CN104859708A - Electronic control unit and electric power steering device using the same - Google Patents
Electronic control unit and electric power steering device using the same Download PDFInfo
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- CN104859708A CN104859708A CN201510086594.7A CN201510086594A CN104859708A CN 104859708 A CN104859708 A CN 104859708A CN 201510086594 A CN201510086594 A CN 201510086594A CN 104859708 A CN104859708 A CN 104859708A
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- input terminal
- terminal pad
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- semiconductor module
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D5/00—Power-assisted or power-driven steering
- B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
- B62D5/0457—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by control features of the drive means as such
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D5/00—Power-assisted or power-driven steering
- B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Steering Mechanism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An electronic control unit (1) used for an object (101) comprises: a substrate (10); input, output and control patterns (21-23) respectively having input, output and control connecting discs (211, 221, 231); a first extending pattern (24) integrated with the input pattern; semiconductor modules (30-34) comprising a switching element (41), a sealant (42), and input, output and control terminals (43-45) respectively connected to the switching element, and the input, output and control connecting discs; and control parts (50-52) connected to the control connecting discs. When first to eighth directions (d1-d8) are set in a peripheral direction of the input connecting disc every 45 degrees, the input pattern extends in the third to seventh directions of the input connecting disc. The output connecting disc and the control connecting disc are arranged on the side of the first direction of the input connecting disc. The first extending pattern extends in the second or eighth direction of the input connecting disc.
Description
Technical field
Present disclosure relates to the electronic control unit controlled controll plant, and uses the electric power-assisted steering apparatus of this electronic control unit.
Background technology
Traditionally, the known electronic control unit being provided with the semiconductor module comprising on-off element on substrate.Such as, in the electronic control unit disclosed in JP2012-59759A, semiconductor module is installed into input terminal pad input terminal being electrically connected to be formed in the input pattern on a surface of substrate.In addition, the lead-out terminal of semiconductor module and control terminal are electrically connected to the output terminal pad of the output pattern be formed on a surface of substrate respectively and control the control linkage dish of pattern.
According in the electronic control unit of JP2012-59759A, predetermined direction when supposition is watched from the input terminal pad a surface of substrate is first direction, be second direction about first direction to the direction of a sideway swivel 45 degree along the circumferencial direction of input terminal pad, be third direction about second direction to the direction of a sideway swivel 45 degree along the circumferencial direction of input terminal pad, be fourth direction about third direction to the direction of a sideway swivel 45 degree along the circumferencial direction of input terminal pad, be five direction about fourth direction to the direction of a sideway swivel 45 degree along the circumferencial direction of input terminal pad, be six direction about the 5th direction to the direction of a sideway swivel 45 degree along the circumferencial direction of input terminal pad, along input terminal pad circumferencial direction about the 6th direction to the direction of a sideway swivel 45 degree be the 7th direction and be eighth direction about the 7th direction to the direction of a sideway swivel 45 degree along the circumferencial direction inputting terminal pad time, output terminal pad and control linkage dish are positioned at the first direction side about input terminal pad.
Input pattern is formed extending scheduled volume or more about on the input third direction of terminal pad, fourth direction, the 5th direction, the 6th direction and the 7th direction.But input pattern is about the input first direction of terminal pad, second direction and eighth direction extend to scheduled volume or less.Therefore, the heat that on-off element produces during operation is being transmitted about on the third direction of input terminal pad of input pattern, fourth direction, the 5th direction, the 6th direction and the 7th direction by input terminal and input terminal pad, but is not transmitting fully about in the first direction of input terminal pad, second direction and eighth direction.Therefore, in the electronic control unit of JP2012-59759A, the direction of heat transfer in input pattern is restrictive, and is difficult to effectively carry out radiation to the heat of on-off element.
Summary of the invention
The object of present disclosure is to provide a kind of electronic control unit with higher radiating effect, and provides a kind of electric power-assisted steering apparatus.
According to the first aspect of present disclosure, substrate, input pattern, output pattern, control pattern, the first extension pattern, semiconductor module and control part are comprised to the electronic control unit that controll plant controls.Described substrate has first surface and second surface.The first surface that described input pattern is formed in substrate has input terminal pad.The first surface that described output pattern is formed in substrate has output terminal pad.The first surface that described control pattern is formed in substrate has control linkage dish.Described first extends on first surface that pattern and described input pattern be formed on substrate to extend from inputting pattern.
Semiconductor module comprises on-off element, aquaseal, input terminal, lead-out terminal and control terminal.Described aquaseal overlay switch element.Described input terminal has the first end that is connected to on-off element and is configured to expose from aquaseal and is electrically connected to the second end of input terminal pad, and described input terminal receives the electric current to on-off element.
Described lead-out terminal has the first end that is connected to on-off element and is configured to expose from aquaseal and is electrically connected to the second end exporting terminal pad, and lead-out terminal exports the electric current being inputed to on-off element by input terminal.Control terminal has the first end that is connected to on-off element and is configured to expose from aquaseal and is electrically connected to the second end of control linkage dish, and control terminal is provided with control signal, described control signal is for the signal allowed or stop electric current to flow between input terminal and lead-out terminal.The first surface that semiconductor module is arranged on substrate produces heat during the operation of on-off element.
Described control part is arranged on substrate to be electrically connected to control linkage dish.Described control part is by providing control signal to carry out the operation of master cock element via control linkage dish to control terminal, and described control part controls controll plant by controlling the electric current flow in controll plant.
When a direction setting from the input terminal pad viewing on the first surface of substrate is become first direction, circumferencial direction along input terminal pad is become second direction about first direction to the direction setting of a sideway swivel 45 degree, circumferencial direction along input terminal pad is become third direction about the direction setting of second direction one sideway swivel 45, circumferencial direction along input terminal pad is become fourth direction about third direction to the direction setting of a sideway swivel 45 degree, circumferencial direction along input terminal pad is become the 5th direction about fourth direction to the direction setting of a sideway swivel 45 degree, circumferencial direction along input terminal pad is become the 6th direction about the 5th direction to the direction setting of a sideway swivel 45 degree, circumferencial direction along input terminal pad is become the 7th direction about the 6th direction to the direction setting of a sideway swivel 45 degree, and when the circumferencial direction along input terminal pad is become eighth direction about the 7th direction to the direction setting of a sideway swivel 45 degree, input pattern is formed at the third direction about input terminal pad, fourth direction, 5th direction, 6th direction and the 7th direction extend scheduled volume or more.Output terminal pad and control linkage dish are positioned at the first direction side about input terminal pad.First extends pattern is formed extending about at least one direction in the input second direction of terminal pad and eighth direction.
According to the electronic control unit of first aspect, there is higher radiating effect.
