CN104907288A - Cleaning equipment and technique for cleaning electronic components - Google Patents
Cleaning equipment and technique for cleaning electronic components Download PDFInfo
- Publication number
- CN104907288A CN104907288A CN201410093758.4A CN201410093758A CN104907288A CN 104907288 A CN104907288 A CN 104907288A CN 201410093758 A CN201410093758 A CN 201410093758A CN 104907288 A CN104907288 A CN 104907288A
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- China
- Prior art keywords
- electronic component
- treatment region
- cleaning equipment
- conveyer
- region
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
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- Cleaning In General (AREA)
Abstract
The invention discloses cleaning equipment used for cleaning electronic components (for example, a camera module or an electronic substrate). The cleaning equipment is provided with a plurality of treatment areas, and one or more conveyers, wherein the conveyers are used for conveying the electronic components to each treatment area successively to allow the electronic components to be treated in the tandem treatment areas sequentially. In one aspect, the electronic components are subjected to plasma treatment at atmospheric pressure in one treatment area. In the other aspect, the cleaning equipment further comprises the multiple separately controlled conveyers, wherein the electronic components are treated during respective processing time in each treatment area; and at least one processing time is different from other processing time.
Description
Technical field
The present invention relates to a kind of cleaning equipment for clean electronic component and cleaning procedure, this electronic component such as, camera module and electric substrate.
Background technology
Existing cleaning procedure utilizes the cleaning of multiple process different step usually.A problem of these existing cleaning procedures needs with hand, electronic component to be cleaned to be delivered to next cleaning from a cleaning by workman.Therefore, these existing cleaning procedure inefficiencies, reduce handling capacity and output.Another problem is that the people hand operated of electronic component between cleaning is made dirty electronic component further, makes electronic component have dirt, dust and other pollutants.
The object of the invention is to overcome or improve at least one shortcoming of the prior art, or a kind of useful replacement scheme is provided.
Summary of the invention
Various aspects of the present invention and various feature limit in the appended claims.Be understandable that, what various feature of the present invention can be different is combined into now in various embodiments.
In whole description, comprise in claims, unless explicitly stated or context clearly requirement, word " comprises ", and " comprising " and other classes seemingly should be interpreted as the meaning comprised, namely, " include, but are not limited to ", instead of meaning that is exclusive or limit.
Accompanying drawing explanation
Preferred embodiment according to optimal mode of the present invention will by way of example, is described with reference to accompanying drawing simultaneously, wherein:
Fig. 1 is the schematic plan view of the cleaning equipment of one embodiment of the invention;
Fig. 2 is the schematic side elevation of the cleaning equipment of one embodiment of the invention;
Fig. 3 is the schematic side elevation of the cleaning equipment of another embodiment of the present invention;
Fig. 4 is the schematic side elevation of the cleaning equipment of another embodiment of the present invention;
Fig. 5 is the schematic plan view of the cleaning equipment of further embodiment of this invention;
Fig. 6 is the schematic plan view of the cleaning equipment that yet another embodiment of the invention provides.
Detailed description of the invention
With reference to accompanying drawing, provide the cleaning equipment 1 for clean electronic component 2.This cleaning equipment comprises multiple treatment region 3, and one or more conveyer 4 for electronic component 2 being sent in succession each treatment region 3, and described electronic component order is processed at each treatment region at series winding.
This electronic component 2 can be electric substrate, ceramic substrate, camera module, for the element of the display floater of OLED and LED.This electronic component 2 also can be multiple electronic component.Such as, as described in the accompanying drawings, this can be hold the electric substrate 6 of an arrangement or the camera module of an arrangement with the form of haul box 5.It should be understood that device described herein and technique are except electronic component, also can clean other suitable parts.
According to an aspect of the present invention, in a treatment region 7, apply plasma at atmosheric pressure to electronic component 2, this treatment region is called ion plasma.Another treatment region is blowing district 8, and this blowing district 8 passes through to electronic component blow gas to remove the pollutant on electronic component.This gas can be air, nitrogen (N2), or other suitable gases.Also another treatment region is region of no pressure 9, in this region of no pressure 9, adopt application of vacuum to remove the pollutant on electronic component to electronic component.This region of no pressure is before ion plasma, and blow zones is before this region of no pressure.That is, first this electronic component 2 is sent to blow zones, then delivers to region of no pressure, then delivers to ion plasma.In one embodiment, in ion plasma 7, also apply deionized water (DIW) on this electronic component.
