CN104959610A - Method and device for preparing Sn-Bi alloy wires - Google Patents
Method and device for preparing Sn-Bi alloy wires Download PDFInfo
- Publication number
- CN104959610A CN104959610A CN201510381282.9A CN201510381282A CN104959610A CN 104959610 A CN104959610 A CN 104959610A CN 201510381282 A CN201510381282 A CN 201510381282A CN 104959610 A CN104959610 A CN 104959610A
- Authority
- CN
- China
- Prior art keywords
- alloy
- extruding
- alloy wire
- squeegee roller
- plug
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910020830 Sn-Bi Inorganic materials 0.000 title claims abstract description 45
- 229910018728 Sn—Bi Inorganic materials 0.000 title claims abstract description 45
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 38
- 239000000956 alloy Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000003723 Smelting Methods 0.000 claims abstract description 7
- 238000005516 engineering process Methods 0.000 claims abstract description 5
- 229910000521 B alloy Inorganic materials 0.000 claims description 29
- 230000008018 melting Effects 0.000 claims description 27
- 238000002844 melting Methods 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 238000001540 jet deposition Methods 0.000 claims description 14
- 238000000889 atomisation Methods 0.000 claims description 12
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 229910052797 bismuth Inorganic materials 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000001125 extrusion Methods 0.000 abstract description 5
- 238000005266 casting Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 2
- 238000009826 distribution Methods 0.000 abstract description 2
- 238000009718 spray deposition Methods 0.000 abstract 3
- 238000005096 rolling process Methods 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 10
- 229910001152 Bi alloy Inorganic materials 0.000 description 9
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 8
- 239000006023 eutectic alloy Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- 238000005204 segregation Methods 0.000 description 5
- 238000005098 hot rolling Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000009749 continuous casting Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910001074 Lay pewter Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The invention discloses a method and device for preparing Sn-Bi alloy wires, and belongs to the field of lead-free solder manufacturing. The method includes the steps of burdening, smelting and spray deposition continuous extrusion. Through a spray deposition continuous extrusion method, the Bi hard and brittle phase can be smaller, and dispersion distribution is more uniform; the extension strength and the fracture elongation of the machined Sn-Bi alloy wires are obviously improved, and the welding using performance is excellent. The novel spray deposition continuous extrusion technology is simplified in working procedure, the manufacturing working procedures of casting, rolling, dragging, pulling and the like are saved, the production cost is more reasonable, and the production efficiency is higher. The alloy wires in different sizes can be produced according to different requirements.
Description
Technical field
The present invention relates to a kind of method and the device of preparing Sn-Bi B alloy wire, belong to the manufacture field of lead-free solder.
Background technology
Solder uses existing history in several thousand from inventing to, and leaded electronic product exists the problem of contaminated environment, and every country is positive to be reduced by making laws and forbids the use of the harmful elements such as lead and carry out the developmental research activity of lead-free solder.At present, Xi Yin, tin copper, tin zinc, sn-bi alloy are conventional lead-free solders, current generally acknowledged lead-free brazing designing requirement comprise following some: (1) fusing point should lower than or be equivalent to the fusing point (183 DEG C) of Sn-Pb eutectic alloy; (2) nontoxic pollution-free; (3) cost is not too high; (4) have and Sn-Pb quite or better performance.Sn-Bi alloy system is then considered to uniquely meet the lead-free solder that first three items required, was applied to production.Sn-58Bi eutectic solder fusing point is low, has good mobility and thermal fatigue property, is the very potential lead-free solder of one.
In addition Sn-Bi system solder contains lower Sn content, thus reduces high tin risk (as tin palpus).But bismuth also brings other problem, the impact comprising its composition alloy mechanical property changes greatly, easy generation low melting point problem (can low melting point eutectic be formed after inclined tin), boundary layer instability causes reliability poor, particularly Sn-Bi solder when departing from eutectic composition because melting range is larger, in process of setting, easily there is dendritic segregation and organize coarsening, in addition unequal power distribution causes easily peeling off harm, and supply is few naturally, reserves are limited, this makes the research of Sn-Bi system solder and uses always at a low tide.
