CN104889964A - Automatic marking device for semiconductor inspection - Google Patents
Automatic marking device for semiconductor inspection Download PDFInfo
- Publication number
- CN104889964A CN104889964A CN201510237037.0A CN201510237037A CN104889964A CN 104889964 A CN104889964 A CN 104889964A CN 201510237037 A CN201510237037 A CN 201510237037A CN 104889964 A CN104889964 A CN 104889964A
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- Prior art keywords
- movable plate
- screw thread
- button
- marker pen
- pen
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
- B25H7/00—Marking-out or setting-out work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses an automatic marking device for semiconductor inspection. The device comprises a microscope, an inspection platform, a base, a moving plate, a linear motor, a lead screw and a marking component, wherein the linear motor drives the moving plate to linearly move through the lead screw; a rotating angle of the linear motor is set; when a first button or a second button is operated each time, a distance of the moving plate driving the microscope to move is equal to a gap between two wafer bodies; when operators discover the wafer bodies with unqualified welding lines, a third button is pressed down; the linear motor drives the marking component to move rightly above the wafer body with the unqualified welding line; the cylinder drives a marking pen to downwards move to mark the wafer body; after the marking pen triggers a travel switch, a cylinder drives the marking pen to upwards move; and meanwhile, the linear motor drives the moving plate to return to an original position. The device is simple in structure, and automatically marks the wafer bodies with the unqualified welding lines; and the operators generate no marking missing or repeated marking, so that the labor intensity of the operators is greatly reduced.
Description
Technical field
The present invention relates to a kind of labelling apparatus, particularly relate to a kind of semiconductor inspection automatic marking device.
Background technology
At present, when semiconductor production, need inspection wafer body bonding wire whether qualified, and the wafer body of disqualified upon inspection is marked, traditional labeling methods is manually use the wafer body of marking pen to disqualified upon inspection to mark, when operating personnel find defective work, need the framework of manual mobile storing wafer body and mark, owing to being distributed in the wafer body One's name is legion on framework, after working long hours, not only easily there is spill tag note or repeating label in operating personnel, and production efficiency is low, and labour intensity is large.In view of above-mentioned defect, be necessary to design a kind of semiconductor inspection automatic marking device in fact.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of semiconductor inspection automatic marking device, when solving manual markings, and the easy spill tag note of operating personnel or repeating label, the problem that labour intensity is large.
For solving the problems of the technologies described above, technical scheme of the present invention is:
A kind of semiconductor inspection automatic marking device, comprise microscope, verifying bench, base, movable plate, linear electric motors, leading screw, marker assemblies, described movable plate is positioned at base upper end, described movable plate is connected with base sliding, described linear electric motors are positioned on the right side of movable plate lower surface, described linear electric motors are connected with movable plate screw thread, described leading screw runs through linear electric motors, described leading screw is connected with linear electric motors screw thread and is connected with base rotation, described marker assemblies also comprises support, cylinder, sleeve pipe, guide pillar, marker pen, travel switch, described support is positioned at upper end on the right side of movable plate upper surface, described support is connected with movable plate screw thread, described cylinder is positioned at pedestal lower end, described cylinder is connected with support screw thread, described sleeve pipe is positioned at cylinder lower end, described sleeve pipe is connected with cylinder screw thread, described guide pillar is positioned at its lower end, described guide pillar is connected with casing threads, described marker pen is positioned at guide pillar outer wall both sides, described marker pen and guide pillar are weldingly connected, described travel switch is positioned at mid-stent, described travel switch is connected with support screw thread, described marker pen adopts with sleeve pipe and is threaded, marker pen can conveniently take off by operating personnel.
The present invention further improves as follows:
Further, the upper and lower both sides of described base upper surface are provided with slide rail, and described slide rail is connected with whorl of base.
Further, the described upper and lower both sides of movable plate lower surface are provided with slide block, and described slide block is connected with movable plate screw thread.
Further, described movable plate upper surface is also provided with the first button, the second button, the 3rd button, the first described button is connected with movable plate screw thread, the second described button is connected with movable plate screw thread, the 3rd described button is connected with movable plate screw thread, described first button rotates forward for controlling linear electric motors, and described second button is for controlling linear electric motors reversion, and the 3rd described button is used for the action of control mark assembly.
