CN104945853B - A kind of composition epoxy resin suitable for high voltage surfaces mount device package - Google Patents
A kind of composition epoxy resin suitable for high voltage surfaces mount device package Download PDFInfo
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- CN104945853B CN104945853B CN201510433427.5A CN201510433427A CN104945853B CN 104945853 B CN104945853 B CN 104945853B CN 201510433427 A CN201510433427 A CN 201510433427A CN 104945853 B CN104945853 B CN 104945853B
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 85
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 85
- 239000000203 mixture Substances 0.000 title claims abstract description 78
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 71
- 239000011256 inorganic filler Substances 0.000 claims abstract description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 10
- 238000010521 absorption reaction Methods 0.000 claims abstract description 9
- 239000007822 coupling agent Substances 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 claims description 9
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 5
- -1 small molecule pyrolysate Chemical class 0.000 abstract description 5
- 230000004580 weight loss Effects 0.000 abstract description 4
- 238000005979 thermal decomposition reaction Methods 0.000 abstract description 3
- 230000009477 glass transition Effects 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 208000016261 weight loss Diseases 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 101001014562 Homo sapiens Male-specific lethal 3 homolog Proteins 0.000 description 1
- 102100032515 Male-specific lethal 3 homolog Human genes 0.000 description 1
- MKYLOMHWHWEFCT-UHFFFAOYSA-N Manthidine Natural products C1C2=CC=3OCOC=3C=C2C2C3=CC(OC)C(O)CC3N1C2 MKYLOMHWHWEFCT-UHFFFAOYSA-N 0.000 description 1
- SNFRINMTRPQQLE-JQWAAABSSA-N Montanin Chemical compound O[C@H]([C@@]1(CO)O[C@H]1[C@H]1[C@H]2O3)[C@]4(O)C(=O)C(C)=C[C@H]4[C@]11OC3(CCCCCCCCCCC)O[C@@]2(C(C)=C)C[C@H]1C SNFRINMTRPQQLE-JQWAAABSSA-N 0.000 description 1
- SNFRINMTRPQQLE-OFGNMXNXSA-N Montanin Natural products O=C1[C@@]2(O)[C@@H](O)[C@@]3(CO)O[C@H]3[C@@H]3[C@H]4[C@@]5(C(=C)C)O[C@](CCCCCCCCCCC)(O4)O[C@@]3([C@H](C)C5)[C@@H]2C=C1C SNFRINMTRPQQLE-OFGNMXNXSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- QTZPBQMTXNEKRX-UHFFFAOYSA-N Voacristine pseudoindoxyl Natural products N1C2=CC=C(OC)C=C2C(=O)C21CCN(C1)C3C(C(C)O)CC1CC32C(=O)OC QTZPBQMTXNEKRX-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 239000004209 oxidized polyethylene wax Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000003340 retarding agent Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Abstract
The present invention is a kind of composition epoxy resin suitable for high voltage device encapsulation, and the composition includes mainly：（A）Epoxy resin；（B）Curing agent；（C）Curing agent accelerating agent；（D）Inorganic filler；（E）Coupling agent；（F）Stress absorption agent；（A）It is by formula【1】、【2】One kind in the epoxy resin of expression or two kinds, content are the 5% ~ 15% of composition epoxy resin gross mass；（C）Selection formula【4】The curing agent accelerating agent of the structure, content are 0.1% the 2.5% of composition epoxy resin gross mass.The present invention is suitable for the composition epoxy resin of high voltage surfaces mount device package, since it is with glass transition temperature height, water absorption rate is low, simultaneously at high temperature structure than existing general stable system, it is not likely to produce thermal decomposition, its thermal weight loss rate is low after 1000 hours under 150 degree, is not likely to produce small molecule pyrolysate, to excellent high voltage characteristics.
Description
Technical field
It is especially a kind of suitable for high voltage surfaces mount device package the present invention relates to a kind of composition epoxy resin
Composition epoxy resin.
Background technology
With the fast development of current electronics and information industry, electronic component is to miniaturization, high power and high integration side
To development, the manufacturing technology of chip has also been deep into the sub-micron epoch, and die area reduces significantly, and chemically mechanical polishing is accurate
It is thinned with the obvious advantage, therefore the encapsulation technology that tube core small using these, ultra-thin is assembled becomes real challenge.
Packing forms also have traditional through-hole type encapsulation diverter surface attachment.And discrete device, as the previous and present life of integrated circuit,
Many occasions such as high-power, anti-high pressure, high-frequency high-speed, frequency microwave, low noise, high sensitivity, which play, holds the balance and can not replace
The key effect changed.Therefore the encapsulation technology of surface mount device is also faced with baptism.
