CN104914595B - Substrate briquetting machine - Google Patents
Substrate briquetting machine Download PDFInfo
- Publication number
- CN104914595B CN104914595B CN201410084449.0A CN201410084449A CN104914595B CN 104914595 B CN104914595 B CN 104914595B CN 201410084449 A CN201410084449 A CN 201410084449A CN 104914595 B CN104914595 B CN 104914595B
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- CN
- China
- Prior art keywords
- substrate
- pedestal
- movable pressing
- driver
- briquetting machine
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of substrate briquetting machine, and it is used to push down a piece of substrate for being located at a hot pressing position and being ready for hot pressing, and including two pressure settings mutually side by side, each pressure setting includes a pedestal, a support stick and a dip mold group.It is each to support stick to be located on corresponding pedestal, each driver for pushing module and including a movable pressing board and connection and driving the movable pressing board to rotate and lift.When the substrate is sent to a hot pressing position, each driver for pushing module drives its movable pressing board to turn to after an operating position to drop to again from a home position and push down position, so that two movable pressing board is press respectively against on the substrate and respectively close to the two opposite sides side of the substrate.The substrate briquetting machine of the present invention, takes up space by previous constructions than less, is applicable in the occasion that some space availability ratios require high.
Description
Technical field
The present invention with for one or more flexible circuit boards engages to an a substrate (such as display panel or one rigid electric
Road plate) device-dependent, more particularly to the substrate briquetting machine in the equipment.
Background technology
One or more flexible circuit boards are pasted into a rigid substrate (circuit board or liquid by anisotropic conductive adhesive paste (ACF)
Crystal panel) it is electrically connected so that the flexible base plate is formed with rigid substrate, has been common assembling skill.In order to automatically continuously make
Needs in industry, the flexible circuit board are typically to be made into winding form, to facilitate continuous conveying, such as use chip on film
The COF winding of packing forms (Chip On Film, COF).The COF winding can be delivered continuously a blanking units, the punching
Device can be punched into COF pieces one by one from the COF winding, and these COF pieces are exactly foregoing flexible circuit board.These quilts
The flexible circuit board being punched can then be labeled with one layer of anisotropic conductive adhesive paste, then by a false press of a hot-press equipment
The hot pressing of structure (or precompressed mechanism), by flexible circuit board elder generation temporary joint a to substrate, then, then by the hot pressing
The hot pressing of one press mechanism of equipment, the flexible circuit board is positively engaged to the substrate so that the flexible circuit board with
Corresponding pin (or external pin) completes to be electrically connected with the substrate.
Before above-mentioned hot pressing is carried out, the substrate be by a transport microscope carrier and be transported to a hot pressing position prepare into
The above-mentioned hot pressing of row, and pushed down in this hot pressing position by a substrate briquetting machine.By taking a press mechanism shown in Fig. 6 as an example, when
When one substrate 70 reaches the hot pressing position shown in figure, the multiple flexible circuit boards 71 of temporary joint (COF pieces) on substrate 70
One fringe region can be supported by a hot pressing filler strip 90 of this press mechanism, and the one of a substrate briquetting machine 8 supports stick 80 then
Substrate 70 is support in the position close to the fringe region, then, the block of press strip once 81 of substrate briquetting machine 8 moves down into a pressure
Position processed, substrate 70 is compressed on and supported on stick 80, as shown in FIG., in this way, completing the preparation before hot pressing.Then,
Multiple thermal heads 91 of this press mechanism 9 can together move down and push 71 1 sections of scheduled times of corresponding flexible circuit board, use
Complete above-mentioned hot pressing so that the flexible circuit board 71 pin (not shown) corresponding with substrate 70, which is formed, electrically to be connected
Connect.
The support stick 80 of above-mentioned substrate briquetting machine 8 and to push stick 81 be all strip, its length substantially phase
When in the Breadth Maximum of substrate 70, however, the support stick 80 of this strip, pushing stick 81 and its drive device and can take very
More spaces, can not be suitable for some for the high occasion of space availability ratio requirement, there is the necessity for adding improvement again in fact.
The content of the invention
It is an object of the invention to provide a kind of new substrate briquetting machine, the exigent field of space availability ratio is applicable to
In conjunction.
