CN104902154A - Circuit board subassembly, camera module and camera shooting equipment with the same - Google Patents
Circuit board subassembly, camera module and camera shooting equipment with the same Download PDFInfo
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- CN104902154A CN104902154A CN201510277982.3A CN201510277982A CN104902154A CN 104902154 A CN104902154 A CN 104902154A CN 201510277982 A CN201510277982 A CN 201510277982A CN 104902154 A CN104902154 A CN 104902154A
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- circuit board
- heat dissipating
- dissipating layer
- thermal trough
- camera lens
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- 230000000712 assembly Effects 0.000 claims description 37
- 238000000429 assembly Methods 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 235000012364 Peperomia pellucida Nutrition 0.000 claims description 3
- 240000007711 Peperomia pellucida Species 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 104
- 230000009977 dual effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002365 multiple layer Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000003351 stiffener Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract
The invention provides a circuit board subassembly. The circuit board subassembly comprises a first circuit board, a first heat dissipating layer, a second heat dissipating layer and a second circuit board, which are arranged in turn in a superposed manner. At least one heat conducting groove is arranged at the first heat dissipating layer and/or the second heat dissipating layer. The invention further provides a camera module and video shooting equipment.
Description
Technical field
The present invention relates to a kind of circuit board assemblies, there is the camera module of circuit board assemblies and picture pick-up device.
Background technology
In prior art, drive recorder uses a wide-angle camera to take image as Ji Chewai front, operator seat front usually, and this camera lens adopts larger wide angular range to take larger field range usually.But this structure cannot be taken in car and car rear scene, can not realize pan-shot simultaneously.And the electronic component on the circuit board of these cameras can produce a large amount of heats in the course of the work, affects electronic component performance and stability.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides a kind of circuit board assemblies improving radiating effect.
The present invention there is a need to provide a kind of picture pick-up device with described camera module.
To achieve these goals, embodiment of the present invention provides following technical scheme:
The invention provides a kind of circuit board assemblies, described circuit board assemblies comprises first circuit board, the first heat dissipating layer, the second heat dissipating layer and second circuit board; Described first circuit board, the first heat dissipating layer, the second heat dissipating layer and second circuit board superpose setting successively; Described first heat dissipating layer and/or described second heat dissipating layer are provided with at least one thermal trough.
Wherein, described first heat dissipating layer comprises the first inner surface, and described second heat dissipating layer comprises the second inner surface; Described thermal trough comprises first thermal trough and second thermal trough; Described first thermal trough is located on described first inner surface, and described second thermal trough is located on described second surface; Described first inner surface and the second inner surface are fitted, and described first thermal trough is arranged in a crossed manner with described second thermal trough or superpose and arrange.
Wherein, described first heat dissipating layer comprises the first inner surface, and described second heat dissipating layer comprises the second inner surface; Described thermal trough comprises multiple first thermal trough and multiple second thermal troughs identical with described multiple first thermal trough quantity; Described multiple first thermal trough arrangement is located on described first inner surface, and described first inner surface and the second inner surface are fitted, and described multiple second thermal trough arrangement is located on described second inner surface; Described multiple first thermal trough is man-to-man arranged in a crossed manner or superpose and arrange with described multiple second thermal trough.
Wherein, described first heat dissipating layer the first outer surface of comprising the first inner surface and being oppositely arranged with the first inner surface; The second outer surface that described second heat dissipating layer comprises the second inner surface and is oppositely arranged with the second inner surface; At least one thermal trough described to be located on described first heat dissipating layer and to be run through described first inner surface and the first outer surface; Or at least one thermal trough described is located on described second heat dissipating layer, and run through described second inner surface and the second outer surface.
Wherein, described first circuit board and described second circuit board are flexible circuit board; Described first heat dissipating layer and described second heat dissipating layer are that the metal materials such as steel are made.
