CN104934360A - Clamp capable of independently loading and sintering multiple large-area chips with different thicknesses under constant pressure - Google Patents
Clamp capable of independently loading and sintering multiple large-area chips with different thicknesses under constant pressure Download PDFInfo
- Publication number
- CN104934360A CN104934360A CN201510354802.7A CN201510354802A CN104934360A CN 104934360 A CN104934360 A CN 104934360A CN 201510354802 A CN201510354802 A CN 201510354802A CN 104934360 A CN104934360 A CN 104934360A
- Authority
- CN
- China
- Prior art keywords
- support frame
- type support
- lower nut
- word type
- back word
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005245 sintering Methods 0.000 title abstract description 15
- 238000007906 compression Methods 0.000 claims description 28
- 230000006835 compression Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 abstract description 13
- 230000035515 penetration Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005483 Hooke's law Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dc-Dc Converters (AREA)
Abstract
The invention discloses a clamp capable of independently loading and sintering multiple large-area chips with different thicknesses under constant pressure. The clamp comprises a hollow square supporting framework, wherein a plurality of set of loading devices are arranged from the top plate of the framework and the bottom plate of the framework in a penetration mode; each set of loading devices is the same in structure, and each loading device comprises a through hole which is formed in the top plate of the hollow square supporting framework, wherein a screw penetrates through the through hole, an upper nut is arranged on a position, above the top plate of the square supporting framework, of the screw; a lower nut is arranged on a position, below the top plate of the square supporting framework, of the screw; a pointer moving up and down along with the lower nut is arranged on a position, above the lower nut, of the screw in a sleeving mode; a pressure spring is arranged on a position, below the lower nut, of the screw in the sleeving mode; a gasket is arranged on the lower surface of the pressure spring; a vertical scale is arranged on the side surface of the hollow square supporting framework; and the end part of the pointer is in contact with the vertical scale. According to the clamp disclosed by the invention, the chips with different thickness and different areas on the same substrate can be interdependently pressurized, and the pressure is kept constant, so that deformation generated by sintering shrinkage can be compensated.
Description
Technical field
The present invention relates to a kind of for the nano mattisolda sintering device of chip on substrate, particularly relate to a kind of can simultaneously to the large-area chips independent loads separately of multiple different-thickness, constant voltage sinters.
Background technology
In hybrid vehicle, be direct current with large power, electrically submodules such as inverters by AC conversion.Because the encapsulation of this generic module is just towards more small size, more powerful trend development, therefore will inevitably produce a large amount of heat.When using traditional pricker welding method to manufacture this generic module, there is short, the shortcoming such as heat-sinking capability is low in useful life, the junction temperature of power model chips in hybrid vehicle is limited in less than 150 degree.Emerging low-temperature nanosilver sintering technology, can make up the shortcoming of traditional method for welding to a great extent.
When nano mattisolda being applied to manufacture IGBT module, need large-area chips different for thickness to be sintered on substrate.Connect good when sintering large-area chips if want, certain pressure must be applied while heat-agglomerating, and the pressing plate of current most hot press is overall structure, and chip thickness, fall head, especially the thickness of silver paste is difficult to accurately control, and cannot realize the disposable pressure sintering of the different chips of thickness on one piece of substrate.And silver paste can shrink in sintering process, cause pressure can not remain constant.Therefore, this just needs one to address these problems device.
Summary of the invention
For problems of the prior art, the invention provides the fixture that a kind of independent loads constant voltage sinters multiple large area different-thickness chip, its precision is high, structure is simple, multiple chips that can realize different-thickness different area independently pressurize on the same substrate, and in sintering process pressure remained constant.
In order to solve the problems of the technologies described above, a kind of independent loads constant voltage that the present invention proposes sinters the fixture of multiple large area different-thickness chip, comprise Back Word type support frame, top board to the base plate of Back Word type support frame through Back Word type support frame is provided with and overlaps charger more, the structure of often overlapping charger is identical, described charger comprises the through hole be arranged on Back Word type support frame top board, through a screw rod in described through hole, described screw rod is positioned on Back Word type support frame top board and is equipped with top nut, described screw rod is positioned under Back Word type support frame top board and is equipped with lower nut, described screw rod is positioned on described lower nut and is set with a pointer moved up and down with lower nut, described screw rod is positioned under described lower nut and is set with a compression spring, a pad is provided with below described compression spring, the side of described Back Word type support frame is provided with vertical scale, the end of described pointer contacts with described vertical scale.
Wherein, the upper surface of described pad is provided with circular groove, and the diameter of described circular groove is identical with the external diameter of compression spring.The elastic force of the compression spring in many covers charger is different.
Compared with prior art, the invention has the beneficial effects as follows:
Adopt the present invention, can realize the independent loads of multiple different-thickness chip on one piece of substrate, the object of constant voltage sintering, simultaneously coordinating of nut and screw rod can controlled loading speed, avoids the rapid increasing of pressure.The size of compression spring, pointer, vertically the cooperation controlled loading pressure of scale can also be passed through.