All contain a large amount of bismuths in current Unlead low-smelting point Thermal Cutoffs alloy, due to the fragility of bismuth and easily occur segregation in alloy graining process, make alloy very responsive to strain rate.Therefore little wire diameter bismuth-contained lead-free B alloy wire is difficult to be prepared with traditional casting-extrusion process.
Due to Sn-58Bi eutectic alloy wire forming difficulty, about the research report of Sn-58Bi eutectic alloy silk is also little.University of Toronto Divya Bhardwaj etc. adopt OCC(Ohno Continuous Casting) continuous casting process successfully prepared the B alloy wire of the high bi content (bismuth-containing amount 44%-77%) of diameter 2mm.But this continuous casting process makes the dispersion of brittlement phase Bi in sn-bi alloy uneven, in technological process process, technique is easy to interrupt, and sn-bi alloy silk does not have good plasticity, and product defects is many, easy brittle failure.Complicated operation, state modulator are unstable, and production cost is high.
(find following relevant to the application patent document according to the retrieval, in patent document CN103639620, disclose a kind of preparation method of Sn-Bi brittle alloy preformed soldering, comprise the steps such as batching, founding, hot rolling, stamping-out.Comprise: (1) prepares burden, and is that Sn42% and Bi58% raw material prepares by mass percent.(2) founding, puts into the crucible protecting pre-alloyed system, at N by above-mentioned steps (1) gained raw material
2be heated to 180 DEG C 200 DEG C under protective atmosphere and be fused into uniform LIQUID Sn-Bi alloy, and be cast to formation rod type Sn-Bi alloy cast ingot in ingot mould; (3) hot rolling, adopts hot-rolling mill calendering for band by rod type Sn-Bi alloy cast ingot obtained in above-mentioned steps (2); (4) stamping-out, obtains preformed soldering by the band of hot rolling gained in above-mentioned steps (3) by Dies ' Blanking.Wherein CN102296208A discloses a kind of lead-free low-temperature alloy of the fusing core for making Thermal Cutoffs, and raw material is formed and percentage range is respectively: Bi:34% ~ 36%; Zn:3.5% ~ 4.5%; Sn: surplus; The step of its preparation method is as follows: metallic tin is put into stainless steel crucible, electric furnace heats, after tin fusing, at 250 DEG C ~ 280 DEG C, add metallic zinc, after melting down, add bismuth metal again, carry out the conventional degasser that adds after melting down degassed, slagging-off, is cast into the low-temperature alloy rod of required size.The preparation method of this patent is that melting is cast again.In the process of melting, because the density of Bi is large, after alloy graining, segregation is very serious, and there is thick Bi phase, and make alloy fragility large, plasticity is extremely low, substantially can not obtain tin bismuth fine alloy silk.
(patent document CN102912204A discloses a kind of lead-free low-temperature Alloy And Preparation Method and application, and this low-temperature alloy is made up of tin bismuth indium three kinds of metals, and each composition percentage by weight is as follows: tin: 15% ~ 17%; Bismuth: 32% ~ 34%; Surplus is indium, and its preparation methods steps is: (1) melts molten indium (4) degassed (5) casting of the molten bismuth (3) of tin (2).Patent document CN103146955A discloses a kind of lead-free low-temperature Alloy And Preparation Method of 198 DEG C of fuse burned-out core.Its raw material is formed and weight percentage ranges is respectively: Cu:0.4% ~ 0.6%, Ag:1.8% ~ 2.2%, In:7.5% ~ 8.5%, Bi:0.8% ~ 1.2%, Sn surplus.Its preparation methods steps is as follows: (1) melts tin: by weight ratio metal is put into stainless steel crucible, and electric furnace is heated to tin fusing; (2) cast: at 280 DEG C ~ 320 DEG C, add metallic copper, after melting down, add argent, after melting down, add bismuth again, after melting down, add the low-temperature alloy rod that the degassed slagging-off of degasser is cast into diameter 25mm; (3) extruded: with the vertical extruders of 100 tons extruding, extrusion temperature is 80 DEG C, mould diameter is the five holes extruding of 25mm, and the low-temperature alloy silk squeezing out diameter 1.0mm uses as the fusing core of Thermal Cutoffs.Use the method for melting-casting-extruding in patent document CN103146955A, obtain refinement through extruding crystal grain, but still the problem that the segregation that there is brittlement phase Bi is serious, in preparation process, goods plasticity is poor, can not continuous seepage.