Nowadays, with the raising of the power of power device, power density is also increased to 5-20kW/L, as power is close
The raising of degree, operating temperature are also increased to 150 degree or so from original 120 degree or so.The raising of operating temperature, the prior art
Epoxy-plastic packaging material be also easy to produce thermal decomposition, release some small-molecule substances to cause epoxy-plastic packaging material structural damage, from
And electrical property is caused to fail.
Therefore, the structural stability under long term high temperature for how improving composition epoxy resin, to improve its resistance to height
Voltage characteristic, it has also become one of urgent problem in high voltage device encapsulation.
Invention content
The technical problem to be solved by the present invention is in view of the deficiencies of the prior art, provide a kind of rapid curing, mobility and
Insulation performance is good, the epoxy suitable for high voltage surfaces mount device package with excellent high voltage characteristics, environment-friendly type
Resin combination.
The technical issues of problem of being solved of the invention, is realized by technical solution below.The present invention is a kind of
Suitable for the composition epoxy resin of high voltage surfaces mount device package, the composition includes mainly（A）Epoxy resin；（B）
Curing agent；（C）Curing agent accelerating agent；（D）Inorganic filler；（E）Coupling agent；（F）Stress absorption agent；Its main feature is that：
Described（A）Epoxy resin is by formula【1】、【2】The mixing of one kind or two kinds of compositions in the epoxy resin of expression
Object, content are the 5% ~ 15% of composition epoxy resin gross mass；
Formula【1】
Formula【2】
Wherein n=1-2；
Described（C）Curing agent accelerating agent selects formula【4】The curing agent accelerating agent of the structure, content are epoxy resin
The 0.1%-2.5% of composition gross mass；
Formula【4】；
Its trade name TPTP；It is produced by Hokko Chemical Industry Co., Ltd..
Common releasing agent, fire retardant, ion capturing agent, colorant can also be contained in composition epoxy resin of the present invention
Equal compositions.Unless otherwise instructed, each composition and its dosage of component epoxy composition can use existing skill to the present invention
Disclosed in art or common composition and dosage.
Composition epoxy resin in the present invention, wherein epoxy resin epoxide epoxy group group and phenolic hydroxyl group in phenolic resin
Equivalent proportion is between 0.5-1.5.
Composition epoxy resin of the present invention, wherein inorganic filler（D）Inorganic filler is mainly fused silica, crystallization two
Silica, they can be spherical, angular or both mixture.Its content is the 75% ~ 88% of gross mass.
Coupling agent can also be added in composition epoxy resin of the present invention, be to improve the bonding of inorganic filler and resin
Property and the bonding force between composition epoxy resin and metal framework, do not require particularly, generally silane coupling agent,
Can be with functional groups such as epoxy group, amino, sulfydryl, urea groups, isocyanate group, content is the 0.1%-2% of gross mass.
Composition epoxy resin in the present invention, can also be added stress release agent, mainly rubber-like material such as CTBN,
ATBN and methyl acrylic ester, silicone oil, thermoplastic elastomer (TPE) or polysiloxane rubber, according to different packing forms and ring
Epoxy resin composition system can use one or more mixtures, content to be less than the 0.1%-2.5% of gross mass.
Composition epoxy resin in the present invention, can also be added releasing agent, not have particular/special requirement to releasing agent, can make
It is mixed with oxidized form or Non-oxidized polyethylene wax, Brazil wax, stearic acid, montanin wax, synthesis paraffin etc. are one or more of
Object is closed, total content is the 0.1%-2% of gross mass.
Fire retardant can also be added in composition epoxy resin in the present invention as needed, and wherein fire retardant is not brominated
The environmental protection fire retarding agent of antimony can be containing nitrogen, the compound of phosphorus, metal hydroxides, boron compound etc., and content is with combination
The difference of objects system and change, reach UL-94V0 ranks, the generally 0.1%-20% of gross mass.
Composition epoxy resin in the present invention, can also be added colorant as needed, and ion capturing agent etc. lifts group
Point, wherein the content of colorant is the 0.1%-1%, ion capturing agent 0.1%-2% of gross mass.
A kind of composition epoxy resin suitable for high voltage surfaces mount device package of the present invention, it is further excellent
The technical solution of choosing is：Described（B）Curing agent is by formula【3】The phenolic resin of expression, content are composition epoxy resin
The 5% ~ 15% of gross mass.
Formula【3】
Wherein n=1-2.
A kind of composition epoxy resin suitable for high voltage surfaces mount device package of the present invention, it is further excellent
The technical solution of choosing is：The formula【4】The curing agent accelerator content of the structure is composition epoxy resin gross mass
0.5%-2%；The further preferably formula【4】The curing agent accelerator content of the structure is composition epoxy resin gross mass
1.0%-1.5%.