According to the second aspect of present disclosure, substrate, input pattern, output pattern, control pattern, specific pattern, through hole, semiconductor module and control part are comprised to the electronic control unit that controll plant controls.Described substrate has first surface and second surface.The first surface that described input pattern is formed in substrate has input terminal pad.The first surface that described output pattern is formed in substrate has output terminal pad.The first surface that described control pattern is formed in substrate has control linkage dish.Described specific pattern is formed between the first surface of substrate and second surface, or is formed on the second surface of substrate.Described through hole has the first end being connected to input pattern and the second end being connected to specific pattern.
Semiconductor module comprises on-off element, aquaseal, input terminal, lead-out terminal and control terminal.Described aquaseal overlay switch element.Described input terminal has the first end that is connected to on-off element and is configured to expose from aquaseal and is electrically connected to the second end of input terminal pad, and described input terminal receives the electric current to on-off element.
Described lead-out terminal has the first end that is connected to on-off element and is configured to expose from aquaseal and is electrically connected to the second end exporting terminal pad, and lead-out terminal exports the electric current being inputed to on-off element by input terminal.Control terminal has the first end that is connected to on-off element and is configured to expose from aquaseal and is electrically connected to the second end of control linkage dish, and described control terminal is provided with control signal, described control signal is for the signal allowed or stop electric current to flow between input terminal and lead-out terminal, and the first surface that described semiconductor module is arranged on substrate produces heat during the operation of on-off element.
Described control part is arranged on substrate to be electrically connected to control linkage dish.Described control part is by providing control signal to carry out the operation of master cock element via control linkage dish to control terminal, and described control part controls controll plant by controlling the electric current flow in controll plant.
When a direction setting from the input terminal pad viewing on the first surface of substrate being become first direction, circumferencial direction along input terminal pad is become second direction about first direction to the direction setting of a sideway swivel 45 degree, circumferencial direction along input terminal pad is become third direction about the direction setting of second direction one sideway swivel 45, circumferencial direction along input terminal pad is become fourth direction about third direction to the direction setting of a sideway swivel 45 degree, circumferencial direction along input terminal pad is become the 5th direction about fourth direction to the direction setting of a sideway swivel 45 degree, circumferencial direction along input terminal pad is become the 6th direction about the 5th direction to the direction setting of a sideway swivel 45 degree, circumferencial direction along input terminal pad is become the 7th direction about the 6th direction to the direction setting of a sideway swivel 45 degree, and when the circumferencial direction along input terminal pad is become eighth direction about the 7th direction to the direction setting of a sideway swivel 45 degree.Input pattern is formed extending scheduled volume or more about on the input third direction of terminal pad, fourth direction, the 5th direction, the 6th direction and the 7th direction.Output terminal pad and control linkage dish are positioned at the first direction side about input terminal pad.
Electronic control unit according to second aspect can have higher radiating effect.
According to the third aspect of present disclosure, electric power-assisted steering apparatus comprises the electronic control unit according to first aspect or second aspect, and controll plant, described controll plant is controlled by an electronic control unit and exports and carries out for driver assistance the assist torque that turns to.
Accompanying drawing explanation
According to the detailed description of carrying out below in conjunction with accompanying drawing, the other object of present disclosure and advantage will become more obvious.In the accompanying drawings:
Fig. 1 is the schematic diagram of a part for the electronic control unit of the first embodiment illustrated according to present disclosure;
Fig. 2 is the cross sectional drawing obtained along the line II-II in Fig. 1;
Fig. 3 illustrates that the electronic control unit according to the first embodiment of present disclosure is applied to the schematic diagram of the state of electric power-assisted steering apparatus;
Fig. 4 is the figure of the electricity configuration of the electronic control unit of the first embodiment illustrated according to present disclosure;
Fig. 5 is the cross sectional drawing of a part for the electronic control unit of the second embodiment illustrated according to present disclosure; And
Fig. 6 is the schematic diagram of a part for the electronic control unit of the 3rd embodiment illustrated according to present disclosure.
Detailed description of the invention
Hereinafter, the electronic control unit of the multiple embodiments according to present disclosure is described with reference to the accompanying drawings.In multiple embodiment, indicate substantially the same parts by identical mark, and omit the description detailed to it.In addition, in order to avoid making the diagram of accompanying drawing become complicated, in the accompanying drawings each, can only to a component in substantially the same multiple component or part or part distribute labels.
(the first embodiment)
The electronic control unit of the first embodiment according to present disclosure and a part for electronic control unit have been shown in Fig. 1 to Fig. 3.As shown in Figure 3, electronic control unit 1 is used in the electric power-assisted steering apparatus 100 of vehicle, and electronic control unit 1 is based on the driving turning to dtc signal and vehicle velocity signal to control motor 101, and described motor 101 produces the assist torque that driver assistance carries out turning to.In the present embodiment, motor 101 corresponds to controll plant.
As depicted in figs. 1 and 2, electronic control unit 1 comprise substrate 10, input pattern (pattern) 21, output pattern 22, control pattern 23, first extend pattern 24, second extend pattern 25, semiconductor module 30, control part 50, specific pattern 71,72,73, through hole 81, first radiating component 91 and heat conduction member 92.Substrate 10 is by PC board, and---FR-4 be such as made up of glass fabric and epoxy resin---is formed.
Each input pattern in input pattern 21 is formed on the first surface 11 of substrate 10, and has input terminal pad 211.Each input pattern in input pattern 21 is that the surface by such as covering the thin copper film formed on the substrate 10 with dielectric film is formed.Input terminal pad (inputland) 211 is formed as rectangular shape to be formed by such as making the presumptive area of thin copper film expose from dielectric film.
Each output pattern in output pattern 22 is formed on the first surface 11 of substrate 10, and has output terminal pad 221.The same with input pattern 21, each output pattern in output pattern 22 is that the surface by such as covering the thin copper film formed on the substrate 10 with dielectric film is formed.Exporting terminal pad 221 is be formed as rectangular shape to be formed by such as making the presumptive area of thin copper film expose from dielectric film.
The each control pattern controlled in pattern 23 is formed on the first surface 11 of substrate 10, and has control linkage dish 231.The same with input pattern 21, each control pattern controlled in pattern 23 is that the surface by such as covering the thin copper film formed on the substrate 10 with dielectric film is formed.Control linkage dish 231 is formed as rectangular shape to be formed by such as making the presumptive area of thin copper film expose from dielectric film.
First extends on first surface 11 that pattern 24 and input pattern 21 be formed on substrate 10 to extend from inputting pattern 21.First extends each first in pattern 24 extends the dielectric film that pattern comprises the surface that the thin copper film that forms with the thin copper film of input pattern 21 and covering copper connect up.