Accompanying drawing explanation
Fig. 1 is the front view of fixture of the present invention;
Fig. 2 is the side view cutaway drawing of fixture shown in Fig. 1;
Fig. 3 is the vertical view of fixture shown in Fig. 1.
Wherein:
1-screw rod, 2-top nut, 3-Back Word type support frame, 4-pointer, 5-lower nut, 6-compression spring, 7-pad, 8-substrate, the vertical scale of 9-.
Embodiment
Be described in further detail technical solution of the present invention below in conjunction with the drawings and specific embodiments, described specific embodiment only explains the present invention, not in order to limit the present invention.
As shown in Figure 1, Figure 2 and Figure 3, a kind of independent loads of the present invention constant voltage sinters the fixture of multiple large area different-thickness chip, include many cover chargers and the Back Word type support frame 3 for supporting substrate and charger, many cover chargers are through the base plate of top board to Back Word type support frame 3 of Back Word type support frame 3.The structure of often overlapping charger is identical, described charger comprises the through hole be arranged on Back Word type support frame 3 top board, through a screw rod 1 in described through hole, described screw rod 1 is provided with the top nut 2 be positioned on Back Word type support frame 3 top board and the lower nut 5 be positioned under Back Word type support frame 3 top board, described screw rod 1 is positioned at and is set with one on described lower nut 5 and can rotates with lower nut 5 and the pointer 4 that moves up and down, described screw rod 1 is positioned under described lower nut 5 and is set with a compression spring 6, described lower nut 5 withstands on above compression spring 6, a pad 7 is provided with below described compression spring 6, the upper surface of described pad 7 is provided with circular groove, the diameter of described circular groove is identical with the external diameter of compression spring, this circular groove can make the bottom surface of compression spring 6 be embedded in wherein just, opposite planar, this circular groove can make comparatively stable being supported of compression spring 6, the side of described Back Word type support frame 3 is provided with vertical scale 9, one end of described pointer 4 is be sleeved on the annulus on screw rod 1, the other end of described pointer 4 is pointer end, this pointer end contacts with described vertical scale 9, by precession lower nut 5 compression pressure spring 6, its decrement can clearly be drawn by the displacement of pointer 4 vertically scale 9, during design, the scale that vertical scale 9 marks can be spring deformation amount, the scale that also can mark on vertical scale 9 according to Hooke's law is the loading force of corresponding charger, because the elastic force overlapping the compression spring in charger different more, therefore, the size of controlled loading can be carried out by precession lower nut 4.
In fixture of the present invention, the screw rod 1 in charger plays a part that abutment pressure spring 6 and lower nut 4 load.Compression spring 6 is enclosed within screw rod 1, prevents from bending in deformation process, can know the size learning loading accurately from the deformation quantity of compression spring 1 simultaneously.Because the pressure of pressure sintering is generally at more than 1MPa, now, for large-area chips (>=10 × 10mm
2) pressure must reach more than 100N, spring deformation amount is at 5-10mm, and 10-20 μm that bounces back in such silver paste sintering process would not be caused too large impression to on-load pressure, substantially maintain constant pressure.Screw rod position on compression spring 6 is equipped with the lower nut 4 for loading, and slowly loading, ensureing the uniform and stable of on-load pressure by turning lower nut 5 pairs of compression springs 6.Have a pointer 4 be enclosed within screw rod 1 above lower nut 6, this pointer points to vertical scale 9, and in loading procedure, this pointer 4 declines with the precession of lower nut 4, can read spring deformation amount in real time, and by the size of deformation quantity controlled loading power.Below compression spring 6, there is size to be slightly less than the square pad 7 of chip, make whole uniform force of compression spring 6 pairs of chips in loading procedure, certainly, preferably on pad, being provided with circular groove, is that compression spring 6 is embedded in this circular groove with stable abutment pressure spring 6.
Embodiment, a substrate 8 can be placed with the chip that multiple thickness is different, area is different simultaneously, during the parts such as the pad 7 of the charger on chip placement and its and compression spring 7, should be especially careful, in order to avoid cause the relative displacement not sintering chip and substrate placed.
When using fixture of the present invention to sinter, key step is: be placed on by chip and brush on the substrate 8 of soldering paste; The substrate 8 of chip and pad 7 is had to put on the base plate of Back Word type support frame 3 pre-determined bit above; By the through hole be arranged on the top board of Back Word type support frame 3, screw rod 1 is passed top board, along with penetrating of screw rod 1 puts pointer 4, fit on lower nut 5, puts compression spring 6, with top nut 2, screw rod 1 is stabilized in suitable height, slowly compression spring 6 is loaded by precession lower nut 5, until to suitable load, then start pressure sintering.
For ensureing precision and the useful life of fixture of the present invention, advise that the heat-resistance stainless steel that the parts in this fixture all adopt thermal coefficient of expansion little makes.
Fixture of the present invention independently can pressurize to the chip of different-thickness on the same substrate, different area, and keeps constant pressure, thus can compensate because the deformation of sintering shrinkage generation.
