CN104950581A - Stoving device and photoresist layer hardening method - Google Patents
Stoving device and photoresist layer hardening method Download PDFInfo
- Publication number
- CN104950581A CN104950581A CN201510377047.4A CN201510377047A CN104950581A CN 104950581 A CN104950581 A CN 104950581A CN 201510377047 A CN201510377047 A CN 201510377047A CN 104950581 A CN104950581 A CN 104950581A
- Authority
- CN
- China
- Prior art keywords
- photoresist layer
- hot
- heating plate
- substrate
- hot frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention relates to a stoving device and a photoresist layer hardening method. The stoving device comprises a plane and a heating plate, wherein a base plate with a film layer and a photoresist layer to be hardened is arranged on the plane; the heating plate is opposite to the base plate and is used for heating the photoresist layer; the temperature of the center of the heating is set to be higher than that of the periphery of the heating plate. The stoving device provided by the invention can be used for adjusting the photoresist hardening speed of the periphery of the base plate to be similar to that of the center of the base plate, so that the line widths of all parts of an image formed after exposure are relatively uniform, and further the clearness during displaying of a liquid crystal display is improved.
Description
Technical field
The invention belongs to LCD Technology field, be specifically related to the method for curing of a kind of apparatus for baking and a kind of photoresist layer.Need repeatedly to use photoetching technique in the processing procedure of the array base palte of liquid crystal display, and step indispensable in photoetching technique is exactly need to carry out cure process to the photoresist be just coated on the thin layer of substrate, the method for curing of apparatus for baking of the present invention and photoresist layer all can carry out cure process to photoresist to be hardened.
Background technology
Along with the development of tft liquid crystal display (Thin Film TransistorLiquid Crystal Display, TFTLCD), the requirement for the array base palte used in tft liquid crystal display is increased thereupon.Because photoetching technique is that manufacturing array substrate must obligato technology, the device that photoetching technique uses can determine the quality of array base palte, and therefore improving the device used in photoetching technique is the target that manufacturer is constantly pursued.
Before step of exposure in photoetching technique, need on the thin layer of the substrate with thin layer, be coated with one deck photoresist layer (or claiming photoresist layer), then carry out cure process by the photoresist layer of apparatus for baking to just coating.But, because existing apparatus for baking can not carry out homogeneous heating to photoresist layer, make the setting rate of the photoresist of the peripheral part of substrate faster than the setting rate of the photoresist of the central part of substrate, thus the figure formed after causing step of exposure (is such as gate electrode and holding capacitor C
sthe figure formed) each position live width even not, and then affect sharpness when liquid crystal display shows.
Summary of the invention
In order to solve the problem, the invention provides the method for curing of a kind of apparatus for baking and a kind of photoresist layer, this apparatus for baking and the method for curing carving glue-line all can be similar the setting rate that the setting rate of the photoresist of the peripheral part of substrate adjusts to the photoresist of the central part of substrate, make each position live width of the figure formed after exposing relatively more even, thus readability when can improve liquid crystal display display
According to a first aspect of the invention, provide a kind of apparatus for baking, this apparatus for baking comprises: for placing the plane of the substrate with thin layer and photoresist layer to be hardened; And the heating plate for heat described photoresist layer relative with described substrate.Wherein, the temperature of the central part of described heating plate is arranged to the temperature of the peripheral part higher than described heating plate.Thus, apparatus for baking of the present invention can be similar the setting rate that the setting rate of the photoresist of the peripheral part of substrate adjusts to the photoresist of the central part of substrate, make each position live width of the figure formed after exposing relatively more even, thus readability when can improve liquid crystal display display.
In one embodiment, described heating plate comprises multiple concentric hot frame be socketed successively and is arranged on the hot block in inner most described hot frame, and the temperature of wherein said hot block is the highest, and the temperature of each described hot frame reduces successively along direction from inside to outside.
In one embodiment, the shape of described heating plate and the shape of described substrate suitable.
