CN104951017A - Modularized data center - Google Patents
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- CN104951017A CN104951017A CN201510296634.0A CN201510296634A CN104951017A CN 104951017 A CN104951017 A CN 104951017A CN 201510296634 A CN201510296634 A CN 201510296634A CN 104951017 A CN104951017 A CN 104951017A
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Abstract
The invention provides a modularized data center. The modularized data center comprises a lower box body and heat release devices, wherein cabinets and heat absorption devices are arranged in the lower box body, and the heat release devices are arranged outside the lower box body and connected with the heat absorption devices. Each cabinet comprises a cold air inlet and a hot air outlet. Each heat absorption device comprises a hot air inlet and a cold air outlet. The cabinets and the heat absorption devices are arranged side by side. The air entering and leaving direction of the cabinets is parallel to that of the heat absorption devices. The air flow flowing direction of the cabinets is opposite to that of the heat absorption devices. Thus, annular circulating air flow which sequentially passes through the hot air outlets of the cabinets, the hot air inlets of the heat absorption devices, the cold air outlets of the heat absorption devices and the cold air inlets of the cabinets is formed. The cabinets and the heat absorption devices are integrated in the lower box body, the space utilization rate and integrity are high, the modularized data center is suitable for being manufactured in an industrial mode, air flow in the lower box body is smooth, and the heat exchange efficiency is high.
Description
Technical field
The present invention relates to a kind of modular data center.
Background technology
At present, along with the density of equipment in machine room and power constantly rise, traditional civil engineering data center module can not be expanded, and causes client to build, the cost at service data center constantly increases.In order to the efficiency that solves data center and the problem of disposing as required, modular data center arises at the historic moment.
In recent years, data center is towards large, super-high density direction and modularization future development.Wherein, one of large-scale data center modularization main Types is container modular data center, in packing into the container by server cabinet (hereinafter referred to as rack), air-conditioning equipment, battery distribution, lighting equipment etc., this container adopts TEU (Twenty-foot Equivalent Unit) usually.
Existing modular data center generally includes two vertical stackings container together, one of them container is equipment box, built-in row's equipment rack, another container is heat pipe exchanger case, heat pipe heat transfer case is divided into two parts, one is condensation end, it two is evaporation ends, the joint face of equipment box and heat pipe exchanger case has air inlet/outlet and blower fan is housed, the evaporator tube wing of the hot blast that equipment is discharged and heat pipe evaporation ends carries out heat exchange, become the air inlet that cold wind gets back to equipment, condenser end and outdoor air are cooled by sidewall ventilating opening and blower fan.But this kind of one of them container of embodiment is equipment box, another container is the set-up mode of heat pipe heat transfer case, and Existential Space utilization factor is low, the problem that integrated level is not high, and the prior art is site operation, there is project installation complexity, safeguard the defect of inconvenience.
In order to overcome above-mentioned defect, prior art such as Chinese patent CN102662434A discloses a kind of modular data center, comprise housing 10, heat pipe evaporator module 22, heat pipe condenser module 21 and frame 30, housing 10 comprises and is divided into bottom compartment inner region and upper chambers outskirt by seal diaphragm, upper chambers outskirt is provided with heat pipe condenser module 21, upper chambers outskirt is provided with air inlet and air outlet, heat pipe condenser module 21 is carried out exchange heat through air inlet and air outlet and outside air and is realized natural air cooled, bottom compartment inner region is provided with frame 30 and heat pipe evaporator module 22, heat pipe evaporator module 22 is arranged on the back side of frame, heat pipe evaporator module 22 is connected with heat pipe condenser module 21, arrange according to face-to-face mode between first group of frame 31 and second group of frame 32, second group of frame 32 and the 3rd group of frame 33 are arranged according to back-to-back mode.The prior art is by being integrated in condensation end, evaporation ends and equipment rack in a container, and space availability ratio is high, and the prior art is that factory manufactures, and substantially reduces the workload of site operation.
