CN104927700A - Conductive paste and preparing method thereof - Google Patents
Conductive paste and preparing method thereof Download PDFInfo
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- CN104927700A CN104927700A CN201510372014.0A CN201510372014A CN104927700A CN 104927700 A CN104927700 A CN 104927700A CN 201510372014 A CN201510372014 A CN 201510372014A CN 104927700 A CN104927700 A CN 104927700A
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Abstract
Disclosed are conductive paste and a preparing method thereof. The conductive paste comprises, by weight, 24 to 38 parts of epoxy resin, 0.1 to 0.5 part of ultraviolet absorbent, 0.4 to 0.8 part of antioxidant, 12 to 18 parts of silver powder, 5 to 9 parts of ethylene vinyl acetate copolymer, 10 to 18 parts of carbon black, 50 to 80 parts of poly(propylene glycol) diglycidyl ether, 29 to 48 parts of aluminum oxide powder, and 0.03 to 0.06 part of curing agent. The preparing method includes: mixing the aluminum oxide powder and the silver powder to obtain first mixture; adding the epoxy resin, the ethylene vinyl acetate copolymer, the poly(propylene glycol) diglycidyl ether and the curing agent into a magnetic stirrer, performing stirring under heating to 60 to 78 DEG C to obtain second mixture, spraying the first mixture into the second mixture, performing stirring before allowing cooling to 25 to 30 DEG C, adding the ultraviolet absorbent, the antioxidant and the carbon black, and performing concentrating to obtain a finished product. The conductive paste is good in stability and is widely applicable.
Description
Technical field
The present invention relates to electronics field, be specifically related to a kind of conductive resin and preparation method thereof.
Background technology
Conductive resin is the tackiness agent after a kind of fixed line or drying with certain conductivity, it is main moiety with matrix resin and conductive filler material and conducting particles usually, by the bonding effect of matrix resin, conducting particles is combined, form conductive path, the conduction realized by gluing material connects.At present, the kind of conductive resin is a lot, although a lot of very superior on conductivity, stability is inadequate, easily peels off, therefore need to research and develop a kind of good conductivity, the conductive resin that stability is strong under high temperature.
Summary of the invention
For the deficiencies in the prior art, the object of the present invention is to provide a kind of conductive resin and preparation method thereof, this conductive resin good conductivity, high temperature resistant, preparation method is simple.
A kind of conductive resin, comprise the following component counted by weight: epoxy resin 24-38 part, UV light absorber 0.1-0.5 part, antioxidant 0.4-0.8 part, silver powder 12-18 part, ethene-vinyl acetate 5-9 part, carbon black 10-18 part, polypropylene glycol diglycidyl ether 50-80 part, aluminium oxide powder 29-48 part, solidifying agent 0.03-0.06 part.
As conductive resin preferably, comprise the following component counted by weight: epoxy resin 28-34 part, UV light absorber 0.2-0.4 part, antioxidant 0.6-0.7 part, silver powder 14-16 part, ethene-vinyl acetate 6-8 part, carbon black 12-16 part, polypropylene glycol diglycidyl ether 63-73 part, aluminium oxide powder 32-45 part, solidifying agent 0.04-0.06 part.
As conductive resin preferably, the order number of described silver powder and aluminium oxide powder is respectively 400-500 order.
Improve as conductive resin, also comprise chloroprene rubber 3-9 part.
The preparation method of above-mentioned conductive resin, comprises the following steps:
Step 1, takes component, by aluminium oxide powder and silver powder mixing, stirs to obtain the first mixture;
Step 2, drops into epoxy resin, ethene-vinyl acetate, polypropylene glycol diglycidyl ether and solidifying agent in magnetic stirring apparatus, is heated to 60-78 DEG C while stirring and obtains the second mixture;
Step 3, spray the first mixture in the second mixture after, stir to be cooled to 25-30 DEG C time, add UV light absorber, antioxidant and carbon black, after concentrated 1-3min finished product.
As preparation method preferably, in step 2, stirring velocity is 300-450rpm.
As preparation method preferably, when concentrating in step 3, vacuum tightness is 0.12-0.18MPa temperature is 50-80 DEG C.
beneficial effect
Conductive resin conductive resin of the present invention is good, electric performance stablity, and heatproof, up to 280 DEG C, is applicable to electronic industry conductive adhesive and sealing agent.
Embodiment
Below in conjunction with specific embodiment, technical scheme of the present invention is further described, should be appreciated that specific embodiment described herein only in order to explain the present invention, be not construed as limiting the invention.
embodiment 1
A kind of conductive resin, comprise the following component counted by weight: epoxy resin 24-38 part, UV light absorber 0.1-0.5 part, antioxidant 0.4-0.8 part, 400 order silver powder 12-18 parts, ethene-vinyl acetate 5-9 part, carbon black 10-18 part, polypropylene glycol diglycidyl ether 50-80 part, 400 order aluminium oxide powder 29-48 parts, solidifying agent 0.03-0.06 part.