A kind of composition epoxy resin suitable for high voltage surfaces mount device package of the present invention, it is further excellent
The technical solution of choosing is：Described（A）Epoxy resin is by formula【1】With【2】The mixture of the epoxy resin composition of expression, wherein
Formula【1】It accounts for（A）50% or more of epoxy resin gross mass；Further preferred formula【1】It accounts for（A）The 70- of epoxy resin gross mass
80%；Most preferably formula【1】It accounts for（A）The 75% of epoxy resin gross mass.
Compared with prior art, the present invention is suitable for the composition epoxy resin of high voltage surfaces mount device package, by
In it with glass transition temperature height, water absorption rate is low, while structure is not likely to produce than existing general stable system at high temperature
Thermal decomposition, its thermal weight loss rate is low after 1000 hours under 150 degree, is not likely to produce small molecule pyrolysate, to excellent
Good high voltage characteristics.
Specific implementation mode
The specific technical solution of the present invention described further below, in order to which those skilled in the art is further understood that
The present invention, without constituting the limitation to its right.
Embodiment 1, a kind of composition epoxy resin suitable for high voltage surfaces mount device package, the composition are main
Including：（A）Epoxy resin；（B）Curing agent；（C）Curing agent accelerating agent；（D）Inorganic filler；（E）Coupling agent；（F）Stress absorption
Agent；
Described（A）Epoxy resin is by formula【1】、【2】One kind in the epoxy resin of expression, content are epoxy resin
The 5% of composition gross mass；
Described（C）Curing agent accelerating agent selects formula【4】The curing agent accelerating agent of the structure, content are epoxy resin
The 0.1% of composition gross mass；
Described（B）Curing agent is by formula【3】The phenolic resin of expression, content are composition epoxy resin gross mass
5%。
Routinely dosage selects remaining raw material.
Embodiment 2, a kind of composition epoxy resin suitable for high voltage surfaces mount device package, the composition are main
Including：（A）Epoxy resin；（B）Curing agent；（C）Curing agent accelerating agent；（D）Inorganic filler；（E）Coupling agent；（F）Stress absorption
Agent；
Described（A）Epoxy resin is by formula【1】、【2】One kind in the epoxy resin of expression, content are epoxy resin
The 15% of composition gross mass；
Described（C）Curing agent accelerating agent selects formula【4】The curing agent accelerating agent of the structure, content are epoxy resin
The 2.5% of composition gross mass；
Described（B）Curing agent is by formula【3】The phenolic resin of expression, content are composition epoxy resin gross mass
15%。
Routinely dosage selects remaining raw material.
Embodiment 3, a kind of composition epoxy resin suitable for high voltage surfaces mount device package, the composition are main
Including：（A）Epoxy resin；（B）Curing agent；（C）Curing agent accelerating agent；（D）Inorganic filler；（E）Coupling agent；（F）Stress absorption
Agent；
Described（A）Epoxy resin is by formula【1】、【2】The mixture of two kinds of compositions of epoxy resin of expression, content are
The 10% of composition epoxy resin gross mass；Wherein formula【1】The epoxy resin content of expression is composition epoxy resin gross mass
6%；
Described（C）Curing agent accelerating agent selects formula【4】The curing agent accelerating agent of the structure, content are epoxy resin
The 1.5% of composition gross mass；
Described（B）Curing agent is by formula【3】The phenolic resin of expression, content are composition epoxy resin gross mass
10%。
Routinely dosage selects remaining raw material.
Embodiment 4, a kind of composition epoxy resin suitable for high voltage surfaces mount device package, the composition are main
Including：（A）Epoxy resin；（B）Curing agent；（C）Curing agent accelerating agent；（D）Inorganic filler；（E）Coupling agent；（F）Stress absorption
Agent；
Epoxy resin is by formula【1】、【2】The mixture of two kinds of compositions of epoxy resin of expression, content are epoxy resin
The 8% of composition gross mass；Wherein formula【1】The epoxy resin content of expression is the 7% of composition epoxy resin gross mass；
Described（C）Curing agent accelerating agent selects formula【4】The curing agent accelerating agent of the structure, content are epoxy resin
The 1.0% of composition gross mass；
Described（B）Curing agent is by formula【3】The phenolic resin of expression, content are composition epoxy resin gross mass
8%。
Routinely dosage selects remaining raw material.