Sn-58Bi solder is used for the history that Electronic Packaging has 20 years.In recent years along with the development of LED Display Technique and the market of light-emitting diode display constantly expand, need to use Sn-58Bi eutectic alloy silk to the welding of the more sensitive LED component of temperature, its market demand is by increasing.Therefore how high efficiency of forming Sn-58Bi eutectic silk material, one of study hotspot becoming researcher.Sn-58Bi sn-bi alloy is a kind of alloy of high Bi content, the tin bismuth eutectic alloy silk that this patent uses jet deposition continuous squeezing method to prepare, and brittlement phase Bi receives great fragmentation, and crystal grain is more tiny, at N
2effect under Dispersed precipitate evenly, solve serious segregation problems.Spray quiet continuous extruding technology simple, easy to operate, occupation area of equipment is little, can high efficiency of forming sn-bi alloy silk material.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, the preparation method that a kind of sn-bi alloy silk jet deposition is continuously extruded is provided, the method effectively can make that the hard crisp phase of Bi is more tiny, Dispersed precipitate evenly, improve the fracture elongation of its B alloy wire, high efficiency of forming Sn-58Bi eutectic silk material can be reached, specifically comprise the following steps:
(1) by raw material Sn, Bi heat fused uniformly LIQUID Sn-Bi alloy, pass into atomization gas, liquation is atomized;
(2) prepare Sn-Bi B alloy wire by jet deposition continuously extruding and molding technology: under the effect of flow pattern controller by atomization after Sn-Bi alloy molten solution jet deposition in the race of squeegee roller, under the effect of jam power, continue extruding by the mould after preheating extrude Sn-Bi B alloy wire.
The temperature of LIQUID Sn-Bi alloy of the present invention is 220 DEG C ~ 300 DEG C, and mold preheating temperature is 70 DEG C ~ 100 DEG C.
The pressure of atomization gas of the present invention is 0.3MPa ~ 0.5MPa, and in flow pattern controller, the rotating speed of motor is 800r.min
-1~ 1000r.min
-1; The rotating speed of squeegee roller controls at 2r.min
-1~ 5r.min
-1between.
The method equipment therefor preparing Sn-Bi B alloy wire of the present invention, comprise Metal Melting device 1, atomising device 2, popular controller 3, support 4, squeegee roller 5, plug 6, extruding machine cavity 7, Metal Melting device 1 is fixed on support 4, atomising device 2 to be positioned at below smelting apparatus and to be fixed on support 4, be provided with popular controller 3 below atomising device 2, popular controller 3 is fixed on extruding machine cavity 7; Extruding machine cavity 7 is positioned at the outside of squeegee roller 5, and the surface of squeegee roller 5 is provided with extruding race 9; Extruding machine cavity 7 is provided with plug 6, and extruding race 9 is blocked in one end of plug 6, and the inside of plug 6 is provided with mould 8.
Described popular controller 3 comprises two copper dishes 10 and two motors 11, and copper dish 10 is connected with motor 11, in 30 ° ~ 45 ° angles between two copper dishes 10.
Advantage of the present invention and good effect are:
(1) low-temperature alloy of the present invention is the lead-free low-temperature alloy containing Sn, Bi, may be used for the fusing core making Thermal Cutoffs; This kind of low-temperature alloy is eutectic alloy, has uniform composition, crystal grain is tiny, percentage elongation is high, applied widely feature.