Although invention has been described by reference to the accompanying drawings above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment is only schematic; instead of it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; when not departing from present inventive concept, can also make a lot of distortion, these all belong within protection of the present invention.
Claims (3)
1. independent loads constant voltage sinters a fixture for multiple large area different-thickness chip, comprises Back Word type support frame (3), it is characterized in that,
Top board to the base plate of Back Word type support frame (3) through Back Word type support frame (3) is provided with and overlaps charger more;
The structure of often overlapping charger is identical, described charger comprises the through hole be arranged on Back Word type support frame (3) top board, through a screw rod (1) in described through hole, described screw rod (1) is positioned on Back Word type support frame (3) top board and is equipped with top nut (2), described screw rod (1) is positioned under Back Word type support frame (3) top board and is equipped with lower nut (5), described screw rod (1) is positioned on described lower nut (5) and is set with a pointer (4) moved up and down with lower nut (5), described screw rod (1) is positioned under described lower nut (5) and is set with a compression spring (6), a pad (7) is provided with below described compression spring (6), the side of described Back Word type support frame (3) is provided with vertical scale (9), the end of described pointer (4) contacts with described vertical scale (9).
2. a kind of independent loads constant voltage sinters the fixture of multiple large area different-thickness chip according to claim 1, it is characterized in that, the upper surface of described pad (7) is provided with circular groove, and the diameter of described circular groove is identical with the external diameter of compression spring.
3. a kind of independent loads constant voltage sinters the fixture of multiple large area different-thickness chip according to claim 1, it is characterized in that, the elastic force of the compression spring in many cover chargers is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510354802.7A CN104934360A (en) | 2015-06-24 | 2015-06-24 | Clamp capable of independently loading and sintering multiple large-area chips with different thicknesses under constant pressure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510354802.7A CN104934360A (en) | 2015-06-24 | 2015-06-24 | Clamp capable of independently loading and sintering multiple large-area chips with different thicknesses under constant pressure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104934360A true CN104934360A (en) | 2015-09-23 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510354802.7A Pending CN104934360A (en) | 2015-06-24 | 2015-06-24 | Clamp capable of independently loading and sintering multiple large-area chips with different thicknesses under constant pressure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104934360A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109676139A (en) * | 2019-03-06 | 2019-04-26 | 河海大学常州校区 | A kind of power device nanoparticles sinter packaging fixture |
| CN109920755A (en) * | 2019-02-25 | 2019-06-21 | 天津大学 | A kind of nano mattisolda low pressure assisted sintering fixture and method |
| CN109994373A (en) * | 2019-04-12 | 2019-07-09 | 中国电子科技集团公司第三十八研究所 | A kind of dress bare chip connection of micro-group and repair method |
| CN117103750A (en) * | 2023-10-25 | 2023-11-24 | 泰姆瑞（北京）精密技术有限公司 | Pressing device, pressing working method and pressing equipment for chip processing |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5316278A (en) * | 1992-09-18 | 1994-05-31 | Applied Materials, Inc. | Clamping ring apparatus for processing semiconductor wafers |
| CN101123202A (en) * | 2006-08-09 | 2008-02-13 | 日月光半导体制造股份有限公司 | Clamping device and method for mature making process |
| CN201266603Y (en) * | 2008-10-11 | 2009-07-01 | 天水华天微电子股份有限公司 | Clamper for packing ultrasound aluminum wire bonding equipment |
| CN102879881A (en) * | 2012-10-31 | 2013-01-16 | 中国科学院自动化研究所 | Element holding device |
-
2015
- 2015-06-24 CN CN201510354802.7A patent/CN104934360A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5316278A (en) * | 1992-09-18 | 1994-05-31 | Applied Materials, Inc. | Clamping ring apparatus for processing semiconductor wafers |
| CN101123202A (en) * | 2006-08-09 | 2008-02-13 | 日月光半导体制造股份有限公司 | Clamping device and method for mature making process |
| CN201266603Y (en) * | 2008-10-11 | 2009-07-01 | 天水华天微电子股份有限公司 | Clamper for packing ultrasound aluminum wire bonding equipment |
| CN102879881A (en) * | 2012-10-31 | 2013-01-16 | 中国科学院自动化研究所 | Element holding device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109920755A (en) * | 2019-02-25 | 2019-06-21 | 天津大学 | A kind of nano mattisolda low pressure assisted sintering fixture and method |
| CN109676139A (en) * | 2019-03-06 | 2019-04-26 | 河海大学常州校区 | A kind of power device nanoparticles sinter packaging fixture |
| CN109994373A (en) * | 2019-04-12 | 2019-07-09 | 中国电子科技集团公司第三十八研究所 | A kind of dress bare chip connection of micro-group and repair method |
| CN117103750A (en) * | 2023-10-25 | 2023-11-24 | 泰姆瑞（北京）精密技术有限公司 | Pressing device, pressing working method and pressing equipment for chip processing |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
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Application publication date: 20150923 |