CN104866814A - Fingerprint identification device and manufacturing method thereof - Google Patents
Fingerprint identification device and manufacturing method thereof Download PDFInfo
- Publication number
- CN104866814A CN104866814A CN201510183293.6A CN201510183293A CN104866814A CN 104866814 A CN104866814 A CN 104866814A CN 201510183293 A CN201510183293 A CN 201510183293A CN 104866814 A CN104866814 A CN 104866814A
- Authority
- CN
- China
- Prior art keywords
- ink
- fingerprint recognition
- layer
- recognition element
- sublayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Image Input (AREA)
Abstract
The invention relates to a fingerprint identification device. The fingerprint identification device comprises a protection substrate, an ink layer and a fingerprint identification element, wherein the ink layer is formed on the protection substrate, and the fingerprint identification element is fixed on the ink layer through a characteristic that the ink layer is converted from a liquid state into a solid state in the forming process. The fingerprint identification device and the manufacturing method thereof provided by the invention can reduce the thickness of the fingerprint identification device, thereby providing a lighter and thinner fingerprint identification device.
Description
Technical field
The present invention relates to the manufacture method of a kind of fingerprint identification device and described fingerprint identification device.
Background technology
Fingerprint identification device is to be widely used in the different field such as industry, national defence, fire-fighting, consumer electronics.For consumer electronics field, the electronic installations such as existing many mobile phones, notebook computer are configured with fingerprint identification function, to realize the function such as unlocked by fingerprint, fingerprint payment.But current electronic installation more and more tends to lightening, the thickness how reducing fingerprint identification device has been laid out subject under discussion.
Summary of the invention
Given this, be necessary to provide a kind of fingerprint identification device.Described fingerprint identification device comprises protective substrate, ink layer and fingerprint recognition element; described ink layer is formed on described protective substrate, and described fingerprint recognition element is converted to solid-state characteristic by liquid state by described ink layer and is fixed on described ink layer in forming process.
There is a need to the manufacture method providing a kind of fingerprint identification device, the method comprises: provide protective substrate, and is coated with ink material layer in described protection; Solidify described ink material layer, and the fingerprint recognition element embedding this ink material layer is set when described ink material layer does not solidify completely; And complete the described ink material layer of solidification to form ink layer.
Compared to prior art, fingerprint identification device provided by the present invention and manufacture method thereof can reduce the thickness of fingerprint identification device, thus provide more lightening fingerprint identification device.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the fingerprint identification device that the specific embodiment of the invention provides.
Fig. 2 is the cut-open view that fingerprint identification device that first embodiment of the invention provides is formed along II-II line of cut in Fig. 1.
Fig. 3 is the cut-open view that fingerprint identification device that second embodiment of the invention provides is formed along II-II line of cut in Fig. 1.
Fig. 4 is the cut-open view that fingerprint identification device that third embodiment of the invention provides is formed along II-II line of cut in Fig. 1.
Fig. 5 is the cut-open view that fingerprint identification device that four embodiment of the invention provides is formed along II-II line of cut in Fig. 1.
Fig. 6 is the cut-open view that fingerprint identification device that fifth embodiment of the invention provides is formed along II-II line of cut in Fig. 1.
Fig. 7 is the process flow diagram of the fingerprint identification device manufacture method of the specific embodiment of the invention.
Fig. 8 to Figure 13 is the schematic diagram of each step of manufacture method in Fig. 7.
Main element symbol description
| Electronic installation | 20 |
| Cover sheet | 100 |
| Touch Zone | 110 |
| Non-touch-control district | 120 |
| Opening | 100a |
| Fingerprint identification device | 200、300、400、500、600 |
| Protective substrate | 210、310、410、510、610 |
| Ink layer | 220、320、420、520、620 |
| First ink sublayer | 221、321、421、521、621 |
| Second ink sublayer | 222、322、422、522、622 |
| Fingerprint recognition element | 230、330、430、530、630 |
| Colloid | 440、640 |
| Groove | 550、650 |
| Protective surface | 311 |
| Bending side | 312 |
| First ink material layer | 420a |
| Second ink material layer | 420b |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, Fig. 1 for fingerprint identification device 200 that the specific embodiment of the invention provides be applied in one there is the electronic installation 20 of touch controllable function time structural representation.This electronic installation 10 comprises a touch-control structure to realize touch controllable function, a cover sheet 100 and a decorative layer (non-label).The definition of this electronic installation has Touch Zone 110 and a non-touch-control district 120.The corresponding non-touch-control district 120 of this cover sheet 100 of this electronic installation is provided with the opening 100a of this fingerprint identification device 200 of a collecting.This decorative layer is for covering the metal routing (not shown) that is positioned at non-touch-control region 120 and forming a Decorative frame in this non-touch-control district 120.The material of this decorative layer is colored ink, as black ink or white ink, not as limit.