The substrate briquetting machine of the present invention is ready for the substrate of hot pressing for pushing down a piece of hot pressing position that is located at, and wraps
Two pressure settings mutually side by side are included, each pressure setting includes a pedestal, a support stick and a dip mold group.Each support
Stick is located on corresponding pedestal, and for supporting the substrate when the substrate is located at the hot pressing position；Each module that pushes is set
In on corresponding pedestal, and including a movable pressing board and connection and the movable pressing board is driven to rotate the driver with lifting.
When the substrate is sent to a hot pressing position, each two movable pressing boards for pushing module are located at the upper of the substrate two opposite sides side
Side, and each driver for pushing module drives its movable pressing board to turn to after an operating position from a home position again to decline
Position is pushed down to one, so that two movable pressing board is press respectively against on the substrate and respectively close to the two opposite sides side of the substrate.
It is preferred that it is above-mentioned it is each push module and also include one set a position regulator on the base, it is each to push
The position regulator of module connects its driver, and for adjusting the position of its driver and movable pressing board, to adapt to the substrate
Size.
It is preferred that above-mentioned each module that pushes also includes a position regulator, the position regulator includes being fixed on this
A pedestal on pedestal, the drive motor on the pedestal, driven and parallel to the support stick by drive motor
One driving screw and swivel nut in a Mobile base of the driving screw, wherein, the driver is installed on the Mobile base.
Relative to known technology, aforesaid substrate briquetting machine of the invention, using two short movable pressing boards and short two
Stick is held to push down the substrate, such way takes up space than less, is applicable to the occasion that some space availability ratios require high.
As for the other content of the invention and more detailed technology and function declaration of the present invention, subsequent explanation will be exposed in.
Brief description of the drawings
The following drawings is only intended to, in doing schematic illustration and explanation to the present invention, not delimit the scope of the invention.Wherein,
Fig. 1 is the stereo appearance figure of a preferred embodiment of the substrate briquetting machine of the present invention.
Fig. 2 is the stereo appearance figure of a wherein pressure setting 100 for the preferred embodiment of the present invention.
The movable pressing board 13 of the preferred embodiment of Fig. 3 display present invention is located at a stereo appearance figure during operating position.
The movable pressing board 13 of the preferred embodiment of Fig. 4 display present invention is located at the side view during operating position.
The movable pressing board 13 of the preferred embodiment of Fig. 5 display present invention positioned at one push down position when side view.
Fig. 6 is the schematic diagram of known substrate briquetting machine.
Main element label declaration：
The pedestal of 1 substrate briquetting machine 10
100 pressure settings 11 support stick
110 suckers 111 push module
The movable axis of 12 driver 120
The movable pressing board of 121 cylinder body 13
The position regulator of 130 block rubber 14
The drive motor of 140 pedestal 141
The Mobile base of 142 driving screw 143
2 hot pressing filler strips of press mechanism 20
21 thermal heads
The flexible circuit board of 70 substrate 71
8 briquetting machines 80 support stick
81 push stick
The thermal head of 90 hot pressing filler strip 91
Embodiment
In order to which technical characteristic, purpose and the effect of the present invention is more clearly understood, now control illustrates this hair
Bright embodiment.
One preferred embodiment of the substrate briquetting machine 1 of Fig. 1 display present invention, in this example, the substrate press
Structure 1 includes mutually the front that rows of two pressure setting 100 side by side is located at a press mechanism 2 respectively.This press mechanism 2 includes a heat
Pressure pad bar 20 and multiple thermal head (not shown) side by side directly over hot pressing filler strip 20.Each pressure setting 100 wraps
Include the pedestal 10 being made up of two L-type supports, the support stick 11 on pedestal 10 and on the pedestal 10
One dip mold group 111, this, which pushes module 111, includes a movable pressing board 13 and connects and drive the movable pressing board 13 to rotate and rise
One driver 12 of drop.It is preferred that this, which pushes module 111, also includes a position regulator 14 being fixed on the pedestal 10,
The position regulator 14 connects the driver 12, and (this is the equal of adjustment activity pressure to the position for adjusting the driver 12
The position of plate 13).
