CN104862720B - A kind of process for being used to remove ITO residues on vacuum component - Google Patents
A kind of process for being used to remove ITO residues on vacuum component Download PDFInfo
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- CN104862720B CN104862720B CN201510188213.6A CN201510188213A CN104862720B CN 104862720 B CN104862720 B CN 104862720B CN 201510188213 A CN201510188213 A CN 201510188213A CN 104862720 B CN104862720 B CN 104862720B
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Abstract
The present invention relates to a kind of process for being used to remove ITO residues on vacuum component, the vacuum component that there are ITO residues on surface is handled according to following processing step：Alkali cleaning-pickling-cleaning-air-dry-blasting treatment-immersion-baking dehumidifying.Vacuum component surface is handled according to processes such as alkali cleaning, pickling, cleaning, blasting treatment, immersion, baking dehumidifying, ensure that parts surface is cleaned, totally, blasting treatment simultaneously causes workpiece surface roughness to increase, and ITO residues are difficult for drop-off during magnetron sputtering plating.
Description
Technical field
It is used to remove vacuum the present invention relates to a kind of technology for removing ITO residues on vacuum component, more particularly to one kind
The process of ITO residues on part.
Background technology
Based on superior photoelectric properties, current touch-control display line sparetime university amount uses ITO materials, is entered based on principle of magnetron-sputtering
The technique that row vacuum is coated with ito film has obtained quick development, but vacuum chamber is interior due to not stopping to splash in the industrial production simultaneously
Penetrate plated film, vacuum component is polluted by ITO residues, there is surface and fall ash influence and be coated with film layer, cause " pin hole " to fall film, part and put
The problems such as gas influences resistivity.
During magnetic control sputtering vacuum coating, heating barricade, slide glass workpiece car, anode cap, technique tracheae etc. in vacuum chamber
Vacuum component can be polluted by ITO residues, and as ITO residues come off increase, film surface can have that " pin hole " falls film.
To ensure product quality, raising efficiency, reducing cost, it is necessary to ensure following 2 key elements：
1. the pollution in vacuum chamber is preferably minimized, otherwise film layer can be caused to fall film；
2. relatively low resistivity, reduces thickness, reduces cost.
The content of the invention
It is an object of the invention to provide a kind of process for being used to remove ITO residues on vacuum component, with solution
State technical problem.The problems such as vacuum component is considered to deflate, it is general to use titanium alloy material, it is effective processing workpiece (vacuum
Part) remained on surface ITO residues, according to alkali cleaning, pickling, cleaning, blasting treatment, immersion, baking dehumidifying etc. process to vacuum
Part surface is handled, it is ensured that parts surface is cleaned, totally, while blasting treatment causes workpiece surface roughness to increase, magnetic control
ITO residues are difficult for drop-off during sputter coating.
The technical problems to be solved by the invention are realized using following technical scheme：
A kind of process for being used to remove ITO residues on vacuum component, it is characterised in that there are into ITO residues on surface
Vacuum component handled according to following processing step：
(1) alkali cleaning
Pending vacuum component is placed in storage tank, and vacuum component is immersed the NaOH that mass fraction is 25%
In solution, NaOH solution is heated to taking-up vacuum component after 80 DEG C, immersion 2-4h and drained, and drip is taken out after placing into rinse bath cleaning
It is dry；
(2) pickling
The vacuum component drained is put into the dilution heat of sulfuric acid that mass fraction is 25%, dilution heat of sulfuric acid is heated to 50
DEG C, take out vacuum component after immersion 2-4h and drain；
(3) clean
Vacuum component after draining is put into rinse bath soaking and washing, using cleaning means by above vacuum component during cleaning
ITO residues are all cleaned up, then by the vacuum component after cleaning be put into potcher rinsing, it is rinsed after vacuum component use again
Jetting machine is drained after being rinsed to it；
(4) air-dry
Cleaned vacuum component is placed on work rest with electric fan or heat gun drying moisture；
(5) blasting treatment
Air-dried vacuum component is subjected to blasting treatment, blasting treatment is more than 6MPa, processing time using pressure
0.5-2h；
(6) soak
The good vacuum component of sandblasting is placed in rinse bath to soak and taken out after 1h, is drained away the water；
(7) baking dehumidifying
The vacuum component drained away the water is put and toasted in an oven, 80 DEG C of baking temperature, baking time 1-2h.
The cleaning means includes perching knife, copper brush.
The beneficial effects of the invention are as follows：
1. effectively remove ITO residues on vacuum component；
2. soda acid is suitable with when technique, vacuum component will not be damaged, it is ensured that processing procedure will not pollute workpiece surface；
3. workpiece surface is coarse after processing, surface area is larger, and ITO residues are attached to above not during vacuum magnetron sputtering coating film
It is easy to fall off, reduce due to producing the problems such as film layer " pin hole " falls film when residue comes off and causes plated film.