(2) low-temperature alloy of the present invention be leadless environment-friendly material to replace traditional leypewter, and there is good social benefit and economic benefit.
(3) preparation method of lead-free low-temperature Sn-Bi alloy of the present invention is simple, is easy to operation, eliminates casting, rolls, draws, Ba Deng manufacturing process, and more rationally, production efficiency is higher for production cost.Improve the economic worth of enterprise, the production for leadless welding wire brings theoretical foundation widely, moreover, can also produce the Sn-Bi B alloy wire of different fine sizes with jet deposition continuous extruder according to different needs.
Accompanying drawing explanation
Fig. 1 is Sn-Bi B alloy wire preparation flow figure;
Fig. 2 is the continuously extruded schematic diagram of jet deposition;
Fig. 3 is popular controller principle figure;
Fig. 4 is the micro-organization chart of Sn-58Bi B alloy wire in embodiment 1;
Fig. 5 is the micro-organization chart of Sn-58Bi B alloy wire in embodiment 2.
In figure: 1-Metal Melting device; 2-atomising device; The popular controller of 3-; 4-support; 5-squeegee roller; 6-plug; 7-extruding machine cavity; 8-mould; 9-extrudes race; 10-copper dish; 11-motor.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail, but protection scope of the present invention is not limited to described content
Embodiment 1
A preparation method for Sn-Bi B alloy wire, comprises the steps:
(1) prepare burden: be that raw material prepares by Sn42% and Bi58% by institute's mass percent;
(2) melting: sn-bi alloy is put into crucible, puts it in Metal Melting device, and setting furnace temperature is 220 DEG C;
(3) the continuously extruded process of jet deposition: the Sn-Bi alloy solution obtained of step (2) after atomising device atomization through flow pattern controller jet deposition in squeegee roller race, by the continuous Sn-Bi B alloy wire extruding Φ 0.8mm of the mould (70 DEG C) after preheating under the effect of jam power, wherein, the pressure of atomization gas is 0.5MPa, and in flow pattern controller, the rotating speed of motor is 800r.min
-1; The rotating speed of squeegee roller controls at 5r.min
-1between.
Shown in microscopic structure Fig. 4 of the Sn-Bi B alloy wire of the Φ 0.8mm that the present embodiment is prepared; Can see that in microscopic structure, white is rich Bi phase mutually by Fig. 4, black is rich Sn phase matrix mutually; Tiny Bi crystal grain is uniformly distributed with in Sn matrix, the tiny rich Bi phase of size more easily coordinates the distortion of Sn matrix, most energy in the Sn matrix absorption stretcher strain that plasticity is good, therefore Sn-58Bi eutectic alloy silk material has higher percentage elongation in fracture.
The method equipment therefor preparing Sn-Bi B alloy wire described in the present embodiment, comprise Metal Melting device 1, atomising device 2, popular controller 3, support 4, squeegee roller 5, plug 6, extruding machine cavity 7, Metal Melting device 1 is fixed on support 4, atomising device 2 to be positioned at below smelting apparatus and to be fixed on support 4, be provided with popular controller 3 below atomising device 2, popular controller 3 is fixed on extruding machine cavity 7; Extruding machine cavity 7 is positioned at the outside of squeegee roller 5, and the surface of squeegee roller 5 is provided with extruding race 9; Extruding machine cavity 7 is provided with plug 6, and extruding race 9 is blocked in one end of plug 6, and the inside of plug 6 is provided with mould 8.
Described popular controller 3 comprises two copper dishes 10 and two motors 11, and copper dish 10 is connected with motor 11, in 30 ° of angles between two copper dishes 10.