Second extends pattern 25 and first extends on first surface 11 that pattern 24 is formed on substrate 10 and extends to extend pattern 24 from first.Second extends each second in pattern 25 extends the dielectric film that pattern comprises the surface that the thin copper film that forms with the first thin copper film extending pattern 24 and covering copper connect up.
Each semiconductor module in semiconductor module 30 be there is switching function semiconductor packages as MOS-FET.In the present embodiment, the first surface 11 of substrate 10 is provided with four semiconductor modules 30 (that is, semiconductor module 31,32,33,34).As depicted in figs. 1 and 2, each semiconductor module in semiconductor module 30 comprises on-off element 41, aquaseal 42, input terminal 43, lead-out terminal 44, control terminal 45 and specific heat conduction member 46.On-off element 41 is the elements be made up of quartz conductor, and on-off element 41 has drain electrode, source electrode and grid.Aquaseal 42 overlay switch element 41.
Input terminal 43 is made for rectangular plate shape by metal (such as aluminium or copper), and input terminal 43 has the first end of the drain electrode being connected to on-off element 41 and exposes from aquaseal 42 and be electrically connected to the second end inputting terminal pad 211.In the present embodiment, input terminal 43 has the first surface of the drain electrode being electrically connected to on-off element 41 and is soldered to the second surface (with reference to Fig. 2) of input terminal pad 211.Input terminal 43 receives the electric current (with reference to Fig. 3) to on-off element 41 from battery 102.In the present embodiment, input terminal 43 is formed and inputs compared with terminal pad 211 slightly little, and all second surfaces of input terminal 43 are in the face of input terminal pad 211.
Lead-out terminal 44 is made up of metal (such as aluminium or copper), and lead-out terminal 44 has the first end of the source electrode being connected to on-off element 41 and exposes from aquaseal 42 and be electrically connected to the second end exporting terminal pad 221.In the present embodiment, three lead-out terminals 44 are furnished with for a semiconductor module 30.The first end of lead-out terminal 44 is by being electrically connected to the source electrode of on-off element 41 after a while by the specific heat conduction member 46 described, and the second end of lead-out terminal 44 is soldered to output terminal pad 221 (with reference to Fig. 2).Lead-out terminal 44 exports the electric current being inputed to on-off element 41 by input terminal 43.
Control terminal 45 is made up of metal (such as aluminium or copper), and control terminal 45 has the first end of the grid being connected to on-off element 41 and exposes from aquaseal 42 and be electrically connected to the second end of control linkage dish 231.In the present embodiment, the first end of control terminal 45 is electrically connected to the grid of on-off element 41 by wire-bonded, and the second end of control terminal 45 is soldered to control linkage dish 231.Control terminal 45 is provided with following control signal: described control signal is the signal for allowing or stop electric current to flow between input terminal 43 and lead-out terminal 44.On-off element 41 is during switching manipulation---that is, when electric current flows between input terminal 43 and lead-out terminal 44---produce heat.
Specific heat conduction member 46 makes tabular by the metal (such as aluminium or copper) with the thermal conductivity being equal to or higher than predetermined value.Specific heat conduction member 46 is electrically connected to the source electrode of on-off element 41, and forms with the first end of lead-out terminal 44.As a result, the first end of lead-out terminal 44 is electrically connected to the source electrode of on-off element 41 by specific heat conduction member 46.Specific heat conduction member 46 is configured such that the surface relative with on-off element 41 of specific heat conduction member 46 is exposed from aquaseal 42.By the heat trnasfer extremely specific heat conduction member 46 produced when operating on-off element 41.
As shown in Figure 1, in the present embodiment, semiconductor module 31 and semiconductor module 32 are arranged on the substrate 10 with adjacent one another are.In addition, semiconductor module 33 and semiconductor module 34 are arranged on the substrate 10 with adjacent one another are.The input pattern 21 be electrically connected with semiconductor module 31 and the input pattern 21 be electrically connected with semiconductor module 32 form.On the other hand, the input pattern 21 be electrically connected with semiconductor module 33 and the input pattern 21 be electrically connected with semiconductor module 34 are formed dividually.
The output pattern 22 be electrically connected with semiconductor module 31 and the input pattern 21 be electrically connected with semiconductor module 32 form.The output pattern 22 be electrically connected with semiconductor module 33 and the input pattern 21 be electrically connected with semiconductor module 34 form.
In the present embodiment, the electric power from battery 102 inputs to the input pattern 21 be electrically connected with semiconductor module 32.Electric power inputs to the input pattern 21 be electrically connected with semiconductor module 31 by the input pattern 21 be electrically connected with semiconductor module 32.Electric power inputs to the input pattern 21 be electrically connected with semiconductor module 33 by the output pattern 22 be electrically connected with semiconductor module 31.Electric power inputs to the input pattern 21 be electrically connected with semiconductor module 34 by the output pattern 22 be electrically connected with semiconductor module 32.
Control part 50 comprises such as microcomputer 51 and customization IC 52.Microcomputer 51 and each customization in IC 52 are the semiconductor packages such as with CPU, ROM, RAM and I/O.Control part 50 controls the operation (31 to 34) of semiconductor module 30.Control part 50 produces control signal based on the signal from the sensor be arranged in each part of vehicle, and controls the operation of semiconductor module 30 according to this control signal, thus controls the rotary actuation to motor 101.In the present embodiment, motor 101 is for there being brushless motor.
As shown in Figure 1, microcomputer 51 and customization IC 52 are arranged on the first surface 11 of substrate 10.Control part 50 is electrically connected to control linkage dish 231 by the wiring in the wiring on substrate 10 and substrate 10.Control part 50 provides control signal by control linkage dish 231 to control terminal 45, and with the operation of master cock element 41, thus the electric current controlling to flow in motor 101 is to control motor 101.
In the present embodiment, above-mentioned semiconductor module 30 (31 to 34) and control part 50 (microcomputer 51, IC 52) and electronic unit (such as, cond 61, relay 62, relay 63, coil 64 and divert shunt resistor 65) are installed on the substrate 10.
Cond 61 is such as aluminium electrolutic capacitors.Relay 62 and 63 is such as by the mechanical relay mechanically configured.Coil 64 is such as choke coil.As shown in Figure 1, divert shunt resistor 65 is formed such as rectangular plate shape, and is installed on the first surface 11 of substrate 10.The first end of divert shunt resistor 65 is electrically connected to formation pattern 26 on the substrate 10, together with the output pattern 22 be electrically connected with semiconductor module 33 and the output pattern 22 be electrically connected with semiconductor module 34.Second end of divert shunt resistor 65 is electrically connected to the first end of formation pattern 27 on the substrate 10.Second end of pattern 27 is connected to ground.