But, still there is following problem in actual use in the prior art: 1. in the prior art, although adopted by heat pipe evaporator module installation face-to-face and back-to-back array mode to arrange the distance shortening bottom compartment inner region inner air flow between the frame back side and frame, but the air inlet/outlet direction of the air inlet/outlet direction of frame and heat pipe evaporator is formed in axially same, this just causes the air of bottom compartment inner region only to circulate at this axial direction, air circulation is poor, reduce the heat exchange efficiency of container, and two frames of back-to-back setting, the air-out direction of the heat pipe evaporator that its back side is arranged is arranged in opposite directions, this causes the air-out of two heat pipe evaporators to hinder each other, reduce further the air circulation of bottom compartment inner region, 2. the prior art is by being integrated in condensation end, evaporation ends and equipment rack in a container, improves space availability ratio, but becomes large due to the overall volume of integral type, increases the transport difficulty of container.
Therefore, how to provide that a kind of integrated level is high, convenient transportation and the high modular data center of heat exchange efficiency be prior art urgent need to solve the problem.
Summary of the invention
Therefore, technical matters to be solved by this invention is that the modular data center module container space of prior art utilizes that rate variance, integrated level are low, site operation is complicated and the technical matters that air circulation is poor, heat transfer effect is bad, thus provide that a kind of space availability ratio is high, integrated level is high, the modular data center of batch production manufacture and good effect of heat exchange.
Modular data center provided by the invention comprises:
Lower box, rack and heat sink is provided with in described lower box, described rack has cold wind import and hot-blast outlet, described heat sink has hot wind inlet and cold wind outlet, described rack is arranged side by side with described heat sink and the air inlet/outlet direction of described rack and air flow direction parallel with the air inlet/outlet direction of described heat sink is contrary, thus the cold wind formed successively through the hot wind inlet of the hot-blast outlet of described rack, described heat sink, described heat sink exports, the annular circulating current of the cold wind import of described rack;
At least one heat-releasing device, be located at outside described lower box, described heat-releasing device connects described heat sink.
Preferably, be provided with rack described in several in described lower box and heat sink described at least one, several racks described and described heat sink are arranged side by side along described lower box length direction, and described heat sink is embedded between several racks described.
Preferably, cold air duct and the hot-air channel along described lower box Width laying respectively at both sides before and after several racks described and heat sink described at least one is provided with in described lower box.
The described lower box of preferred another kind, rack described in several is provided with and heat sink described at least one in described lower box, several racks described and described heat sink are arranged side by side along described lower box Width, and described heat sink is embedded between several racks described.
Preferably, cold air duct and the hot-air channel along described lower box length direction laying respectively at several racks described and the heat sink left and right sides described at least one is provided with in described lower box.
The described lower box of preferred another kind, rack described in several is provided with and heat sink described at least one in described lower box, several racks described and heat sink described at least one are located at the medium position along the described lower box in described lower box short transverse by bracing frame, are also provided with cold air duct and the hot-air channel of rack and the upper and lower both sides of described heat sink described in several described in laying respectively in described lower box.
Preferably, described modular data center also comprises is located at above described lower box, for placing the upper box of described heat-releasing device; Heat-releasing device described in each configures a described upper box or whole described heat-releasing device is integrated in a described upper box.
Preferably, described lower box altitude range is between 1.8-2.0m.
Preferably, described lower box height is 1.85m.
Preferably, described heat sink comprises evaporator and circulating fan.
Preferably, described heat-releasing device comprises the compressor, condenser, reservoir and the expansion valve that connect successively, the refrigerant inlet of described compressor is connected with the refrigerant outlet of described heat sink, and the refrigerant outlet of described expansion valve is connected with the refrigerant inlet of described heat sink.
Preferably, described heat-releasing device also comprises the non-return valve being parallel to described compressor and the by-pass valve being parallel to described expansion valve.
Preferably, described heat-releasing device also comprises the water atomization plant for cooling described condenser.
Preferably, the whole height of described upper box and described lower box is no more than 3m.
Preferably, described heat-releasing device and described heat sink one_to_one corresponding are arranged.