See also Fig. 2; the fingerprint identification device 200 provided for first embodiment of the invention is along the cut-open view of II-II line in Fig. 1; this fingerprint identification device 200 to be arranged in this opening in 100a; and for ensureing the consistance of whole Decorative frame, the fingerprint recognition element 230 of this fingerprint identification device 200 arranges ink layer 220 and protective substrate 210 further.In the present embodiment, the solid colour of the color of this ink layer 220 and the decorative layer of this electronic installation.This protective substrate 210 can be consistent with the material of the cover sheet 100 of this electronic installation.Change ground, this fingerprint identification device 200 also can use independent of electronic installation.This protective substrate 210 is for the protection of the fingerprint recognition element 230 of this fingerprint identification device 200.This ink layer 220 also can be used for covering this fingerprint recognition element 230 to realize the aesthetic property of fingerprint identification device 200, and is not limited to the object coordinating Decorative frame in the present embodiment.
In the present embodiment, described ink layer 220 is formed on described protective substrate 210.Described fingerprint recognition element 230 is formed on described ink layer 220.Described protective substrate 210 can not be destroyed with described fingerprint recognition element 230 for the protection of described ink layer 220.Described ink layer 220 is for covering this fingerprint recognition element 230 to realize the aesthetic property of fingerprint identification device 200.Described fingerprint recognition element 230 is for responding to the fingerprint of the finger being placed on corresponding described fingerprint recognition element 230 position on described protective substrate 210.In the present invention, this ink layer 220 have in forming process from liquid state be solid-state characteristic.This fingerprint recognition element 230 embeds in this ink layer 220, and is converted to by liquid state the laminating that solid-state characteristic realizes this fingerprint recognition element 230 and this protective substrate 210 by this ink layer 220.
In the present embodiment, described protective substrate 210 is protective substrates 210 of a plane.Described ink layer 220 comprises the first ink sublayer 221 and the second ink sublayer 222 of stacked setting.Described first ink sublayer 221 is between described second ink sublayer 222 and described protective substrate 210.Described fingerprint recognition element 230 is pasted onto on described first ink sublayer 221 by described second ink sublayer 222.Particularly, this first ink sublayer 221 is formed in protective substrate 210 on the surface, and this fingerprint recognition element 230 only embeds in this second ink sublayer 222.For the ink layer 220 with bilayer or even multilayer ink sublayer; compared to the ink layer 220 of individual layer; when the laminating between fingerprint recognition element 230 and this protective substrate 210 can either be realized; because at least one first ink sublayer 222 is arranged between this fingerprint recognition element 230 and this protective substrate 210, the effect that energy effective guarantee covers.
The material of described protective substrate 210 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate; PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin; and polyethylene terephthalate (polyethylene terephthalate, PET) etc. PES).The material of described first ink sublayer 221 and the second ink sublayer 222 can be thermosetting ink or light solidity ink, is preferably the ink that dielectric coefficient is greater than 7.The color of described first ink sublayer 221 and the second ink sublayer 222 can be black, white or colored.The integral thickness of described ink layer 220 is between 2 to 10um.Wherein, the thickness of described first ink sublayer 221 is preferably 2um, and the thickness of described second ink sublayer 222 is preferably greater than the thickness of described first ink sublayer 221.
Because described fingerprint recognition element 230 is converted to solid-state characteristic by liquid state by the second ink sublayer 222 in forming process to be fixed on described first ink sublayer 221; and then be fixed on described protective substrate 210; therefore do not need additionally to add glue between ink layer 220 and fingerprint recognition element 230, thus the thickness of fingerprint identification device 200 can be reduced.
Refer to Fig. 3, the fingerprint identification device 300 that second embodiment of the invention provides comprises protective substrate 310, ink layer 320 and fingerprint recognition element 330.Described ink layer 320 is formed on described protective substrate 310.Described fingerprint recognition element 330 is formed on described ink layer 320.Described protective substrate 310 can not be destroyed with described fingerprint recognition element 330 for the protection of described ink layer 320.Described ink layer 320 is for covering this fingerprint recognition element 330 to realize the aesthetic property of fingerprint identification device 300.Described fingerprint recognition element 330 is for responding to the fingerprint of the finger being placed on corresponding described fingerprint recognition element 330 position on described protective substrate 310.
