CN104882401A - Repeatedly usable chip tray and chip bearing and sorting system - Google Patents
Repeatedly usable chip tray and chip bearing and sorting system Download PDFInfo
- Publication number
- CN104882401A CN104882401A CN201410069480.7A CN201410069480A CN104882401A CN 104882401 A CN104882401 A CN 104882401A CN 201410069480 A CN201410069480 A CN 201410069480A CN 104882401 A CN104882401 A CN 104882401A
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- CN
- China
- Prior art keywords
- crystal grain
- chip bearing
- bearing disc
- load
- adhesive tape
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mounting Of Bearings Or Others (AREA)
Abstract
The invention discloses a repeatedly usable chip tray and a chip bearing and sorting system. The chip tray can be used for bearing crystal grains with different dimensions. The crystal grains are cut ones. The chip tray comprises a bearing frame arranged on the periphery of the chip tray in a surrounding way and made of metal or plastic materials for stabilizing the structure of the chip tray; and a viscous tape arranged in the center of the bearing frame and used for fixing and bearing cut crystal grains.
Description
Technical field
The present invention relates to a kind of reusable chip bearing disc and chip bearing and pick system, particularly relating to a kind of reusable, can be used to the crystal grain loading different size, and only need the chip bearing disc of single specification and chip bearing and pick system.
Background technology
Chip bearing disc has importance on chip back-end process, the chip bearing disc of prior art is with plastic ejection moulding, be provided with multiple bug hole (pocket) being arranged in array shape thereon, according to the grain size for carrying and spacing custom-made, be used for loading and fix the crystal grain after cutting, so that transport.
Generally speaking, chip bearing disc mostly is two to five inch, but, chip bearing disc due to prior art is customized to the crystal grain institute of specific size dimension, so the number of chips that can carry for different customized carriers also can be different, therefore the chip die of other different products cannot be used for, cause the increase of production cost.
In addition, the chip bearing disc due to prior art need be coated with last layer antistatic agent film to prevent electrostatic, even if be only previously used once, this film is still likely destroyed and loses protective effect.So, in order to avoid having the doubt of electrostatic defending (Electrostatic Discharge, ESD), all can directly scrap with the chip bearing disc crossed.Therefore, even the different chip die of same type, still cannot reuse same chip carrier, thus, both not environmentally, also result in the rising of cost.
Please refer to Fig. 1, Fig. 1 is the design diagram of a chip bearing disc 10 of prior art, and chip bearing disc 10 is according to customized size with plastic ejection moulding, then process coats antistatic agent film and dyeing forms.The central design of chip bearing disc 10 has the bug hole (pocket) 100 of one to multiple row, is used for carrying the chip detecting and cut.The main material of chip bearing disc 10 is acryl butadiene styrene polymer (Acrylonitrile Butadiene Styrene, ABS) add antistatic agent and toner, its product quality keyholed back plate and dimensions require that comprising crystalline substance coils warpage 102, bug hole size and surface resistance value etc.
Please refer to Fig. 2, Fig. 2 is the design diagram of a chip bearing disc 20 of another specification of prior art, and chip bearing disc 20 is less from the different size design be in the bug hole 200 of chip bearing disc 20 of chip bearing disc 10, is used for carrying less crystal grain.Can carry 48 crystal grain compared to chip bearing disc 10, chip bearing disc 20 can carry 72 crystal grain.It can thus be appreciated that each time for the customization of different product crystal grain, must redesign and manufacture new chip bearing disc, its manufacturing and design cost is considerable.
Due to the crystal grain of different chip product, be have different designs according to the difference in functionality of this chip, the size of chip naturally also can be different, and its shape, except square, also may be strip.But, these chips are after manufacturing with wafer factory through design, have to pass through to cut and load and be distributed to client, for these various crystal grain varied in size of transport, nature must design different chip bearing discs to load, first comprise designed size Kong Weiyu hole column pitch just, making to place superincumbent crystal grain can stablize, unlikely because of transport or upper board process in landing or collision and damage.Moreover, because the plastic material of chip bearing disc itself may be out of shape because of humiture or other externalities, and then cause the danger of crystal grain landing or collision in transport process, therefore guarantee that it is also most important to the maximum tolerance degree of distortion.In addition, the electrostatic defending to these crystal grain also must be taken into account, to guarantee that the internal wiring of chip will cause function impaired because of electrostatic.But in the face of the crystal grain of these different size dimensions, except must redesign different chip bearing discs at every turn, just onesize at last crystal grain is also because the risk of electrostatic defending is considered must be scrapped, no matter in resource or on the time, all very waste.
Therefore, how to design reusable chip bearing disc, and can be used to the crystal grain loading different size, real is one of important topic of this area.
Summary of the invention
Therefore, namely main purpose of the present invention is to provide a kind of single specification but can be used to load different size chip die and the reusable chip bearing disc device loading in crystal grain and transport, to save production cost.
The invention discloses a kind of reusable chip bearing disc, can be used to the crystal grain loading different size, this crystal grain is the crystal grain after cutting, and this chip bearing disc comprises: a load-carrying ring (Frame), be made up of metal or plastic material, be used for the structure of this chip bearing disc firm; And a tool adhesive tape (Tape), connect this load-carrying ring in the ring being arranged at this load-carrying ring, be used for fixing and carry the crystal grain after cutting.
The invention also discloses a kind of chip bearing and pick system, be used for loading and pick the crystal grain of different size, it comprises: a chip bearing disc, reusable, and can be used to the crystal grain loading different size, this crystal grain is the crystal grain after cutting, and this chip bearing disc comprises: a load-carrying ring (Frame), be made up of metal or plastic material, be used for the structure of this chip bearing disc firm; And a tool adhesive tape (Tape), connect this load-carrying ring in the ring being arranged at this load-carrying ring, be used for fixing and carry the crystal grain after cutting.One bracing frame, supports the corner of this load-carrying ring, and the bottom of this load-carrying ring and a workbench are separated by a specific range; And a push pin device, comprise one to several thimble, the bottom surface being arranged at this tool adhesive tape corresponds to the position of this crystal grain, is used for slightly being lifted by this crystal grain on this tool adhesive tape, so that a board picks this crystal grain.
Accompanying drawing explanation
Fig. 1 is the design diagram of a chip bearing disc 10 of prior art.
Fig. 2 is the design diagram of a chip bearing disc 20 of another specification of prior art.
Fig. 3 is the schematic diagram of the embodiment of the present invention one chip bearing disc 30.
Fig. 4 is the schematic diagram that the embodiment of the present invention one chip bearing disc 40 carries crystal grain 404.
Fig. 5 is the schematic perspective view of the embodiment of the present invention one load-carrying ring 500.
Fig. 6 is the assembling schematic diagram of the embodiment of the present invention one chip bearing disc 60.
Fig. 7 is the embodiment of the present invention one chip bearing and the schematic diagram picking system 70.
Fig. 8 is the schematic diagram of the operating process 80 using the chip bearing of Fig. 7 and pick system 70.
Wherein, description of reference numerals is as follows:
10,20,30,40,60,700 chip bearing discs
100,200 bug holes
102 brilliant dish warpages
300,400,500,600,701 load-carrying rings
302,402,602,702 tool adhesive tape
404,704 crystal grain
405,406 spacing
407 anchor points
501,601 joint mouths
6020 first surfaces
6022 second
6024 zone lines
70 chip bearings with pick system
710 bracing frames
720 thimbles
730 workbenches
740 suction nozzles
H specific range
80 flow processs
800 ~ 806 steps
Embodiment
Please refer to Fig. 3, Fig. 3 is the schematic diagram of the embodiment of the present invention one chip bearing disc 30.Chip bearing disc 30 is roughly made up of a load-carrying ring (Frame) 300 and a tool adhesive tape 302.Load-carrying ring 300 is made up of the plastic material of metal or hard, and in a frame shape, to reach robust structure.Connect load-carrying ring 300 in the ring that tool adhesive tape 302 is arranged on load-carrying ring 300, be used for fixing and carry the crystal grain after cutting.In other words, chip bearing disc 30 utilizes tool adhesive tape 302 to fix and carries the crystal grain after cutting, and do not need the chip bearing disc 10,20 as prior art to utilize the fixing crystal grain of bug hole 100,200, therefore, can be used for the crystal grain loading various different size, and reach reusable advantage.
Specifically, as shown in Figure 3, chip bearing disc 30 is the crystal grain bogey roughly in a rectangle plane, and the crystal grain of any size is all applicable, and can be generally reused many times.For example, please refer to Fig. 4, Fig. 4 is the schematic diagram that the embodiment of the present invention one chip bearing disc 40 carries crystal grain 404.Chip bearing disc 40 is derived from chip bearing disc 30, and it is the carrier of one 76 square centimeters of sizes, namely 8.72 centimeters square, be 68 square centimeters after deducting the part of its load-carrying ring 400.If the crystal grain 404 that need carry is rectangle, such as 24 millimeters are multiplied by 1.7 millimeters, then chip bearing disc 40 can be divided into twoth district, left and right by centre, 24 crystal grain are respectively placed in each district, X-direction between each crystal grain leaves the spacing 405 of 11.6 millimeters, and Y-direction then leaves the spacing 406 of 1.6 millimeters.Thus, operator only needs the board that relevant for above data input (or in image identification mode) crystal grain is placed or picked, board just can be placed exactly according to the position of crystal grain 404 or pick crystal grain 404, and does not need to redesign and produce new chip bearing disc.
In addition, as shown in Figure 4, chip bearing disc 40 possesses flexible shallow storage space for the crystal grain of each different size, and that is, the crystal grain for different size does not have different carrier sizes or specification requirement.In addition, the load-carrying ring 400 of chip bearing disc 40 or tool adhesive tape 402 can have one or more anchor point 407, for the use of the board identification or location of picking crystal grain 404.
It is noted that the present invention utilizes load-carrying ring and tool adhesive tape to form reusable chip bearing disc, those skilled in the art when doing different modifications according to this, and is not limited thereto.For example, please refer to Fig. 5, Fig. 5 is the schematic perspective view of the embodiment of the present invention one load-carrying ring 500.Load-carrying ring 500 can be used to the load-carrying ring 300 realizing Fig. 3, and the inner side on its four limit remains with the joint mouth 501 carrying out with tool adhesive tape 302 engaging, so that the adhesive tape of device adhesive tape or displacement stickiness deficiency.The material of load-carrying ring 500 can be metal, or has the plastic material of isolated effect to electrostatic.If load-carrying ring 500 is made of metal, benefit is that durability is better, does not have electrostatic and remains, and it is also comparatively large to meet with stresses, and can not produce torsional deformation, and then affect the reliability of chip bearing disc with the difference of temperature or humidity.If load-carrying ring 500 is made up of plastic material, then must coat thicker anti-static coatings in its material, accumulate in handling process to prevent electrostatic.In addition, the viscose of the adhesive tape engaged with load-carrying ring 500 should be removable viscose, such as, be the polyethylene (polyethylene with an acrylic basedPSA) of acrylic acid pressure-sensing glue.
In addition, the material due to load-carrying ring is metal, or comparatively durable plastic material, therefore can be reused.No matter be the different product carrying different grain size, or the like products of same grain size, do not need the specification changing load-carrying ring just can reuse.
Fig. 6 is the assembling schematic diagram of the embodiment of the present invention one chip bearing disc 60, and the load-carrying ring 600 in chip bearing disc 60 is similar to the load-carrying ring 500 shown in Fig. 5, has a joint mouth 601, to connect tool adhesive tape 602.The surrounding of tool adhesive tape 602 fits in load-carrying ring 600, and make tool adhesive tape 602 in a plane in the ring of load-carrying ring 600, to be used for fixing the crystal grain be placed on tool adhesive tape 602, the crystal grain cut can be fixed on tool adhesive tape 602 regularly.Adhesive tape 602 has two sides, and first surface 6020 roughly forms the back side of chip bearing disc 60, and its edge has stickiness, is used for being attached to the joint mouth 601 of load-carrying ring 600, to be fixed on load-carrying ring 600; And the second face 6022 of tool adhesive tape 602 roughly forms the front of chip bearing disc 60, its zone line 6024 has stickiness, is used for sticking crystal grain, and crystal grain can not be slided in handling process.Wherein, be arranged between the crystal grain on tool adhesive tape 602 and there is a specific interval, so can not collide with each other in the process of carrying or pick each other.
In addition, be applicable to tool adhesive tape of the present invention and can adopt and can change the material of stickiness with the external environment factor, such as, controlled the material of stickiness by the change of light, ultraviolet light, illumination or temperature, be adsorbed on intensity on adhesive tape to control crystal grain.Such as, Ultraviolet radiation adhesive tape (UV Tape), can reduce its tackness by the irradiation of ultraviolet light, pick to pick board, also avoid cull to stay on crystal grain.
In addition, tool adhesive tape can disposable or muptiple-use use, and has the function blocking electrostatic.Its reusable number of times, must decide depending on different situations, and the difference of the distance of such as transporting, time, method and ambient temperature, humidity decides.
Please refer to Fig. 7, Fig. 7 is the embodiment of the present invention one chip bearing and the schematic diagram picking system 70.Chip bearing with pick the crystal grain that system 70 is used for loading and picking different size, it comprises reusable chip bearing disc 700, bracing frame 710 and a thimble 720.Bracing frame 710 is four angles supporting a load-carrying ring 701, and the bottom of load-carrying ring 701 and a workbench 730 are separated by a specific range h.Thimble 720 is a part for a push pin device, the bottom surface being arranged at tool adhesive tape 702 corresponds to the position of crystal grain, when a certain crystal grain 704 is selected, thimble 720 can be moved on to immediately below crystal grain 704 by driving, and rise so that the crystal grain on tool adhesive tape 702 is lifted slightly, utilize a suction nozzle 740 to pick crystal grain 704 to pick board.
In addition, bracing frame 710 is a detachable apparatus, just can be assembled on chip bearing disc 700 when picking crystal grain.Bracing frame 710 can be an independently device, also can be arranged in advance on board, and only when selecting crystal grain, ability is assembled is attached on chip bearing disc 700.In addition, the push pin device belonging to thimble 720 can possess one to several thimble, can be installed on and pick on board.Push pin device also can comprise an X-axis shifter, a Y-axis shifter and a Z axis shifter, be used for controlling the position of thimble 720, thimble 720 is made to do the movement of dual space (i.e. X, Y direction) and tridimensional adjustment (namely X, Y direction add Z-direction) up and down, slightly to be lifted by the crystal grain 704 on tool adhesive tape 702.
Please refer to Fig. 8, Fig. 8 is the schematic diagram of the operating process 80 using the chip bearing of Fig. 7 and pick system 70.Flow process 80 is used to the crystal grain in chip bearing disc 700 to pick out.Flow process 80 comprises following steps:
Step 800: be combined in by bracing frame 710 on chip bearing disc 700, with the corner of support bearing ring 701, makes the bottom of load-carrying ring 701 and workbench 730 be separated by a specific range h.
Step 802: push pin device is arranged under tool adhesive tape 702.
Step 804: the plan position approach (X, Y direction) of adjustment thimble 720, makes it in alignment with the position of crystal grain on tool adhesive tape 702 front.
Step 806: the upper-lower position (Z-direction) of adjustment thimble 702, lifts the crystal grain on tool adhesive tape 702, slightly so that pick crystal grain.
In sum, chip bearing disc of the present invention and chip bearing and the system of picking can be used for the crystal grain loading various different size, and can be recycled, and therefore not only can reduce the waste of resource, more can save production cost.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (15)
1. a reusable chip bearing disc, can be used to the crystal grain loading different size, this crystal grain is the crystal grain after cutting, and this chip bearing disc comprises:
One load-carrying ring, is made up of metal or plastic material, is used for the structure of this chip bearing disc firm; And
One tool adhesive tape, connects this load-carrying ring in the ring being arranged at this load-carrying ring, is used for fixing and carry the crystal grain after cutting.
2. reusable chip bearing disc as claimed in claim 1, is characterized in that this chip bearing disc is the crystal grain bogey of a rectangle plane.
3. reusable chip bearing disc as claimed in claim 1, is characterized in that this load-carrying ring or this tool adhesive tape have one or more anchor point, for the use of board identification or location.
4. reusable chip bearing disc as claimed in claim 1, is characterized in that this load-carrying ring is a rectangle.
5. reusable chip bearing disc as claimed in claim 1, is characterized in that this load-carrying ring can muptiple-usely use.
6. reusable chip bearing disc as claimed in claim 1, is characterized in that a material of this load-carrying ring is the plastic material that a metal material or tool electrostatic completely cut off effect.
7. reusable chip bearing disc as claimed in claim 1, it is characterized in that the surrounding of this tool adhesive tape fits in this load-carrying ring, this tool adhesive tape in a plane, is used for fixing this crystal grain be placed on this tool adhesive tape in the ring of this load-carrying ring.
8. reusable chip bearing disc as claimed in claim 1, is characterized in that this tool adhesive tape can disposable or muptiple-use use.
9. reusable chip bearing disc as claimed in claim 1, is characterized in that this tool adhesive tape has the function blocking electrostatic.
10. reusable chip bearing disc as claimed in claim 1, it is characterized in that the edge of a first surface of this tool adhesive tape has stickiness, for fixing on this load-carrying ring, the centre of one second of this tool adhesive tape has stickiness, be used for arranging this crystal grain, this crystal grain can not be slided, wherein, be arranged between this crystal grain on this tool adhesive tape and there is a specific interval.
11. reusable chip bearing discs as claimed in claim 1, is characterized in that a material of this tool adhesive tape can change stickiness with an external environment factor, and this external environment factor is used for controlling this crystal grain and is adsorbed on intensity on this tool adhesive tape.
12. 1 kinds of chip bearings with pick system, be used for loading and pick the crystal grain of different size, it comprises:
One chip bearing disc, reusable, and can be used to the crystal grain loading different size, this crystal grain is the crystal grain after cutting, and this chip bearing disc comprises:
One load-carrying ring, is made up of metal or plastic material, is used for the structure of this chip bearing disc firm; And
One tool adhesive tape, connects this load-carrying ring in the ring being arranged at this load-carrying ring, is used for fixing and carry the crystal grain after cutting;
One bracing frame, supports the corner of this load-carrying ring, and the bottom of this load-carrying ring and a workbench are separated by a specific range; And
One push pin device, comprises one to several thimble, and the bottom surface being arranged at this tool adhesive tape corresponds to the position of this crystal grain, is used for slightly being lifted by this crystal grain on this tool adhesive tape, so that a board picks this crystal grain.
13. chip bearings as claimed in claim 12 with pick system, it is characterized in that this bracing frame is a detachable apparatus, be assembled in time picking this crystal grain on this chip bearing disc.
14. chip bearings as claimed in claim 12 with pick system, it is characterized in that this push pin device is arranged on this board.
15. chip bearings as claimed in claim 12 with pick system, it is characterized in that this push pin device comprises an X-axis shifter, a Y-axis shifter and a Z axis shifter, be used for controlling this one to the position of several thimble, this is made one to do the movement of dual space to several thimble and tridimensionally to adjust up and down, slightly to be lifted by this crystal grain on this tool adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410069480.7A CN104882401A (en) | 2014-02-27 | 2014-02-27 | Repeatedly usable chip tray and chip bearing and sorting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410069480.7A CN104882401A (en) | 2014-02-27 | 2014-02-27 | Repeatedly usable chip tray and chip bearing and sorting system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104882401A true CN104882401A (en) | 2015-09-02 |
Family
ID=53949841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410069480.7A Pending CN104882401A (en) | 2014-02-27 | 2014-02-27 | Repeatedly usable chip tray and chip bearing and sorting system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104882401A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190441A (en) * | 1984-10-11 | 1986-05-08 | Nec Corp | Adhesive tape to wafer |
| CN1467797A (en) * | 2002-06-11 | 2004-01-14 | �¹������ҵ��ʽ���� | Method of manufacturing micro-semiconductor element |
| CN1503320A (en) * | 2002-11-27 | 2004-06-09 | 先进自动器材有限公司 | Device and method for separating thin crystalline grains |
| CN101101889A (en) * | 2006-07-07 | 2008-01-09 | 京元电子股份有限公司 | Thimble module of crystal grain extractor |
| US20090170290A1 (en) * | 2005-01-21 | 2009-07-02 | Hiroshi Maki | Semiconductor manufacturing method of die pick-up from wafer |
| CN101587826A (en) * | 2008-05-21 | 2009-11-25 | 启耀光电股份有限公司 | Crystal solidifying apparatus |
| CN201780969U (en) * | 2010-07-15 | 2011-03-30 | 徐荣祥 | Semiconductor crystal particle detection detachment structure |
| CN103579069A (en) * | 2012-07-20 | 2014-02-12 | 久元电子股份有限公司 | Crystalline grain picking and placing method, bearing structure for picking and placing of crystalline grains and crystalline grain picking and placing device |
-
2014
- 2014-02-27 CN CN201410069480.7A patent/CN104882401A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6190441A (en) * | 1984-10-11 | 1986-05-08 | Nec Corp | Adhesive tape to wafer |
| CN1467797A (en) * | 2002-06-11 | 2004-01-14 | �¹������ҵ��ʽ���� | Method of manufacturing micro-semiconductor element |
| CN1503320A (en) * | 2002-11-27 | 2004-06-09 | 先进自动器材有限公司 | Device and method for separating thin crystalline grains |
| US20090170290A1 (en) * | 2005-01-21 | 2009-07-02 | Hiroshi Maki | Semiconductor manufacturing method of die pick-up from wafer |
| CN101101889A (en) * | 2006-07-07 | 2008-01-09 | 京元电子股份有限公司 | Thimble module of crystal grain extractor |
| CN101587826A (en) * | 2008-05-21 | 2009-11-25 | 启耀光电股份有限公司 | Crystal solidifying apparatus |
| CN201780969U (en) * | 2010-07-15 | 2011-03-30 | 徐荣祥 | Semiconductor crystal particle detection detachment structure |
| CN103579069A (en) * | 2012-07-20 | 2014-02-12 | 久元电子股份有限公司 | Crystalline grain picking and placing method, bearing structure for picking and placing of crystalline grains and crystalline grain picking and placing device |
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Application publication date: 20150902 |
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