Modular data center provided by the invention, comprise lower box and at least one heat-releasing device that inside is provided with rack and heat sink, by described rack to be arranged side by side with described heat sink and the air inlet/outlet direction of rack is parallel with the air inlet/outlet direction of heat sink and air flow direction is contrary in lower box, thus formed successively through the hot-blast outlet of rack, the hot wind inlet of heat sink, the cold wind outlet of heat sink, the annular circulating current of the cold wind import of rack, compared to the mode that the air inlet/outlet direction of rack in prior art and the air inlet/outlet direction of heat sink are arranged along the same axis, the annular circulating current formed in lower box of the present invention, circulation is better, make heat interchange efficiency in lower box higher, in addition, by being integrated in lower box by rack and heat sink, integrated level is high, achieves the batch production manufacture of modular data center, greatly reduces the workload of site operation.
Modular data center provided by the invention, its lower box also comprises the cold air duct and hot-air channel that are positioned at several racks and at least one heat sink both sides, by the setting of cold air duct and hot-air channel, further increase the circulation of annular circulating current in lower box, and cold air duct and hot-air channel can also be used for installing some servicing units, such as lighting equipment, fire control equipment etc., in addition cold air duct and hot-air channel can also be used for cabling, therefore, this kind is arranged down, whole module cage intracorporeal space is abundant, easy to operate, air-flow is unobstructed.
Modular data center provided by the invention, by described lower box height is arranged between 1.8-2.0m, on the one hand installation and maintenance personnel are easily passed in and out, after on the other hand installing heat-releasing device in modular tank of the present invention, overall height can not be above standard container height, facilitate the integrality batch production manufacture of data center on the one hand, be convenient to road transport on the other hand.
Modular data center provided by the invention, also comprise the upper box for placing heat-releasing device, heat-releasing device is located in upper box and completes in factory equally, during site operation, only need upper box be positioned over above lower box, the in-site installation of modular data center can be completed, in addition, heat-releasing device is located in upper box and is also convenient to transport; Upper box and lower box independently manufacture, but whole Transporting.In addition, the upper box of heat-releasing device is installed, also can be complete integrated in factory with the lower box being provided with rack and heat-releasing device, and make its whole height not higher than the height of TEU (Twenty-foot Equivalent Unit), this facilitates the road transport of whole module, realizes the completes batch production manufacture of modular data center.
Accompanying drawing explanation
In order to be illustrated more clearly in the specific embodiment of the invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of the modular data center that Fig. 1 provides for the embodiment of the present invention;
Fig. 2 is the side view of Fig. 1;
The cut-away view of the lower box of the modular data center that Fig. 3 provides for the embodiment of the present invention;
Fig. 4 is the side view of Fig. 3;
The fundamental diagram of heat sink and rack in the lower box of the modular data center that Fig. 5 provides for the embodiment of the present invention;
The structural drawing of the heat sink of the modular data center that Fig. 6 provides for the embodiment of the present invention;
The heat-releasing device schematic diagram of the modular data center that Fig. 7 provides for the embodiment of the present invention;
The fundamental diagram of the refrigeration system of heat sink and heat-releasing device composition in the modular data center that Fig. 8 provides for the embodiment of the present invention.
Reference numeral:
1-lower box, 101-rack, the import of 101a-cold wind, 101b-hot-blast outlet, 102-heat sink, 102a-hot wind inlet, 102b-cold wind exports, 1021-evaporator, 1022-circulating fan, 103-cold air duct, 104-hot-air channel;
2-upper box, 20-heat-releasing device, 201-compressor, 202-condenser, 203-condensation fan, 204-reservoir, 205-expansion valve, 206-non-return valve, 207-by-pass valve, 208-water atomization plant, 2081-atomizer, 2082-water pipe, 209-refrigeration control case;
A-length direction, B-Width, C-short transverse.
Embodiment
Be clearly and completely described technical scheme of the present invention below in conjunction with accompanying drawing, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
In describing the invention, it should be noted that, orientation or the position relationship of the instruction such as term " " center ", " on ", D score, "left", "right", " vertically ", " level ", " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be only the present invention for convenience of description and simplified characterization; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.In addition, term " first ", " second ", " the 3rd " only for describing object, and can not be interpreted as instruction or hint relative importance.Wherein, term " primary importance " and " second place " are two different positions.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, concrete condition above-mentioned term concrete meaning in the present invention can be understood.