In the present embodiment, described protective substrate 310 has curved surface.Particularly, described protective substrate 310 comprises protective surface 311 and by the bending side 312 of described protective surface 311 to described fingerprint recognition element 330 1 lateral buckling.Described ink layer 320 comprises the first ink sublayer 321 and the second ink sublayer 322 of stacked setting.Described first ink sublayer 321 is between described second ink sublayer 322 and described protective substrate 310.Described fingerprint recognition element 330 is pasted onto on described first ink sublayer 321 by described second ink sublayer 322.Particularly, this first ink sublayer 221 is formed in protective substrate 210 on the surface, and this fingerprint recognition element 230 only embeds in this second ink sublayer 222.
The material of described protective substrate 310 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate; PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin; and polyethylene terephthalate (polyethylene terephthalate, PET) etc. PES).The material of described first ink sublayer 321 and the second ink sublayer 322 can be thermosetting ink or light solidity ink, is preferably the ink that dielectric coefficient is greater than 7.The color of described first ink sublayer 321 and the second ink sublayer 322 can be black, white or colored.The integral thickness of described ink layer 320 is between 2 to 10um.Wherein, the thickness of described first ink sublayer 321 is preferably 2um, and the thickness of described second ink sublayer 322 is preferably greater than the thickness of described first ink sublayer 321.
Because described fingerprint recognition element 330 is converted to solid-state characteristic by liquid state by the second ink sublayer 322 in forming process to be fixed on described first ink sublayer 321; and then be fixed on described protective substrate 310; therefore do not need additionally to add glue between ink layer 320 and fingerprint recognition element 330, thus the thickness of fingerprint identification device 300 can be reduced.
Refer to Fig. 4, the fingerprint identification device 400 that third embodiment of the invention provides comprises protective substrate 410, ink layer 420, fingerprint recognition element 430 and colloid 440.Described ink layer 420 is formed on described protective substrate 410.Described fingerprint recognition element 430 is formed on described ink layer 420.Described colloid 440 is positioned on the ink layer 420 of described fingerprint recognition element 430 both sides, and is pasted onto the both sides of described fingerprint recognition element 430.The both sides of described fingerprint recognition element 430 are covered by described colloid 440 near one end of described ink layer 420.Described protective substrate 410 can not be destroyed with described fingerprint recognition element 430 for the protection of described ink layer 420.Described ink layer 420 is for covering this fingerprint recognition element 430 to realize the aesthetic property of fingerprint identification device 400.Described fingerprint recognition element 430 is for responding to the fingerprint of the finger being placed on corresponding described fingerprint recognition element 430 position on described protective substrate 410.Described colloid 440 is fixed on intensity on ink layer 420, simultaneously also for preventing steam from entering described fingerprint recognition element 430 for strengthening described fingerprint recognition element 430.
In the present embodiment, described protective substrate 410 is protective substrates 410 of a plane.Described ink layer 420 comprises the first ink sublayer 421 and the second ink sublayer 422 of stacked setting.Described first ink sublayer 421 is between described second ink sublayer 422 and described protective substrate 410.Described fingerprint recognition element 430 is pasted onto on described first ink sublayer 421 by described second ink sublayer 422.Particularly, this first ink sublayer 421 is formed on the surface of protective substrate 410, and this fingerprint recognition element 430 only embeds in this second ink sublayer 422, and this colloid 440 is positioned on the second ink sublayer 422 of described fingerprint recognition element 430 both sides.
The material of described protective substrate 410 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate; PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin; and polyethylene terephthalate (polyethylene terephthalate, PET) etc. PES).The material of described first ink sublayer 421 and the second ink sublayer 422 can be thermosetting ink or light solidity ink, is preferably the ink that dielectric coefficient is greater than 7.The color of described first ink sublayer 421 and the second ink sublayer 422 can be black, white or colored.The integral thickness of described ink layer 420 is between 2 to 10um.Wherein, the thickness of described first ink sublayer 321 is preferably 2um, and the thickness of described second ink sublayer 322 is preferably greater than the thickness of described first ink sublayer 321.Described colloid 440 is three strong rubbers.
Because described fingerprint recognition element 430 is converted to solid-state characteristic by liquid state by the second ink sublayer 422 in forming process to be fixed on described first ink sublayer 421; and then be fixed on described protective substrate 410; therefore do not need additionally to add glue between ink layer 420 and fingerprint recognition element 430, thus the thickness of fingerprint identification device 400 can be reduced.Simultaneously, described colloid 440 can be strengthened fingerprint recognition element 430 and be fixed on intensity on ink layer 420 under the prerequisite not increasing fingerprint identification device 400 thickness, and prevent steam from entering described fingerprint recognition element 430, thus improve the stability of described fingerprint recognition element 430.