Wherein, described first heat dissipating layer be formed at described first circuit board a surface on and form the first printed circuit board (PCB) with first circuit board; Described second heat dissipating layer to be formed on described second circuit board surface and to form the second printed circuit board (PCB) with second circuit board; Described first heat dissipating layer and described second heat dissipating layer are provided with at least one thermal trough; Described first printed circuit board (PCB) and second printed circuit board laminatedly adds setting, described first heat dissipating layer and described second heat dissipating layer are fitted, and at least one thermal trough of described first heat dissipating layer intersects one to one with at least one thermal trough on described second heat dissipating layer or superposes and arranges.
Wherein, described first heat dissipating layer and the second heat dissipating layer are ink layer or metal conducting layer.
The invention provides a kind of camera module, it comprises the first camera lens, the second camera lens and described circuit board assemblies; Described first camera lens is loaded on described first circuit board, and described second camera lens is loaded on described second circuit board.
Wherein, described first camera lens and the second camera lens are coaxially arranged, and the center of described first circuit board is located at by described first camera lens, and the center of described second circuit board is located at by described second camera lens.
The invention provides a kind of picture pick-up device, described picture pick-up device comprises circuit main board and described camera module, and described circuit main board and described circuit board assemblies are electrically connected.
Circuit board assemblies of the present invention increases heat dissipating layer on flexible PCB; dredge the heat that electronic element on circuit board is distributed; heat dissipating layer is dispelled the heat by thermal trough and self; avoid the electronic component of the too high damage circuit board of Yin Wendu; described heat dissipating layer can be used as stiffener use simultaneously; in order to increase the intensity of circuit board, and then the electronic component on protective circuit plate.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the circuit board assemblies decomposing schematic representation of present pre-ferred embodiments;
Fig. 2 is the schematic cross-section after the circuit board assemblies assembling described in Fig. 1;
Fig. 3 is the decomposing schematic representation of the second embodiment of the heating panel of circuit board assemblies described in Fig. 1;
Fig. 4 and Fig. 5 is the schematic cross-section of two kinds of different assembling modes of circuit board assemblies described in Fig. 3;
Fig. 6 is the decomposing schematic representation of the 3rd embodiment of the heating panel of the circuit board assemblies of present pre-ferred embodiments;
Fig. 7 is the schematic cross-section after the assembling of the circuit board assemblies of Fig. 6;
Fig. 8 is the circuit board assemblies decomposing schematic representation of fourth embodiment of the invention;
Fig. 9 is the schematic cross-section after the circuit board assemblies assembling described in Fig. 8;
Figure 10 is the schematic diagram of camera module of the present invention, comprising the circuit board assemblies described in Fig. 8;
Figure 11 is the schematic cross-section of the circuit board assemblies comprised described in the camera module of Figure 10.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, present pre-ferred embodiments provides a kind of circuit board assemblies, and it comprises first circuit board 10, first heat dissipating layer 31, second heat dissipating layer 33 and second circuit board 20.Described first circuit board 10, first heat dissipating layer 31, second heat dissipating layer 33 and second circuit board 20 superpose setting successively; Described first heat dissipating layer 31 and/or described second heat dissipating layer 33 are provided with at least one thermal trough (figure does not mark).
In first embodiment of the invention, described first heat dissipating layer 31 and described second heat dissipating layer 33 are provided with at least one thermal trough.Described first heat dissipating layer 31 comprises the first inner surface 311, and described second heat dissipating layer 33 comprises the second inner surface 331.At least one thermal trough described is two, comprises first thermal trough 41 and second thermal trough 42.Described first thermal trough 41 is opened on described first inner surface 311, and described second thermal trough 42 is opened on described second surface 331.Described first inner surface 311 and the second inner surface 331 are fitted, and described first thermal trough 41 is arranged in a crossed manner with described second thermal trough 42 or superpose and arrange.
In the present embodiment, that described first circuit board 10 is two rectangles with second circuit board 20, that size is identical rectangular panel body.Described first circuit board 10 comprises the first installed surface 11 and the second installed surface 12 with the opposing setting of the first installed surface.Described second circuit board 20 comprises the 3rd installed surface 21 and the 4th installed surface 22 with the opposing setting of the 3rd installed surface 21.In the present embodiment, described first heat dissipating layer 31 and the second heat dissipating layer 33 are rectangle lamellar body, and described first heat dissipating layer 31 is fitted with the second installed surface 12 of described first circuit board 10; Described second heat dissipating layer 33 is fitted with the 4th installed surface 22 of described second circuit board 20, and described first inner surface 311 is relative with described second inner surface 331 and fit.Preferably, the laminating between described first circuit board 10, second circuit board 20, first heat dissipating layer 31 and the second heat dissipating layer 33 adopts viscose glue laminating.
