items of pass.
Below in conjunction with the accompanying drawings, illustrate the better embodiment of the present invention.
It please refers to Fig.4 and Fig. 5, the present invention proposes a kind of FPC100, including substrate 110.The one side of substrate 110 is formed with
Bonding area and non-bonding area.Wherein, bonding area includes multiple golden fingers 112；Non- bonding area (i.e. 112 region below of golden finger) is covered
It is stamped cover film 114.The cover film 114 below have it is being connected with golden finger 112, the conducting wire formed is etched by copper foil, cover
Epiphragma 114 is the surface for being attached at circuit, plays insulation, masking protection circuit, can increase circuit ability resistant to bending.
Join Fig. 4, substrate 110 is rectangle and (is commonly called as strip), and length direction is consistent with X-direction, width side and Y-direction
Unanimously.The length direction of golden finger 112 is consistent with the width direction (Y-direction) of substrate 110.Golden finger 112 is then along substrate 110
Length direction (X-direction) is evenly distributed successively, contributes to increase the distance between adjacent golden finger 112 in this way, makes arrangement unlikely
In too closely, and then ensure FPC100 with shielding the reliability of 200 bonding of body, and shield on body 200 with FPC100 bondings occupied by
Space also reduced, and then can reduce FOG (FPC on Glass, FPC are attached at glass) end frame.
Join Fig. 4, cover film 114 is insulating materials, common including polyimides and polyester material.Cover film 114 covers
112 region below of golden finger in substrate 110 has the contact site 1142 being in contact with the end of golden finger 112.Contact site
1142 be the part that cover film is connected with golden finger 112.Join Fig. 4, cover film 114 also extend it is multiple extend respectively into it is adjacent
Spacer portion 1144 between two golden fingers 112.There are one spacer portion 1144 between the adjacent golden finger 112 of each two, and
There are gaps 116 between the golden finger 112 adjacent thereto of portion 1144.I.e. compared with traditional technology, in of the invention, cover film 114 increases
If extending to the spacer portion 1144 between adjacent golden finger 112, the stress suffered by contact site 1142 can be reduced, so as to prevent
Covering membrane part of the golden finger below 112 is fractureed or is tilted in Fig. 3, avoids the occurrence of that circuit is exposed to be aoxidized, be connected in air
The phenomenon that bad.
It please join Fig. 4, Fig. 5, the width of spacer portion 1144 is set as 2 times of the width in gap 116.The height of spacer portion 1144
(i.e. vertical and far from the size on 110 direction of substrate) less than the height of golden finger 112, when FPC100 is with screen 200 bonding of body,
Golden finger 112 is first directly contacted with screen body electrode 210, therefore the presence of spacer portion 1144 does not influence FPC100 with shielding the nation of body 200
It is fixed.
Join Fig. 4, cover film 114 also extends first edge portion 1145 and second edge portion 1146.First edge portion 1145
Positioned at the left side of the golden finger 112 of the leftmost side.Second edge portion 1146 is then positioned at the right side of the golden finger 112 of the rightmost side.So that
The both sides of the golden finger 112 of the leftmost side are respectively a spacer portion 1144 and first edge portion 1145；The golden finger 112 of the rightmost side
Both sides be respectively a spacer portion 1144 and second edge portion 1146.First edge portion 1145 and second edge portion 1146 deposit
It is further promoted making the intensity of entire cover film 114.
There are gaps, the width in the gap between the golden finger 112 of the leftmost side and first edge portion 1145 to be equal to spacer portion
The 1/2 of 1144 width.Similarly, also there are gap, the gaps between the golden finger 112 of the rightmost side and second edge portion 1146
Width be equal to spacer portion 1144 width 1/2.
By fillet R transition between first edge portion 1145 and contact site 1142, the radius of fillet R is spacer portion 1144
The 1/2 of width.Also through round-corner transition, the radius of fillet between second edge portion 1146 and the contact site 1142 of cover film 114
1/2 of width for spacer portion 1144.
With reference to Fig. 5, when FPC100 is with screen 200 bonding of body, due to cover film 114 extended to by spacer portion 1144 it is adjacent
Between golden finger 112, therefore reduce the gap 310 that two neighboring golden finger 112 surrounds jointly with two neighboring screen body electrode 210
Size.So after using ACF by FPC100 and screen 200 bonding of body, the conductive particle in gap 310 is shifted to due to extruding
Subnumber mesh is also accordingly reduced, and forms conducting then short circuit so as to which adjacent screen body electrode 210 be prevented to contact conducting particles, simultaneously
Gap 310 is full of by ACF after bonding, plays the role of carrying out screen body 200 with FPC100 be bonded.And due to spacer portion 1144
Presence so that required ACF materials are reduced in gap 310, so as to save cost.
When contact site 1142 is FPC100 bendings where stress, impetus is in straight line during for FPC100 being avoided to be bent
On, join Fig. 4, the edge of contact site 1142 that contact site 1142 is in contact with golden finger 112 is curvilinear structures, so as to avoid
Force point-blank, so as to enhance the tensile strength of golden finger 112, it is therefore prevented that FPC100 is fractureed easily, is avoided
The golden finger 112 of FPC100 heated pressure sections is broken due to connecting insecure, improves the reliability and yields of product.
In Fig. 4, which includes intermediate arc section 11421 and the straightway 11423 of both sides.Arc section 11421
Radius be the 1/3 of 112 width of golden finger, and the axis B on the length direction of the axis of arc section 11421 and golden finger 112
It overlaps.
When the edge of contact site 1142 that contact site 1142 is in contact with golden finger 112 is curvilinear structures, golden finger 112
The shape of end matches with the shape of curve.Cause seamless connection between cover film 114 and golden finger 112, under effective protection
The conducting wire of side.