As shown in Figure 4, the side of the positive electrode as the battery 102 of the power supply of vehicle is connected to relay 62.Relay 62 is controlled by control part 50, and relay 62 performs making operation or opening operation, thus allows or stop to provide electric power from battery 102 to electronic control unit 1 (motor 101).That is, in the present embodiment, relay 62 is power supply relay.
Electric power from battery 102 is supplied to semiconductor module 30 (31 to 34) by coil 64.The noise of the electric power provided from battery 102 to motor 101 by electronic control unit 1 eliminated by coil 64.Control part 50 (microcomputer 51, customization IC 52) utilizes the electric power from the ignition source as unshowned source to operate.
As shown in Figure 4, semiconductor module 31 is one another in series with semiconductor module 33 and is connected, and semiconductor module 32 is one another in series with semiconductor module 34 and is connected.Semiconductor module 31 and these two semiconductor modules of semiconductor module 33 and semiconductor module 32 and these two semiconductor modules of semiconductor module 34 are connected in parallel with each other.
Relay 63 and motor 101 are disposed between following two point of connection: the point of connection namely between semiconductor module 31 and semiconductor module 33 and the point of connection between semiconductor module 32 and semiconductor module 34.In this way, in the present embodiment, semiconductor module 31 to semiconductor module 34 forms H-bridge circuit.In addition, divert shunt resistor 65 is connected to source electrode (lead-out terminal 44) side of semiconductor module 33 and semiconductor module 34.Cond 61 is connected between power lead and ground.Cond 61 suppresses to operate by the ON/OFF of semiconductor module 30 (31 to 34) surge voltage that (switching manipulation) produce.
Utilize above-mentioned configuration, such as, when semiconductor module 31 and semiconductor module 34 conducting, and semiconductor module 32 and semiconductor module 33 turn off, and electric current flows according to the sequence in semiconductor module 31, relay 63, motor 101 and semiconductor module 34.On the other hand, when semiconductor module 32 and semiconductor module 33 conducting and semiconductor module 31 and semiconductor module 34 turn off time, electric current flows according to the sequence in semiconductor module 32, motor 101, relay 63 and semiconductor module 33.Because motor 101 is brush direct current motor, so each semiconductor module 30 (31 to 34) is controlled so as to carry out ON/OFF in this way, motor 101 is rotatably driven by H bridge driver thus.The control terminal 45 of each semiconductor module 30 (31 to 34) is connected with the signal wire (SW) from control part 50 (customizing IC 52).That is, control part 50 controls the switching manipulation of semiconductor module 30, thus controls the rotary actuation to motor 101.Control part 50 can control the rotary actuation to motor 101 based on the current value detected by the divert shunt resistor 65 with degree of precision.
Relay 63 is controlled by control part 50, and relay 63 performs making operation or opening operation, thus allows or stop to provide electric power from battery 102 to motor 101.That is, in the present embodiment, relay 63 is motor relay.
During the switching manipulation of semiconductor module 30, because relatively large electric current flows in semiconductor module 30, cond 61, relay 62, relay 63, coil 64 and divert shunt resistor 65, so semiconductor module 30, cond 61, relay 62, relay 63, coil 64 and divert shunt resistor 65 produce heat, and temperature becomes relatively high.In the present embodiment, semiconductor module 30 (31 to 34), cond 61, relay 62, relay 63, coil 64 and divert shunt resistor 65 is surface mount device (SMD).
In the present embodiment, as shown in Figure 1, the direction observed from the input terminal pad 211 first surface 11 of substrate 10 is configured to first direction d1, circumferencial direction along input terminal pad 211 is configured to second direction d2 about first direction d1 to the direction of a sideway swivel 45 degree, circumferencial direction along input terminal pad 211 is configured to third direction d3 about second direction d2 to the direction of a sideway swivel 45 degree, circumferencial direction along input terminal pad 211 is configured to fourth direction d4 about third direction d3 to the direction of a sideway swivel 45 degree, circumferencial direction along input terminal pad 211 is configured to the 5th direction d5 about fourth direction d4 to the direction of a sideway swivel 45 degree, circumferencial direction along input terminal pad 211 is configured to the 6th direction d6 about the 5th direction d5 to the direction of a sideway swivel 45 degree, circumferencial direction along input terminal pad 211 is configured to the 7th direction d7 about the 6th direction d6 to the direction of a sideway swivel 45 degree, and be configured to eighth direction d8 about the 7th direction d7 to the direction of a sideway swivel 45 degree along the circumferencial direction of input terminal pad 211.Input pattern 21 is formed extending scheduled volume or more about on input third direction d3, the fourth direction d4 of terminal pad 211, the 5th direction d5, the 6th direction d6, the 7th direction d7.Output terminal pad 221 and control linkage dish 231 are positioned at the first direction d1 side about input terminal pad 211.
First extends pattern 24 is formed extending about on both input second direction d2 of terminal pad 211 and eighth direction d8.Second extension pattern 25 is formed to extend pattern 24 from first on the direction parallel with first direction d1 and extends.
In the present embodiment, what extend from the input pattern 21 be electrically connected with semiconductor module 31 at second direction d2 first extends pattern 24 and second and extends pattern 25, with extend from the input pattern 21 be electrically connected with semiconductor module 32 at eighth direction d8 first extend pattern 24 and second and extend pattern 25 and form.On the other hand, what second direction d2 extended from the input pattern 21 be electrically connected with semiconductor module 33 first extends pattern 24 and second and extends pattern 25, with extend from the input pattern 21 be electrically connected with semiconductor module 34 on eighth direction d8 first extend pattern 24 and second and extend pattern 25 and formed dividually.
Specific pattern 71,72,73 is the wiring pattern be made up of metal (such as Copper Foil), and described specific pattern 71,72,73 is formed in the part except first surface 11 of substrate 10.Specific pattern 71 and specific pattern 72 are formed between the first surface 11 of substrate 10 and second surface 12.Specific pattern 72 is formed on second surface 12 side about specific pattern 71 of substrate 10.Specific pattern 73 is formed on the second surface 12 of substrate 10.
Through hole 81 is formed by electroplating with metal (such as copper) hole extended on the thickness direction of substrate 10.In the present embodiment, each through hole in through hole 81 is formed to have the first end being electrically connected to input pattern 21 and the second end being electrically connected to specific pattern 72 (with reference to Fig. 2).The first end of each through hole in multiple through hole 81 is at input terminal pad 211, between output terminal pad 221 and control linkage dish 231, and that is, first end is positioned at the first direction d1 side (with reference to Fig. 1) about input terminal pad 211.In the present embodiment, five through holes 81 are formed with for each semiconductor module in semiconductor module 30.