The structural representation of the modular data center that Fig. 1 provides for the embodiment of the present invention; Fig. 2 is the side view of Fig. 1; The cut-away view of the lower box of the modular data center that Fig. 3 provides for the embodiment of the present invention; Fig. 4 is the side view of Fig. 3; The fundamental diagram of heat sink and rack in the lower box of the modular data center that Fig. 5 provides for the embodiment of the present invention.As shown in Figure 1 to Figure 3, modular data center provided by the invention comprises the lower box 1 that inside is provided with rack 101 and heat sink 102, and is located at least one heat-releasing device 20 outside described lower box 1.The magnitude setting of described heat-releasing device 20 is consistent with heat sink 102 quantity in described lower box 1, in actual use, configures the quantity of heat sink 102 and heat-releasing device 20 according to the actual requirements.
As shown in Figure 4 and Figure 5, described rack 101 has cold wind import 101a and hot-blast outlet 101b, described heat sink has hot wind inlet 102a and cold wind outlet 102b, in the present embodiment, in order to improve heat interchange and airflow efficiency in described lower box 1, described rack 101 is arranged side by side with described heat sink 102 and the air inlet/outlet direction of described rack 101 is parallel with the air inlet/outlet direction of described heat sink 102 and air flow direction is contrary, thus formed successively through the hot-blast outlet 101b of described heat sink 102, the hot wind inlet 102a of described rack 101, the cold wind outlet 102b of described rack 101, the annular circulating current of the cold wind import 101a of described heat sink 102.
During work, described heat sink 102 is entered from the hot wind inlet 102a of described heat sink 102 from the hot-blast outlet 101b hot-air out of described rack 101, described in described heat sink 102, hot-air is cooled, 102b is exported out from the cold wind of described heat sink 102 through cooled air, and by the cold wind import 101a that the cold wind import 101a of described rack 101 enters described rack 101, circulate and so forth.
By above-mentioned setting, the air circulation in the lower box 1 of modular data center modular tank is better, and namely resistance is little, low in energy consumption, improves the efficiency of heat interchange.
It should be noted that, rack described in the present invention is the general name of rack or rack row and electronic equipment.Described rack can be a rack monomer, and can be the rack row of multiple rack monomer composition, concrete facilities, determines according to the actual requirements.
Further, the present embodiment lower box 1 comprises rack 101 described in several and heat sink 102 described at least one, several racks 101 described and described heat sink 102 are arranged side by side along the length direction A of described lower box 1, and described heat sink 102 is embedded between several racks 101 described.
As shown in Figure 3 and Figure 5, described modular tank comprises 6 racks 101 and 3 heat sinks, wherein, along on the length direction A of described lower box 1,2 described racks 101 lay respectively at the two ends of lower box 1, the rack 101 of two groups of combination of two is arranged at intervals between two ends rack 101, is located to be respectively equipped with between the spaced combination of two rack 101 of a heat sink 102, two between the rack 101 at both ends and the rack 101 of combination of two to arrange a heat sink.The flow direction of direction of arrow instruction air-flow in Fig. 3.
In addition, as shown in Figure 5, the cold air duct 103 along the both sides, the front and back Width B of described lower box 1 laying respectively at several racks 101 described and at least one heat sink 102 and hot-air channel 104 is also provided with in described lower box 1.By the setting of cold air duct and hot-air channel, further increase the circulation of annular circulating current in lower box, and cold air duct and hot-air channel can also be used for installing some servicing units, such as lighting equipment, fire control equipment etc., in addition cold air duct and hot-air channel can also be used for cabling, therefore, this kind is arranged down, and whole nowel intracorporeal space is abundant, easy to operate, air-flow is unobstructed.
As a kind of alternative way of the present embodiment lower box, described lower box can also be set to: described lower box comprises rack 101 described in several and heat sink 102 described at least one, several racks 101 described and described heat sink 102 are arranged side by side along the Width B of described lower box 1, and described heat sink is embedded between several racks 101 described.
In addition, as the lower box of the present embodiment alternative form, in described lower box 1, be also provided with cold air duct 103 and the hot-air channel 104 along described lower box 1 length direction A laying respectively at several racks 101 described and heat sink 102 left and right sides described at least one.
