CN104953004A - 一种高可靠性lamp发光二极管封装技术 - Google Patents

一种高可靠性lamp发光二极管封装技术 Download PDF

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CN104953004A
CN104953004A CN201410120467.XA CN201410120467A CN104953004A CN 104953004 A CN104953004 A CN 104953004A CN 201410120467 A CN201410120467 A CN 201410120467A CN 104953004 A CN104953004 A CN 104953004A
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led
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严春伟
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Jiangsu Wenrun Optoelectronic Co Ltd
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Jiangsu Wenrun Optoelectronic Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/48997—Reinforcing structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/85951—Forming additional members, e.g. for reinforcing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明涉及一种高可靠性LAMP发光二极管封装技术。将LED芯片正常固晶焊线，对焊线后的线尾使用导电涂敷物涂敷覆盖，覆盖后对覆盖物烘烤固化，使得LED线尾支架和导电涂敷物牢固的结合在一起，烘烤后正常封胶、切脚、测试。完成低高可靠性LAMP发光二极管封装。使用此方法封装的LED极大的提升了LED线尾的强度，避免了LED使用过程中线尾断裂、脱落造成的LED失效不良，提升LED的可靠性。

Description

一种高可靠性LAMP发光二极管封装技术
技术领域  本发明涉及一种高可靠性LAMP发光二极管封装技术 
背景技术  LAMP发光二极管是一种较为传统的发光二极管封装形式，使用领域众多，到目前为止使用量仍非常巨大。LAMP封装采用金线键合焊接的工艺，用金线将LED芯片与支架键合连接，形成回路。 
传统键合焊接工艺，将连接芯片和支架的金线按照结构划分为A，B，C，D，E，5个点(如附图1)。其中D，E两个点是焊线中最为脆弱的两个点，终端客户在焊接使用过程中，LED受热内部膨胀后拉扯内部金线结构，易造成D点断裂或者E点与支架脱落，从而引起LED失效。传统键合焊接中为了降低D、E点断裂／脱落等现象，采用了BSOB和BBOS等焊接方式。BSOB，先在支架上打一金球，再将E点线尾打在金球上，以提高E点与支架的粘着力，但是金线D点仍暴露在外部，仍易受应力断裂；BBOS，先将金线线尾打在支架上，再在线尾上方打一金球压住线尾，起到保护D点、及E点的作用，然而由于打金球工艺的局限性，金球较难将D点及E点完全覆盖，并且在打金球时焊线瓷嘴会对线尾的D点产生一定的压迫损伤，降低D点的连接强度。 
发明内容  为了克服传统LAMP发光二极管，金线D、E点在焊接过程中容易断裂、脱落造成LED失效等问题，提出了一种高可靠性LAMP发光二极管封装技术： 
一种LED封装结构，其中包含LED支架，至少一个LED芯片，至少一条金线，和一个线尾涂敷层。采用LED支架正常固晶焊线，对焊线后的半成品使用导电涂敷物将LED线尾涂敷覆盖，涂敷后进行烘烤使得涂敷物固化将LED线尾与支架紧密的结合在一起，烘烤后正常封胶、切脚、测试。完成低高可靠性LAMP发光二极管封装。 
具体操作方法如附图1，将LED晶片③通过固晶机固定到LED支架①上，固晶后正常烘烤，烘烤条件150℃2HRS，烘烤后通过焊线机将金线键合到芯片和支架上，导通芯片和支架间的连接；对焊线后的半成品使用导电涂敷物⑨将LED线尾的D点⑦和E点⑧涂敷覆盖，覆盖后对覆盖物烘烤固化，使得LED线尾支架和导电涂敷物牢固的结合在一起，烘烤后正常封胶、切脚、测试。完成低高可靠性LAMP发光二极管封装。 
高可靠性LAMP发光二极管封装技术的优点： 
1、使用覆盖物将LED金线线尾较脆弱的D点、E点完全覆盖固化，较少金线线尾在LED使用过程中热应力对D、E点的拉扯，提升LED内部结构的强度 
2、覆盖物采用导电材料(银浆、铜浆等)，即使LED在使用过程中，应力过大造成线尾D、E点断裂、脱落，覆盖物仍可将金线与支架导通，确保LED正常工作。 
具体实施方式  如图1所示，将LED晶片③通过固晶机固定到LED支架①上，固晶后正常烘烤，烘烤条件150℃2HRS，烘烤后通过焊线机将金线键合到芯片和支架上，导通芯片和支架间的连接；对焊线后的半成品使用导电涂敷物⑨将LED线尾的D点⑦和E点⑧涂敷覆盖，覆盖后对覆盖物烘烤固化，烘烤条件150℃2HRS，使得LED线尾支架和导电涂敷物牢固的结合在一起，烘烤后正常封胶、切脚、测试。完成低高可靠性LAMP发光二极管封装。 
附图说明
图1是正常焊线后使用导电物将线尾涂敷覆盖示意图 
图2是传统常规焊线方式示意图 
图3是BSOB焊线方式示意图 
图4是BBOS焊线方式示意图 
对图中的标注加以说明： 
①①％2  LED支架 
②②％2  银胶 
③③％2  LED芯片 
④④％2  LED金线A点 
⑤⑤％2  LED金线B点 
⑥⑥％2  LED金线C点 
⑦⑦％2  LED金线D点 
⑧⑧％2  LED金线E点 
⑨⑨％2  线尾导电覆盖物 
⑩⑩％2  线尾底部金球 
％2  线尾顶部金 。

Claims (3)

1.一种LED封装结构，其中包含LED支架，至少一个LED芯片，至少一条金线，和一个线尾涂敷层。采用LED支架正常固晶焊线，对焊线后的半成品使用导电涂敷物将LED线尾涂敷覆盖，涂敷后进行烘烤使得涂敷物固化将LED线尾与支架紧密的结合在一起，烘烤后正常封胶、切脚、测试。完成低高可靠性LAMP发光二极管封装。 
2.如权利要求书1所述的LED封装结构，其特征在于：涂敷物需将LED线尾D点、E点完全覆盖。 
3.如权利要求书1所述的LED封装结构，其特征在于：涂敷物为导电涂敷物，可以为银粉、铜粉等导电金属与树脂的混合物。 
CN201410120467.XA 2014-03-27 2014-03-27 一种高可靠性lamp发光二极管封装技术 Pending CN104953004A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113540330A (zh) * 2021-07-12 2021-10-22 格力电器（合肥）有限公司 一种发光二极管

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1355571A (zh) * 2000-11-23 2002-06-26 诠兴开发科技股份有限公司 发光二极管的封装方法
CN102130280A (zh) * 2010-12-31 2011-07-20 浙江名芯半导体科技有限公司 一种led封装焊点结构及工艺
CN203179954U (zh) * 2013-02-06 2013-09-04 华宏光电子(深圳)有限公司 一种led焊线封装结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1355571A (zh) * 2000-11-23 2002-06-26 诠兴开发科技股份有限公司 发光二极管的封装方法
CN102130280A (zh) * 2010-12-31 2011-07-20 浙江名芯半导体科技有限公司 一种led封装焊点结构及工艺
CN203179954U (zh) * 2013-02-06 2013-09-04 华宏光电子(深圳)有限公司 一种led焊线封装结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113540330A (zh) * 2021-07-12 2021-10-22 格力电器（合肥）有限公司 一种发光二极管

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Application publication date: 20150930