Further, described marker pen top is also provided with chock plug, and described chock plug is connected with marker pen close-fitting, and when in marker pen, ink is used up, opening chock plug can add ink in marker pen.
Further, described chock plug is also provided with steam vent, and described steam vent runs through chock plug main body, and described steam vent is for being communicated with marker pen inner chamber and air.
Further, described marker pen is also provided with pen core, and described pen core is positioned at marker pen inside, and described pen core runs through bottom marker pen, and described pen core is connected with marker pen close-fitting.
Compared with prior art, this semiconductor inspection automatic marking device, during work, linear electric motors drive movable plate to do rectilinear motion by leading screw, setting linear electric motors rotational angle, make often to operate the first button or the second button, the distance of movable plate drive microscope movement equals the spacing between two wafer bodies, when operating personnel find that there is the underproof wafer body of bonding wire, press the 3rd button, linear electric motors drive marker assemblies to move to directly over the underproof wafer body of bonding wire, cylinder drives marker pen to move down and marks wafer body, after marker pen triggers travel switch, cylinder drives marker pen to move upward, linear electric motors drive movable plate to be back to initial position simultaneously.This apparatus structure is simple, automatically marks the underproof wafer body of bonding wire, and spill tag note or repeating label situation can not occur operating personnel, greatly reduce labor intensity of operating staff, improve checkability and accuracy.
Accompanying drawing explanation
Fig. 1 illustrates axonometric drawing of the present invention
Fig. 2 illustrates movable plate upward view of the present invention
Fig. 3 illustrates marker pen sectional view of the present invention
Microscope 1 verifying bench 2
Base 3 movable plate 4
Linear electric motors 5 leading screw 6
Marker assemblies 7 slide rail 301
Slide block 401 first knob 402
Second button 403 the 3rd button 404
Support 701 cylinder 702
Sleeve pipe 703 guide pillar 704
Marker pen 705 travel switch 706
Chock plug 707 steam vent 708
Pen core 709
Detailed description of the invention
As Fig. 1, Fig. 2, shown in Fig. 3, a kind of semiconductor inspection automatic marking device, comprise microscope 1, verifying bench 2, base 3, movable plate 4, linear electric motors 5, leading screw 6, marker assemblies 7, described movable plate 4 is positioned at base 3 upper end, described movable plate 4 slides with base 3 and is connected, described linear electric motors 5 are positioned on the right side of movable plate 4 lower surface, described linear electric motors 5 are connected with movable plate 4 screw thread, described leading screw 6 runs through linear electric motors 5, described leading screw 6 is connected with linear electric motors 5 screw thread and is connected with base rotation, described marker assemblies 7 also comprises support 701, cylinder 702, sleeve pipe 703, guide pillar 704, marker pen 705, travel switch 706, described support 701 is positioned at upper end on the right side of movable plate 4 upper surface, described support 701 is connected with movable plate 4 screw thread, described cylinder 702 is positioned at support 701 lower end, described cylinder 702 is connected with support 701 screw thread, described sleeve pipe 703 is positioned at cylinder 702 lower end, described sleeve pipe 703 is connected with cylinder 702 screw thread, described guide pillar 704 is positioned at sleeve pipe 703 lower end, described guide pillar 704 is connected with sleeve pipe 703 screw thread, described marker pen position 705 is in guide pillar 704 outer wall both sides, described marker pen 705 is weldingly connected with guide pillar 704, described travel switch 706 is positioned in the middle part of support 701, described travel switch 706 is connected with support 701 screw thread, be threaded owing to adopting, marker pen 705 can conveniently take off by operating personnel, the described upper and lower both sides of base 3 upper surface are provided with slide rail 301, described slide rail 301 is connected with base 3 screw thread, the described upper and lower both sides of movable plate 4 lower surface are provided with slide block 401, described slide block 401 is connected with movable plate 4 screw thread, described movable plate 4 upper surface is also provided with the first button 402, second button 403, 3rd button 404, the first described button 402 is connected with movable plate 4 screw thread, the second described button 403 is connected with movable plate 4 screw thread, the 3rd described button 403 is connected with movable plate 4 screw thread, described first button 402 rotates forward for controlling linear electric motors 5, described second button 403 reverses for controlling linear electric motors 