As the another kind of alternative way of the present embodiment lower box, described lower box can also be set to: be provided with rack 1 described in several and heat sink 102 described at least one in described lower box 1, several racks 101 described and heat sink 102 described at least one are set up in the centre position along the described lower box 1 on described lower box 1 short transverse C by bracing frame, are also provided with cold air duct 103 and the hot-air channel 104 of rack 1 and described heat sink about 102 both sides described in several described in laying respectively in described lower box 1.
It should be noted that, lower box of the present invention is not limited to above-mentioned three kinds of forms, and every casing form that can realize the object of the invention all should be included within protection scope of the present invention.
In addition, conveniently transport, and improve " batch production " of modular data center, the modular data center of the present embodiment is for placing described heat-releasing device 20 and independent of the upper box 2 of lower box 1.Described upper box 2 can be positioned over the top of described lower box 1, but is not limited to top, according to actual installation site requirements, can also be positioned over the side of described lower box 1, as long as can realize the heat exchange of heat sink 102 and described heat-releasing device 20.
Heat-releasing device 20 described in several can be integrated in a described upper box 2, also the corresponding described upper box 2 of a heat-releasing device 20 can be configured to, no matter be integrated in a described upper box 2, or one_to_one corresponding arranges multiple described upper box 2, all can complete manufacture in factory, just according to different client's needs, carry out difference and arrange.
In addition, as shown in Figure 2, described lower box 1 is between 1.8-2.0m along the altitude range of short transverse C.Preferably, described lower box 1 is 1.85m along the height of short transverse C.Arranged by this kind, on the one hand the installation and maintenance personnel of height below 1.85 meters are easily passed in and out, handled easily, is positioned on the other hand overall height after on described lower box 1 and can not be above standard container height, be convenient to road transport by heat-releasing device popular at present.
Therefore, described upper box 2 also requires to be configured to, when above described upper box 2 is positioned over described lower box 1, the overall height of described upper box 2 and described lower box 1 can not higher than TEU (Twenty-foot Equivalent Unit) height, at present, TEU (Twenty-foot Equivalent Unit) height is 3m to the maximum, and namely the overall height of described upper box 2 and described lower box 1 can not more than 3m.
Further, as shown in Figures 3 to 5, described heat sink 102 comprises evaporator 1021 and circulating fan 1022.During work, described heat sink 102 is entered from the hot wind inlet 102a of described heat sink 102 from the hot-blast outlet 101b hot-air out of described rack 101, described in described heat sink 102, hot-air is cooled by evaporator 1021, the cold wind outlet 102b that blower fan 1022 blows out described heat sink 102 is recycled through cooled air, and enter described rack 101 by the cold wind import 101a of described rack 101, then from the hot-blast outlet 101b of described rack 101 out, again enter described heat sink, circulate and so forth.
Further particularly, as shown in Figure 6, in the present embodiment, described evaporator 1021 is parallel-flow micro-channel heat exchanger, or is copper pipe aluminum fin formula heat exchanger.The evaporator 1021 of the present embodiment is not limited to these two kinds, and every equipment that can realize heat exchange effect all should be included within scope.
In the present embodiment, described circulating fan 1022 is axial flow blower or centrifugal blower.It should be noted that equally, the circulating fan 1022 of the present embodiment is not limited to these two kinds, everyly can realize drying or equipment that strengthening air ringing is played in air draught all should be included within protection scope of the present invention.In addition, when the air circulation ability of the blower fan being installed on the electronic equipment within rack 101 itself is enough strong, or when making its air resistance enough low by the area increasing evaporator 1021, also circulating fan 1022. can not be installed
The heat-releasing device schematic diagram of the modular data center that Fig. 7 provides for the embodiment of the present invention; The fundamental diagram of the refrigeration system of heat sink and heat-releasing device composition in the modular data center that Fig. 8 provides for the embodiment of the present invention.As shown in Figure 7 and Figure 8, described heat-releasing device 20 comprises the compressor 201, condenser 202, condensation fan 203, reservoir 204 and the expansion valve 205 that connect successively, and the parts such as refrigeration control case 209.Wherein, described condenser 202 is preferably copper pipe aluminum fin, can also be parallel-flow micro channel heat exchanger or other type condenser.Described expansion valve 205 is preferably electric expansion valve, can also be heating power expansion valve.Described condensation fan 203 can be axial flow blower or centrifugal blower.The refrigerant inlet of described compressor 201 is connected with the refrigerant outlet of described heat sink 102, and the refrigerant outlet of described expansion valve 205 is connected with the refrigerant inlet of described heat sink 102.