Described first thermal trough 41 is strip groove with described second thermal trough 42, described first thermal trough 41 is located on the first inner surface 311 medium position and the first heat dissipating layer 31 side is run through at the two ends of the first thermal trough 41, so that the evacuation of the heat on the first heat dissipating layer 31.Described second thermal trough 42 is located on the second inner surface 331 medium position and the second heat dissipating layer 33 side is run through at the two ends of the second thermal trough 42, so that the evacuation of the heat on the second heat dissipating layer 33.Described first thermal trough 41 is arranged in a crossed manner with described second thermal trough 42, and preferably described first thermal trough 41 intersects with described second thermal trough 42 " ten " font.Refer to Fig. 2, described first thermal trough 41 superposes with described second thermal trough 42 and arranges, i.e. described first thermal trough 41 and the involutory groove being formed through " one " font of described second thermal trough 42.
Refer to Fig. 3, in the second execution mode of the present invention, with above-described embodiment unlike, described thermal trough comprises multiple first thermal trough 41 and multiple second thermal troughs 42 identical with described multiple first thermal trough 41 quantity; Described multiple first thermal trough 41 arrangement is located on described first inner surface 311, and described multiple second thermal trough 42 arrangement is located on described second inner surface 331; Described first inner surface 311 and the second inner surface 331 are fitted, and described multiple first thermal trough 41 is man-to-man arranged in a crossed manner or superpose and arrange with described multiple second thermal trough 42.
Refer to Fig. 4 and Fig. 5, concrete, described multiple first thermal trough 41 is divided into matrix arrangement on the first inner surface 311 of described first heat dissipating layer 31.Described multiple second thermal trough 42 is divided into matrix arrangement on the second inner surface 331 of described second heat dissipating layer 33.In the present embodiment, the first thermal trough 41 is four, be divided into the both sides that two row are located at described first inner surface 331, and each first thermal trough 41 all runs through the sidepiece of described first heat dissipating layer 31.Described second thermal trough 42 is four, be divided into the both sides that two row are located at described second inner surface 331, and each second thermal trough 42 all runs through the sidepiece of described second heat dissipating layer 33.Described first inner surface 311 and the second inner surface 332 are fitted, wherein, first thermal trough 41 described in each is arranged in a crossed manner with corresponding second thermal trough 42 or superpose and arrange respectively, and first thermal trough 41 is only arranged in a crossed manner with second thermal trough 42 or superpose and arrange, this kind of structure, the timely heat by described heat dissipating layer of maximum area can dredge and distribute.
Refer to Fig. 6, in the 3rd execution mode of the present invention, differently from above-mentioned two execution modes to be: at least one thermal trough described is opened on the first heat dissipating layer or described second heat dissipating layer.In the present embodiment, the first outer surface 342 that described first heat dissipating layer 34 comprises the first inner surface 341 and is oppositely arranged with the first inner surface 341; The second outer surface 352 that described second heat dissipating layer 35 comprises the second inner surface 351 and is oppositely arranged with the second inner surface 351.At least one thermal trough 36 described to be located on described first heat dissipating layer 34 and to be run through described first inner surface 341 and the first outer surface 342; Or at least one thermal trough described is located on described second heat dissipating layer 35, and run through described second inner surface 351 and the second outer surface 352.
See also Fig. 7, in the present embodiment, preferably, described thermal trough 36 to be located on described first heat dissipating layer 34 and to be run through described first inner surface 341 and the first outer surface 342, and described thermal trough 36 is arrange around described first heat dissipating layer 34 center multiple.In other embodiments, described thermal trough 36 to be located on described second heat dissipating layer 35 and to be run through described second inner surface 351 and the second outer surface 352.