Refer to Fig. 5, the fingerprint identification device 500 that four embodiment of the invention provides comprises protective substrate 510, ink layer 520 and fingerprint recognition element 530.The inside surface of described protective substrate 510 offers groove 550.The degree of depth of this groove 550 is less than the thickness of this protective substrate 510.Described ink layer 520 is formed in described groove 550.Described fingerprint recognition element 530 is formed on the ink layer 520 in described groove 550.Described protective substrate 510 can not be destroyed with described fingerprint recognition element 530 for the protection of described ink layer 520.Described ink layer 520 is for covering this fingerprint recognition element 530 to realize the aesthetic property of fingerprint identification device 500.Described fingerprint recognition element 530 is for responding to the fingerprint of the finger being placed on corresponding described fingerprint recognition element 530 position on described protective substrate 510.
Described ink layer 520 comprises the first ink sublayer 521 and the second ink sublayer 522 of stacked setting.Described first ink sublayer 521 is between described second ink sublayer 522 and described protective substrate 510.Described fingerprint recognition element 530 is pasted onto on described first ink sublayer 521 by described second ink sublayer 522.Particularly, this fingerprint recognition element 530 only embeds in this second ink sublayer 522.
The material of described protective substrate 510 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate; PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin; and polyethylene terephthalate (polyethylene terephthalate, PET) etc. PES).The material of described first ink sublayer 521 and the second ink sublayer 522 can be thermosetting ink or light solidity ink, is preferably the ink that dielectric coefficient is greater than 7.The color of described first ink sublayer 521 and the second ink sublayer 522 can be black, white or colored.The integral thickness of described ink layer 520 is between 2 to 10um.Wherein, the thickness of described first ink sublayer 521 is preferably 2um, and the thickness of described second ink sublayer 522 is preferably greater than the thickness of described first ink sublayer 521.
Because described fingerprint recognition element 530 is converted to solid-state characteristic by liquid state by the second ink sublayer 522 in forming process to be fixed on described first ink sublayer 521; and then be fixed on described protective substrate 510; therefore do not need additionally to add glue between ink layer 520 and fingerprint recognition element 530, thus the thickness of fingerprint identification device 500 can be reduced.
Refer to Fig. 6, the fingerprint identification device 600 that fifth embodiment of the invention provides comprises protective substrate 610, ink layer 620, fingerprint recognition element 630 and colloid 640.The inside surface of described protective substrate 610 offers groove 650.The degree of depth of this groove 650 is less than the thickness of this protective substrate 610.Described ink layer 620 is formed in described groove 650.Described fingerprint recognition element 630 is formed on the ink layer 620 in described groove 650.Described colloid 640 is positioned on the ink layer 620 of described fingerprint recognition element 640 both sides, and is pasted onto the both sides of described fingerprint recognition element 630, and is filled by described groove 650 full.The both sides of described fingerprint recognition element 630 are all covered by described colloid 640.Described protective substrate 610 can not be destroyed with described fingerprint recognition element 630 for the protection of described ink layer 620.Described ink layer 620 is for covering described fingerprint recognition element 630 to realize the aesthetic property of fingerprint identification device 600.Described fingerprint recognition element 630 is for responding to the fingerprint of the finger being placed on corresponding described fingerprint recognition element 530 position on described protective substrate 610.Described colloid 640 is fixed on intensity on ink layer 620, simultaneously also for preventing steam from entering described fingerprint recognition element 630 for strengthening described fingerprint recognition element 630.
Described ink layer 620 comprises the first ink sublayer 621 and the second ink sublayer 622 of stacked setting.Described first ink sublayer 621 is between described second ink sublayer 622 and described protective substrate 610.Described fingerprint recognition element 630 is pasted onto on described first ink sublayer 621 by described second ink sublayer 622.Particularly, described fingerprint recognition element 630 only embeds in described second ink sublayer 622.Described colloid 640 is positioned on the second ink layer 622 of described fingerprint recognition element 630 both sides.