Referring to Fig. 2, it is used for adsorbing a substrate with multiple on the support stick 11 of each pressure setting 100 (in figure not
Show) sucker 110.Furthermore the bottom of each movable pressing board 13 for pushing module 111 has a block rubber 130, this block rubber
130 under movable pressing board 13 when being pressed on the substrate, can protect the substrate, avoid the substrate from being crushed, especially be in the substrate
Under the occasion of one liquid crystal panel.Each driver 12 for pushing module 111 is that one kind can drive movable pressing board 13 to rotate and rise
The device of drop, commercially available rotary extension cylinder (or rotation clamping cylinder), in this example, movable pressing board 13 can be selected herein
One end be fixed on a movable axis 120 of driver 12.In addition, each position regulator 14 for pushing module 111 includes one
Pedestal 140, the drive motor 141 (such as a servo motor) located at the one end of pedestal 140, by drive motor 141 driven and put down
Row in the support stick 11 a driving screw 142 and swivel nut in a Mobile base 143 of the driving screw 142, wherein, driver 12
Cylinder body 121 be installed on the Mobile base 143.Therefore, under the drive of the drive motor 141, the activity pressure on driver 12
Plate 13 can make displacement along the length direction of pedestal 140, reach the purpose for adjusting its position.In this way, user's can by
By the position of the corresponding adjustment movable pressing board 13 of position regulator 14, to adapt to various sizes of substrate.
Hereby coordinate this press mechanism 2 below to illustrate the running of the substrate briquetting machine 1 of the present invention, however, need to point out
It is that substrate briquetting machine 1 of the invention can also be fitted to a false press mechanism or other laminating mechanisms, to suppress liquid crystal surface
Plate, circuit board or other rigid substrates.
As shown in Figure 1, Figure 3, a substrate 70 (such as a liquid crystal panel) is transported to one by a transport microscope carrier (not shown)
Hot pressing position, now, the fringe region (the multiple flexible circuit boards 71 of temporary joint, such as COF pieces) of substrate 70 is by Fig. 1 institutes
The hot pressing filler strip 20 shown is supported, and is then supported close to the part of this fringe region 71 by two support sticks 11, and by two
The sucker 110 on stick 11 is held to hold without any slip.Then, as shown in Figure 3, Figure 4, in the drive respectively of two drivers 12
Under dynamic, two movable pressing boards 13 are rolled over an operating position from a home position respectively, and now, two movable pressing boards 13 are located at substrate
The top of 70 two opposite sides side simultaneously faces the upper surface of substrate 70.Then, two movable pressing boards 13 continue in two drivers 12
Under driving respectively, move down into one and push down position, one as shown in figure 5, now, substrate 70 is pressed in two support bars by two movable pressing boards 13
On block 11, and two underfaces for supporting stick 11 to be located at two movable pressing boards 13 respectively, complete the compacting to substrate 70.
When the thermal head 21 of this press mechanism 2 move down and to the flexible circuit board 71 complete hot pressing and on be moved back into original position
Afterwards, two movable pressing boards 13 continue under the driving respectively of two drivers 12, rise from the depressed position and return to the operating position, then
The home position is rotated back into from the operating position, when next plate base 70 is transported to the hot pressing position by the transport microscope carrier
When, two movable pressing boards 13 perform above-mentioned running again under the driving of two drivers 12, and appearance does not repeat.
Relative to prior art, substrate briquetting machine 1 of the invention gives up the single support bar of strip used in the past
Block and the single way for pushing stick of strip, are changed and are pushed down using above-mentioned two short movable pressing boards 13 with short support stick 11
Substrate 70, such way take up space than less, are applicable to the occasion that some space availability ratios require high.
The schematical embodiment of the present invention is the foregoing is only, is not limited to the scope of the present invention.It is any
Those skilled in the art, made equivalent variations and modification on the premise of the design of the present invention and principle is not departed from,
The scope of protection of the invention should be belonged to.
Claims (3)
1. a kind of substrate briquetting machine, for pushing down a piece of substrate for being located at a hot pressing position and being ready for hot pressing, its feature exists
In the substrate briquetting machine includes phase, and rows of two pressure setting, each pressure setting include side by side：
One pedestal；
One supports stick, on the pedestal, and for supporting the substrate when the substrate is located at the hot pressing position；
And
One dip mold group, on the pedestal and including a movable pressing board and connection and drive the movable pressing board rotate with
One driver of lifting；
Wherein, when the substrate is located at the hot pressing position, two movable pressing boards of module are pushed described in two positioned at described
The top on substrate two opposite sides side, and each driver for pushing module drives its movable pressing board to be rotated from a home position
Drop to again after to an operating position and push down position, so that the substrate is pressed in described in two by two movable pressing boards respectively
Support on stick, and two underfaces for supporting stick to be now located at two movable pressing boards respectively.
2. substrate briquetting machine as claimed in claim 1, it is characterised in that push module described in each and be also located at institute including one
The position regulator on pedestal is stated, each position regulator for pushing module connects its driver, and for adjusting it
The position of driver and movable pressing board.
