CN104867809B - The fixed point Ginding process of packaging - Google Patents
The fixed point Ginding process of packaging Download PDFInfo
- Publication number
- CN104867809B CN104867809B CN201410062007.6A CN201410062007A CN104867809B CN 104867809 B CN104867809 B CN 104867809B CN 201410062007 A CN201410062007 A CN 201410062007A CN 104867809 B CN104867809 B CN 104867809B
- Authority
- CN
- China
- Prior art keywords
- packaging
- chip
- grinding
- fixed point
- ginding process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000000227 grinding Methods 0.000 claims abstract description 47
- 244000137852 Petrea volubilis Species 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 238000002360 preparation method Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention provides a kind of fixed point Ginding process of packaging, chip is packaged with the packaging, methods described includes：Level grinding is carried out to the packaging on the packaging surface corresponding to chip surface, until close to stopping grinding during chip surface in packaging；The chip profile position of needs is demarcated on the horizontal abradant surface of packaging；Section grinding is carried out to packaging on the side of horizontal abradant surface in packaging, stops grinding when abradant surface reaches the chip profile position of the demarcation.The present invention need not remove encapsulation, and damage will not be caused to chip, with low cost, it is easy to accomplish.
Description
Technical field
The present invention relates to the fixed point Ginding process of technical field of semiconductors, more particularly to a kind of packaging.
Background technology
In failure analysis, product development and the reverse engineer for carrying out device, it is sometimes desirable to fixed point observation device chips
Section pattern.
Now widely used first method is to be removed using chemical solution after encapsulation, fixed point grinding, but the method meeting
The exposed metal and polyimide layer of bonding line and chip surface is damaged simultaneously（For using polyimide layer as chip list
For the product of face protective layer）；Second method is while to realize that positioning, mark, fixed point are cut and ground using corollary equipment
Mill, but the high-end devices that the method is related to are more, and price is high；The third is directly grinds, and this method can not determine previewing
Point position in the devices, in the case where not removing encapsulation, is ground to specified location, success rate and less efficient.
From foregoing description, in the prior art except the expensive corollary equipment of non-usage, otherwise encapsulation can not removed
In the case of to packaging realize fixed point grinding, it is impossible to be precisely accomplished the preparation of chip specified location section sample.
The content of the invention
The purpose of the present invention is can to carry out fixed point grinding to packaging in the case where not removing encapsulation, completes chip
The preparation of specified location section sample.
In order to achieve the above object, the invention provides a kind of fixed point Ginding process of packaging, the packaging
In be packaged with chip, methods described includes：The packaging is cuboid, and the chip surface is parallel to packaging table
Face.
Level grinding is carried out to the packaging on the packaging surface corresponding to chip surface, until close encapsulation
Stop grinding during chip surface in device；
The chip profile position of needs is demarcated on the horizontal abradant surface of packaging；
Section grinding is carried out to packaging on the side of horizontal abradant surface in packaging, when abradant surface reaches
Stop grinding during the chip profile position of the demarcation.
Preferably, this method also includes：The chip surface close in packaging refers to saturating using light microscope
Remaining encapsulating material is crossed it is observed that the pattern of chip surface.
Preferably, this method also includes：When section grinds packaging close to the position demarcated, intermittently using optics
Micro- sem observation chip profile pattern, suits the requirements and then stops grinding, otherwise proceeds section grinding.
Preferably, this method also includes：Horizontal abradant surface is all the time parallel to chip surface.
Preferably, this method also includes：Abradant surface when section is ground is all the time perpendicular to chip surface.
Preferably, this method also includes：It is described to be ground to be ground packaging using sand paper.
