CN104934726A - Carrier tape connector - Google Patents

Carrier tape connector Download PDF

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Publication number
CN104934726A
CN104934726A CN201410099935.XA CN201410099935A CN104934726A CN 104934726 A CN104934726 A CN 104934726A CN 201410099935 A CN201410099935 A CN 201410099935A CN 104934726 A CN104934726 A CN 104934726A
Authority
CN
China
Prior art keywords
carrier band
circular substrate
conductive pole
band connector
carrier tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410099935.XA
Other languages
Chinese (zh)
Other versions
CN104934726B (en
Inventor
谢正华
官将
赵晓青
刘超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HIERSTAR (SUZHOU) Co Ltd
Original Assignee
HIERSTAR (SUZHOU) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HIERSTAR (SUZHOU) Co Ltd filed Critical HIERSTAR (SUZHOU) Co Ltd
Priority to CN201410099935.XA priority Critical patent/CN104934726B/en
Publication of CN104934726A publication Critical patent/CN104934726A/en
Application granted granted Critical
Publication of CN104934726B publication Critical patent/CN104934726B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • H01R4/023Soldered or welded connections between cables or wires and terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The invention relates to a carrier tape connector which comprises a circular substrate and conductive poles. The circular substrate is provided with a plurality of circular through holes. The conductive poles are embedded and fixed in the circular through holes of the circular substrate. Furthermore the conductive poles are insulated from the circular substrate. The end surface of each conductive pole is tinned. One end surface of each conductive pole is in conductive connection with an external carrier tape, and the other end surface is in conductive connection with an external flexible printed circuit board (FPC). According to the carrier tape connector, the carrier belt is connected with the flexible printed circuit board (FPC) through the carrier tape connector, thereby saving a process of manually implanting solder balls on FPC contacts. Furthermore the carrier tape connector has advantages of simple operation, high efficiency, low cost and high reliability.

Description

Carrier band connector
Technical field
The present invention relates to a kind of carrier band connector, particularly relate to a kind of carrier band connector of visible intelligent IC-card.
Background technology
Along with expanding economy, " Golden Card Program " is vigorously implemented rapidly, IC-card the industries such as bank, communication, traffic all fast development get up.In order to ensure that IC-card is read and write correctly within its useful life, the embedded technology of IC-card carrier band becomes extremely important.Now connect contact on FPC and carrier band with anisotropic conductive adhesive (ACF) useful in embedded technology, also useful tin cream replaces ACF's.
In use, card is bending or distortion inevitably, connects the IC-card of carrier band with ACF, there will be the phenomenon of carrier band because of open circuit not conducting; And use tin cream to connect, owing to having added a circle PUR in the surrounding of carrier band and contact, when distortion appears in card, can effectively protect the conducting of carrier band and contact.But use tin cream to connect in the technique of carrier band and contact, need implant tin ball (diameter is at about 1mm) on the contact of FPC, operate more difficult, efficiency is low, and cost is high.
Summary of the invention
The object of the invention is the defect for prior art, a kind of carrier band connector is provided, to solve in the Joining Technology of carrier band and contact complicated operation, efficiency is low and cost is high problem.
For achieving the above object, the invention provides a kind of carrier band connector, this carrier band connector comprises: circular substrate and conductive pole; Described circular substrate has several manhole, and described conductive pole embeds grafting and is fixed in the described manhole of described circular substrate, and described conductive pole insulate mutually with described circular substrate; The end face of described conductive pole is zinc-plated, and be connected with outside carrier band conducting by mode end face of hot-pressing processing, another end face is connected with external flexible wiring board FPC conducting.
Preferably, the outer surface of described conductive pole is gold-plated.
Preferably, the material of described circular substrate is insulation resin material.
Preferably, the height of described conductive pole is identical with the thickness of circular substrate.
Preferably, the mutual alignment of the manhole on described circular substrate is identical with the mutual alignment of the solder joint that described flexible circuit board FPC distributes.
Preferably, the diameter of described conductive pole is identical with the diameter of the solder joint that described flexible circuit board FPC distributes.
Advantage of the present invention adopts carrier band connector, carrier band and flexible circuit board FPC coupled together, eliminate the technique of Artificial Intervention tin ball on FPC contact, and use carrier band connector is simple to operate, efficiency is high, cost is low and reliability is high.
Accompanying drawing explanation
Fig. 1 is the structural representation of carrier band connector of the present invention;
Fig. 2 is the structural representation of circular substrate of the present invention;
Fig. 3 is the intention of the structure of conductive pole of the present invention.
Embodiment
Below by drawings and Examples, technical scheme of the present invention is described in further detail.
Carrier band connector of the present invention is for connecting carrier band and flexible circuit board FPC, simple to operate and reliability is high.
Fig. 1 is the structural representation of carrier band connector of the present invention, and as shown in the figure, carrier band connector comprises: circular substrate 10, conductive pole 20.
Fig. 2 is the structural representation of circular substrate of the present invention, as shown in the figure, circular substrate 10 has several manhole 11, has 8 manholes in the present embodiment.The material of circular substrate 10 is insulation resin material, and conductive pole 20 embeds grafting and is fixed in manhole, and conductive pole 20 insulate with circular substrate 10 phase.The mutual alignment relation of the manhole 11 on circular substrate 10 is identical with the mutual alignment relation of the solder joint that flexible circuit board FPC distributes.External diameter size on circular substrate 10 and highly need to rely on the groove that on IC-card card base, reserved milling is good to set.
Fig. 3 is the structural representation of conductive pole of the present invention, and as shown in the figure, conductive pole 20 outer surface is gold-plated, and its height is identical with the thickness of circular substrate 10, and diameter is identical with the diameter of the solder joint that flexible circuit board FPC distributes.Conductive pole 20 embeds grafting and to be fixed on two end faces exposing circular substrate 10 after in the manhole 11 of circular substrate 10 zinc-plated, be connected with outside carrier band conducting by mode end face of hot-pressing processing, another end face is connected with external flexible wiring board FPC conducting.
Below in conjunction with Fig. 1 to Fig. 3, the assembling process of the embodiment of carrier band connector of the present invention is set forth as follows:
Gold-plated conductive pole 20 is embedded grafting successively and is fixed in the manhole 11 of circular substrate 10, the both ends of the surface up and down of the conductive pole 20 exposed are zinc-plated, by hot-pressing processing, conductive pole 20 end face is connected with outside carrier band conducting, another end face is connected with external flexible wiring board FPC conducting, completes the connection work of carrier band and flexible circuit board FPC.
Carrier band connector in the present invention is connected to carrier band and flexible circuit board FPC, compares directly to connect carrier band by Artificial Intervention tin ball and flexible circuit board FPC has larger improvement.Upper and lower end face due to conductive pole is plane, and only need to use connector by tin cream heat fixation on carrier band and flexible circuit board FPC, just can complete the connection of carrier band and flexible circuit board FPC, technique reliability that is simple, that connect is high.Therefore, the use of carrier band connector simplifies production process, improves operating efficiency and improve connection reliability.
Above-described embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only the specific embodiment of the present invention; the protection range be not intended to limit the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (6)