First radiating component 91 is by having metal (such as aluminium) the manufactured Board shape of the permeability to heat being equal to or higher than predetermined value with diffusion heat.First radiating component 91 is arranged on first surface 11 side of substrate 10, makes the surface direction of the surface direction of the first radiating component 91 and substrate 10 substantially parallel (see Fig. 2).Each recess 911 be formed in the first radiating component 91 in the surface of substrate 10 side.Recess 911 is formed to have can the size of holding semiconductor module 30.In the present embodiment, each semiconductor module in semiconductor module 30 (31 to 34) is configured to be contained in recess 911.
Heat conduction member 92 is such as hot grease.Hot grease is the gel grease such as with silicone with the low thermal resistance being base material.Heat conduction member 92 is arranged on semiconductor module 30 (31 to 34) and between substrate 10 and the first radiating component 91.In some instances, the space between recess 911 and semiconductor module 30 (31 to 34) is filled with heat conduction member 92.Utilize above-mentioned configuration, heat conduction member 92 can by recess 911 by heat trnasfer to the first radiating component 91 of semiconductor module 30.
Heat conduction member 92 is configured to against the first surface 11 of substrate 10, input pattern 21 and output pattern 22 and the first radiating component 91.Therefore, the heat of semiconductor module 30 is passed to the first radiating component 91 by the first surface 11 of substrate 10, input pattern 21, output pattern 22 and heat conduction member 92.Be passed to the first radiating component 91, the heat of semiconductor module 30 spreads on the first radiating component 91.As a result, semiconductor module 30 can dispel the heat.
In the present embodiment, the outward flange of substrate 10 is provided with adaptor union 3 (with reference to Fig. 3).Adaptor union 3 is made up of such as resin, and has multiple terminal such as PIG (power line voltage, side of the positive electrode) terminal, earth terminal and motor terminal therein.Adaptor union 3 is connected to wire harness 103.The side of the positive electrode of battery 102 is electrically connected to the PIG terminal of adaptor union 3 by the conductor 104 of wire harness 103.PIG terminal is connected to the positive terminal of relay 62 by unshowned wiring pattern.Utilize above-mentioned configuration, provide electric power from battery 102 to input pattern 21 by PIG terminal and relay 62.
In addition, the motor terminal of adaptor union 3 is electrically connected to the point of connection between semiconductor module 31 and semiconductor module 33 and the point of connection between semiconductor module 32 and semiconductor module 34.The wiring terminals of motor 101 is electrically connected to the motor terminal of adaptor union 3 by the conductor 105 of wire harness 103.Utilize above-mentioned configuration, provide electric power by motor terminal, conductor 105 and wiring terminals to motor 101.
Subsequently, electronic control unit 1 according to the present embodiment will be described.When the chaufeur of vehicle connects ignition lock, provide electric power to start electronic control unit 1 from priming supply to electronic control unit 1.When electronic control unit 1 starts, control part 50 cutin relay 62 and relay 63.Utilize above-mentioned configuration, allow to provide electric power from battery 102 to motor 101.
Control part 50 based on the switching manipulation turning to dtc signal and vehicle velocity signal to control the on-off element of each semiconductor module 30 (31 to 34), thus controls rotary actuation to motor 101 when ignition lock is connected.As a result, the assist torque being used for driver assistance and carrying out turning to is exported from motor 101.
In the present embodiment, when control part 50 controls the switching manipulation of the on-off element 41 of each semiconductor module 30 (31 to 34), during to control the rotary actuation to motor 101, on-off element 41 produces heat, and the temperature of semiconductor module 30 (31 to 34) becomes relatively high.The heat of semiconductor module 30 to be led the first radiating component 91 by heat conduction member 92.The heat of semiconductor module 30 also by with substrate 10, input heat conduction member 92 that pattern 21, output pattern 22 and the first radiating component 91 contact and to lead the first radiating component 91.
As mentioned above, in the present embodiment, each input pattern in input pattern 21 is formed on the first surface 11 of substrate 10, and has input terminal pad 211.Each output pattern in output pattern 22 is formed on the first surface 11 of substrate 10, and has output terminal pad 221.The each control pattern controlled in pattern 23 is formed on the first surface 11 of substrate 10, and has control linkage dish 231.First extends pattern 24 is formed on the first surface 11 of substrate 10 with input pattern 21, to extend from input pattern 21.
Each semiconductor module in semiconductor module 30 (31 to 34) has on-off element 41, aquaseal 42, input terminal 43, lead-out terminal 44 and control terminal 45.Aquaseal 42 overlay switch element 41.Input terminal 43 has the first end that is connected to on-off element 41 and is configured to expose from aquaseal 42 and is electrically connected to the second end of input terminal pad 211, and input terminal 43 receives the electric current to on-off element 41.Lead-out terminal 44 has the first end that is connected to on-off element 41 and is configured to expose from aquaseal 42 and is electrically connected to the second end exporting terminal pad 221, and lead-out terminal 44 exports the electric current being inputed to on-off element 41 by input terminal 43.
Control terminal 45 has the first end being connected to on-off element 41, with be configured to expose from aquaseal 42 and be electrically connected to the second end of control linkage dish 231, and control terminal 45 is provided with following control signal: described control signal is the signal allowing or stop electric current to flow between input terminal 43 and lead-out terminal 44.Semiconductor module 30 (31 to 34) is arranged on the first surface 11 of substrate 10, and produces heat during on-off element 41 operates.
Control part 50 is installed on the substrate 10 to be electrically connected to control linkage dish 231, utilizing provides control signal to carry out the operation of master cock element 41 by control linkage dish 231 to control terminal 45, and the electric current controlling to flow in motor 101 is to control motor 101.
Input pattern 21 is formed extending scheduled volume or more about on input third direction d3, the fourth direction d4 of terminal pad 211, the 5th direction d5, the 6th direction d6 and the 7th direction d7.In addition, input terminal pad 221 and control linkage dish 231 are positioned at the first direction d1 side about input terminal pad 211.
First extends pattern 24 is formed extending about on both input second direction d2 of terminal pad 211 and eighth direction d8.Therefore, the heat that on-off element 41 produces during operation is transmitted on third direction d3, the fourth direction d4 of the input terminal pad 211 about input pattern 21, the 5th direction d5, the 6th direction d6, the 7th direction d7 by input terminal 43 and input terminal pad 211, and is passed to be positioned at and extends pattern 24 about first on the second direction d2 of input terminal pad 211 and eighth direction d8.Therefore, the heat of on-off element 41 (semiconductor module 30) can carry out radiation effectively by input pattern 21 and the first extension pattern 24.