In one embodiment, the shape of described hot block is rectangle, and the shape of each described hot frame is rectangular loop.
In one embodiment, the spacing between any two adjacent described hot frames is all not more than 2mm, and the spacing between inner most described hot frame and hot block is not more than 2mm.
In one embodiment, the width of each described hot frame increases from inside to outside successively.
In one embodiment, the quantity of described hot frame is set to five by the size according to described substrate, and described in each, hot frame all has identical width.
In one embodiment, the closed figure that the outward flange of outermost described hot frame is formed can hold the orthogonal projection of described photoresist layer on described heating plate.
In one embodiment, equally distributed heater is provided with in described hot block and hot frame described in each.
According to a second aspect of the invention, provide a kind of method for curing of photoresist layer, described method for curing is comprised and being heated the photoresist layer to be hardened on substrate, to make described photoresist layer hardening by apparatus for baking described according to a first aspect of the invention.
The setting rate that the setting rate of the photoresist of the peripheral part of substrate adjusts to the photoresist of the central part of substrate can be similar according to apparatus for baking of the present invention, each position live width of the figure formed after ensureing exposure is relatively more even, can improve readability during liquid crystal display display thus.Meanwhile, simple, easily manufactured according to the structure of apparatus for baking of the present invention, use safety, is convenient to practice and extension application.
In addition, the setting rate that the setting rate of the photoresist of the peripheral part of substrate adjusts to the photoresist of the central part of substrate can be similar equally according to the method for curing of photoresist layer of the present invention, make each position live width of the figure formed after exposing relatively more even, readability during liquid crystal display display can be improved thus.Meanwhile, there is according to the method for curing of photoresist layer of the present invention the advantages such as simple to operate, use safety, be convenient to practice and extension application.
Accompanying drawing explanation
Also will be described in more detail the present invention with reference to accompanying drawing based on embodiment hereinafter.Wherein:
Fig. 1 is the structural representation of the embodiment according to apparatus for baking of the present invention;
Fig. 2 is the front elevation of the heating plate of the apparatus for baking shown in Fig. 1;
Fig. 3 shows the substrate used in array base palte;
Fig. 4 is the partial enlarged drawing at B place in Fig. 2; And
Fig. 5 is the partial enlarged drawing at C place in Fig. 2.
Parts identical in the accompanying drawings use identical Reference numeral.Accompanying drawing is not according to the scale of reality.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
Fig. 1 is the structural representation of the embodiment according to apparatus for baking 10 of the present invention.As shown in Figure 1, apparatus for baking 10 this comprise the casing 7 with inner chamber 8, and be arranged on worktable in casing 72 and be positioned at the heating plate 3 of top of worktable 2.In other examples, heating plate 3 also can be arranged in worktable 2.Worktable 2 has the plane 2a for placing the substrate 6 (separately claiming glass mother board) with thin layer 5 and photoresist layer 4 to be hardened.Heating plate 3 faces photoresist layer 4 along vertical direction D1, to carry out homogeneous heating to photoresist layer 4.Wherein, thin layer 5 can be metal level.The thickness of thin layer 5 is generally 50nm-300nm.
As shown in Figures 2 and 3, the temperature of the central part 3a of heating plate 3 is arranged to the temperature of the peripheral part 3b higher than heating plate 3, to ensure that the setting rate of the photoresist of the peripheral part 6b of substrate 6 is consistent with the setting rate convergence of the photoresist of the central part 6a of substrate 6, make each position live width convergence of the figure formed after exposing identical, sharpness during liquid crystal display display can be improved thus.
In order to improve sharpness during liquid crystal display display further, as shown in Figure 2, heating plate 3 comprises multiple sockets successively and concentric hot frame and the hot block 32 be arranged in inner most hot frame 31a.In this embodiment, the quantity of hot frame is 5, is respectively hot frame 31a, hot frame 31b, hot frame 31c, hot frame 31d and hot frame 31e.The temperature of hot block 32 is arranged to maximum temperature, and the temperature of each hot frame reduces successively along direction D2 from inside to outside.By the sheathed distribution of the hot block 32 and hot frame with different heating temperature, different temperature compensations is carried out to the zones of different of substrate 6, be formed with the thermograde being beneficial to photoresistance photonasty and reaching best.