The material of described protective substrate 610 can be selected from glass, polymethylmethacrylate (PolymethylMethacrylate; PMMA), sapphire, polyethersulfone resin (Polyethersulfone resin; and polyethylene terephthalate (polyethylene terephthalate, PET) etc. PES).The material of described first ink sublayer 621 and the second ink sublayer 622 can be thermosetting ink or light solidity ink, is preferably the ink that dielectric coefficient is greater than 7.The color of described first ink sublayer 621 and the second ink sublayer 622 can be black, white or colored.The integral thickness of described ink layer 620 is between 2 to 10um.Wherein, the thickness of described first ink sublayer 621 is preferably 2um, and the thickness of described second ink sublayer 622 is preferably greater than the thickness of described first ink sublayer 621.Described colloid 640 is three strong rubbers.
Because described fingerprint recognition element 630 is converted to solid-state characteristic by liquid state by the second ink sublayer 622 in forming process to be fixed on described first ink sublayer 621; and then be fixed on described protective substrate 610; therefore do not need additionally to add glue between ink layer 620 and fingerprint recognition element 630, thus the thickness of fingerprint identification device 600 can be reduced.Simultaneously, described colloid 640 can be strengthened fingerprint recognition element 630 and be fixed on intensity on ink layer 620 under the prerequisite not increasing fingerprint identification device 600 thickness, and prevent steam from entering described fingerprint recognition element 630, thus improve the stability of described fingerprint recognition element 630.
Referring to Fig. 7, is the process flow diagram of the manufacture method of described fingerprint identification device.Be appreciated that the manufacture method of the fingerprint identification device of above-mentioned five embodiments is roughly the same.For convenience of description, be now described for the manufacture method of the fingerprint identification device 400 in above-mentioned 3rd embodiment, all the other embodiments are not repeated.The method comprises the steps:
Step S201, sees also Fig. 8, provides protective substrate 410, and is coated with the first ink material layer 420a on described protective substrate 410.The material of described first ink material layer 420a can be selected from thermosetting ink or light solidity ink, is preferably the ink that dielectric coefficient is greater than 7.The thickness of described first ink material layer 420a is preferably 2um.The color of described first ink material layer 420a can be black, white or colored.In the present embodiment, described protective substrate 410 is a plane, and be appreciated that described protective substrate 410 also can be other shapes, the plane as described in embodiment two is curved surface, and the slab construction for having a groove described in embodiment five and six, not as limit.
Step S202, refers to Fig. 9, solidifies described first ink material layer 420a to form the first ink sublayer 421.Wherein, the method for solidifying described first ink material layer 420a comprises and heating described first ink material layer 420a, by modes such as the first ink material layer 420a described in UV-irradiation.
Step S203, refers to Figure 10, and described first ink sublayer 421 is coated with the second ink material layer 420b.The material of described second ink material layer 420b can be selected from thermosetting ink or light solidity ink, is preferably the ink that dielectric coefficient is greater than 7.The thickness of described second ink material layer 420b is preferably 2um.The color of described second ink material layer 420b can be black, white or colored.
Step S204, refers to Figure 11, solidifies described second ink material layer 420b, and is arranging the fingerprint recognition element 430 embedding this second ink material layer 420b when described second ink material layer 420b does not solidify completely.Be appreciated that, because described second ink material layer 420b is not yet cured, described second ink material layer 420b is thick liquid, therefore described fingerprint recognition element 430 is arranged on after on described second ink material layer 420b, and the part second ink material layer 420b between described fingerprint recognition element 430 and the first ink sublayer 421 is extruded into the both sides of described fingerprint recognition element 430.
Step S205, refers to Figure 12, completes the described second ink material layer 420b of solidification to form the second ink sublayer 422.Now, this fingerprint recognition element 430 embeds in this second ink sublayer 422.Wherein, the method for solidifying described second ink material layer 420b comprises and heating described second ink material layer 420b, by modes such as the second ink material layer 420b described in UV-irradiation.
Step S206, refers to Figure 13, and described second ink sublayer 422 forms colloid 440, and the second ink sublayer 422 that described colloid 440 is positioned at described fingerprint recognition element 430 both sides is pasted onto on the two sides of described fingerprint recognition element 430.
So far, described fingerprint identification device 400 completes.Be appreciated that step S206 can omit.Further, for the ink layer 420 of single layer structure, step S203 omits, and only need arrange when individual layer ink layer does not solidify completely and embed this fingerprint recognition element.
Above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not depart from the spirit and scope of technical solution of the present invention.
Claims (14)
1. a fingerprint identification device; it comprises protective substrate, ink layer and fingerprint recognition element; described ink layer is formed on described protective substrate, and described fingerprint recognition element is converted to solid-state characteristic by liquid state by described ink layer and is fixed on described ink layer in forming process.