Ion plasma 7 applies plasma instead of under the vacuum pressures at atmosheric pressure, and this is existing before being the present invention.The considerable advantage that this mode has, it is independently device that such ion plasma did not need as the past, to provide vacuum environment.This independently vacuum plant usually need sealing.This makes cleaning course become complicated, because can be placed into this at cleaned electronic component 2, independently vacuum plant is with before applying plasma, and the pressure independently in vacuum plant needs to revert to atmospheric pressure.And electronic component 2 is placed to this independently in vacuum plant, then need that Pressure Drop is low to moderate vacuum pressure and just apply plasma.Then, then by this independently vacuum plant return to atmospheric pressure, electronic component 2 can be removed.
In other embodiments, the combination of said process or other process may be incorporated in the same area.Such as, application of vacuum is adopted to may be incorporated in same treatment region and use in blow gas to electronic component and to electronic component.Equally, the process described in an above-mentioned district can splitly be assigned in several independent treatment region.Such as, the application of deionized water can in the treatment region separated with ion plasma.In other embodiments, above-mentioned one or more process or region can be omitted.In other embodiment other, also can add other suitable step and combine at independent treatment region or with the process of a treatment region.
This treatment region 3 can be integrated into a single machine.This comprises the single machine be made up of the separate modular station corresponding to this treatment region 3, and they are combined together to form this single machine.This also comprises the single machine with the multiple parts performing the operation corresponding to treatment region 3 respectively.
This treatment region 3 and one or more conveyer 4 also can be integrated into single machine.In the same manner, this comprises the single machine be made up of the separate modular station group and one or more conveyer 4 that correspond to this treatment region 3, and they are combined together to form this single machine; And there is the multiple part and one or more single machine of part existed with the form of conveyer 4 that perform the operation corresponding to treatment region 3 respectively.
This treatment region 3 and one or more conveyer 4 can be encapsulated in an in check cleaning ambient, such as toilet.Due to this ion plasma 7 be in atmospheric pressure under, so do not need independently Vacuum Package, therefore do not need process workman enter into this in check cleaning ambient.
Another aspect of the present invention, also provides a kind of cleaning procedure for clean electronic component.This cleaning procedure embodiment can be understood by description above.Such as, in one embodiment, this cleaning procedure comprises: electronic component 2 order is sent to multiple treatment region 3, processes in order at the treatment region of series winding to make electronic component; Operation is carried out for electronic component 2 in order at the treatment region 3 of each series winding.This cleaning procedure is also included in a treatment region 7, adds upper plasma at atmosheric pressure for electronic component 2.
In another embodiment, this cleaning procedure is included in a treatment region 9 and carries out application of vacuum to electronic component 2, and then at atmosheric pressure for electronic component applies plasma in a treatment region 7, and carry out application of vacuum to electronic component 2 employing in described treatment region before, in a treatment region 8, blow gas is on electronic component.
Other embodiments of further characteristic sum of this clean method can be understood from description above.
The different embodiments of cleaning equipment 1 can have one or more conveyer 4.In the embodiment with multiple conveyer, each conveyer 4 can independent operation.This is the present invention's specific features on the other hand.
Particularly, according to another aspect of the present invention, and reference accompanying drawing, provide the cleaning equipment 1 for clean electronic component 2.This cleaning equipment comprises multiple treatment region 3.Electronic component 2 is at each treatment region 3 through the process of respective processing time, and wherein at least one processing time is different from other processing time.This cleaning equipment 1 also has the conveyer 4 of multiple independent operation for successively electronic component 2 being sent to each treatment region 3, sequentially passes through each treatment region process to make electronic component.
This cleaning equipment 1 comprises one or more buffering area 10.After electronic component 2 leaves a treatment region 3, The delivers to a buffering area 10 by the conveyer 4 of one or more independent operation, to wait until that next treatment region 3 is ready to receive this electronic component 2.Such as, conveyer 11 is from blowing district 8 transport electronic components 2b.Because the processing time in region of no pressure 9 is than long in the processing time of blow zones 8, the electronic component 2a before electronic component 2b still processes in region of no pressure 9.Therefore, region of no pressure 9 is also not ready for receiving electronic component 2.So electronic component 2b is sent to buffering area 12 by conveyer 11, electronic component 2b is allowed well to treat to be ready to receive it to region of no pressure 9 at this buffering area 12.