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, tie below
Specific embodiment is closed, the present invention, but following embodiments only the preferred embodiments of the present invention, and not all are expanded on further.
Based on the embodiment in embodiment, those skilled in the art obtain other realities on the premise of creative work is not made
Example is applied, protection scope of the present invention is belonged to.
It is a kind of to be used to remove the processes of ITO residues on vacuum component, by surface have the vacuum components of ITO residues by
Handled according to following processing step：
(1) alkali cleaning
Pending vacuum component is placed in storage tank, and vacuum component is immersed the NaOH that mass fraction is 25%
In solution, NaOH solution is heated to taking-up vacuum component after 80 DEG C, immersion 2-4h and drained, and drip is taken out after placing into rinse bath cleaning
It is dry；
(2) pickling
The vacuum component drained is put into the dilution heat of sulfuric acid that mass fraction is 25%, dilution heat of sulfuric acid is heated to 50
DEG C, take out vacuum component after immersion 2-4h and drain；
(3) clean
Vacuum component after draining is put into rinse bath soaking and washing, will be upper using cleaning means such as perching knife, copper brush during cleaning
Face ITO part all cleans up, then by the vacuum component after cleaning be put into potcher rinsing, it is rinsed after vacuum component
Drained after being rinsed again with jetting machine to it；
(4) air-dry
Cleaned vacuum component is placed on work rest with electric fan or heat gun drying moisture；
(5) blasting treatment
Air-dried vacuum component is subjected to blasting treatment, blasting treatment is more than 6MPa, processing time using pressure
0.5-2h；
(6) soak
The good vacuum component of sandblasting is placed in rinse bath to soak and taken out after 1h, is drained away the water；
(7) vacuum component drained away the water is put in baking dehumidifying is toasted in an oven, and 80 DEG C of baking temperature dries
Roasting time 1-2h.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and that described in above-described embodiment and specification is only the present invention
Preference, be not intended to limit the present invention, without departing from the spirit and scope of the present invention, the present invention also have it is various
Changes and improvements, these changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by institute
Attached claims and its equivalent thereof.
Claims (2)
1. a kind of process for being used to remove I TO residues on vacuum component, it is characterised in that there are into I TO residues on surface
Vacuum component handled according to following processing step：
(1) alkali cleaning
Pending vacuum component is placed in storage tank, and vacuum component is immersed the NaOH solution that mass fraction is 25%
In, NaOH solution is heated to 80 DEG C, and taking out vacuum component after immersion 2-4h drains, and places into take out after rinse bath cleaning and drains；
(2) pickling
The vacuum component drained is put into the dilution heat of sulfuric acid that mass fraction is 25%, dilution heat of sulfuric acid is heated to 50 DEG C,
Vacuum component is taken out after immersion 2-4h to drain；
(3) clean
Vacuum component after draining is put into rinse bath soaking and washing, using cleaning means by the I TO above vacuum component during cleaning
Residue is all cleaned up, then by the vacuum component after cleaning be put into potcher rinsing, it is rinsed after vacuum component again with height
Pressure cleaning machine is drained after being rinsed to it；
(4) air-dry
Cleaned vacuum component is placed on work rest with electric fan or heat gun drying moisture；
(5) blasting treatment
Air-dried vacuum component is subjected to blasting treatment, blasting treatment is more than 6MPa, processing time 0.5-2h using pressure；
(6) soak
The good vacuum component of sandblasting is placed in rinse bath to soak and taken out after 1h, is drained away the water；
(7) baking dehumidifying
The vacuum component drained away the water is put and toasted in an oven, 80 DEG C of baking temperature, baking time 1-2h.
2. the process according to claim 1 for being used to remove I TO residues on vacuum component, it is characterised in that described
Cleaning means includes perching knife, copper brush.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510188213.6A CN104862720B (en) | 2015-04-20 | 2015-04-20 | A kind of process for being used to remove ITO residues on vacuum component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510188213.6A CN104862720B (en) | 2015-04-20 | 2015-04-20 | A kind of process for being used to remove ITO residues on vacuum component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104862720A CN104862720A (en) | 2015-08-26 |
| CN104862720B true CN104862720B (en) | 2017-09-05 |
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| CN115029697B (en) * | 2022-06-10 | 2023-03-24 | 合肥升滕半导体技术有限公司 | Acid etching liquid and application thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103952664A (en) * | 2014-05-02 | 2014-07-30 | 合肥永信信息产业股份有限公司 | Surface pretreatment process for diamond-like carbon coated workpiece |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103952664A (en) * | 2014-05-02 | 2014-07-30 | 合肥永信信息产业股份有限公司 | Surface pretreatment process for diamond-like carbon coated workpiece |
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| CN104862720A (en) | 2015-08-26 |
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