3. substrate briquetting machine as claimed in claim 1, it is characterised in that each module that pushes also includes position tune
Whole device, the position regulator include be fixed on the pedestal on the pedestal, the drive motor on the pedestal, by
The drive motor drives and parallel to the driving screw for supporting stick and swivel nut in a movement of the driving screw
Seat, wherein, the driver is installed on the Mobile base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410084449.0A CN104914595B (en) | 2014-03-10 | 2014-03-10 | Substrate briquetting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410084449.0A CN104914595B (en) | 2014-03-10 | 2014-03-10 | Substrate briquetting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104914595A CN104914595A (en) | 2015-09-16 |
| CN104914595B true CN104914595B (en) | 2018-01-09 |
Family
ID=54083798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410084449.0A Active CN104914595B (en) | 2014-03-10 | 2014-03-10 | Substrate briquetting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104914595B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109064886B (en) * | 2018-08-29 | 2020-04-03 | 武汉华星光电技术有限公司 | Binding machine horizontal alignment system and method |
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| TW448331B (en) * | 1996-02-28 | 2001-08-01 | Toshiba Corp | Thermo-compressing bonding method and thermo-compressing bonding apparatus |
| TW457608B (en) * | 1999-07-22 | 2001-10-01 | Nippon Electric Co | Thermocompression bonding device for connecting LCD panel to external driving circuit |
| TW549594U (en) * | 2002-12-19 | 2003-08-21 | Chipmos Technologies Bermuda | Thermal compression head for bonding substrate and chip |
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| CN102473654A (en) * | 2009-07-03 | 2012-05-23 | 松下电器产业株式会社 | Tape applying apparatus |
| CN203002988U (en) * | 2012-12-26 | 2013-06-19 | 深圳平显光电设备有限公司 | Pulse hot press of long pressure head |
| CN103716995A (en) * | 2013-12-06 | 2014-04-09 | 深圳市东旭发自动化有限公司 | Novel stiffening plate laminating machine |
-
2014
- 2014-03-10 CN CN201410084449.0A patent/CN104914595B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW448331B (en) * | 1996-02-28 | 2001-08-01 | Toshiba Corp | Thermo-compressing bonding method and thermo-compressing bonding apparatus |
| TW457608B (en) * | 1999-07-22 | 2001-10-01 | Nippon Electric Co | Thermocompression bonding device for connecting LCD panel to external driving circuit |
| TW559963B (en) * | 2001-06-08 | 2003-11-01 | Shibaura Mechatronics Corp | Pressuring apparatus of electronic device and its method |
| CN1592961A (en) * | 2002-01-15 | 2005-03-09 | 松下电器产业株式会社 | Adhesive sheet stamping device, adhesive sheet stamping method, part mounter, and display panel manufacturing method |
| TW563890U (en) * | 2002-12-17 | 2003-11-21 | Chunghwa Picture Tubes Ltd | Hot press head structure for plasma display panel |
| TW549594U (en) * | 2002-12-19 | 2003-08-21 | Chipmos Technologies Bermuda | Thermal compression head for bonding substrate and chip |
| JP2006024592A (en) * | 2004-07-06 | 2006-01-26 | Sony Corp | Press-contacting device for anisotropic conductive adhesive film |
| TWI306804B (en) * | 2005-10-14 | 2009-03-01 | Hon Hai Prec Ind Co Ltd | Thermoforming machine |
| CN101277588A (en) * | 2007-03-29 | 2008-10-01 | 株式会社日立高新技术 | ACF paste device and flat panel display |
| CN101916001A (en) * | 2007-08-21 | 2010-12-15 | 株式会社日立高新技术 | ACF method of attaching and ACF sticker |
| CN102227760A (en) * | 2008-12-26 | 2011-10-26 | Nec液晶技术株式会社 | Acf attachment device and display device manufacturing method |
| CN102473654A (en) * | 2009-07-03 | 2012-05-23 | 松下电器产业株式会社 | Tape applying apparatus |
| CN101988996A (en) * | 2009-07-31 | 2011-03-23 | 株式会社日立高新技术 | Pcb mounting treatment device and PCB mounting treatment method |
| CN201674727U (en) * | 2010-04-02 | 2010-12-15 | 禾宇精密科技股份有限公司 | Hot pressing cutting device |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104914595A (en) | 2015-09-16 |
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