Embodiment 2
A preparation method for Sn-Bi B alloy wire, comprises the steps:
(1) prepare burden: be that raw material prepares by Sn42% and Bi58% by institute's mass percent;
(2) melting: sn-bi alloy is put into crucible, puts it in Metal Melting device, and setting furnace temperature is 260 DEG C;
(3) the continuously extruded process of jet deposition: the Sn-Bi alloy solution obtained of step (2) after atomising device atomization through flow pattern controller jet deposition in squeegee roller race, by the continuous Sn-Bi B alloy wire extruding Φ 1.5mm of the mould (80 DEG C) after preheating under the effect of jam power, wherein, the pressure of atomization gas is 0.3MPa, and in flow pattern controller, the rotating speed of motor is 900r.min
-1; The rotating speed of squeegee roller controls at 4r.min
-1between.
Shown in microscopic structure Fig. 4 of the Sn-Bi B alloy wire of the Φ 1.5mm that the present embodiment is prepared; Can see that in microscopic structure, white is rich Bi phase mutually by Fig. 4, black is rich Sn phase matrix mutually; Tiny Bi crystal grain is uniformly distributed with in Sn matrix, the tiny rich Bi phase of size more easily coordinates the distortion of Sn matrix, most energy in the Sn matrix absorption stretcher strain that plasticity is good, therefore Sn-58Bi eutectic alloy silk material has higher percentage elongation.
The method equipment therefor preparing Sn-Bi B alloy wire described in the present embodiment, comprise Metal Melting device 1, atomising device 2, popular controller 3, support 4, squeegee roller 5, plug 6, extruding machine cavity 7, Metal Melting device 1 is fixed on support 4, atomising device 2 to be positioned at below smelting apparatus and to be fixed on support 4, be provided with popular controller 3 below atomising device 2, popular controller 3 is fixed on extruding machine cavity 7; Extruding machine cavity 7 is positioned at the outside of squeegee roller 5, and the surface of squeegee roller 5 is provided with extruding race 9; Extruding machine cavity 7 is provided with plug 6, and extruding race 9 is blocked in one end of plug 6, and the inside of plug 6 is provided with mould 8.
Described popular controller 3 comprises two copper dishes 10 and two motors 11, and copper dish 10 is connected with motor 11, in 45 ° of angles between two copper dishes 10.
Embodiment 3
A preparation method for Sn-Bi B alloy wire, comprises the steps:
(1) prepare burden: be that raw material prepares by Sn42% and Bi58% by institute's mass percent;
(2) melting: sn-bi alloy is put into crucible, puts it in Metal Melting device, and setting furnace temperature is 300 DEG C;
(3) the continuously extruded process of jet deposition: the Sn-Bi alloy solution obtained of step (2) after atomising device atomization through flow pattern controller jet deposition in squeegee roller race, by the continuous Sn-Bi B alloy wire extruding Φ 1.0mm of the mould (100 DEG C) after preheating under the effect of jam power, wherein, the pressure of atomization gas is 0.4MPa, and in flow pattern controller, the rotating speed of motor is 1000r.min
-1; The rotating speed of squeegee roller controls at 5r.min
-1between.
The method equipment therefor preparing Sn-Bi B alloy wire described in the present embodiment, comprise Metal Melting device 1, atomising device 2, popular controller 3, support 4, squeegee roller 5, plug 6, extruding machine cavity 7, Metal Melting device 1 is fixed on support 4, atomising device 2 to be positioned at below smelting apparatus and to be fixed on support 4, be provided with popular controller 3 below atomising device 2, popular controller 3 is fixed on extruding machine cavity 7; Extruding machine cavity 7 is positioned at the outside of squeegee roller 5, and the surface of squeegee roller 5 is provided with extruding race 9; Extruding machine cavity 7 is provided with plug 6, and extruding race 9 is blocked in one end of plug 6, and the inside of plug 6 is provided with mould 8.
Described popular controller 3 comprises two copper dishes 10 and two motors 11, and copper dish 10 is connected with motor 11, in 40 ° of angles between two copper dishes 10.