Further, in above-described embodiment, described first circuit board 10 is flexible circuit board with described second circuit board 20.Described first heat dissipating layer 31 is that the metal materials such as steel are made with described second heat dissipating layer 33.Preferably, described first heat dissipating layer 31 is steel with described second heat dissipating layer 33, while can dredging heat, increases the hardness of described first circuit board 10 and described second circuit board 20 to described first circuit board 10 with described second circuit board 20.
Circuit board assemblies of the present invention increases heat dissipating layer on flexible PCB; dredge the heat that electronic element on circuit board is distributed; heat dissipating layer is dispelled the heat by thermal trough and self; avoid the electronic component on the too high damage circuit board of Yin Wendu; described heat dissipating layer can be used as stiffener use simultaneously; in order to increase the intensity of circuit board, and then the electronic component on protective circuit plate.
Refer to Fig. 8, in the 4th embodiment of circuit board assemblies of the present invention, the surface that described first heat dissipating layer 37 is formed at described first circuit board 10 forms the first printed circuit board (PCB) 40 with first circuit board 10; Described second heat dissipating layer 38 to be formed on described second circuit board 20 1 surfaces and to form the second printed circuit board (PCB) 50 with second circuit board 20; Described first heat dissipating layer 37 and the second heat dissipating layer 38 are provided with at least one thermal trough; Described first printed circuit board (PCB) 40 superposes with the second printed circuit board (PCB) 50 and arranges, and described first heat dissipating layer 37 is fitted with described second heat dissipating layer 38.Further, described first heat dissipating layer 37 and the second heat dissipating layer 38 are ink layer or metal conducting layer.
Concrete, described first heat dissipating layer 37 is the outmost surface structure of the first printed circuit board (PCB) 40, can be ink layer or metal conducting layer.Described first heat dissipating layer 37 can be formed on described first circuit board 10 by modes such as coatings.Described first circuit board 10 is that certain one deck of the first printed circuit board (PCB) 40 or multiple-layer stacked form.Described thermal trough is located on the first heat dissipating layer 37, can to extend on first circuit board 40 towards the surface of the first heat dissipating layer 37, or only run through the first heat dissipating layer 37 through the first heat dissipating layer 37.
Described second heat dissipating layer 38 is the outmost surface structure of the second printed circuit board (PCB) 50, can be ink layer or metal conducting layer.Described second circuit board 20 is that certain one deck of the second printed circuit board (PCB) 50 or multiple-layer stacked form.Described thermal trough is located on the second heat dissipating layer 38, can extend to the surface of second circuit board 20 towards the second heat dissipating layer 38, or only run through the second heat dissipating layer 38 through the second heat dissipating layer 38.
Refer to Fig. 9, in the present embodiment, described first heat dissipating layer 37 is the first inner surface 371 away from the surface of first circuit board 10.Described second heat dissipating layer 38 is the second inner surface 381 away from the surface of second circuit board 20.In the present embodiment, described first inner surface 371 is provided with multiple thermal trough, and described thermal trough is around described first inner surface 371 center spread configuration, and this thermal trough is the first thermal trough 372.Described second inner surface 381 is provided with multiple thermal trough, and described thermal trough is around described second inner surface 381 center spread configuration.This thermal trough is the second thermal trough 382.Thermal trough shape in the present embodiment is identical with the described first and the 3rd shape in embodiment.Described first printed circuit board (PCB) 40 superposes with the second printed circuit board (PCB) 50 and arranges, described first thermal trough 372 and the second thermal trough 382 are arranged in a crossed manner or superpose and arrange one to one, and first thermal trough 372 is only arranged in a crossed manner with second thermal trough 382 or superpose and arrange.This kind of structure, the timely heat by described first printed circuit board (PCB) 40 and the second printed circuit board (PCB) 50 of maximum area can dredge and distribute.Understandable, can to be heat sink material be formed with on first, second circuit board by printing, the mode such as in-molded for described first heat dissipating layer 37 and the second heat dissipating layer 38, or described first heat dissipating layer 37 and the second heat dissipating layer 38 also can be that fin fits on first, second circuit board.