Buffering area 12 is that a vertical stack 12a, vertical stack 12a are used for the stacking multiple electronic component 2 of the mode of vertical stack, as shown in Figure 4.Electronic component 2b is sent to the first order of vertical stack by conveyer 11.If electronic component 2n in succession out also needs to wait for from blowing district 8, these electronic components 2n will be transported in the vertical stack of buffering area 12 by conveyer 11.Then electronic component 2b is just promoted to the higher level of vertical stack, because electronic component 2n is in succession stacked under electronic component 2b.When electronic component 2a leaves region of no pressure 9, region of no pressure 9 is ready to receive another electronic component.In buffering area 12, the electronic component 2 in the vertical stack first order is delivered to region of no pressure 9 by the conveyer 13 below vertical stack.Or the electronic component 2 in the first order can be delivered on another conveyer by conveyer 13, again this electronic component 2 is transported to region of no pressure afterwards.Fig. 4 shows after electronic component 2b is promoted to the highest level of vertical stack 12a, and electronic component 2n is in succession stacked on the layout below electronic component 2b.The electronic component 2b be shown in broken lines in blowing district 8 shows the position of electronic component 2b before electronic component 2b is sent to buffering area 12 by conveyer 11.
As shown in Figure 5, in another embodiment, conveyer 14 is formed by one or more buffering area 10, and the length of this conveyer 14 can hold the multiple electronic components 2 formed a line.This electronic component 2 is piled into row, until next treatment region 3 is ready to receive next electronic component.
This cleaning equipment 1 can have one or more buffering area 10.One or more in these buffering areas 10 can be the forms of the vertical stack similar with aforementioned buffering area 12, or can be the forms of aforementioned conveyer 14.The embodiment of this cleaning equipment can also have multiple vertical stack 12 or multiple conveyer 14 or the combination of the two.
In addition, cleaning equipment 1 can comprise the treatment region of multiple identical type and parallel operation.Such as, as shown in Figure 6, if this ion plasma 7 has the longer processing time than previous region of no pressure 9, then this cleaning equipment can have multiple ion plasma 7 and multiple corresponding conveyer 15.Because electronic component 2 in succession will be processed by region of no pressure 9, electronic component 2 is just transported to different ion plasmas 7 by different branch's conveyers 16.Electronic component 2 is optionally delivered to suitable branch's conveyer 16 by transfer conveyer 17.The ion plasma 7 that this cleaning equipment 1 can have sufficient amount does not need to wait for make arbitrary electronic component 2, namely, have the ion plasma of sufficient amount, like this, first start process ion plasma will start in last ion plasma process before or be ready to simultaneously.In another embodiment, one or more branches conveyer 16 can serve as buffering area 10 as above, specifically, serves as buffering area exactly to be similar to as above-mentioned conveyer 14.
This cleaning equipment can comprise one or more blowing district 8 described in above-mentioned each side, region of no pressure 9 and ion plasma 7, but not necessarily.
This aspect of the present invention is exactly advantage place: the operation of a treatment region does not need to stop the completing of the operation of waiting for next treatment region of making a return journey.Which greatly enhances efficiency, handling capacity and output.
Another aspect of the present invention additionally provides, the another cleaning procedure for clean electronic component.The embodiment of this cleaning procedure can be understood from description above.Such as, in one embodiment, this cleaning procedure comprises the conveyer 4 of multiple independent control behaviour, electronic component 2 order to be delivered in each treatment region 3, processes with the treatment region making electronic component 2 sequentially pass through series winding; This electronic component 2 processes through the respective processing time at each treatment region, and wherein at least one processing time is different from other processing time.Other embodiments of further characteristic sum of this processing procedure can be understood according to description above.
Although the present invention is described in conjunction with object lesson, it will be understood by those skilled in the art that the present invention can be embodied in other forms many.When not departing from spirit of the present invention and essence, those of ordinary skill in the art can make various variant and amendment, and these variants and amendment are also within protection scope of the present invention.Those skilled in the art are also appreciated that the feature of described various embodiments can be incorporated in other embodiments.
Claims (10)
1., for a cleaning equipment for clean electronic component, described cleaning equipment comprises:
Multiple treatment region, described electronic component is in the process of each treatment region through the respective processing time, and the wherein said respective processing time, at least one was different from other processing time; With
The conveyer of multiple independent manipulation, described conveyer is used for described electronic component to be in succession sent to each treatment region, sequentially passes through each treatment region process successively to make described electronic component.