Claims (5)
1. prepare a method for Sn-Bi B alloy wire, it is characterized in that: specifically comprise the following steps:
(1) by raw material Sn, Bi heat fused uniformly LIQUID Sn-Bi alloy, pass into atomization gas, liquation is atomized;
(2) Sn-Bi B alloy wire is prepared by jet deposition continuously extruding and molding technology: by the Sn-Bi alloy molten solution jet deposition after atomization in the race of squeegee roller, under the effect of jam power, continue extruding by the mould after preheating extrude Sn-Bi B alloy wire.
2. the method preparing Sn-Bi B alloy wire according to claim 1, is characterized in that: the temperature of LIQUID Sn-Bi alloy is 220 DEG C ~ 300 DEG C, and mold preheating temperature is 70 DEG C ~ 100 DEG C.
3. the method preparing Sn-Bi B alloy wire according to claim 1, is characterized in that: the pressure of atomization gas is 0.3MPa ~ 0.5MPa, and in flow pattern controller, the rotating speed of motor is 800r.min
-1~ 1000r.min
-1; The rotating speed of squeegee roller controls at 2r.min
-1~ 5r.min
-1between.
4. the method equipment therefor preparing Sn-Bi B alloy wire according to claim 1, it is characterized in that: comprise Metal Melting device (1), atomising device (2), popular controller (3), support (4), squeegee roller (5), plug (6), extruding machine cavity (7), Metal Melting device (1) is fixed on support (4), atomising device (2) to be positioned at below smelting apparatus and to be fixed on support (4), be provided with popular controller (3) below atomising device (2), popular controller (3) is fixed on extruding machine cavity (7); Extruding machine cavity (7) is positioned at the outside of squeegee roller (5), and the surface of squeegee roller (5) is provided with extruding race (9); Extruding machine cavity (7) is provided with plug (6), and extruding race (9) is blocked in one end of plug (6), and the inside of plug (6) is provided with mould (8).
5. device according to claim 4, is characterized in that: described popular controller (3) comprises two copper dishes (10) and two motors (11), and copper dish (10) is connected with motor (11), in 30 ° ~ 45 ° angles between two copper dishes (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510381282.9A CN104959610A (en) | 2015-06-30 | 2015-06-30 | Method and device for preparing Sn-Bi alloy wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510381282.9A CN104959610A (en) | 2015-06-30 | 2015-06-30 | Method and device for preparing Sn-Bi alloy wires |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104959610A true CN104959610A (en) | 2015-10-07 |
Family
ID=54213787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510381282.9A Pending CN104959610A (en) | 2015-06-30 | 2015-06-30 | Method and device for preparing Sn-Bi alloy wires |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104959610A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105643147A (en) * | 2016-03-07 | 2016-06-08 | 昆明理工大学 | Preparation method for Sn-58Bi welding wire |
| CN106392383A (en) * | 2016-11-16 | 2017-02-15 | 广东省焊接技术研究所（广东省中乌研究院） | Aluminum-based flux-cored wire and preparation method thereof |
| CN108655404A (en) * | 2018-05-07 | 2018-10-16 | 宿迁学院 | Metal continuous forming method and device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992278A (en) * | 2010-11-26 | 2011-03-30 | 昆明理工大学 | Spray deposition region fluid type controller matched with continuous extruder |
| CN102528336A (en) * | 2011-12-13 | 2012-07-04 | 浙江亚通焊材有限公司 | Method for preparing high-plasticity welding wire by use of brittle Sn-Bi alloy |
| CN203346464U (en) * | 2013-07-08 | 2013-12-18 | 昆明理工大学 | Spray deposition device matched with continuous extrusion machine |
| CN205020811U (en) * | 2015-06-30 | 2016-02-10 | 昆明理工大学 | Device of preparation sn -Bi alloy silk |
-
2015