Specifically, temperature on heating plate 3 is reduced piecemeal along direction D2 from inside to outside, not only can ensure that the setting rate of the photoresist of the peripheral part 6b of substrate 6 is consistent with the setting rate convergence of the photoresist of the central part 6a of substrate 6 thus, but also whole photoresist layer 4 can be impelled to harden uniformly, make each position live width of the figure formed after exposing more approximate, sharpness during liquid crystal display display can be significantly improved thus.Wherein, equally distributed heater is provided with in described hot block 32 and each hot frame.Heater is chosen as heating wire, is certainly also chosen as the parts that other have heating function.
The shape of heating plate 3 and the shape of substrate 6 suitable.In other words, the shape of heating plate 3 is identical with the shape of substrate 6.When apparatus for baking 10 needs the substrate 6 of sclerosis rectangle, the shape of the hot block 32 of apparatus for baking 10 should elect rectangle as, and the shape of each hot frame all elects rectangular loop as.And when the substrate 6 that apparatus for baking 10 needs sclerosis circular, the shape of the hot block 32 of apparatus for baking 10 should elect circle as, and the shape of each hot frame all elects annular as.
In a preferred embodiment, as shown in Figure 2, according to the size of substrate 6, five sheathed successively hot frame 31a, hot frame 31b, hot frame 31c, hot frame 31d and hot frame 31e are set, and each hot frame has roughly the same width G 3, make heating plate 3 effectively can ensure the even sclerosis of photoresist layer 4.In another embodiment, the width G 3 of each hot frame increases successively along direction D2 from inside to outside.When the width G 3 of each hot frame suitably increases successively along direction D2 from inside to outside, heating plate 3 also evenly can harden to each position of photoresist layer 4.
In order to ensure that heating plate 3 can heat efficiently to the entirety of photoresist layer 4, the closed figure that the outward flange of outermost hot frame 31e is formed can hold the orthogonal projection of photoresist layer 4 on heating plate 3.Each size due to heating plate 3 is greater than the corresponding size of photoresist layer 4 respectively, heating plate 3 can be heated efficiently to the entirety of photoresist layer 4, and then guarantee that photoresist layer 4 can harden uniformly.
As shown in Figure 4 and Figure 5, the spacing G1 between any two adjacent hot frames is all not more than 2mm, and the spacing G2 between inner most hot frame 31a and hot block 32 is not more than 2mm.In fact, spacing G1 between hot frame and the spacing G2 between hot frame 31a and hot block 32 can have a significant impact the even sclerosis of photoresist layer 4, by experimental results demonstrate, spacing G1 when between hot frame be not more than 2mm and spacing G2 between hot frame 31a and hot block 32 is not more than 2mm time, photoresist layer 4 can be impelled to harden more uniformly, make each position live width of the figure formed after exposing more close, thus sharpness when improving liquid crystal display display more significantly.
In summary, the setting rate that the setting rate of the photoresist of the peripheral part 6b of substrate 6 adjusts to the photoresist of the central part 6a of substrate 6 can be similar according to apparatus for baking 10 of the present invention, each position live width of the figure formed after ensureing exposure is relatively more even, can improve readability during liquid crystal display display thus.
Although invention has been described with reference to preferred embodiment, without departing from the scope of the invention, various improvement can be carried out to it and parts wherein can be replaced with equivalent.Especially, only otherwise there is structural hazard, the every technical characteristic mentioned in each embodiment all can combine in any way.The present invention is not limited to specific embodiment disclosed in literary composition, but comprises all technical schemes fallen in the scope of claim.