Refer to Figure 10 and Figure 11, the present invention also provides a kind of camera module, and described camera module comprises the circuit board assemblies in the first camera lens 110, second camera lens 120 and above arbitrary execution mode.For the circuit board assemblies comprising the first printed circuit board (PCB) 40 and the second printed circuit board (PCB) 50 of the 4th embodiment in the present embodiment.Described first camera lens 110 is loaded on described first printed circuit board (PCB) 40, and described second camera lens 120 is loaded on described second printed circuit board (PCB) 50.In the present embodiment, described camera module is dual camera module.Described first camera lens 110 is provided with the first image sensor 1101, first camera lens module 1102 and the first microscope base 1103.Described first image sensor 1101, first camera lens module 1102 is loaded in the first microscope base 1103.First microscope base 1103 of described first camera lens 110 is loaded on the first installed surface 11, and described first image sensor 1101 and the first installed surface 11 are fixed by COB technique.Described second camera lens 120 is provided with the second image sensor 1201, second camera lens module 1202 and the second microscope base 1203.Second image sensor 1201, second camera lens module 1202 is loaded on the second microscope base 1203.Second microscope base 1203 of described second camera lens 120 is loaded on the 3rd installed surface 21, and described second image sensor 1201 and the 3rd installed surface 21 are fixed by COB technique.Whereby, not only first, second heat dissipating layer described dispels the heat to first, second image sensor, extends the useful life of dual camera module, and ensures that first, second image sensor is in assembling process requirement of strength.Described camera module can be mobile phone camera module, camera of notebook computer module, security protection camera, vehicle-mounted camera and optical navigation module etc.Above-mentioned dual camera module have employed 180 degree of bugeye lenses, can realize taking simultaneously, and realize pan-shot by software process quality.
Further, described first camera lens 110 and the second camera lens 120 are coaxially arranged, and the center of described first circuit board 10 is located at by described first camera lens 110, and the center of described second circuit board 20 is located at by described second camera lens 120.Concrete, described first camera lens 110, first circuit board 10, second circuit board 20 and the second camera lens 120 are coaxial setting, effectively can reduce the volume of dual camera module.
The present invention also provides a kind of picture pick-up device, and described picture pick-up device comprises circuit main board and described camera module, and described circuit main board and described circuit board assemblies are electrically connected.In the present embodiment, described circuit main board and described circuit board assemblies are electrically conducted by metallic conduction terminal, wire or connector.Described picture pick-up device can be drive recorder, mobile phone, security device etc.As being used on the drive recorder of vehicle-mounted product, picture pick-up device of the present invention can image inside and outside synchronous recording panorama car.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a circuit board assemblies, is characterized in that: described circuit board assemblies comprises first circuit board, the first heat dissipating layer, the second heat dissipating layer and second circuit board; Described first circuit board, the first heat dissipating layer, the second heat dissipating layer and second circuit board superpose setting successively; Described first heat dissipating layer and/or described second heat dissipating layer are provided with at least one thermal trough.
2. circuit board assemblies as claimed in claim 1, it is characterized in that, described first heat dissipating layer comprises the first inner surface, and described second heat dissipating layer comprises the second inner surface; Described thermal trough comprises first thermal trough and second thermal trough; Described first thermal trough is located on described first inner surface, and described second thermal trough is located on described second surface; Described first inner surface and the second inner surface are fitted, and described first thermal trough is arranged in a crossed manner with described second thermal trough or superpose and arrange.
3. circuit board assemblies as claimed in claim 1, it is characterized in that, described first heat dissipating layer comprises the first inner surface, and described second heat dissipating layer comprises the second inner surface; Described thermal trough comprises multiple first thermal trough and multiple second thermal troughs identical with described multiple first thermal trough quantity; Described multiple first thermal trough arrangement is located on described first inner surface, and described first inner surface and the second inner surface are fitted, and described multiple second thermal trough arrangement is located on described second inner surface; Described multiple first thermal trough is man-to-man arranged in a crossed manner or superpose and arrange with described multiple second thermal trough.