- 2015-06-30 CN CN201510381282.9A patent/CN104959610A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992278A (en) * | 2010-11-26 | 2011-03-30 | 昆明理工大学 | Spray deposition region fluid type controller matched with continuous extruder |
| CN102528336A (en) * | 2011-12-13 | 2012-07-04 | 浙江亚通焊材有限公司 | Method for preparing high-plasticity welding wire by use of brittle Sn-Bi alloy |
| CN203346464U (en) * | 2013-07-08 | 2013-12-18 | 昆明理工大学 | Spray deposition device matched with continuous extrusion machine |
| CN205020811U (en) * | 2015-06-30 | 2016-02-10 | 昆明理工大学 | Device of preparation sn -Bi alloy silk |
Non-Patent Citations (2)
| Title |
|---|
| DIVYA BHARDWAJ等: "Characterization and fracture behavior of bismuth–tin thermal fuse alloy wires produced by the Ohno continuous casting process", 《MATERIALS CHARACTERIZATION》 * |
| 王宇锋等: "喷射沉积连续挤压２Ａ１２铝合金的微观组织形成模型", 《材料科学与工程学报》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105643147A (en) * | 2016-03-07 | 2016-06-08 | 昆明理工大学 | Preparation method for Sn-58Bi welding wire |
| CN106392383A (en) * | 2016-11-16 | 2017-02-15 | 广东省焊接技术研究所（广东省中乌研究院） | Aluminum-based flux-cored wire and preparation method thereof |
| CN106392383B (en) * | 2016-11-16 | 2018-07-27 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of aluminium base flux-cored wire and preparation method thereof |
| CN108655404A (en) * | 2018-05-07 | 2018-10-16 | 宿迁学院 | Metal continuous forming method and device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108526422B (en) | Production method of high-strength high-conductivity heat-resistant copper alloy | |
| CN102528336B (en) | Method for preparing high-plasticity welding wire by use of brittle Sn-Bi alloy | |
| CN101531149B (en) | Preparation method of overlength Cu-Cr-Zr alloyed contact line | |
| CN105643147A (en) | Preparation method for Sn-58Bi welding wire | |
| CN105039883B (en) | A kind of preparation method of Cu Cr Zr alloyed contact lines | |
| CN101447259B (en) | Manufacture methods of contact wire and rod blank | |
| CN103352136B (en) | Copper-base contact material and manufacture craft | |
| CN104959610A (en) | Method and device for preparing Sn-Bi alloy wires | |
| CN101707155B (en) | Method for preparing tin oxide reinforced silver-based electrical contact materials | |
| CN111069609A (en) | Welding wire preparation process suitable for spray forming ultrahigh-strength aluminum alloy plate fusion welding | |
| JP2022501198A (en) | Bearing body anti-friction layer copper alloy filling device and bearing body Bimetal composite material manufacturing method | |
| CN109848417B (en) | Low-melting-point metal wire for 3D printing and preparation method thereof | |
| CN101447260B (en) | Method for preparing contact wires and pole blanks | |
| CN205020811U (en) | Device of preparation sn -Bi alloy silk | |
| CN101418393A (en) | Novel method for preparing AgCuV alloy material | |
| CN102319966B (en) | Brazing filler metal for braze welding of titanium and titanium alloy, preparation method and braze welding method | |
| CN101628363B (en) | Zinc-magnesium based brazing alloy and preparation method thereof | |
| CN102553960B (en) | Preparation method for tin-bismuth series alloy temperature fuse material with high plasticity | |
| CN103170766A (en) | Preparation method of low-melting-point high-reliability lead-free solder | |
| CN109848409B (en) | Liquid metal wire for 3D printing and preparation method thereof | |
| CN109513747B (en) | Method for preparing tin-bismuth alloy preformed soldering lug difficult to deform | |
| CN104409136B (en) | A kind of preparation method of compound conductive bar | |
| CN102978429B (en) | Copper alloy for manufacturing frame | |
| CN102492869B (en) | Copper-zirconium-bismuth alloy and its preparation method | |
| CN202283752U (en) | Linear cutting steel wire of solar silicon chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151007 |