The preparation method of above-mentioned conductive resin, comprises the following steps:
Step 1, takes component, by aluminium oxide powder and silver powder mixing, stirs to obtain the first mixture;
Step 2, drops into epoxy resin, ethene-vinyl acetate, polypropylene glycol diglycidyl ether and solidifying agent in magnetic stirring apparatus, is heated to 60 DEG C while stirring obtains the second mixture with 300rpm;
Step 3, spray the first mixture in the second mixture after, stir to be cooled to 25 DEG C time, add UV light absorber, antioxidant and carbon black, at 0.12MPa temperature is 50 DEG C after concentrated 1min finished product.
embodiment 2
A kind of conductive resin, comprise the following component counted by weight: epoxy resin 28-34 part, UV light absorber 0.2-0.4 part, antioxidant 0.6-0.7 part, 500 order silver powder 14-16 parts, ethene-vinyl acetate 6-8 part, carbon black 12-16 part, polypropylene glycol diglycidyl ether 63-73 part, 500 order aluminium oxide powder 32-45 parts, solidifying agent 0.04-0.06 part.
The preparation method of above-mentioned conductive resin, comprises the following steps:
Step 1, takes component, by aluminium oxide powder and silver powder mixing, stirs to obtain the first mixture;
Step 2, drops into epoxy resin, ethene-vinyl acetate, polypropylene glycol diglycidyl ether and solidifying agent in magnetic stirring apparatus, is heated to 75 DEG C while stirring obtains the second mixture with 400rpm;
Step 3, spray the first mixture in the second mixture after, stir to be cooled to 28 DEG C time, add UV light absorber, antioxidant and carbon black, after 0.16MPa temperature is 60 DEG C of concentrated 2min finished product.
embodiment 3
A kind of conductive resin, comprise the following component counted by weight: epoxy resin 24-38 part, UV light absorber 0.1-0.5 part, antioxidant 0.4-0.8 part, 500 order silver powder 12-18 parts, ethene-vinyl acetate 5-9 part, carbon black 10-18 part, polypropylene glycol diglycidyl ether 50-80 part, 500 order aluminium oxide powder 29-48 parts, solidifying agent 0.03-0.06 part.
The preparation method of above-mentioned conductive resin, comprises the following steps:
Step 1, takes component, by aluminium oxide powder and silver powder mixing, stirs to obtain the first mixture;
Step 2, drops into epoxy resin, ethene-vinyl acetate, polypropylene glycol diglycidyl ether and solidifying agent in magnetic stirring apparatus, is heated to 78 DEG C while stirring obtains the second mixture with 450rpm;
Step 3, spray the first mixture in the second mixture after, stir to be cooled to 30 DEG C time, add UV light absorber, antioxidant and carbon black, at 0.18MPa temperature is 80 DEG C after concentrated 3min finished product.
embodiment 4
A kind of conductive resin, comprise the following component counted by weight: epoxy resin 28-34 part, UV light absorber 0.2-0.4 part, antioxidant 0.6-0.7 part, 500 order silver powder 14-16 parts, ethene-vinyl acetate 6-8 part, carbon black 12-16 part, polypropylene glycol diglycidyl ether 63-73 part, 500 order aluminium oxide powder 32-45 parts, solidifying agent 0.04-0.06 part, chloroprene rubber 3-9 part.
The preparation method of above-mentioned conductive resin, comprises the following steps:
Step 1, takes component, by aluminium oxide powder and silver powder mixing, stirs to obtain the first mixture;
Step 2, drops into epoxy resin, ethene-vinyl acetate, polypropylene glycol diglycidyl ether and solidifying agent in magnetic stirring apparatus, is heated to 75 DEG C while stirring obtains the second mixture with 400rpm;
Step 3, spray the first mixture in the second mixture after, stir to be cooled to 28 DEG C time, add UV light absorber, antioxidant and carbon black, after 0.16MPa temperature is 60 DEG C of concentrated 2min finished product.
comparative example 1
A kind of conductive resin, comprise the following component counted by weight: epoxy resin 28-34 part, UV light absorber 0.2-0.4 part, antioxidant 0.6-0.7 part, ethene-vinyl acetate 6-8 part, carbon black 12-16 part, polypropylene glycol diglycidyl ether 63-73 part, 500 order aluminium oxide powder 32-45 parts, solidifying agent 0.04-0.06 part.
The preparation method of above-mentioned conductive resin, comprises the following steps:
Step 1, takes component;
Step 2, drops into epoxy resin, ethene-vinyl acetate, polypropylene glycol diglycidyl ether and solidifying agent in magnetic stirring apparatus, is heated to 75 DEG C while stirring obtains the second mixture with 400rpm;
Step 3, spray aluminium oxide powder in the second mixture after, stir to be cooled to 28 DEG C time, add UV light absorber, antioxidant and carbon black, after 0.16MPa temperature is 60 DEG C of concentrated 2min finished product.
comparative example 2
A kind of conductive resin, comprise the following component counted by weight: epoxy resin 28-34 part, UV light absorber 0.2-0.4 part, antioxidant 0.6-0.7 part, 500 order silver powder 14-16 parts, ethene-vinyl acetate 6-8 part, carbon black 12-16 part, polypropylene glycol diglycidyl ether 63-73 part, solidifying agent 0.04-0.06 part.