Again further, described heat-releasing device 20 also comprises the non-return valve 206 being parallel to described compressor 201 and the by-pass valve 207 being parallel to described expansion valve 205.
By above setting, during modular data center work, the temperature of its hot-air channel 104 is higher than hot-air channel 104 temperature of prior art, thus making when compressor cooling, the EAT of the EAT air-conditioning system more general than other of evaporator is high a lot, and therefore the efficiency of compressor refrigeration system significantly promotes, in addition, distance between heat sink and heat-releasing device is shortened, and the drag losses of pipe system reduces greatly, and therefore the efficiency of refrigeration system is further enhanced.
According to Fig. 8, the work of the modular data center of the present embodiment and control principle to be described below.
When outdoor temperature is higher, run conventional compression-type refrigerating system: compressor 201 starts, the non-return valve 206 being parallel to compressor 201 cuts out, the by-pass valve 207 of expansion valve 205 cuts out, cold-producing medium from compressor 201 out after, enter condenser 202 condensation (release heat in outdoor air), reservoir 204, expansion valve 205 is out flowed through afterwards from condenser 202, enter evaporator 1021, after evaporator 1021, return compressor 201, form compression-type refrigeration circulation.Wherein, condensation fan 203 starts automatically when high pressure is higher, automatically closes again when high pressure is on the low side, or regulates its rotating speed, and the high pressure of refrigeration system is maintained in suitable scope.
When outdoor temperature is lower than data center's inside hot blast path 10 4 air temperature, open non-return valve 206 and by-pass valve 207, close compressor 201, now form cold-producing medium Cooling System: cold-producing medium condensation within the condenser (releasing heat in outdoor air), because Action of Gravity Field flows in reservoir 204 naturally, and flow through from by-pass valve 207, enter evaporator 1021; Cold-producing medium absorbs heat and is evaporated to refrigerant gas in evaporator 1021, flows out from a high position for evaporator, then passes back into condenser condensation again by non-return valve 206.Because the temperature of the hot-air channel 104 of data center module is generally more than 35 degree, therefore the annual most of the time all possesses the condition of cold-producing medium natural circulation cooling, and therefore, refrigeration system of the present invention has good energy-saving potential.When outside air temperature lower than the air themperature of hot blast path 10 4 be not a lot of time, the refrigerating capacity of described cold-producing medium Cooling System may not meet the thermal load demands in lower box 1, now control system 209 can close described Cooling System, and starts compression-type refrigerating system (referring to the refrigeration system be made up of compressor 201, condenser 202 and reservoir 204, expansion valve 205, evaporator 1021 etc.).Control system 209 is according to the capabilities might of indoor and outdoor temperature, lower box 1 internal heat load, compression-type refrigerating system and cold-producing medium Cooling System, and automatic synchronization runs compression-type refrigerating system or cold-producing medium Cooling System.
Further, as shown in Figure 7 and Figure 8, be also provided with in described upper box 2 for strengthening the water atomization plant 208 cooling described condenser 202.Described water atomization plant 208 comprises water pipe 2082 and several nozzles 2081.By the setting of water atomization plant 208, reduce the EAT of condenser 202, thus when the compressor is operated, reduce the consumed power of compressor; When compressor does not work, the efficiency of Cooling System can be promoted.