2. fingerprint identification device as claimed in claim 1; it is characterized in that; described ink layer comprises the first ink sublayer and the second ink sublayer; described first ink sublayer is between described second ink sublayer and described protective substrate, and described fingerprint recognition element is pasted onto on described first ink sublayer by described second ink sublayer.
3. fingerprint identification device as claimed in claim 2, it is characterized in that, described fingerprint identification device also comprises colloid, and the second ink sublayer that described colloid is positioned at described fingerprint recognition elements on either side is pasted onto the both sides of described fingerprint recognition element.
4. fingerprint identification device as claimed in claim 3, it is characterized in that, the both sides of described fingerprint recognition element are covered by described colloid near one end of described ink layer.
5. fingerprint identification device as claimed in claim 1, is characterized in that, described protective substrate comprises protective surface and by the bending side of described protective surface to described fingerprint recognition element one lateral buckling.
6. fingerprint identification device as claimed in claim 1, it is characterized in that, described protective substrate offers groove, described ink layer is formed in described groove, and described fingerprint recognition element is arranged on the ink layer in described groove.
7. fingerprint identification device as claimed in claim 6, it is characterized in that, described fingerprint identification device also comprises colloid, on the second ink layer that described colloid is positioned at described fingerprint recognition elements on either side and on the described fingerprint recognition element of stickup, the side of described fingerprint recognition element is all covered by described colloid.
8. fingerprint identification device as claimed in claim 1, it is characterized in that, the thickness of described ink layer is between 2 to 10um.
9. fingerprint identification device as claimed in claim 1, it is characterized in that, the dielectric coefficient of described ink layer is not less than 7.
10. a manufacture method for fingerprint identification device, comprising:
Protective substrate is provided, and is coated with ink material layer in described protection;
Solidify described ink material layer, and the fingerprint recognition element embedding this ink material layer is set when described ink material layer does not solidify completely; And
Complete the described ink material layer of solidification to form ink layer.
The manufacture method of 11. fingerprint identification devices as claimed in claim 10, it is characterized in that, the step of described coating ink material layer comprises:
Described protective substrate is coated with the first ink material layer;
Solidify described first ink material layer to form the first ink sublayer; And
Described first ink sublayer is coated with the second ink material layer.
The manufacture method of 12. fingerprint identification devices as claimed in claim 11, it is characterized in that, described fingerprint recognition element arranges when described second ink material layer does not solidify completely and embeds this second ink material layer, after completing the described ink material layer of solidification, described second ink material layer is cured as the second ink sublayer.
The manufacture method of 13. fingerprint identification devices as claimed in claim 10, is characterized in that, after formation ink layer, the method also comprises:
Described ink layer forms colloid, the ink layer that described colloid is positioned at described fingerprint recognition elements on either side is pasted onto on the two sides of described fingerprint recognition element.
The manufacture method of 14. fingerprint identification devices as claimed in claim 10, is characterized in that, the method for solidifying described ink layer comprises and to heat described ink material layer and by ink layer described in UV-irradiation.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510183293.6A CN104866814B (en) | 2015-04-17 | 2015-04-17 | Fingerprint identification device and its manufacturing method |
| TW105101444A TWI621069B (en) | 2015-04-17 | 2016-01-18 | Fingerprint identification device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510183293.6A CN104866814B (en) | 2015-04-17 | 2015-04-17 | Fingerprint identification device and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104866814A true CN104866814A (en) | 2015-08-26 |
| CN104866814B CN104866814B (en) | 2019-09-13 |
Family