Claims (10)
1. an apparatus for baking, comprising:
For placing the plane of the substrate with thin layer and photoresist layer to be hardened; And
The heating plate for heat described photoresist layer relative with described substrate;
Wherein, the temperature of the central part of described heating plate is arranged to the temperature of the peripheral part higher than described heating plate.
2. apparatus for baking according to claim 1, it is characterized in that, described heating plate comprises multiple concentric hot frame be socketed successively and is arranged on the hot block in inner most described hot frame, and the temperature of wherein said hot block is the highest, and the temperature of each described hot frame reduces successively along direction from inside to outside.
3. apparatus for baking according to claim 2, is characterized in that, the shape of described heating plate and the shape of described substrate suitable.
4. apparatus for baking according to claim 3, is characterized in that, the shape of described hot block is rectangle, and the shape of each described hot frame is rectangular loop.
5. apparatus for baking according to claim 3, is characterized in that, the spacing between any two adjacent described hot frames is all not more than 2mm, and the spacing between inner most described hot frame and hot block is not more than 2mm.
6. the apparatus for baking according to any one of claim 3 to 5, is characterized in that, the width of each described hot frame increases from inside to outside successively.
7. the apparatus for baking according to any one of claim 3 to 5, is characterized in that, the quantity of described hot frame is set to five by the size according to described substrate, and described in each, hot frame all has identical width.
8. the apparatus for baking according to any one of claim 3 or 5, is characterized in that, the closed figure that the outward flange of outermost described hot frame is formed can hold the orthogonal projection of described photoresist layer on described heating plate.
9. apparatus for baking according to claim 2, is characterized in that, is provided with equally distributed heater in described hot block and hot frame described in each.
10. a method for curing for photoresist layer, described method for curing is comprised and being heated the photoresist layer to be hardened on substrate by the apparatus for baking according to any one of claim 1 to 9, to make described photoresist layer hardening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510377047.4A CN104950581A (en) | 2015-07-02 | 2015-07-02 | Stoving device and photoresist layer hardening method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510377047.4A CN104950581A (en) | 2015-07-02 | 2015-07-02 | Stoving device and photoresist layer hardening method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104950581A true CN104950581A (en) | 2015-09-30 |
Family
ID=54165342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510377047.4A Pending CN104950581A (en) | 2015-07-02 | 2015-07-02 | Stoving device and photoresist layer hardening method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104950581A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244302A (en) * | 2015-10-28 | 2016-01-13 | 武汉华星光电技术有限公司 | Substrate baking device |
| CN108091778A (en) * | 2017-12-27 | 2018-05-29 | 深圳市华星光电技术有限公司 | Drying means, heating unit and its manufacturing method of inkjet printing film layer |
| CN108132587A (en) * | 2017-12-21 | 2018-06-08 | 上海华力微电子有限公司 | Apparatus for baking and the method for adjusting line width |
| CN110133969A (en) * | 2019-04-26 | 2019-08-16 | 厦门通富微电子有限公司 | It is a kind of for toasting the roasting plant, baking system and baking method of photoresist |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR860002082B1 (en) * | 1983-01-19 | 1986-11-24 | 가부시기가이샤 도시바 | Forming method and apparatus of resistor pattern |
| CN1835203A (en) * | 2005-03-17 | 2006-09-20 | 东京毅力科创株式会社 | Substrate supporting member and substrate processing apparatus |
| CN101825808A (en) * | 2009-03-03 | 2010-09-08 | 北京京东方光电科技有限公司 | Alignment film heating device |