5, the 3rd described button 404 is for control mark assembly 7 action, described marker pen 705 top is also provided with chock plug 707, described chock plug 707 is connected with marker pen 705 close-fitting, when in marker pen 705, ink is used up, open chock plug 707 and can add ink in marker pen, described chock plug 707 is also provided with steam vent 708, described steam vent 708 runs through chock plug 707 main body, described steam vent 708 is for being communicated with marker pen 705 inner chamber and air, described marker pen 705 is also provided with pen core 709, it is inner that described pen core 709 is positioned at marker pen 705, and described pen core 709 runs through bottom marker pen 705, described pen core 709 is connected with marker pen 705 close-fitting, this semiconductor inspection automatic marking device, during work, linear electric motors 5 drive movable plate 4 to do rectilinear motion by leading screw 6, setting linear electric motors 5 rotational angle, make often to operate the first button 402 or the second button 403, the spacing that movable plate 5 drives the distance of microscope 1 movement to equal between two wafer bodies, when operating personnel find that there is the underproof wafer body of bonding wire, press the 3rd button 404, linear electric motors 5 drive marker assemblies 7 to move to directly over the underproof wafer body of bonding wire, cylinder 702 drives marker pen 705 to move down and marks wafer body, after marker pen 705 triggers travel switch 706, cylinder 702 drives marker pen 705 to move upward, linear electric motors 5 drive movable plate 4 to be back to initial position simultaneously.This apparatus structure is simple, automatically marks the underproof wafer body of bonding wire, and spill tag note or repeating label situation can not occur operating personnel, greatly reduce labor intensity of operating staff, improve checkability and accuracy.
The present invention is not limited to above-mentioned concrete embodiment, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion made, all drop within protection scope of the present invention.
Claims (7)
1. a semiconductor inspection automatic marking device, comprise microscope, verifying bench, base, characterized by further comprising movable plate, linear electric motors, leading screw, marker assemblies, described movable plate is positioned at base upper end, described movable plate is connected with base sliding, described linear electric motors are positioned on the right side of movable plate lower surface, described linear electric motors are connected with movable plate screw thread, described leading screw runs through linear electric motors, described leading screw is connected with linear electric motors screw thread and is connected with base rotation, described marker assemblies also comprises support, cylinder, sleeve pipe, guide pillar, marker pen, travel switch, described support is positioned at upper end on the right side of movable plate upper surface, described support is connected with movable plate screw thread, described cylinder is positioned at pedestal lower end, described cylinder is connected with support screw thread, described sleeve pipe is positioned at cylinder lower end, described sleeve pipe is connected with cylinder screw thread, described guide pillar is positioned at its lower end, described guide pillar is connected with casing threads, described marker pen is positioned at guide pillar outer wall both sides, described marker pen and guide pillar are weldingly connected, described travel switch is positioned at mid-stent, described travel switch is connected with support screw thread.
2. semiconductor inspection automatic marking device as claimed in claim 1, it is characterized in that the upper and lower both sides of described base upper surface are provided with slide rail, described slide rail is connected with whorl of base.
3. semiconductor inspection automatic marking device as claimed in claim 2, it is characterized in that the described upper and lower both sides of movable plate lower surface are provided with slide block, described slide block is connected with movable plate screw thread.
4. semiconductor inspection automatic marking device as claimed in claim 3, it is characterized in that described movable plate upper surface is also provided with the first button, the second button, the 3rd button, the first described button is connected with movable plate screw thread, the second described button is connected with movable plate screw thread, and the 3rd described button is connected with movable plate screw thread.
5. semiconductor inspection automatic marking device as claimed in claim 4, it is characterized in that described marker pen top is also provided with chock plug, described chock plug is connected with marker pen close-fitting.
6. semiconductor inspection automatic marking device as claimed in claim 5, it is characterized in that described chock plug is also provided with steam vent, described steam vent runs through chock plug main body.