In addition, in the present embodiment, the second extension pattern 25 is provided with.Second extends pattern 25 and first extends pattern 24 and is formed on the first surface 11 of substrate 10, extends to extend pattern 24 from first on the direction parallel with first direction d1.Therefore, be passed to the first extension pattern 24, the heat of on-off element 41 is also passed to the second extension pattern 25 and spreads.As a result, the heat of on-off element 41 (semiconductor module 30) can more effectively by radiation.
In addition, in the present embodiment, specific pattern 71,72,73 and through hole 81 is provided with.Specific pattern 71,72,73 is formed between the first surface 11 of substrate 10 and second surface 12, or is formed on the second surface 12 of substrate 10.Each through hole in through hole 81 is formed to have the first end being connected to input pattern 21 and the second end being connected to specific pattern 72.Therefore, the heat of on-off element 41 is passed to specific pattern 72 by input pattern 21 and through hole 81, and spreads.As a result, the heat of on-off element 41 (semiconductor module 30) can further effectively by radiation.
The first end of each through hole in through hole 81 is positioned at the first direction d1 side about input terminal pad 211.Therefore, the heat of on-off element 41 (semiconductor module 30) is transmitted to the 7th direction at the third direction of the input terminal pad 211 about input pattern 21, and the first extension pattern 24 transmits on the second direction d2 and eighth direction d8 of the input terminal pad 211 about input pattern 21, and through hole 81 transmits on the first direction d1 of the input terminal pad 211 about input pattern 21, namely transmit to all directions of eighth direction at the first direction about input terminal pad 211, and spread.As a result, the heat of on-off element 41 (semiconductor module 30) can further effectively by radiation.
In addition, in the present embodiment, the first radiating component 91 and heat conduction member 92 is provided with.First radiating component 91 is arranged on first surface 11 side of substrate 10, and have be equal to or higher than predetermined value permeability to heat with diffusion heat.Heat conduction member 92 is at least arranged between semiconductor module 30 (31 to 34) and the first radiating component 91, and can by heat trnasfer to the first radiating component 91 of semiconductor module 30.Therefore, the heat of semiconductor module 30 can by heat conduction member 92 and the first radiating component 91 effectively by radiation.
Heat conduction member 92 is against substrate 10, input pattern 21 and output pattern 22.Therefore, semiconductor module 30 heat by with substrate 10, input the heat conduction member 92 that pattern 21, output pattern 22 and the first radiating component 91 contact and be directed to the first radiating component 91.As a result, the heat of semiconductor module 30 can carry out radiation more effectively by heat conduction member 92 and the first radiating component 91.
Each semiconductor module in semiconductor module 30 (31 to 34) has specific heat conduction member 46, and described specific heat conduction member 46 has the permeability to heat that is equal to or higher than predetermined value and is set to expose from aquaseal 42.Given this, the heat of on-off element 41 can carry out radiation effectively by specific heat conduction member 46.
Electric power-assisted steering apparatus 100 comprises electronic control unit 1 and is controlled by electronic control unit 1 and can export the motor 101 carrying out the assist torque turned to for driver assistance.Because electronic control unit 1 according to the present embodiment has the semiconductor module 30 (on-off element 41) of higher radiation effect, so electronic control unit 1 can preferably be used as its heat generation amount becomes large electric power-assisted steering apparatus 100 electronic control unit along with the flowing of larger current.
(the second embodiment)
A part for the electronic control unit of the second embodiment according to present disclosure is described with reference to Fig. 5.
In this second embodiment, except through hole 81 is set, through hole 82 is also provided with.Each through hole in through hole 81 is formed to have the second end being electrically connected to specific pattern 73.Through hole 82 is identical on configuring with through hole 81.Each through hole in through hole 82 is formed to have and is electrically connected to the first end inputting pattern 21 and the second end being electrically connected to specific pattern 73 in the position different from the through hole 81 of input pattern 21.
In this second embodiment, the second radiating component 93 and heat conduction member 94 is also provided with.The same with the first radiating component 91, the second radiating component 93 by metal (such as aluminium) the manufactured Board shape with the permeability to heat being equal to or higher than predetermined value, with diffusion heat.Second radiating component 93 is arranged on second surface 12 side of substrate 10, makes the surface direction of the surface direction of the second radiating component 93 and substrate 10 substantially parallel (with reference to Fig. 5).
The same with heat conduction member 92, heat conduction member 94 is such as hot grease.Heat conduction member 94 is arranged between substrate 10 and the second radiating component 93.In this example, heat conduction member 94 is configured to against substrate 10 and specific pattern 73 and the second radiating component 93.Therefore, the heat of semiconductor module 30 (31 to 34) is directed to the second radiating component 93 by substrate 10, specific pattern 73 and heat conduction member 94.
As mentioned above, in the present embodiment, the second radiating component 93 is provided with.Second radiating component 93 is arranged on second surface 12 side of substrate 10, and have be equal to or higher than predetermined value permeability to heat with diffusion heat.Therefore, the heat of semiconductor module 30 (31 to 34) is passed to the second radiating component 93 by substrate 10, and spreads.As a result, the heat of semiconductor module 30 can carry out radiation more effectively by the second radiating component 93.
(the 3rd embodiment)
A part for the electronic control unit of the 3rd embodiment according to present disclosure is described with reference to Fig. 6.3rd embodiment does not extend pattern 25 from different being in of the first embodiment in arranging the first extension pattern 24 and second.Other structures are identical with the first embodiment.
As mentioned above, in the present embodiment, be provided with alternative first to extend pattern 24 and second and extend pattern 25 and the specific pattern 71,72,73 that arranges and through hole 81.Specific pattern 71,72,73 is formed between the first surface 11 of substrate 10 and second surface 12, or on the second surface 12 of substrate 10.Each through hole in through hole 81 is formed to have the first end being connected to input pattern 21 and the second end being connected to specific pattern 72 (with reference to Fig. 2).In the present embodiment, the heat that on-off element 41 produces during operation is transmitted with inputting on third direction d3, the fourth direction d4 of terminal pad 211 at the input terminal pad 211 about input pattern 21, the 5th direction d5, the 6th direction d6 and the 7th direction d7 by input terminal 43, and is passed to specific pattern 72 by through hole 81.Therefore, the heat of on-off element 41 (semiconductor module 30) can carry out radiation effectively by input pattern 21, through hole 81 and specific pattern 72.
In addition, the first end of each through hole in through hole 81 is positioned at the first direction d1 side about input terminal pad 211.Therefore, the heat of on-off element 41 (semiconductor module 30) is transmitted to the 7th direction at the third direction of the input terminal pad 211 about input pattern 21, and first extends pattern 24 transmits on the second direction d2 and eighth direction d8 of the input terminal pad 211 about input pattern 21, and through hole 81 transmits on the first direction d1 of the input terminal pad 211 about input pattern 21, namely transmit to all directions of eighth direction at the first direction about input terminal pad 211, and spread.As a result, the heat of on-off element 41 (semiconductor module 30) more effectively can carry out radiation.