| CN102169812A (en) * | 2010-02-04 | 2011-08-31 | 东京毅力科创株式会社 | Heating device, coating/developing system, heating method and coating/developing method |
| CN102412117A (en) * | 2010-09-19 | 2012-04-11 | 中芯国际集成电路制造(上海)有限公司 | Film forming method |
-
2015
- 2015-07-02 CN CN201510377047.4A patent/CN104950581A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR860002082B1 (en) * | 1983-01-19 | 1986-11-24 | 가부시기가이샤 도시바 | Forming method and apparatus of resistor pattern |
| CN1835203A (en) * | 2005-03-17 | 2006-09-20 | 东京毅力科创株式会社 | Substrate supporting member and substrate processing apparatus |
| CN101825808A (en) * | 2009-03-03 | 2010-09-08 | 北京京东方光电科技有限公司 | Alignment film heating device |
| CN102169812A (en) * | 2010-02-04 | 2011-08-31 | 东京毅力科创株式会社 | Heating device, coating/developing system, heating method and coating/developing method |
| CN102412117A (en) * | 2010-09-19 | 2012-04-11 | 中芯国际集成电路制造(上海)有限公司 | Film forming method |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244302A (en) * | 2015-10-28 | 2016-01-13 | 武汉华星光电技术有限公司 | Substrate baking device |
| CN105244302B (en) * | 2015-10-28 | 2018-10-30 | 武汉华星光电技术有限公司 | Substrate apparatus for baking |
| CN108132587A (en) * | 2017-12-21 | 2018-06-08 | 上海华力微电子有限公司 | Apparatus for baking and the method for adjusting line width |
| CN108091778A (en) * | 2017-12-27 | 2018-05-29 | 深圳市华星光电技术有限公司 | Drying means, heating unit and its manufacturing method of inkjet printing film layer |
| CN110133969A (en) * | 2019-04-26 | 2019-08-16 | 厦门通富微电子有限公司 | It is a kind of for toasting the roasting plant, baking system and baking method of photoresist |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104950581A (en) | Stoving device and photoresist layer hardening method | |
| US9470931B2 (en) | Method for manufacturing display panel and transfer plate | |
| US9547110B2 (en) | Color filter substrate and method of manufacturing the same, display apparatus | |
| JP2015519613A (en) | Manufacturing method of alignment film of mother board, transfer sheet and alignment liquid | |
| CN106855662B (en) | Repair the undesirable method of liquid crystal display panel orientation | |
| CN106980202A (en) | Preparation method and light shield with integral type black matrix" and the liquid crystal panel of photoresistance sept | |
| CN106773215A (en) | A kind of color membrane substrates, its preparation method, liquid crystal display and display device | |
| CN210348199U (en) | Heating device and photoetching system | |
| WO2016086452A1 (en) | Method for manufacturing colour filter, colour filter and liquid crystal panel | |
| TWI712666B (en) | Method for bonding substrate and substrate for display manufactured by the same | |
| CN106353909A (en) | Heating plate and baking device | |
| KR100324440B1 (en) | Photomask forming method and heat treatment equipment capable of forming a photomask of high dimensional accuracy | |
| JP2015052627A (en) | Manufacturing method and manufacturing device of liquid crystal display device | |
| US20130271705A1 (en) | Color filter, manufacturing method thereof, and liquid crystal panel with the same | |
| JP6412695B2 (en) | Manufacturing method and manufacturing apparatus for liquid crystal display device | |
| US9759953B2 (en) | Sealant curing device and mask plate thereof | |
| US20150346545A1 (en) | Color filter substrate, method for manufacturing the same, display panel and display device | |
| KR100814719B1 (en) | Manufacturing apparatus for heating plate and manufacturing method using of it | |
| EP3159735B1 (en) | Method for manufacturing liquid crystal panel and heating device | |
| US10118318B2 (en) | Temperature regulation mask and alignment layer pre-curing device | |
| CN110888266A (en) | Method for manufacturing liquid crystal display panel | |
| US8873003B2 (en) | Liquid crystal display device and manufacture method thereof | |
| CN106444302A (en) | Movable mask carrying table | |
| US10203543B2 (en) | Color film substrate and manufacturing method thereof, display panel, display device | |
| KR101325218B1 (en) | Manufacturing mthod of flexible panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150930 |
|
| RJ01 | Rejection of invention patent application after publication |