7. semiconductor inspection automatic marking device as claimed in claim 6, it is characterized in that described marker pen is also provided with pen core, described pen core is positioned at marker pen inside, and described pen core runs through bottom marker pen, and described pen core is connected with marker pen close-fitting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510237037.0A CN104889964B (en) | 2015-05-11 | 2015-05-11 | A kind of semiconductor inspection automatic marking device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510237037.0A CN104889964B (en) | 2015-05-11 | 2015-05-11 | A kind of semiconductor inspection automatic marking device |
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| CN104889964A true CN104889964A (en) | 2015-09-09 |
| CN104889964B CN104889964B (en) | 2018-09-28 |
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| CN201510237037.0A Active CN104889964B (en) | 2015-05-11 | 2015-05-11 | A kind of semiconductor inspection automatic marking device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106290376A (en) * | 2016-07-21 | 2017-01-04 | 京东方科技集团股份有限公司 | Microdefect detection device and control method, microscope |
| CN107696006A (en) * | 2017-11-01 | 2018-02-16 | 江苏凯尔生物识别科技有限公司 | A kind of device for dotting |
| CN109444743A (en) * | 2018-12-21 | 2019-03-08 | 湖北艾博智能装备有限公司 | A kind of vertical frequency conversion rotor test device and vertical frequency conversion rotor test machine |
| CN112066900A (en) * | 2020-09-16 | 2020-12-11 | 江西财经大学 | Distance measuring device |
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| CN103616797A (en) * | 2013-12-16 | 2014-03-05 | 史晓华 | Novel nanoimprinting equipment with rapid alignment function |
| CN204736210U (en) * | 2015-05-11 | 2015-11-04 | 池州华钛半导体有限公司 | Semiconductor inspection automatic marking device |
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| JP2005268486A (en) * | 2004-03-18 | 2005-09-29 | Olympus Corp | Marking method, marking apparatus and test device |
| CN101086950A (en) * | 2006-06-08 | 2007-12-12 | 中芯国际集成电路制造(上海)有限公司 | A marking tool for optical microscope and its using method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106290376A (en) * | 2016-07-21 | 2017-01-04 | 京东方科技集团股份有限公司 | Microdefect detection device and control method, microscope |
| CN106290376B (en) * | 2016-07-21 | 2019-04-12 | 京东方科技集团股份有限公司 | Microdefect detection device and its control method, microscope |
| CN107696006A (en) * | 2017-11-01 | 2018-02-16 | 江苏凯尔生物识别科技有限公司 | A kind of device for dotting |
| CN107696006B (en) * | 2017-11-01 | 2023-11-28 | 江苏凯尔生物识别科技有限公司 | Dotting device |
| CN109444743A (en) * | 2018-12-21 | 2019-03-08 | 湖北艾博智能装备有限公司 | A kind of vertical frequency conversion rotor test device and vertical frequency conversion rotor test machine |
| CN112066900A (en) * | 2020-09-16 | 2020-12-11 | 江西财经大学 | Distance measuring device |
| CN112066900B (en) * | 2020-09-16 | 2022-04-29 | 江西财经大学 | Distance measuring device |
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| Publication number | Publication date |
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| CN104889964B (en) | 2018-09-28 |
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Effective date of registration: 20180816 Address after: 247100 Electronic Information Industrial Park 10, Chizhou economic and Technological Development Zone, Anhui Applicant after: CHIZHOU HISEMI ELECTRONIC TECHNOLOGY CO.,LTD. Address before: 247000 8 standardization workshop of Electronic Information Industry Park, Jinan Industrial Park, Chizhou economic and Technological Development Zone, Anhui Applicant before: NATIONT SEMICONDUCTOR Co.,Ltd. |
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Address after: 247100 Electronic Information Industrial Park 10, Chizhou economic and Technological Development Zone, Anhui Patentee after: Chizhou Huayu Electronic Technology Co.,Ltd. Address before: 247100 Electronic Information Industrial Park 10, Chizhou economic and Technological Development Zone, Anhui Patentee before: CHIZHOU HISEMI ELECTRONIC TECHNOLOGY Co.,Ltd. |
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Denomination of invention: An automatic marking device for semiconductor inspection Effective date of registration: 20220916 Granted publication date: 20180928 Pledgee: China Co. truction Bank Corp Chizhou branch Pledgor: Chizhou Huayu Electronic Technology Co.,Ltd. Registration number: Y2022980015312 |
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