The preparation method of above-mentioned conductive resin, comprises the following steps:
Step 1, takes component;
Step 2, drops into epoxy resin, ethene-vinyl acetate, polypropylene glycol diglycidyl ether and solidifying agent in magnetic stirring apparatus, is heated to 75 DEG C while stirring obtains the second mixture with 400rpm;
Step 3, spray silver powder in the second mixture after, stir to be cooled to 28 DEG C time, add UV light absorber, antioxidant and carbon black, after 0.16MPa temperature is 60 DEG C of concentrated 2min finished product.
performance test
Test the conductive resin of embodiment of the present invention 1-4 and comparative example 1-2 gained, the data obtained is as shown in the table:
As can be seen from upper table data, conductive resin of the present invention is high temperature resistant reaches 220 DEG C, good conductivity, and conductivity is stablized, and corrosion-resistant, bonding strength is high, has good market outlook.
The foregoing is only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; any those of ordinary skill in the art are in the technical scope disclosed by the present invention; the change can expected without creative work or replacement, all should be encompassed within protection scope of the present invention.Therefore, the protection domain that protection scope of the present invention should limit with claims is as the criterion.
Claims (7)
1. a conductive resin, it is characterized in that, comprise the following component counted by weight: epoxy resin 24-38 part, UV light absorber 0.1-0.5 part, antioxidant 0.4-0.8 part, silver powder 12-18 part, ethene-vinyl acetate 5-9 part, carbon black 10-18 part, polypropylene glycol diglycidyl ether 50-80 part, aluminium oxide powder 29-48 part, solidifying agent 0.03-0.06 part.
2. conductive resin according to claim 1, it is characterized in that, comprise the following component counted by weight: epoxy resin 28-34 part, UV light absorber 0.2-0.4 part, antioxidant 0.6-0.7 part, silver powder 14-16 part, ethene-vinyl acetate 6-8 part, carbon black 12-16 part, polypropylene glycol diglycidyl ether 63-73 part, aluminium oxide powder 32-45 part, solidifying agent 0.04-0.06 part.
3. conductive resin according to claim 1, is characterized in that: the order number of described silver powder and aluminium oxide powder is respectively 400-500 order.
4. conductive resin according to claim 1, is characterized in that: also comprise chloroprene rubber 3-9 part.
5. the preparation method of conductive resin according to claim 1, is characterized in that, comprises the following steps:
Step 1, takes component, by aluminium oxide powder and silver powder mixing, stirs to obtain the first mixture;
Step 2, drops into epoxy resin, ethene-vinyl acetate, polypropylene glycol diglycidyl ether and solidifying agent in magnetic stirring apparatus, is heated to 60-78 DEG C while stirring and obtains the second mixture;
Step 3, spray the first mixture in the second mixture after, stir to be cooled to 25-30 DEG C time, add UV light absorber, antioxidant and carbon black, after concentrated 1-3min finished product.
6. the preparation method of conductive resin according to claim 5, is characterized in that: in step 2, stirring velocity is 300-450rpm.
7. the preparation method of conductive resin according to claim 5, is characterized in that: time concentrated in step 3, vacuum tightness is 0.12-0.18MPa temperature is 50-80 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201510372014.0A CN104927700A (en) | 2015-06-30 | 2015-06-30 | Conductive paste and preparing method thereof |
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| CN201510372014.0A CN104927700A (en) | 2015-06-30 | 2015-06-30 | Conductive paste and preparing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1759158A (en) * | 2003-03-10 | 2006-04-12 | 蒂萨股份公司 | Electrically heatable pressure-sensitive adhesive compound |
| CN102171307A (en) * | 2008-10-03 | 2011-08-31 | 岛根县 | Heat-resistant and highly heat-conductive adhesive agent |
| CN103540287A (en) * | 2013-09-27 | 2014-01-29 | 长春永固科技有限公司 | High-UPH epoxy resin conductive adhesive and preparation method thereof |
| CN104017529A (en) * | 2014-04-14 | 2014-09-03 | 江苏嘉娜泰有机硅有限公司 | Single-component epoxy resin conductive silver adhesive composition and preparation method thereof |
-
2015
- 2015-06-30 CN CN201510372014.0A patent/CN104927700A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1759158A (en) * | 2003-03-10 | 2006-04-12 | 蒂萨股份公司 | Electrically heatable pressure-sensitive adhesive compound |
| CN102171307A (en) * | 2008-10-03 | 2011-08-31 | 岛根县 | Heat-resistant and highly heat-conductive adhesive agent |
| CN103540287A (en) * | 2013-09-27 | 2014-01-29 | 长春永固科技有限公司 | High-UPH epoxy resin conductive adhesive and preparation method thereof |
| CN104017529A (en) * | 2014-04-14 | 2014-09-03 | 江苏嘉娜泰有机硅有限公司 | Single-component epoxy resin conductive silver adhesive composition and preparation method thereof |
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Application publication date: 20150923 |
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