(other embodiments)
In another embodiment of present disclosure, first extends pattern can be formed extending about in the either direction in the input second direction of terminal pad and eighth direction.In another embodiment of present disclosure, the second extension pattern can not be set, and the first extension pattern is set.
In another embodiment of present disclosure, the input pattern each through hole be connected in the through hole of specific pattern can be formed to have on any direction be positioned at about the input terminal pad of input pattern or the first end of any position.The configuration without through hole can also be applied.The configuration without specific pattern can also be applied.In another embodiment of present disclosure, the cover of covered substrate can be arranged on the side relative with the first radiating component of substrate.
In another embodiment of present disclosure, heat conduction member 92 can against substrate, input pattern and output pattern at least any one.Heat conduction member 92 can against only semiconductor module.First radiating component can be configured to not have recess.The configuration without the first radiating component and heat conduction member 92 can also be applied.First radiating component and the second radiating component are not limited to aluminium, but can by metal (such as, copper, silver or iron), any material in metallic oxide (such as aluminium oxide), ceramic body, carbon or diamond makes, as long as its permeability to heat is predetermined value or higher.
In another embodiment of present disclosure, the specific heat conduction member 46 of semiconductor module can not form with lead-out terminal.Specific heat conduction member can not be electrically connected to on-off element.Specific heat conduction member is not limited to aluminium or copper, but can be made up, as long as its permeability to heat is predetermined value or higher of any material in metal (such as silver or iron), metallic oxide (such as aluminium oxide), ceramic body, carbon or diamond.Semiconductor module can not have specific heat conduction member.In this case, the lead-out terminal of semiconductor module makes its first end be connected directly to on-off element.
In addition, in the above-described embodiment, semiconductor module 31 to semiconductor module 34 configures H-bridge circuit, and brush motor 101 is driven rotatably by H bridge driver.In contrast, in another embodiment of present disclosure, such as, two semiconductor modules (on-off element) being arranged on hot side and low potential side can deploy switch element pair, the on-off element of number identical with the number of the phase of brushless motor is to configuring inverter, and control part can carry out brushless driving by inverter to motor.Such as, when three-phase brushless motor, imagination inverter is right by three on-off elements---that is, six semiconductor modules (on-off element)---configure.In addition, in order to tackle on-off element fault, the configuration of the inverter with multiple system can be set.Such as, when being provided with the inverter of two systems for three-phase brushless motor, provide 12 semiconductor modules (on-off element).If above-mentioned input pattern, the first extension pattern, the second extension pattern and through hole to be applied to each semiconductor module in multiple semiconductor module, then the heat of each semiconductor module can carry out radiation effectively.In this way, in this disclosure, brush motor or heterogeneous brushless motor can be used as the motor that will control.
In another embodiment of present disclosure, input terminal pad, output terminal pad and control linkage dish are not limited to rectangular shape, but can be formed any shape, such as triangular shaped, polygonal shape, round-shaped or elliptical shape.In another embodiment of present disclosure, semiconductor module is not limited to MOS-FET, but can adopt any configuration, such as IGBT, power supply IC or transistor, as long as semiconductor packages has switching function.
In another embodiment of present disclosure, cond 61 is not limited to aluminium electrolutic capacitor, but can be configured by the cond of any type, such as conductive polymer capacitors or mixed capacitor.In another embodiment of present disclosure, cond 61, relay 62, relay 63, coil 64, divert shunt resistor 65, microcomputer 51 and customization IC 52 can be arranged on any surface in the first surface of substrate and second surface.In another embodiment of present disclosure, semiconductor module 30 (31 to 34), cond 61, relay 62, relay 63, coil 64 and divert shunt resistor 65 can be configured by via devices (through-hole device, THD).
In the above-described embodiment, relay 62 and relay 63 adopt mechanical relay.On the contrary, in another embodiment of present disclosure, relay 62 and relay 63 can by by arranging two semiconductor modules 30 with opposite polarity, each semiconductor relay be configured to configures.In this case, if above-mentioned input pattern, first is extended pattern, the second extension pattern or via-hole applications in the semiconductor module 30 configuring relay 62 and relay 63, then the heat of semiconductor module 30 can carry out radiation effectively.In another embodiment of present disclosure, the configuration without cond 61, coil 64 and divert shunt resistor 65 can be applied.
In another embodiment of present disclosure, electronic control unit can with the motor integral that will control formed.In this case, the first radiating component 91 of electronic control unit forms with the frame end of such as motor.Therefore, the number of the component of electric power-assisted steering apparatus can be reduced, and the size of electric power-assisted steering apparatus can be reduced.
The electric power-assisted steering apparatus that electronic control unit according to present disclosure can also be applied to any system---such as tooth bar auxiliary type system or post booster type system---.Electronic control unit according to present disclosure is not limited to electric power-assisted steering apparatus, but can be used to control the driving to the motor in another device.As mentioned above, present disclosure is not limited to above-mentioned embodiment, but can install with various configuration when not deviating from the spirit of present disclosure.
Claims (10)
1. an electronic control unit (1), for controlling controll plant (101), described electronic control unit comprises:
Substrate (10), described substrate (10) has first surface (11) and second surface (12);
Input pattern (21), the described first surface that described input pattern (21) is formed in described substrate has input terminal pad (211);
Output pattern (22), the described first surface that described output pattern (22) is formed in described substrate has output terminal pad (221);
Control pattern (23), the described first surface that described control pattern (23) is formed in described substrate has control linkage dish (231);
First extends pattern (24), and described first extends pattern (24) is formed on the described first surface of described substrate with described input pattern, to extend from described input pattern;
Semiconductor module (30,31,32,33,34), described semiconductor module (30,31,32,33,34) comprising:
On-off element (41),
Cover the aquaseal (42) of described on-off element,
Input terminal (43), described input terminal (43) has the first end that is connected to described on-off element and is configured to expose from described aquaseal and is electrically connected to the second end of described input terminal pad, and described input terminal (43) receives the electric current to described on-off element
Lead-out terminal (44), described lead-out terminal (44) has the first end that is connected to described on-off element and is configured to expose from described aquaseal and is electrically connected to the second end of described output terminal pad, and described lead-out terminal (44) exports the electric current being inputed to described on-off element by described input terminal, and
Control terminal (45), described control terminal (45) has the first end that is connected to described on-off element and is configured to expose from described aquaseal and is electrically connected to the second end of described control linkage dish, and described control terminal (45) is provided with control signal, described control signal is the signal for allowing or stop electric current to flow between described input terminal and described lead-out terminal, and the described first surface that described semiconductor module is arranged on described substrate produces heat during the operation of described on-off element; And
Control part (50,51,52), described control part (50,51,52) is installed on the substrate to be electrically connected to described control linkage dish, described control part is by providing described control signal to control the operation of described on-off element via described control linkage dish to described control terminal, and control described controll plant by controlling the electric current flow in described controll plant, wherein
When a direction setting from the described input terminal pad viewing on the described first surface of described substrate is become first direction (d1), circumferencial direction along described input terminal pad is become second direction (d2) about described first direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become third direction (d3) about described second direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become fourth direction (d4) about described third direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become the 5th direction (d5) about described fourth direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become the 6th direction (d6) about described 5th direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become the 7th direction (d7) about described 6th direction to the direction setting of a sideway swivel 45 degree, and when the described circumferencial direction along described input terminal pad is become eighth direction (d8) about described 7th direction to the direction setting of a sideway swivel 45 degree, described input pattern is formed at the described third direction about described input terminal pad, described fourth direction, described 5th direction, described 6th direction and described 7th direction extend scheduled volume or more
Described output terminal pad and described control linkage dish are positioned on the first direction side about described input terminal pad, and
Described first extends pattern is formed extending about at least one direction in the described second direction of described input terminal pad and described eighth direction.
