CN104953013A - Fluorescent glass fiber board - Google Patents
Fluorescent glass fiber board Download PDFInfo
- Publication number
- CN104953013A CN104953013A CN201510418661.0A CN201510418661A CN104953013A CN 104953013 A CN104953013 A CN 104953013A CN 201510418661 A CN201510418661 A CN 201510418661A CN 104953013 A CN104953013 A CN 104953013A
- Authority
- CN
- China
- Prior art keywords
- glass
- fiber
- fluorescent material
- fluorescence
- material layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003365 glass fiber Substances 0.000 title claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 40
- 239000004744 fabric Substances 0.000 claims abstract description 34
- 239000011521 glass Substances 0.000 claims description 32
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000000741 silica gel Substances 0.000 claims description 20
- 229910002027 silica gel Inorganic materials 0.000 claims description 20
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000009941 weaving Methods 0.000 abstract 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000012858 packaging process Methods 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 238000002834 transmittance Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Woven Fabrics (AREA)
Abstract
The invention discloses a fluorescent glass fiber board which comprises a fluorescent material layer formed after transparent silicone mixed with a fluorescent material is cured; a layer of glass fiber fabric is embedded in the fluorescent material layer, and formed by crossed weaving of a plurality of glass fibers or arranging of a plurality of glass fibers at intervals; the glass fiber fabric formed through crossed weaving has meshes with the set sizes. The layer of glass fiber fabric is embedded in the fluorescent material layer, so that the mechanical strength of the fluorescent material layer can be effectively improved to meet the requirements on supporting strength during wafer packaging in a light emitting device wafer packaging process; gaps are formed between the glass fibers to ensure favorable light transmittance performance; the fluorescent glass fiber board has better high-temperature resistance, and can improve the light emitting performance of light emitting devices such as an LED.
Description
Technical field
The present invention relates to a kind of material being applied to luminescent device, particularly relate to a kind of fluorescence glass-fiber-plate.
Background technology
In the wafer-class encapsulation process of luminescent device, in the wafer-class encapsulation process of such as LED chip, the mechanical strength of wafer has a significant impact each processing procedure, and die strength is not enough, can cause operation inconvenience even cannot the problem of operation.At present, in prior art, usually increase the mechanical strength of encapsulating structure by setting up the form such as light-transmitting support layer or transparent substrates, but this encapsulating structure can increase the package thickness of LED chip, cannot meet the growth requirement of small size luminescent device.Particularly need change LED chip go out light color time, usually need to arrange fluorescent material layer separately, can increase so again LED chip encapsulation after size.
Therefore, in order to adapt to the miniaturization needs of small size luminescent device, and its mechanical strength can be increased, in the urgent need to seeking a material having both mechanical strength and optical property being applied to luminescent device.
Summary of the invention
In order to solve the problems of the technologies described above, the present invention proposes a kind of fluorescence glass-fiber-plate, has high, the resistant to elevated temperatures advantage of mechanical performance, can meet the heat request occurred frequently of the chips such as LED, and can improve the luminescent properties of the luminescent devices such as LED.
Technical scheme of the present invention is achieved in that
A kind of fluorescence glass-fiber-plate, comprise the fluorescent material layer formed after being solidified by the transparent silica gel doped with fluorescent material, layer of glass cloth is embedded with in described fluorescent material layer, described glass fabric is formed by many glass fibre interlacings or is intervally arranged by many glass fibres and formed, and the glass fabric that interlacing is formed has the mesh of setting size.
As a further improvement on the present invention, the thickness range of described fluorescence glass-fiber-plate is 100 microns to 1 millimeter.
As a further improvement on the present invention, the diameter range of described glass fibre is that 10 nanometers are to 100 microns.
As a further improvement on the present invention, the contact interface place of described glass fibre and described fluorescent material layer is provided with binding agent.
As a further improvement on the present invention, the thickness of the fluorescent material layer of described glass fabric upper and lower sides is different.
As a further improvement on the present invention, arranged in parallel by many glass fibres each glass fibre in the glass fabric that formed that is intervally arranged.