ID=53912635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510183293.6A Active CN104866814B (en) | 2015-04-17 | 2015-04-17 | Fingerprint identification device and its manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104866814B (en) |
| TW (1) | TWI621069B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105956561A (en) * | 2016-05-06 | 2016-09-21 | 昆山建皇光电科技有限公司 | Press type fingerprint identifier and manufacturing method thereof |
| CN106383549A (en) * | 2015-08-05 | 2017-02-08 | 上海箩箕技术有限公司 | Electronic product |
| CN106557741A (en) * | 2016-10-20 | 2017-04-05 | 麦克思商务咨询(深圳)有限公司 | Fingerprint identification device, its manufacture method, display device |
| CN106874853A (en) * | 2017-01-16 | 2017-06-20 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device and preparation method thereof and apply its electronic installation |
| CN107146763A (en) * | 2016-03-01 | 2017-09-08 | 南茂科技股份有限公司 | Manufacturing method and manufacturing equipment of fingerprint identification chip packaging structure |
| EP3288072A4 (en) * | 2016-07-15 | 2018-05-23 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition module and preparation method therefor |
| CN108537171A (en) * | 2018-04-09 | 2018-09-14 | 武汉天马微电子有限公司 | A kind of display device and preparation method thereof |
| CN109492491A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint identifies mould group and electric equipment manufacturing method |
| CN109753844A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| US11909898B2 (en) | 2019-04-17 | 2024-02-20 | Huawei Technologies Co., Ltd. | Mobile terminal, cover, display component |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108600450B (en) * | 2018-04-24 | 2020-12-01 | 业成科技（成都）有限公司 | Panel structure |
| TWI748608B (en) * | 2020-08-24 | 2021-12-01 | 義隆電子股份有限公司 | Patterned fingerprint sensing module and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202077266U (en) * | 2011-05-09 | 2011-12-14 | 陈尧明 | High heat-radiation multilayer-type combined base plate |
| WO2013027220A2 (en) * | 2011-08-24 | 2013-02-28 | Digiflex Ltd. | Process for dry-coating of flexogarphic surfaces |
| US20130307818A1 (en) * | 2012-05-18 | 2013-11-21 | Apple Inc. | Capacitive Sensor Packaging |
| CN204178377U (en) * | 2014-08-26 | 2015-02-25 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device and terminal device |
| CN204203913U (en) * | 2014-06-13 | 2015-03-11 | 宸鸿科技(厦门)有限公司 | There is the contact panel of fingerprint identification function |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100463434B1 (en) * | 2001-12-04 | 2004-12-23 | 삼성전기주식회사 | Printed Circuit Board with Buried Resistors and Manufacturing Method Thereof |
| US10043052B2 (en) * | 2011-10-27 | 2018-08-07 | Synaptics Incorporated | Electronic device packages and methods |
| US9785299B2 (en) * | 2012-01-03 | 2017-10-10 | Synaptics Incorporated | Structures and manufacturing methods for glass covered electronic devices |
| US9302457B2 (en) * | 2012-09-07 | 2016-04-05 | Apple Inc. | Liquid optically clear adhesive lamination process control |
| TWI529390B (en) * | 2012-11-21 | 2016-04-11 | 茂丞科技股份有限公司 | Biometrics sensor module, assembly, manufacturing method and electronic apparatus using such biometrics sensor module |
| TWM491885U (en) * | 2014-06-18 | 2014-12-11 | Tpk Touch Solutions Xiamen Inc | Touch panel with a function of fingerprint identification |
| CN105334990B (en) * | 2014-07-15 | 2018-08-07 | 宸鸿科技(厦门)有限公司 | Touch control display device |
| TWM494972U (en) * | 2014-10-06 | 2015-02-01 | Metrics Technology Co Ltd J | Fingerprint sensor having scrape-resisting function |
-
2015
- 2015-04-17 CN CN201510183293.6A patent/CN104866814B/en active Active
-
2016
- 2016-01-18 TW TW105101444A patent/TWI621069B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202077266U (en) * | 2011-05-09 | 2011-12-14 | 陈尧明 | High heat-radiation multilayer-type combined base plate |
| WO2013027220A2 (en) * | 2011-08-24 | 2013-02-28 | Digiflex Ltd. | Process for dry-coating of flexogarphic surfaces |
| US20130307818A1 (en) * | 2012-05-18 | 2013-11-21 | Apple Inc. | Capacitive Sensor Packaging |
| CN204203913U (en) * | 2014-06-13 | 2015-03-11 | 宸鸿科技(厦门)有限公司 | There is the contact panel of fingerprint identification function |
| CN204178377U (en) * | 2014-08-26 | 2015-02-25 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification device and terminal device |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106383549B (en) * | 2015-08-05 | 2019-04-26 | 上海箩箕技术有限公司 | Electronic product |
| CN106383549A (en) * | 2015-08-05 | 2017-02-08 | 上海箩箕技术有限公司 | Electronic product |
| CN107146763A (en) * | 2016-03-01 | 2017-09-08 | 南茂科技股份有限公司 | Manufacturing method and manufacturing equipment of fingerprint identification chip packaging structure |