4. circuit board assemblies as claimed in claim 1, is characterized in that, the first outer surface that described first heat dissipating layer comprises the first inner surface and is oppositely arranged with the first inner surface; The second outer surface that described second heat dissipating layer comprises the second inner surface and is oppositely arranged with the second inner surface; At least one thermal trough described to be located on described first heat dissipating layer and to be run through described first inner surface and the first outer surface; Or at least one thermal trough described is located on described second heat dissipating layer, and run through described second inner surface and the second outer surface.
5. the circuit board assemblies as described in any one of claim 1-4, is characterized in that, described first circuit board and described second circuit board are flexible circuit board; Described first heat dissipating layer and described second heat dissipating layer are that the metal materials such as steel are made.
6. circuit board assemblies as claimed in claim 1, is characterized in that, the surface that described first heat dissipating layer is formed at described first circuit board forms the first printed circuit board (PCB) with first circuit board; Described second heat dissipating layer to be formed on described second circuit board surface and to form the second printed circuit board (PCB) with second circuit board; Described first heat dissipating layer and described second heat dissipating layer are provided with at least one thermal trough; Described first printed circuit board (PCB) and second printed circuit board laminatedly adds setting, described first heat dissipating layer and described second heat dissipating layer are fitted, and at least one thermal trough of described first heat dissipating layer intersects one to one with at least one thermal trough on described second heat dissipating layer or superposes and arranges.
7. circuit board assemblies as claimed in claim 6, it is characterized in that, described first heat dissipating layer and the second heat dissipating layer are ink layer or metal conducting layer.
8. a camera module, is characterized in that, comprises the first camera lens, the second camera lens and the circuit board assemblies described in any one of claim 1-7; Described first camera lens is loaded on described first circuit board, and described second camera lens is loaded on described second circuit board.
9. camera module as claimed in claim 8, it is characterized in that, described first camera lens and the second camera lens are coaxially arranged, and the center of described first circuit board is located at by described first camera lens, and the center of described second circuit board is located at by described second camera lens.
10. a picture pick-up device, is characterized in that, described picture pick-up device comprises circuit main board and the camera module described in any one of claim 8-9, and described circuit main board and described circuit board assemblies are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510277982.3A CN104902154B (en) | 2015-05-27 | 2015-05-27 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510277982.3A CN104902154B (en) | 2015-05-27 | 2015-05-27 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
Publications (2)
| Publication Number | Publication Date |
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| CN104902154A true CN104902154A (en) | 2015-09-09 |
| CN104902154B CN104902154B (en) | 2019-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510277982.3A Expired - Fee Related CN104902154B (en) | 2015-05-27 | 2015-05-27 | Circuit board assemblies, the camera module with circuit board assemblies and picture pick-up device |
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| CN (1) | CN104902154B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109327570A (en) * | 2018-10-31 | 2019-02-12 | Oppo广东移动通信有限公司 | Touch screen component, display screen and electronic device for electronic device display screen |
| WO2020155820A1 (en) * | 2019-02-02 | 2020-08-06 | 北京地平线机器人技术研发有限公司 | Camera module, electronic device and vehicle device |
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| CN2499978Y (en) * | 2001-10-26 | 2002-07-10 | 财团法人工业技术研究院 | Three dimension stacking package radiator module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2020155820A1 (en) * | 2019-02-02 | 2020-08-06 | 北京地平线机器人技术研发有限公司 | Camera module, electronic device and vehicle device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104902154B (en) | 2019-02-12 |
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Address after: 330013 Jiangxi city of Nanchang province Huangjiahu Changbei Economic Development Zone West o-film Technology Park Co-patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee after: Ophiguang Group Co.,Ltd. Co-patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Jiangxi city of Nanchang province Huangjiahu Changbei Economic Development Zone West o-film Technology Park Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee before: OFilm Tech Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013 Jiangxi city of Nanchang province Huangjiahu Changbei Economic Development Zone West o-film Technology Park Co-patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee after: OFilm Tech Co.,Ltd. Co-patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Jiangxi city of Nanchang province Huangjiahu Changbei Economic Development Zone West o-film Technology Park Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Co-patentee before: Shenzhen OFilm Tech Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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