It should be noted that, modular data center module of the present invention is not just limited to container modular data center, in fact, if whole box sizes is done little, only putting one to two electronic equipment cabinets at box house is feasible equally, which forms: the miniaturization data center rack of high energy efficiency.This small-sized cabinet integrated refrigerating system, user only need load the relevant apparatus such as server, battery, uninterrupted power source.This kind of miniaturization data center is applicable to enterprise, public institution etc. on a small scale.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (15)
1. a modular data center, is characterized in that, comprising:
Lower box (1), rack (101) and heat sink (102) is provided with in described lower box (1), described rack (101) has cold wind import (101a) and hot-blast outlet (101b), described heat sink has hot wind inlet (102a) and cold wind outlet (102b), described rack (101) is arranged side by side with described heat sink (102) and the air inlet/outlet direction of described rack (101) is parallel with the air inlet/outlet direction of described heat sink (102) and air flow direction is contrary, thus formed successively through the hot-blast outlet (101b) of described rack (101), the hot wind inlet (102a) of described heat sink (102), cold wind outlet (102b) of described heat sink (102), the annular circulating current of the cold wind import (101a) of described rack (101),
At least one heat-releasing device (20), is located at described lower box (1) outward, and described heat-releasing device (20) connects described heat sink (102).
2. modular data center according to claim 1, it is characterized in that, rack described in several (101) is provided with and heat sink (102) described at least one in described lower box (1), described several racks (101) and described heat sink (102) are arranged side by side along described lower box (1) length direction (A), and described heat sink (102) is embedded between described several racks (101).
3. modular data center according to claim 2, it is characterized in that, in described lower box (1), being provided with cold air duct (103) and the hot-air channel (104) along described lower box (1) Width (B) laying respectively at both sides before and after described several racks (101) and heat sink described at least one (102).
4. modular data center according to claim 1, it is characterized in that, rack described in several (101) is provided with and heat sink (102) described at least one in described lower box (1), described several racks (101) and described heat sink (102) are arranged side by side along described lower box (1) Width (B), and described heat sink is embedded between described several racks (101).
5. modular data center according to claim 4, it is characterized in that, in described lower box (1), being provided with cold air duct (103) and the hot-air channel (104) along described lower box (1) length direction (A) laying respectively at described several racks (101) and heat sink described at least one (102) left and right sides.
6. modular data center according to claim 1, it is characterized in that, rack described in several (101) is provided with and heat sink (102) described at least one in described lower box (1), described several racks (101) and heat sink described at least one (102) are located at the medium position along the described lower box (1) in described lower box (1) short transverse (C) by bracing frame, cold air duct (103) and the hot-air channel (104) of rack (101) described in several described in laying respectively at and the upper and lower both sides of described heat sink (102) is also provided with in described lower box (1).
7. the modular data center according to any one of claim 1-6, is characterized in that, also comprises and is located at described lower box (1) top, for placing the upper box (2) of described heat-releasing device (20); Heat-releasing device described in each (20) configuration described upper box (2) or whole described heat-releasing device (20) are integrated in a described upper box (2).
8. the modular data center according to any one of claim 1-7, is characterized in that, described lower box (1) altitude range is between 1.8-2.0m.
9. modular data center according to claim 8, is characterized in that, described lower box (1) is highly 1.85m.
10. the modular data center according to any one of claim 1-9, is characterized in that, described heat sink (102) comprises evaporator (1021) and circulating fan (1022).
11. modular data centers according to any one of claim 1-10, it is characterized in that, described heat-releasing device (20) comprises the compressor (201), condenser (202), reservoir (204) and the expansion valve (205) that connect successively, the refrigerant inlet of described compressor (201) is connected with the refrigerant outlet of described heat sink (102), and the refrigerant outlet of described expansion valve (205) is connected with the refrigerant inlet of described heat sink (102).
12. modular data centers according to claim 11, it is characterized in that, described heat-releasing device (20) also comprises the non-return valve (206) being parallel to described compressor (201) and the by-pass valve (207) being parallel to described expansion valve (205).
13. modular data centers according to claim 12, is characterized in that, described heat-releasing device (20) also comprises the water atomization plant (208) for cooling described condenser (202).
14. modular data centers according to any one of claim 1-13, is characterized in that, described upper box (2) is no more than 3m with the whole height of described lower box (1).
15. modular data centers according to claim 14, is characterized in that, described heat-releasing device (20) and described heat sink (102) one_to_one corresponding are arranged.
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