The fixed point Ginding process for the packaging that the present invention is used, is ground to close to core to packaging carry out level first
Piece surface, section again is then demarcated after the profile position of needs on horizontal abradant surface and is ground to the position, is completed chip and is specified
The preparation of position profile sample, it is not necessary to remove encapsulation, will not cause damage to chip, with low cost, it is easy to accomplish.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is the flow chart of the fixed point Ginding process of packaging according to an embodiment of the invention；
Fig. 2 is the schematic top plan view of the packaging before grinding；
Fig. 3 is the schematic top plan view of the grinding of completion level and calibrated packaging；
Fig. 4 is the schematic top plan view for completing the packaging after section grinding；
Fig. 5 is the diagrammatic cross-section of the packaging before grinding；
Fig. 6 is the diagrammatic cross-section of the packaging after the grinding of completion level；
Fig. 7 is the diagrammatic cross-section for completing the packaging after section grinding.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is
A part of embodiment of the present invention, rather than whole embodiments, based on the embodiment in the present invention, those of ordinary skill in the art
The every other embodiment obtained on the premise of creative work is not made, belongs to the scope of protection of the invention.
Fig. 1 is the flow chart of the fixed point Ginding process of packaging according to an embodiment of the invention, in packaging
Chip is packaged with, this method comprises the following steps：
Step S1：Level grinding is carried out to the packaging on the packaging surface corresponding to chip surface, until
Close to stopping grinding during chip surface in packaging；Step S2：The chip profile position of needs is demarcated on horizontal abradant surface
Put；
Step S3：Section grinding is carried out to packaging on the side of horizontal abradant surface in packaging, when grinding
Flour milling stops grinding when reaching the chip profile position of the demarcation.
Wherein, level grinding refers to the surface of abradant surface and packaging（For the side of packaging）It is flat
OK, section grinding refers to the section of abradant surface and packaging（It is parallel with the side of packaging）It is parallel.
It is ground to be ground packaging using sand paper, selected sand paper and grinding scheme is specific by packaging
Size, packing forms etc. are determined, will not be repeated here.
The grinding and polishing mode of step S3 section grinding is identical with the section grinding and polishing of traditional packaging, herein
Repeat no more.
The chip surface close in packaging in step S1 refers to encapsulate through remaining using light microscope
Material is it is observed that the pattern of chip surface.
Step S3 also includes：When section grinds packaging close to the position demarcated, intermittently using light microscope
Chip profile pattern is observed, suits the requirements and then stops grinding, otherwise proceeds section grinding.
In this embodiment, packaging is preferably cuboid, and chip surface is parallel to packaging surface.In grinding
When, horizontal abradant surface is all the time parallel to chip surface；Abradant surface when section is ground is all the time perpendicular to chip surface.So, energy
So that grinding when will not deflection and damage chip.
In order to become apparent from embodying the solution of the present invention, carried out below by taking the fixed point grinding of a square package device as an example
Explanation.
The square packaging 1 is packaged with chip 2.
As shown in Fig. 2,5, the chip 2 before grinding in packaging 1 can not be observed away from surface, therefore in packaging 1
To chip 2.
In step S1, level grinds packaging 1 to the surface close to the chip 2 in packaging 1.Complete step S1 it
Afterwards, as shown in fig. 6, packaging 1 is thinning, chip 2 has approached horizontal abradant surface.Core can be now observed on horizontal abradant surface
The basic pattern on the surface of piece 2, as shown in Figure 3, it is preferable that using light microscope through remaining encapsulating material it is observed that chip
The pattern on 2 surfaces.
In step S2, the chip profile position 3 of needs is demarcated on the horizontal abradant surface of packaging 1, as shown in Figure 3.
In step S3, section grinds packaging 1 to the position 3.Preferably, when the close mark of section grinding packaging 3
During fixed position 3, intermittently using the section pattern of observation by light microscope chip 2, suit the requirements and then stop grinding, otherwise after
It is continuous to carry out section grinding.As shown in Fig. 4,7, complete after step S3, abradant surface reaches the chip profile needed, completes chip
The preparation of 2 specified location section sample.
Visible by foregoing description, the embodiment of the present invention has following beneficial effect：
By the fixed point Ginding process of packaging provided in an embodiment of the present invention, packaging carry out level is ground first
It is milled to close to chip surface, then demarcates after the profile position of needs that section is ground to the position again on horizontal abradant surface, it is complete
Into the preparation of chip specified location section sample, it is not necessary to remove encapsulation, damage will not be caused to chip, it is with low cost, it is easy to
Realize.
It is last it should be noted that：Presently preferred embodiments of the present invention is the foregoing is only, the skill of the present invention is merely to illustrate
Art scheme, is not intended to limit the scope of the present invention.Any modification for being made within the spirit and principles of the invention,
Equivalent substitution, improvement etc., are all contained in protection scope of the present invention.
Claims (6)
1. the fixed point Ginding process of a kind of packaging, it is characterised in that chip, methods described are packaged with the packaging
Including：
Level grinding is carried out to the packaging on the packaging surface corresponding to chip surface, until close to packaging
In chip surface when stop grinding；
The chip profile position of needs is demarcated on the horizontal abradant surface of packaging；
Section grinding is carried out to packaging on the side of horizontal abradant surface in packaging, when abradant surface reach it is described
Stop grinding during the chip profile position of demarcation；
Wherein, the chip surface close in packaging refers to observe through remaining encapsulating material using light microscope
To the pattern of chip surface.
2. the fixed point Ginding process of packaging according to claim 1, it is characterised in that this method also includes：When cuing open
When face grinding packaging is close to the position demarcated, intermittently using observation by light microscope chip profile pattern, suit the requirements
Then stop grinding, otherwise proceed section grinding.
3. the fixed point Ginding process of packaging according to claim 1 or 2, it is characterised in that this method also includes：Institute
Packaging is stated for cuboid, the chip surface is parallel to packaging surface.
4. the fixed point Ginding process of packaging according to claim 3, it is characterised in that this method also includes：Level
Abradant surface is all the time parallel to chip surface.
5. the fixed point Ginding process of packaging according to claim 3, it is characterised in that this method also includes：Section
Abradant surface during grinding is all the time perpendicular to chip surface.
6. the fixed point Ginding process of packaging according to claim 1 or 2, it is characterised in that this method also includes：Institute
State and be ground to be ground packaging using sand paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410062007.6A CN104867809B (en) | 2014-02-21 | 2014-02-21 | The fixed point Ginding process of packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410062007.6A CN104867809B (en) | 2014-02-21 | 2014-02-21 | The fixed point Ginding process of packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104867809A CN104867809A (en) | 2015-08-26 |
| CN104867809B true CN104867809B (en) | 2017-09-05 |
Family
ID=53913571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410062007.6A Expired - Fee Related CN104867809B (en) | 2014-02-21 | 2014-02-21 | The fixed point Ginding process of packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104867809B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109623541B (en) * | 2018-10-16 | 2020-07-17 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Solder ball removing equipment and method for BGA packaging device |
| CN114252319B (en) * | 2022-03-01 | 2022-12-09 | 江山季丰电子科技有限公司 | Fault analysis method of semiconductor laser, preparation method of sample and system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522319A (en) * | 2012-01-05 | 2012-06-27 | 航天科工防御技术研究试验中心 | Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG119185A1 (en) * | 2003-05-06 | 2006-02-28 | Micron Technology Inc | Method for packaging circuits and packaged circuits |
| JP2013120883A (en) * | 2011-12-08 | 2013-06-17 | Fuji Electric Co Ltd | Lateral diffusion width evaluation method of diffusion region formed in semiconductor device |
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2014
- 2014-02-21 CN CN201410062007.6A patent/CN104867809B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522319A (en) * | 2012-01-05 | 2012-06-27 | 航天科工防御技术研究试验中心 | Embedding unpackaging method for plastic packaged device packaged by flip chip bonding process |
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| Publication number | Publication date |
|---|---|
| CN104867809A (en) | 2015-08-26 |
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