| CN105956561A (en) * | 2016-05-06 | 2016-09-21 | 昆山建皇光电科技有限公司 | Press type fingerprint identifier and manufacturing method thereof |
| CN105956561B (en) * | 2016-05-06 | 2019-08-06 | 昆山建皇光电科技有限公司 | Push type Fingerprint Identification Unit and its manufacturing method |
| CN108140623B (en) * | 2016-07-15 | 2021-06-25 | 深圳市汇顶科技股份有限公司 | Fingerprint identification module and preparation method thereof |
| EP3288072A4 (en) * | 2016-07-15 | 2018-05-23 | Shenzhen Goodix Technology Co., Ltd. | Fingerprint recognition module and preparation method therefor |
| CN108140623A (en) * | 2016-07-15 | 2018-06-08 | 深圳市汇顶科技股份有限公司 | A kind of fingerprint recognition module and preparation method thereof |
| CN106557741A (en) * | 2016-10-20 | 2017-04-05 | 麦克思商务咨询(深圳)有限公司 | Fingerprint identification device, its manufacture method, display device |
| CN106874853B (en) * | 2017-01-16 | 2020-04-10 | 业成科技（成都）有限公司 | Acoustic wave type fingerprint identification device, manufacturing method thereof and electronic device applying acoustic wave type fingerprint identification device |
| CN106874853A (en) * | 2017-01-16 | 2017-06-20 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device and preparation method thereof and apply its electronic installation |
| CN109492491A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic fingerprint identifies mould group and electric equipment manufacturing method |
| CN109492491B (en) * | 2017-09-12 | 2023-09-08 | 江西欧迈斯微电子有限公司 | Ultrasonic fingerprint identification module and electronic equipment manufacturing method |
| CN109753844A (en) * | 2017-11-02 | 2019-05-14 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN109753844B (en) * | 2017-11-02 | 2024-03-08 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor structure and electronic equipment |
| CN108537171A (en) * | 2018-04-09 | 2018-09-14 | 武汉天马微电子有限公司 | A kind of display device and preparation method thereof |
| US11909898B2 (en) | 2019-04-17 | 2024-02-20 | Huawei Technologies Co., Ltd. | Mobile terminal, cover, display component |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI621069B (en) | 2018-04-11 |
| CN104866814B (en) | 2019-09-13 |
| TW201638834A (en) | 2016-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104866814A (en) | Fingerprint identification device and manufacturing method thereof | |
| WO2007084796A3 (en) | Ionic polymer devices and methods of fabricating the same | |
| WO2015126476A3 (en) | Method of depositing abradable coatings under polymer gels | |
| WO2015130362A3 (en) | Method of depositing abradable coatings under polymer gels | |
| WO2009017770A3 (en) | Microresonantor systems and methods of fabricating the same | |
| ATE363990T1 (en) | DIRT-REPELLENT HURABLE COATING FOR A LAMINATE | |
| TW201543305A (en) | Cover window formed with printing layer for touch screen panel and method for forming printing layer on cover window for touch screen panel | |
| CN102596559A (en) | Decoration sheet with high weather resistanace and hair line | |
| WO2015040048A9 (en) | Voltage-resistant, electrically insulating coatings | |
| CN203618215U (en) | Plate structure for preventing warpage of ladder type printed circuit board | |
| UA98091C2 (en) | Lightweight panel | |
| US9858522B2 (en) | Security document and method of manufacturing security document | |
| CN206532305U (en) | A kind of spraying scheme bio-identification module of band Logo | |
| WO2014108164A8 (en) | Data carrier in the form of a card with a relief | |
| CN207089104U (en) | A kind of resistant to elevated temperatures caravan wallboard | |
| CN203254863U (en) | Stereoscopic color crystal glass | |
| KR101636859B1 (en) | Transparent conductor and preparation method thereof | |
| CN103379726A (en) | Multiple layer line structure of line laminated board | |
| CN102416731A (en) | Pseudo-metal composite film | |
| CN207875041U (en) | Release film with preferable adsorptivity and stickiness | |
| CN103260359B (en) | The manufacture method of the relative blind hole in the positive back side in flexible circuit board | |
| CN102487579B (en) | Preparation method of metamaterial and the same | |
| CN102922841B (en) | Composite film for unbounded glass | |
| CN207846843U (en) | A kind of container house composite glass magnesium board | |
| CN205378367U (en) | Be used as heat -resisting pressure insulation board of baffle when pressfitting circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180814 Address after: No. 689, cooperative road, hi-tech West District, Chengdu, Sichuan Applicant after: Cheng Cheng Technology (Chengdu) Co., Ltd. Applicant after: Interface Optoelectronic (Shenzhen) Co., Ltd. Address before: British Virgin Islands, Tortola, Lord Town, Vickhansky 1, 30 Castro Street, Corvette Trust Services Applicant before: Mike thinks incorporated company |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |