CN104910588A - Preparation method of high-heat conduction epoxy material containing nano-silver wires - Google Patents
Preparation method of high-heat conduction epoxy material containing nano-silver wires Download PDFInfo
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- CN104910588A CN104910588A CN201410087524.9A CN201410087524A CN104910588A CN 104910588 A CN104910588 A CN 104910588A CN 201410087524 A CN201410087524 A CN 201410087524A CN 104910588 A CN104910588 A CN 104910588A
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Abstract
The invention discloses a preparation method of a high-heat conduction epoxy material containing nano-silver wires. The preparation method comprises the following steps: 1, taking all components according to weight percentages; 2, carrying out surface modification by using nano-silver wires; 3, mixing epoxy resin with an epoxy diluent at room temperature for 3-30min to obtain a uniform mixture; 4, adding a curing agent, a curing promoter and a coupling agent to the epoxy resin and epoxy diluent mixture obtained in step 3, and mixing at room temperature for 3-30min; and 5, respectively adding the nano-silver wires prepared in step 2and alumina into the uniform mixture prepared in step 4, and uniformly mixing at room temperature to obtain the material. The material prepared through the preparation method can effectively dissipate heat of microelectronic devices.
Description
Technical field
The present invention is specifically related to a kind of preparation method of the high heat conduction epoxy material containing nano-silver thread.
Background technology
Along with the development of microelectronics and large-scale integrated circuit, circuit components high concentration, the heat radiation of components and parts becomes distinct issues.Common epoxy composite material because of heat conductivility poor, the cooling requirements of some occasion cannot be met, in epoxy composite material, generally take the method for filling conducting filler in epoxy resin to improve its heat conductivility; The metal oxides such as usual use aluminum oxide, magnesium oxide, zinc oxide, quartz, the metal nitride such as boron nitride, aluminium nitride, the metallic carbide such as silicon carbide, the metal hydroxidess such as aluminium hydroxide, the metal such as gold and silver, copper, carbon fiber, graphite etc. are as heat conductive filler; But along with high performance, the multifunction of nearest electronic unit, thermal value also in increase, only relies on these single heat conductive fillers to be difficult to meet the cooling requirements of microelectronic device; Therefore the epoxy composite material developing high heat conduction becomes the active demand of industry.
Summary of the invention
(1) technical problem that will solve
In order to solve the problem, the present invention proposes a kind of preparation method of the high heat conduction epoxy material containing nano-silver thread, can effectively fall apart except the heating of microelectronic device.
(2) technical scheme
The preparation method of the high heat conduction epoxy material containing nano-silver thread of the present invention, described preparation method comprises the following steps:
(1) each component is taken out according to weight percent; Described each component and weight percent are: aluminum oxide powder 50% ~ 80%, nano-silver thread 1 ~ 20%, epoxy resin 10% ~ 25%, epoxide diluent 3% ~ 10%, solidifying agent 8% ~ 20%, curing catalyst 0.5% ~ 2%, polythiol 0.5 ~ 2% and coupling agent 0.5% ~ 2%;
(2) nano-silver thread surface modification: nano-silver thread and polythiol are added in toluene solution, 40 ~ 100
oat C temperature, high degree of agitation is after 6 ~ 48 hours, centrifugal, washing and obtain the nano-silver thread of polythiol modification after cryodrying;
(3) epoxy resin and epoxide diluent are at room temperature mixed 3 ~ 30 minutes, obtain uniform mixture;
(4) solidifying agent, curing catalyst and coupling agent are joined in the epoxy resin of step (3) and the mixture of epoxide diluent, under room temperature, mix 3 ~ 30 minutes;
(5) nano-silver thread step (2) prepared and aluminum oxide add in the obtained uniform mixture of step (4) respectively, mix under room temperature; Obtain material.
Further, described polythiol is the mixture of one or more than one of two (3-thiohydracrylic acid) ethylene glycol, trimethylolpropane tris (3-mercaptopropionic acid ester), tetramethylolmethane four-3-mercaptopropionic acid ester and three [2-(3-thiohydracrylic acid base) ethyl] chlorinated isocyanurates.
Further, described epoxy resin is the mixture of the one or more than one of Racemic glycidol ethers bisphenol A-type, bisphenol f type epoxy resin, ethylene oxidic ester epoxy resin, aliphatic epoxy resin, cycloaliphatic epoxy resin, acrylic modified epoxy resin and modifying epoxy resin by organosilicon.
Further, described epoxide diluent is 1,4-butyleneglycol glycidyl ether, neopentyl glycol glycidyl ether, 1, the mixture of one or more in 6-hexanediol diglycidyl ether, Diethylene Glycol glycidyl ether, Isosorbide-5-Nitrae-cyclohexane diol glycidyl ether, TriMethylolPropane(TMP) glycidyl ether, polyethyleneglycol diglycidylether.
Further, described solidifying agent is the mixture of one or more than one of tetrahydrophthalic anhydride, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, methylnadic anhydride, dodecyl MALEIC ANHYDRIDE.
Further, described curing catalyst is selected from benzyldimethylamine, 2,4,6-three (dimethylamino methyl) phenol (DMP-30) and modifier, 2-ethyl-4-methylimidazole, cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN), the modifier of benzyldimethylamine, Methylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazole, 2,4-diamino-6-(2-undecyl imidazole-1-ethyls) mixture of one or more than one in-S-triazine and derivative thereof and salt in its modifier.
Further, described coupling agent is γ-aminopropyl triethoxysilane, γ-aminopropyltrimethoxysilane, γ-(2, 3-epoxy third oxygen) propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, N-(β-aminoethyl)-γ-aminopropyl triethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, γ-aminopropyltriethoxy dimethoxysilane, γ-aminopropyltriethoxy diethoxy silane, the mixture of one or more in vinyltriethoxysilane.
Further, the diameter of described nano-silver thread is 5 nanometer ~ 100 nanometers,
Preferably, described nano-silver thread is 10 nanometer ~ 20 nanometers.
Further, described alumina particle is 0.5 micron ~ 100 microns.
(3) beneficial effect
Compared with prior art, it has following beneficial effect in the present invention: the preparation method of the high heat conduction epoxy material containing nano-silver thread of the present invention,
(1) carry out surface modification by polythiol to nano-silver thread, make it be dispersed in preferably in resin matrix, during solidification, polythiol participation curable epoxide removes from the surface of nano-silver thread, makes nano-silver thread have good heat conductivility.
(2), after the nano-silver thread that the present invention is used mixes with micron ball-aluminium oxide, formed to mix and take structure, effectively build heat conduction network, therefore, it is possible to increase substantially the heat conductivility of epoxy composite material.
Embodiment
Preparation method's cardinal principle of the high heat conduction epoxy material containing nano-silver thread of the present invention is: use nano-silver thread and ball-aluminium oxide to mix and take, the epoxy material of preparation; Below by the comparative example introducing embodiments of the invention and contrast with embodiment:
Comparative example 1: at normal temperatures, respectively according to each component that comparative example in table 11 is specified, by bisphenol A type epoxy resin and neopentyl glycol glycidyl ether, 1,4-cyclohexane diol glycidyl ether mixes 10 minutes to even, then methyl tetrahydro phthalic anhydride, 2-undecyl imidazole and γ-(2 are added, 3-epoxy third oxygen) propyl trimethoxy silicane, under room temperature, mixing becomes uniform mixture in 15 minutes, again after three-roller grinding, add ball-aluminium oxide, low speed mixing 45 minutes under room temperature.
Comparative example 2: at normal temperatures, respectively according to each component that comparative example in table 12 is specified, by dihydroxyphenyl propane and bisphenol f type epoxy resin and 1,4-butyleneglycol glycidyl ether, polyethyleneglycol diglycidylether mix 10 minutes to even, then methyl hexahydrophthalic anhydride, 2-ethyl-4-methylimidazole, γ-aminopropyl triethoxysilane and γ-methacryloxypropyl trimethoxy silane is added, under room temperature, mixing becomes uniform mixture in 10 minutes, again after three-roller grinding, add ball-aluminium oxide, low speed mixing 45 minutes under room temperature.
Comparative example 3: at normal temperatures, respectively according to each component that comparative example in table 13 is specified, by bisphenol A-type and bisphenol f type epoxy resin and polyethyleneglycol diglycidylether, 1,4-cyclohexane diol glycidyl ether mixes 20 minutes to even, then methyl Na Dike phthalic anhydride, 1-cyanoethyl-2-ethyl-4-methylimidazole and γ-aminopropyl triethoxysilane is added, under room temperature, mixing becomes uniform mixture in 10 minutes, again after three-roller grinding, add nano-silver thread and ball-aluminium oxide, under room temperature, low speed mixing can be made for 45 minutes.
Embodiment 1: formulate each component according to embodiment in table 11, nano-silver thread is in the toluene solution of two (3-thiohydracrylic acid) ethylene glycol 80
oc stirs 24h, centrifugal, prepares modified nano-silver thread after washing drying, for subsequent use; At normal temperatures, respectively according to each component that embodiment in table 11 is specified, bisphenol A-type and bisphenol f type epoxy resin and Diethylene Glycol glycidyl ether are mixed 20 minutes to evenly, then methyl tetrahydro phthalic anhydride, tetrahydrophthalic anhydride, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole and hexanediamine ylmethyl Trimethoxy silane is added, under room temperature, mixing becomes uniform mixture in 10 minutes, again after three-roller grinding, add ball-aluminium oxide and modified Nano silver line, under room temperature, low speed mixing can obtain high heat conduction epoxy material of the present invention for 60 minutes.
Embodiment 2: formulate each component according to embodiment in table 12, nano-silver thread is in the toluene solution of two (3-thiohydracrylic acid) ethylene glycol 80
oc stirring and refluxing 24h, centrifugal, prepare modified nano-silver thread after washing drying, for subsequent use, at normal temperatures, respectively according to each component that embodiment in table 12 is specified, by bisphenol A-type and bisphenol f type epoxy resin and polyethyleneglycol diglycidylether, 1, 4-cyclohexane diol glycidyl ether mixes 20 minutes to even, then methyl hexahydrophthalic anhydride is added, 1-cyanoethyl-2-ethyl-4-methylimidazole, γ-aminopropyl triethoxysilane and hexanediamine ylmethyl Trimethoxy silane, under room temperature, mixing becomes uniform mixture in 10 minutes, again after three-roller grinding, add ball-aluminium oxide and modified Nano silver line, under room temperature, low speed mixing can obtain high heat conduction epoxy material of the present invention for 60 minutes.
Embodiment 3: formulate each component according to embodiment in table 13, nano-silver thread is in the toluene solution of trimethylolpropane tris (3-mercaptopropionic acid ester) 80
oc stirring and refluxing 24h, centrifugal, prepare modified nano-silver thread after washing drying, for subsequent use, at normal temperatures, respectively according to each component that embodiment in table 13 is specified, by bisphenol f type epoxy resin and 1, 4-butyleneglycol glycidyl ether, Diethylene Glycol glycidyl ether mixes 20 minutes to even, then methyl tetrahydro phthalic anhydride is added, methyl hexahydrophthalic anhydride, 2-phenyl-4-methylimidazole, latent curing agent PN23 and γ-(2, 3-epoxy third oxygen) propyl trimethoxy silicane, under room temperature, mixing becomes uniform mixture in 10 minutes, again after three-roller grinding, add ball-aluminium oxide and modified Nano silver line, under room temperature, low speed mixing can obtain high heat conduction epoxy material of the present invention for 60 minutes.
Embodiment 4: formulate each component according to embodiment in table 14, nano-silver thread is in the toluene solution of tetramethylolmethane four-3-mercaptopropionic acid ester 80
oc stirring and refluxing 24h, centrifugal, prepare modified nano-silver thread after washing drying, for subsequent use, at normal temperatures, respectively according to each component that embodiment in table 14 is specified, by dihydroxyphenyl propane and bisphenol f type epoxy resin and neopentyl glycol glycidyl ether, polyethyleneglycol diglycidylether mixes 20 minutes to even, then methyl Na Dike phthalic anhydride is added, tetrahydrophthalic anhydride, latent curing agent PN23 and γ-aminopropyl triethoxysilane, γ-methacryloxypropyl trimethoxy silane, under room temperature, mixing becomes uniform mixture in 10 minutes, again after three-roller grinding, add ball-aluminium oxide and modified Nano silver line, under room temperature, low speed mixing can obtain high heat conduction epoxy material of the present invention for 60 minutes.
Embodiment 5: formulate each component according to embodiment in table 15, in the toluene solution of nano-silver thread [2-(3-thiohydracrylic acid base) ethyl] chlorinated isocyanurates three 80
oc stirring and refluxing 24h, centrifugal, prepare modified nano-silver thread after washing drying, for subsequent use; At normal temperatures, respectively according to each component that embodiment in table 15 is specified, dihydroxyphenyl propane, bisphenol f type epoxy resin and Diethylene Glycol glycidyl ether are mixed 20 minutes to even, then methyl Na Dike phthalic anhydride, tetrahydrophthalic anhydride, 2-phenyl-4-methylimidazole and γ-(2 are added, 3-epoxy third oxygen) propyl trimethoxy silicane, under room temperature, mixing becomes uniform mixture in 10 minutes, again after three-roller grinding, add ball-aluminium oxide and modified Nano silver line, under room temperature, low speed mixing can obtain high heat conduction epoxy material of the present invention for 60 minutes.
Table 1: the component of each comparative example and embodiment
The high heat conduction ring O compoiste material above each comparative example and embodiment prepared is 150 at condition of cure
ooven for curing 1 hour of C, material measuring and calculating thermal conductivity after solidification.
The conductive resin thermal conductivity test result that each embodiment of table 2 obtains
| Comparative example 1 | Comparative example 2 | Comparative example 3 | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| Thermal conductivity (W/mK) | 0.8 | 0.5 | 1 | 3.0 | 3.7 | 5.3 | 7.4 | 7.6 |
As can be seen from Table 2, the present invention takes by using nano-silver thread and ball-aluminium oxide to mix, and the epoxy material of preparation, has higher heat conductivility, can meet the application in field of semiconductor package.
Embodiment recited above is only be described the preferred embodiment of the present invention, not limits the spirit and scope of the present invention.Under the prerequisite not departing from design concept of the present invention; the various modification that this area ordinary person makes technical scheme of the present invention and improvement; all should drop into protection scope of the present invention, the technology contents of request protection of the present invention, all records in detail in the claims.
Claims (10)
1. a preparation method for the high heat conduction epoxy material containing nano-silver thread, it is characterized in that, described preparation method comprises the following steps:
(1) each component is taken out according to weight percent; Described each component and weight percent are: aluminum oxide powder 50% ~ 80%, nano-silver thread 1 ~ 20%, epoxy resin 10% ~ 25%, epoxide diluent 3% ~ 10%, solidifying agent 8% ~ 20%, curing catalyst 0.5% ~ 2%, polythiol 0.5 ~ 2% and coupling agent 0.5% ~ 2%;
(2) nano-silver thread surface modification: nano-silver thread and polythiol are added in toluene solution, 40 ~ 100
oat C temperature, high degree of agitation is after 6 ~ 48 hours, centrifugal, washing and obtain the nano-silver thread of polythiol modification after cryodrying;
(3) epoxy resin and epoxide diluent are at room temperature mixed 3 ~ 30 minutes, obtain uniform mixture;
(4) solidifying agent, curing catalyst and coupling agent are joined in the epoxy resin of step (3) and the mixture of epoxide diluent, under room temperature, mix 3 ~ 30 minutes;
(5) nano-silver thread step (2) prepared and aluminum oxide add in the obtained uniform mixture of step (4) respectively, mix under room temperature; Obtain material.
2. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, is characterized in that: described polythiol be the mixture of one or more than one of pair (3-thiohydracrylic acid) ethylene glycol, trimethylolpropane tris (3-mercaptopropionic acid ester), tetramethylolmethane four-3-mercaptopropionic acid ester and three [2-(3-thiohydracrylic acid base) ethyl] chlorinated isocyanurates.
3. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, is characterized in that: described epoxy resin is the mixture of the one or more than one of Racemic glycidol ethers bisphenol A-type, bisphenol f type epoxy resin, ethylene oxidic ester epoxy resin, aliphatic epoxy resin, cycloaliphatic epoxy resin, acrylic modified epoxy resin and modifying epoxy resin by organosilicon.
4. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, it is characterized in that: described epoxide diluent is 1,4-butyleneglycol glycidyl ether, neopentyl glycol glycidyl ether, 1, the mixture of one or more in 6-hexanediol diglycidyl ether, Diethylene Glycol glycidyl ether, Isosorbide-5-Nitrae-cyclohexane diol glycidyl ether, TriMethylolPropane(TMP) glycidyl ether, polyethyleneglycol diglycidylether.
5. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, is characterized in that: described solidifying agent is the mixture of one or more than one of tetrahydrophthalic anhydride, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, methylnadic anhydride, dodecyl MALEIC ANHYDRIDE.
6. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, it is characterized in that: described curing catalyst is selected from benzyldimethylamine, 2, 4, 6-three (dimethylamino methyl) phenol (DMP-30) and modifier thereof, 2-ethyl-4-methylimidazole, cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN), the modifier of benzyldimethylamine, Methylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazole, 2, 4-diamino-6-(2-undecyl imidazole-1-ethyl) mixture of one or more than one in-S-triazine and derivative thereof and salt in its modifier.
7. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, it is characterized in that: described coupling agent is γ-aminopropyl triethoxysilane, γ-aminopropyltrimethoxysilane, γ-(2, 3-epoxy third oxygen) propyl trimethoxy silicane, γ-methacryloxypropyl trimethoxy silane, N-(β-aminoethyl)-γ-aminopropyl triethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, γ-aminopropyltriethoxy dimethoxysilane, γ-aminopropyltriethoxy diethoxy silane, the mixture of one or more in vinyltriethoxysilane.
8. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, is characterized in that: the diameter of described nano-silver thread is 5 nanometer ~ 100 nanometers.
9. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, is characterized in that: described nano-silver thread is 10 nanometer ~ 20 nanometers.
10. the preparation method of the high heat conduction epoxy material containing nano-silver thread according to claim 1, is characterized in that: described alumina particle is 0.5 micron ~ 100 microns.
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| CN105400477A (en) * | 2015-12-24 | 2016-03-16 | 常熟昊虞电子信息科技有限公司 | Conductive adhesive for high-power LED |
| CN107501861A (en) * | 2017-08-30 | 2017-12-22 | 桂林电子科技大学 | A kind of composite heat interfacial material based on graphene and preparation method thereof |
| CN108395558A (en) * | 2018-02-11 | 2018-08-14 | 江阴通利光电科技有限公司 | A kind of preparation method of high nano-silver thread transparent conductive film |
| WO2019176859A1 (en) * | 2018-03-16 | 2019-09-19 | 日立化成株式会社 | Epoxy resin composition and electronic component device |
| CN110392709A (en) * | 2017-02-15 | 2019-10-29 | 3M创新有限公司 | Use the epoxy resin of metal nanoparticle and nitrogenous catalyst stabilization and method |
| CN113096848A (en) * | 2021-04-09 | 2021-07-09 | 浙江技嘉材料科技有限公司 | Environment-friendly low-resistance low-temperature conductive silver paste and preparation method thereof |
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| CN105400477A (en) * | 2015-12-24 | 2016-03-16 | 常熟昊虞电子信息科技有限公司 | Conductive adhesive for high-power LED |
| CN110392709A (en) * | 2017-02-15 | 2019-10-29 | 3M创新有限公司 | Use the epoxy resin of metal nanoparticle and nitrogenous catalyst stabilization and method |
| CN110392709B (en) * | 2017-02-15 | 2022-04-29 | 3M创新有限公司 | Epoxy resin stabilization using metal nanoparticles and nitrogen-containing catalysts and methods |
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| CN108395558B (en) * | 2018-02-11 | 2021-07-13 | 江阴通利光电科技有限公司 | Preparation method of transparent conductive film of high-transmittance nano silver wire |
| CN108395558A (en) * | 2018-02-11 | 2018-08-14 | 江阴通利光电科技有限公司 | A kind of preparation method of high nano-silver thread transparent conductive film |
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| JPWO2019176859A1 (en) * | 2018-03-16 | 2021-03-11 | 昭和電工マテリアルズ株式会社 | Epoxy resin composition and electronic component equipment |
| CN111868169A (en) * | 2018-03-16 | 2020-10-30 | 日立化成株式会社 | Epoxy resin composition and electronic component device |
| JP7351291B2 (en) | 2018-03-16 | 2023-09-27 | 株式会社レゾナック | Epoxy resin composition and electronic component equipment |
| CN111868169B (en) * | 2018-03-16 | 2024-03-08 | 株式会社力森诺科 | Epoxy resin composition and electronic component device |
| CN113096848A (en) * | 2021-04-09 | 2021-07-09 | 浙江技嘉材料科技有限公司 | Environment-friendly low-resistance low-temperature conductive silver paste and preparation method thereof |
| CN113096848B (en) * | 2021-04-09 | 2022-12-16 | 浙江技嘉材料科技有限公司 | Environment-friendly low-resistance low-temperature conductive silver paste and preparation method thereof |
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