Embodiment 5, a kind of composition epoxy resin suitable for high voltage surfaces mount device package are tested, the composition
Main ingredient dosage（Weight percent）And test result see the table below：
Test condition：All tests and sample are carried out or are prepared, 175 DEG C of mold temperature on transfer modling press, at
Type pressure 5MPa, hardening time 120s.Cured test specimens block after need to carrying out, rear cured condition are：Part is 175 DEG C, and 6 is small
When.
（1）Gel time：It is measured by the 5.3rd article of gelation time of SJ/T 11197-1999 epoxy molding plastics solidifying
Gel time (s).
（2）Length of flow：It is measured by the 5.2nd article of Spiral flow length of SJ/T 11197-1999 epoxy molding plastics
Flow distance (cm).
（3）Anti-flammability：The fire-retardant of material is measured by the 5.12nd article of anti-flammability of SJ/T 11197-1999 epoxy molding plastics
Property.
（4）CTE and Tg:By the 5.6th article of linear expansion coefficient and vitrifying temperature of SJ/T 11197-1999 epoxy molding plastics
It spends to measure CTE and Tg
（5）Bending strength, bending modulus：By the 5.5th article of bending strength of SJ/T 11197-1999 epoxy molding plastics,
Bending modulus measures bending modulus.
（6）150 degree of 1000 hours weight-loss ratios（%）：After samples weighing（W0）, be positioned over 150 degree it is 1000 hours lower, it
After weighed again (W1), carry out calculating its weight-loss ratio by following formula：
（7）Electric performance test：By sample on SOP8 molds, transfer modling technique is packaged at 175 DEG C, after demoulding
MSL3 ranks are carried out after curing 6 hours packaged sample afterwards at 175 DEG C by JESD22-A113D requirements to examine respectively.It
Electric performance test is carried out under the voltage of 1800V afterwards.
Claims (4)
1. a kind of composition epoxy resin suitable for high voltage surfaces mount device package, the composition include mainly：（A）Ring
Oxygen resin；（B）Curing agent；（C）Curing agent accelerating agent；（D）Inorganic filler；（E）Coupling agent；（F）Stress absorption agent；Its feature exists
In：
Described（A）Epoxy resin is by formula【1】With【2】The mixture of the epoxy resin composition of expression, wherein formula【1】It accounts for（A）
The 70-80% of epoxy resin gross mass；Described（A）Epoxy resin content is the 5% ~ 15% of composition epoxy resin gross mass；
Formula【1】
Formula【2】
Wherein n=1-2；
Described（C）Curing agent accelerating agent selects formula【4】The curing agent accelerating agent of the structure, content are epoxy composite
The 0.1%-2.5% of object gross mass；
Formula【4】；
Described（B）Curing agent is by formula【3】The phenolic resin of expression, content be composition epoxy resin gross mass 5% ~
15%；
Formula【3】
Wherein n=1-2.
2. a kind of composition epoxy resin suitable for high voltage surfaces mount device package according to claim 1,
It is characterized in that：The formula【4】The curing agent accelerator content of the structure is the 0.5%- of composition epoxy resin gross mass
2%。
3. a kind of composition epoxy resin suitable for high voltage surfaces mount device package according to claim 2,
It is characterized in that：The formula【4】The curing agent accelerator content of the structure is the 1.0%- of composition epoxy resin gross mass
1.5%。
4. a kind of epoxy suitable for high voltage surfaces mount device package according to any one of claim 1-3
Resin combination, it is characterised in that：In epoxy resin epoxide epoxy group group and phenolic resin the equivalent proportion of phenolic hydroxyl group 0.5-1.5 it
Between.
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| CN107286325B (en) * | 2016-04-01 | 2021-06-01 | 深圳光启高等理工研究院 | Resin composition and use thereof |
| CN106398112B (en) * | 2016-05-31 | 2019-09-13 | 江苏华海诚科新材料股份有限公司 | A kind of composition epoxy resin suitable for ESOP encapsulation |
| CN107195756A (en) * | 2017-07-05 | 2017-09-22 | 斯内尔特种材料有限公司 | The pre-package structure and semiconductor light-emitting apparatus of semiconductor light-emitting apparatus |
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| CN102108184B (en) * | 2009-12-24 | 2015-04-22 | 汉高股份有限及两合公司 | Epoxy resin composition and application thereof |
| JP5821481B2 (en) * | 2011-09-30 | 2015-11-24 | 東レ株式会社 | Negative photosensitive resin composition and protective film and touch panel member using the same |
| CN103450632A (en) * | 2012-05-28 | 2013-12-18 | 汉高华威电子有限公司 | Epoxy resin composition for electronic packaging and preparation method thereof |
| CN102850984A (en) * | 2012-09-19 | 2013-01-02 | 江苏华海诚科新材料有限公司 | Low-stress epoxy resin composition applicable to packaging small-size surface mounted devices |
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