As a further improvement on the present invention, in the glass fabric formed by many glass fibre interlacings, the glass fibre of broadwise and warp-wise is arranged in parallel separately, and the glass fibre square crossing of the glass fibre of warp-wise and broadwise arranges.
As a further improvement on the present invention, the spacing range in glass fabric between each parallel glass fiber is: 10 μm ~ 200 μm.
As a further improvement on the present invention, the refractive index of described transparent silica gel is scope 1.4 ~ 1.6.
As a further improvement on the present invention, the weight ratio of described fluorescent material in transparent silica gel is 2% ~ 40%.
The invention has the beneficial effects as follows: the invention provides a kind of mechanical performance high, resistant to elevated temperatures material, can meet the heat request occurred frequently of the chips such as LED, be applicable to optics, simultaneously this material dopedly has fluorescent material, can improve the luminescent properties of device.
Accompanying drawing explanation
Fig. 1 is the structural profile schematic diagram of one embodiment of the invention;
Fig. 2 is the rough schematic of the present invention one glass fibre;
Fig. 3 is the glass fabric schematic diagram of glass fibre interlacing of the present invention;
Fig. 4 is the structural profile schematic diagram of another embodiment.
Make the following instructions by reference to the accompanying drawings
1-fluorescent material layer 11-fluorescent material
12-transparent silica gel 2-glass fabric
21-glass fibre 22-mesh
5-photic zone
Embodiment
For enabling the present invention more understandable, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.For convenience of description, in the structure of embodiment accompanying drawing, each part does not press normal rates convergent-divergent, therefore does not represent the actual relative size of each structure in embodiment.Wherein said structure or face above or upside, comprise the middle situation also having other layers.
Embodiment 1
As shown in Figure 1, Figure 2, Figure 3 shows, a kind of fluorescence glass-fiber-plate, comprise and solidify the rear fluorescent material layer 1 formed by the transparent silica gel 12 doped with fluorescent material 11, layer of glass cloth 2 is embedded with in described fluorescent material layer, described glass fabric is formed by many glass fibres 21 interlacing or is intervally arranged by many glass fibres and formed, and the glass fabric that interlacing is formed has the mesh 22 of setting size.
In said structure, by being embedded layer of glass cloth in fluorescent material layer, effectively can increase the mechanical strength of fluorescent material layer, to meet in light-emitting device wafer level encapsulation procedure holding strength requirement during wafer package, between glass fibre, there is interval, good light transmission can be ensured, and this fluorescent material layer is solidify to form by transparent silica gel, be heated under the high temperature conditions can not be out of shape due to transparent silica gel, therefore, this fluorescence glass-fiber-plate has good resistance to elevated temperatures; Doped with fluorescent material in transparent silica gel, the luminescent properties of the luminescent devices such as LED can be improved.Therefore, the wafer-class encapsulation processing procedure of such as emitting device/LED chip can greatly be facilitated.
Preferably, the thickness range of described fluorescence glass-fiber-plate is 100 microns to 1 millimeter.Like this, the fluorescence glass-fiber-plate of this size range can better meet size and the requirement of mechanical strength of LED chip encapsulation, namely while guarantee mechanical strength, has good optical property.
Preferably, the diameter range of described glass fibre is that 10 nanometers are to 100 microns.The fluorescence glass-fiber-plate of this size range can better meet size and the requirement of mechanical strength of LED chip encapsulation, namely while guarantee mechanical strength, has good optical property.
Preferably, the contact interface place of described glass fibre and described fluorescent material layer is provided with binding agent.Like this, can increase adhesion between glass fibre and fluorescent material layer by arranging binding agent, what make to combine between glass fabric and fluorescent material layer is tightr.
Preferably, the thickness of the fluorescent material layer of described glass fabric upper and lower sides is different.Like this, the object reaching optical property or facilitate technique can be optimized.
Preferably, arranged in parallel by many glass fibres each glass fibre in the glass fabric that formed that is intervally arranged.As one preferred embodiment, can by arranged in parallel for each glass fibre of glass fabric.