1. a carrier band connector, is characterized in that, described carrier band connector comprises: circular substrate and conductive pole;
Described circular substrate has several manhole, and described conductive pole embeds grafting and is fixed in the described manhole of described circular substrate, and described conductive pole insulate mutually with described circular substrate;
The end face of described conductive pole is zinc-plated, and be connected with outside carrier band conducting by mode end face of hot-pressing processing, another end face is connected with external flexible wiring board FPC conducting.
2. carrier band connector according to claim 1, is characterized in that, the outer surface of described conductive pole is gold-plated.
3. carrier band connector according to claim 1, is characterized in that, the material of described circular substrate is insulation resin material.
4. carrier band connector according to claim 1, is characterized in that, the height of described conductive pole is identical with the thickness of circular substrate.
5. carrier band connector according to claim 1, is characterized in that, the mutual alignment of the manhole on described circular substrate is identical with the mutual alignment of the solder joint that described flexible circuit board FPC distributes.
6. carrier band connector according to claim 1, is characterized in that, the diameter of described conductive pole is identical with the diameter of the solder joint that described flexible circuit board FPC distributes.
CN201410099935.XA 2014-03-18 2014-03-18 Carrier tape connector Active CN104934726B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410099935.XA CN104934726B (en) 2014-03-18 2014-03-18 Carrier tape connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410099935.XA CN104934726B (en) 2014-03-18 2014-03-18 Carrier tape connector

Publications (2)

Publication Number Publication Date
CN104934726A true CN104934726A (en) 2015-09-23
CN104934726B CN104934726B (en) 2021-08-06

Family

ID=54121774

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410099935.XA Active CN104934726B (en) 2014-03-18 2014-03-18 Carrier tape connector

Country Status (1)

Country Link
CN (1) CN104934726B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788767A (en) * 1987-03-11 1988-12-06 International Business Machines Corporation Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
EP1615166A1 (en) * 2004-07-07 2006-01-11 Axalto S.A. Carrier tape for chip modules and method of manufacturing a chip card
JP2009157428A (en) * 2007-12-25 2009-07-16 Toppan Printing Co Ltd Production method for non-contact type ic tag inlet, and non-contact type ic tag inlet
CN201548983U (en) * 2009-11-13 2010-08-11 中电智能卡有限责任公司 Novel contact type intelligent card module
CN202075772U (en) * 2011-02-16 2011-12-14 中电智能卡有限责任公司 Contact-type integrated card (IC) module
CN102509148A (en) * 2011-10-18 2012-06-20 无锡邦普氿顺微电子有限公司 Technology for manufacturing card by using strap

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788767A (en) * 1987-03-11 1988-12-06 International Business Machines Corporation Method for mounting a flexible film semiconductor chip carrier on a circuitized substrate
EP1615166A1 (en) * 2004-07-07 2006-01-11 Axalto S.A. Carrier tape for chip modules and method of manufacturing a chip card
JP2009157428A (en) * 2007-12-25 2009-07-16 Toppan Printing Co Ltd Production method for non-contact type ic tag inlet, and non-contact type ic tag inlet
CN201548983U (en) * 2009-11-13 2010-08-11 中电智能卡有限责任公司 Novel contact type intelligent card module
CN202075772U (en) * 2011-02-16 2011-12-14 中电智能卡有限责任公司 Contact-type integrated card (IC) module
CN102509148A (en) * 2011-10-18 2012-06-20 无锡邦普氿顺微电子有限公司 Technology for manufacturing card by using strap

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