Cover film 114 of the present invention can be used following methods and be made and be attached at substrate 110.
Isolation board is used to be covered isolation board on the copper foil of substrate 110 for intermediary, and by full wafer cover film be attached to every
From on plate.Then it hammers into pin in isolation board to position cover film and copper foil, utilizes photoetching machining cover film windowing figure
Shape obtains cover film 114, extracts isolation board, the cover film 114 for obtaining holding successfully figure is bonded with substrate 110.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (9)
1. a kind of FPC bondings structure including substrate, is formed with bonding area and non-bonding area, the bonding area packet in the substrate
Multiple evenly distributed golden fingers successively are included, the non-bonding area is covered by cover film, and the cover film has and the golden hand
The contact site that the end of finger is in contact, which is characterized in that the cover film, which further includes, multiple extends respectively into two neighboring golden hand
Spacer portion between finger, the height of the spacer portion are less than the height of the golden finger, and the spacer portion is by adjacent golden finger
Isolation.
2. FPC bondings structure according to claim 1, which is characterized in that the substrate is rectangle, the golden finger
Length direction is consistent with the width direction of substrate, and the multiple golden finger is arranged along the length direction of substrate.
3. FPC bondings structure according to claim 1, which is characterized in that the cover film, which further includes, to be extended respectively into most
The first edge portion in the outside of the golden finger in left side and the golden finger of the rightmost side and second edge portion so that the golden finger of the leftmost side
Both sides be respectively a spacer portion and the first edge portion, the both sides of the golden finger of the rightmost side are respectively described in one
Spacer portion and the second edge portion.
4. FPC bondings structure according to claim 1, which is characterized in that between the spacer portion golden finger adjacent thereto
There are gap, the width of the spacer portion is 2 times of gap width.
5. FPC bondings structure according to claim 3, which is characterized in that the golden finger and first edge of the leftmost side
There are gap between portion, the width in the gap is equal to the 1/2 of the width of the spacer portion, the golden finger of the rightmost side and the
There are gap between two edge parts, the width in the gap is equal to the 1/2 of the width of the spacer portion.
6. FPC bondings structure according to claim 3, which is characterized in that the first edge portion and second edge portion with
Respectively by round-corner transition between the contact site, the radius of the fillet is the 1/2 of the width of the spacer portion.
7. FPC bondings structure according to claim 1, which is characterized in that the end of the cover film and the golden finger
The edge for the contact site being in contact is curvilinear structures, and the shape of the end of the golden finger matches with the shape of the curve.
8. FPC bondings structure according to claim 7, which is characterized in that the curvilinear structures include intermediate arc section
And the straightway of both sides.
9. FPC bondings structure according to claim 8, which is characterized in that the radius of the arc section is the golden finger
The 1/3 of width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510300146.2A CN104968139B (en) | 2015-06-03 | 2015-06-03 | FPC bonding structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510300146.2A CN104968139B (en) | 2015-06-03 | 2015-06-03 | FPC bonding structures |
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| Publication Number | Publication Date |
|---|---|
| CN104968139A CN104968139A (en) | 2015-10-07 |
| CN104968139B true CN104968139B (en) | 2018-06-22 |
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| CN201510300146.2A Active CN104968139B (en) | 2015-06-03 | 2015-06-03 | FPC bonding structures |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578746B (en) * | 2016-02-25 | 2018-09-04 | 广东欧珀移动通信有限公司 | Rigid Flex and mobile terminal |
| CN106793743A (en) * | 2016-12-12 | 2017-05-31 | 晟光科技股份有限公司 | A kind of inexpensive FPC designs implementation method |
| CN110139470A (en) * | 2019-05-13 | 2019-08-16 | 深圳市华星光电技术有限公司 | Flexible circuit board and display device |
| CN115004370A (en) | 2020-10-27 | 2022-09-02 | 京东方科技集团股份有限公司 | Display panel, preparation method thereof and display device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004259982A (en) * | 2003-02-26 | 2004-09-16 | Toyota Motor Corp | Coupling part and its use |
| CN101346035B (en) * | 2007-07-13 | 2010-06-02 | 富葵精密组件(深圳)有限公司 | Flexible circuit board |
| CN103118480B (en) * | 2011-11-17 | 2016-08-17 | 深圳市比亚迪电子部品件有限公司 | Flexible printed circuit board |
| CN103928415A (en) * | 2013-03-01 | 2014-07-16 | 厦门天马微电子有限公司 | Structure of pin region |
| CN203934147U (en) * | 2014-04-30 | 2014-11-05 | 深圳市金立通信设备有限公司 | The syndeton of FPC and LCD glass substrate |
| CN204119645U (en) * | 2014-09-28 | 2015-01-21 | 江西鑫力华数码科技有限公司 | There is the flexible circuit board of the anti-jackknifing structure of circuit |
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| CN104968139A (en) | 2015-10-07 |
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Application publication date: 20151007 Assignee: Yungu (Gu'an) Technology Co., Ltd.|Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd Assignor: Kunshan Guo Xian Photoelectric Co., Ltd. Contract record no.: X2019990000157 Denomination of invention: FPC bonding structure Granted publication date: 20180622 License type: Common License Record date: 20191031 |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191209 Address after: No. 2 Xiangshan Avenue, Yongning Street, Zengcheng District, Guangzhou, Guangdong province (the core of Zengcheng economic and Technological Development Zone) Patentee after: Guangzhou Guoxian Technology Co., Ltd Address before: 215300, No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou, 4 Patentee before: Kunshan Guo Xian Photoelectric Co., Ltd. |