2. cleaning equipment as claimed in claim 1, it comprises the conveyer of one or more buffering area and one or more independent manipulation, described conveyer, for transmitting described electronic component to described buffering area, allows well electronic component leave described treatment region to wait until that next treatment region is ready to receive this electronic component.
3. cleaning equipment as claimed in claim 2, it is characterized in that, at least one buffering area is the form of vertical stack, and described vertical stack is used for the stacking multiple described electronic component of the mode of vertical stack.
4. cleaning equipment as claimed in claim 2, it is characterized in that, at least one buffer district is formed by a conveyer, and the length of described conveyer can hold the multiple described electronic component of queue form.
5. cleaning equipment as claimed in claim 1, is characterized in that, in a treatment region, applies plasma at atmosheric pressure to described electronic component.
6. cleaning equipment as claimed in claim 5, is characterized in that, execute lower isoionic treatment region, also to electronic component application deionized water under being atmospheric pressure to electronic component.
7. cleaning equipment as claimed in claim 1, is characterized in that, in a treatment region, to remove the pollutant on described electronic component in blow gas to described electronic component.
8. cleaning equipment as claimed in claim 1, is characterized in that, in a treatment region, carry out application of vacuum to remove the pollutant on electronic component to described electronic component.
9. cleaning equipment as claimed in claim 1, it is characterized in that, one of described treatment region is the blowing district to described electronic component blow gas, another treatment region carries out vacuum treated region of no pressure to described electronic component, another treatment region applies isoionic ion plasma to electronic component at atmosheric pressure, described blowing district is before described region of no pressure, and described region of no pressure is before described ion plasma.
10., for a cleaning procedure for clean electronic component, described cleaning procedure comprises:
The conveyer of multiple independent manipulation with by described electronic component in succession be sent to each treatment region, processed by described treatment region order to make described electronic component; With
Process described electronic component at each treatment region by the respective processing time, the respective processing time wherein described at least one is different from other processing time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410093758.4A CN104907288A (en) | 2014-03-13 | 2014-03-13 | Cleaning equipment and technique for cleaning electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410093758.4A CN104907288A (en) | 2014-03-13 | 2014-03-13 | Cleaning equipment and technique for cleaning electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104907288A true CN104907288A (en) | 2015-09-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410093758.4A Pending CN104907288A (en) | 2014-03-13 | 2014-03-13 | Cleaning equipment and technique for cleaning electronic components |
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| Country | Link |
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| CN (1) | CN104907288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106079184A (en) * | 2016-08-04 | 2016-11-09 | 深圳大宇精雕科技有限公司 | Die cleaning apparatus and cleaning method |
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| CN101794710A (en) * | 2009-01-30 | 2010-08-04 | 细美事有限公司 | Method and system for treating substrate |
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Patent Citations (10)
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| CN1451491A (en) * | 2002-04-19 | 2003-10-29 | 显像制造服务株式会社 | Method and device for cleaning LCD using plasma |
| WO2004021411A2 (en) * | 2002-08-31 | 2004-03-11 | Applied Materials, Inc. | Method and apparatus for supplying substrates to a processing tool |
| CN1505108A (en) * | 2002-12-02 | 2004-06-16 | 株式会社华祥 | Substrate processing device and substrate delivery device in the same |
| US20040238324A1 (en) * | 2003-03-12 | 2004-12-02 | Hisashi Fujimura | Wafer carrying apparatus and wafer carrying method |
| CN1534728A (en) * | 2003-03-31 | 2004-10-06 | ������������ʽ���� | Device and method for transporting products |
| CN1655324A (en) * | 2003-12-11 | 2005-08-17 | 日本网目版制造株式会社 | Substrate treating apparatus |
| CN101013655A (en) * | 2006-02-03 | 2007-08-08 | 三星电子株式会社 | Substrate processing device and method |
| CN101086625A (en) * | 2006-06-05 | 2007-12-12 | Lg.菲利浦Lcd株式会社 | Lithography device and its method |
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| CN106079184A (en) * | 2016-08-04 | 2016-11-09 | 深圳大宇精雕科技有限公司 | Die cleaning apparatus and cleaning method |
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Application publication date: 20150916 |