Preferably, in the glass fabric formed by many glass fibre interlacings, the glass fibre of broadwise and warp-wise is arranged in parallel separately, and the glass fibre square crossing of the glass fibre of warp-wise and broadwise arranges.As another preferred embodiment, each glass fibre of the warp-wise of glass fabric and broadwise all can be designed to the form that square crossing is arranged, but be not limited thereto, the various ways such as skewed crossing can also be designed to as required.
Preferably, the spacing range in glass fabric between each parallel glass fiber is: 10 μm ~ 200 μm.Interval in the glass fabric of this spacing range between each glass fibre is suitable, can ensure good printing opacity, can meet the support strength in LED chip encapsulation procedure simultaneously.
Preferably, the refractive index of described transparent silica gel is scope 1.4 ~ 1.6.The transparent silica gel of this ranges of indices of refraction is used in luminescent device, light reflection occurs few, therefore improves transmissivity, can meet the printing opacity requirement of LED chip luminescence.
Preferably, the weight ratio of described fluorescent material in transparent silica gel is 2% ~ 40%.The fluorescent material of this weight ratio has the luminescent properties of good improvement device.
As a kind of preferred implementation, some are for the glass fabric of interlacing, the preparation method of fluorescence glass-fiber-plate of the present invention are described: first, carry out interlacing to glass fibre, form glass fabric, then, woven glass fabric is immersed in transparent silica gel, in this transparent silica gel, is mixed with fluorescent material in advance, finally, transparent silica gel 2 is solidified, forms a fluorescence glass-fiber-plate, shown in Figure 1.Preferably, during transparent silica gel solidification, can curing agent be added, accelerate curing rate or strengthen solidification effect.
In other embodiments, transparent silica gel can also be the printing opacity glue of other curing types in the present invention.
Embodiment 2
The present embodiment 2 comprises all technical characteristic of embodiment 1, its difference is: be also located at a photic zone, the intensity etc. of this photic zone printing opacity and increase fluorescence glass-fiber-plate, and photic zone material can be that inorganic material is as glass, or organic material is as transparent silica gel, as shown in Figure 4.
Above embodiment is with reference to accompanying drawing, to a preferred embodiment of the present invention will be described in detail.Those skilled in the art by carrying out amendment on various forms or change to above-described embodiment, but when not deviating from essence of the present invention, drops within protection scope of the present invention.
Claims (10)
1. a fluorescence glass-fiber-plate, it is characterized in that: comprise the fluorescent material layer (1) formed after being solidified by the transparent silica gel (12) doped with fluorescent material (11), layer of glass cloth (2) is embedded with in described fluorescent material layer, described glass fabric is formed by many glass fibres (21) interlacing or is intervally arranged by many glass fibres and formed, and the glass fabric that interlacing is formed has the mesh (22) of setting size.
2. fluorescence glass-fiber-plate according to claim 1, is characterized in that: the thickness range of described fluorescence glass-fiber-plate is 100 microns to 1 millimeter.
3. fluorescence glass-fiber-plate according to claim 1, is characterized in that: the diameter range of described glass fibre is that 10 nanometers are to 100 microns.
4. fluorescence glass-fiber-plate according to claim 1, is characterized in that: the contact interface place of described glass fibre and described fluorescent material layer is provided with binding agent.
5. fluorescence glass-fiber-plate according to claim 1, is characterized in that: the thickness of the fluorescent material layer of described glass fabric upper and lower sides is different.
6. fluorescence glass-fiber-plate according to claim 1, is characterized in that: arranged in parallel by many glass fibres each glass fibre in the glass fabric that formed that is intervally arranged.
7. fluorescence glass-fiber-plate according to claim 1, it is characterized in that: in the glass fabric formed by many glass fibre interlacings, the glass fibre of broadwise and warp-wise is arranged in parallel separately, and the glass fibre square crossing of the glass fibre of warp-wise and broadwise arranges.
8. the fluorescence glass-fiber-plate according to claim 6 or 7, is characterized in that: the spacing range in glass fabric between each parallel glass fiber is: 10 μm ~ 200 μm.
9. fluorescence glass-fiber-plate according to claim 1, is characterized in that: the refractive index of described transparent silica gel is scope 1.4 ~ 1.6.
10. fluorescence glass-fiber-plate according to claim 1, is characterized in that: the weight ratio of described fluorescent material in transparent silica gel is 2% ~ 40%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510418661.0A CN104953013A (en) | 2015-07-16 | 2015-07-16 | Fluorescent glass fiber board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510418661.0A CN104953013A (en) | 2015-07-16 | 2015-07-16 | Fluorescent glass fiber board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104953013A true CN104953013A (en) | 2015-09-30 |
Family
ID=54167538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510418661.0A Pending CN104953013A (en) | 2015-07-16 | 2015-07-16 | Fluorescent glass fiber board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104953013A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712931A (en) * | 2017-12-20 | 2020-09-25 | 亮锐有限责任公司 | Converter with glass layer |
| WO2021196359A1 (en) * | 2020-04-01 | 2021-10-07 | 澜起电子科技(昆山)有限公司 | Package substrate and manufacturing method therefor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005108922A (en) * | 2003-09-29 | 2005-04-21 | Okaya Electric Ind Co Ltd | Light emitting diode and manufacturing method thereof |
| JP2010003791A (en) * | 2008-06-19 | 2010-01-07 | Okaya Electric Ind Co Ltd | Light-emitting diode and manufacturing method thereof |
| JP2010003790A (en) * | 2008-06-19 | 2010-01-07 | Okaya Electric Ind Co Ltd | Light-emitting diode and manufacturing method thereof |
| CN101735796A (en) * | 2008-11-12 | 2010-06-16 | 颜永裕 | Fluorescent adhesive tape for converting blue light of LED into white light and manufacturing method thereof |
| CN103943760A (en) * | 2014-04-04 | 2014-07-23 | 厦门立达信光电有限公司 | Preparation method of remote phosphor device, remote phosphor device and LED lamp |
| CN204809252U (en) * | 2015-07-16 | 2015-11-25 | 华天科技（昆山）电子有限公司 | Fluorescence glass fiber plate |
-
2015
- 2015-07-16 CN CN201510418661.0A patent/CN104953013A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005108922A (en) * | 2003-09-29 | 2005-04-21 | Okaya Electric Ind Co Ltd | Light emitting diode and manufacturing method thereof |
| JP2010003791A (en) * | 2008-06-19 | 2010-01-07 | Okaya Electric Ind Co Ltd | Light-emitting diode and manufacturing method thereof |
| JP2010003790A (en) * | 2008-06-19 | 2010-01-07 | Okaya Electric Ind Co Ltd | Light-emitting diode and manufacturing method thereof |
| CN101735796A (en) * | 2008-11-12 | 2010-06-16 | 颜永裕 | Fluorescent adhesive tape for converting blue light of LED into white light and manufacturing method thereof |
| CN103943760A (en) * | 2014-04-04 | 2014-07-23 | 厦门立达信光电有限公司 | Preparation method of remote phosphor device, remote phosphor device and LED lamp |
| CN204809252U (en) * | 2015-07-16 | 2015-11-25 | 华天科技（昆山）电子有限公司 | Fluorescence glass fiber plate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712931A (en) * | 2017-12-20 | 2020-09-25 | 亮锐有限责任公司 | Converter with glass layer |
| US11637225B2 (en) | 2017-12-20 | 2023-04-25 | Lumileds Llc | Converter with glass layers |
| CN111712931B (en) * | 2017-12-20 | 2024-04-23 | 亮锐有限责任公司 | Converter with glass layer |
| US11973168B2 (en) | 2017-12-20 | 2024-04-30 | Lumileds Llc | Converter with glass layers |
| WO2021196359A1 (en) * | 2020-04-01 | 2021-10-07 | 澜起电子科技(昆山)有限公司 | Package substrate and manufacturing method therefor |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150930 |
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| RJ01 | Rejection of invention patent application after publication |