2. electronic control unit according to claim 1, also comprises:
Second extends pattern (25), described second extension pattern (25) and described first extends pattern and is formed on the described first surface of described substrate, extends to extend pattern from described first on the direction parallel with described first direction.
3. electronic control unit according to claim 1, also comprises:
Specific pattern (71,72,73), described specific pattern (71,72,73) is formed between the described first surface of described substrate and described second surface, or is formed on the described second surface of described substrate; And
Through hole (81,82), described through hole (81,82) has the first end being connected to described input pattern and the second end being connected to described specific pattern.
4. an electronic control unit (1), for controlling controll plant (101), described electronic control unit comprises:
Substrate (10), described substrate (10) has first surface (11) and second surface (12);
Input pattern (21), the described first surface that described input pattern (21) is formed in described substrate has input terminal pad (211);
Output pattern (22), the described first surface that described output pattern (22) is formed in described substrate has output terminal pad (221);
Control pattern (23), the described first surface that described control pattern (23) is formed in described substrate has control linkage dish (231);
Specific pattern (71,72,73), described specific pattern (71,72,73) is formed between the described first surface of described substrate and described second surface (12), or is formed on the described second surface of described substrate;
Through hole (81,82), described through hole (81,82) has the first end being connected to described input pattern and the second end being connected to described specific pattern;
Semiconductor module (30,31,32,33,34), described semiconductor module (30,31,32,33,34) comprising:
On-off element (41),
Cover the aquaseal (42) of described on-off element,
Input terminal (43), described input terminal (43) has the first end that is connected to described on-off element and is configured to expose from described aquaseal and is electrically connected to the second end of described input terminal pad, and described input terminal (43) receives the electric current to described on-off element
Lead-out terminal (44), described lead-out terminal (44) has the first end that is connected to described on-off element and is configured to expose from described aquaseal and is electrically connected to the second end of described output terminal pad, and described lead-out terminal (44) exports the electric current being inputed to described on-off element by described input terminal, and
Control terminal (45), described control terminal (45) has the first end that is connected to described on-off element and is configured to expose from described aquaseal and is electrically connected to the second end of described control linkage dish, and described control terminal (45) is provided with control signal, described control signal is the signal for allowing or stop electric current to flow between described input terminal and described lead-out terminal, and the described first surface that described semiconductor module is arranged on described substrate produces heat during the operation of described on-off element; And
Control part (50,51,52), described control part (50,51,52) is installed on the substrate to be electrically connected to described control linkage dish, described control part is by providing described control signal to control the described operation of described on-off element via described control linkage dish to described control terminal, and control described controll plant by controlling the electric current flow in described controll plant, wherein
When a direction setting from the described input terminal pad viewing on the described first surface of described substrate is become first direction (d1), circumferencial direction along described input terminal pad is become second direction (d2) about described first direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become third direction (d3) about described second direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become fourth direction (d4) about described third direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become the 5th direction (d5) about described fourth direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become the 6th direction (d6) about described 5th direction to the direction setting of a sideway swivel 45 degree, described circumferencial direction along described input terminal pad is become the 7th direction (d7) about described 6th direction to the direction setting of a sideway swivel 45 degree, and when the described circumferencial direction along described input terminal pad is become eighth direction (d8) about described 7th direction to the direction setting of a sideway swivel 45 degree, described input pattern is formed at the described third direction about described input terminal pad, described fourth direction, described 5th direction, described 6th direction and described 7th direction extend scheduled volume or more, and
Described output terminal pad and described control linkage dish are positioned on the first direction side about described input terminal pad.
5. the electronic control unit according to claim 3 or 4, wherein,
The described first end of described through hole is positioned on the described first direction side about described input terminal pad.
6. electronic control unit according to any one of claim 1 to 4, also comprises:
First radiating component (91), described first radiating component (91) is arranged on the first surface side of described substrate, and have be equal to or higher than predetermined value permeability to heat with diffusion heat; And
Heat conduction member (92), described heat conduction member (92) is at least arranged between described semiconductor module and described first radiating component, and by the heat trnasfer of described semiconductor module to described first radiating component.
7. electronic control unit according to claim 6, wherein,
Described heat conduction member against in described substrate, described input pattern and described output pattern one of at least.
8. electronic control unit according to claim 6, also comprises:
Second radiating component (93), described second radiating component (93) is arranged on the second surface side of described substrate, and have be equal to or higher than predetermined value permeability to heat with diffusion heat.
9. electronic control unit according to any one of claim 1 to 4, wherein,
Described semiconductor module comprises specific heat conduction member (46), and described specific heat conduction member (46) has the permeability to heat that is equal to or higher than predetermined value and is configured to expose from described aquaseal.
10. an electric power-assisted steering apparatus (100), comprising:
Electronic control unit according to any one of claim 1 to 4; And
Controll plant, described controll plant is controlled by described electronic control unit, and exports the assist torque being used for driver assistance and carrying out turning to.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-033897 | 2014-02-25 | ||
| JP2014033897A JP6131879B2 (en) | 2014-02-25 | 2014-02-25 | Electronic control unit and electric power steering apparatus using the same. |
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| CN104859708A true CN104859708A (en) | 2015-08-26 |
| CN104859708B CN104859708B (en) | 2017-12-29 |
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| CN201510086594.7A Active CN104859708B (en) | 2014-02-25 | 2015-02-17 | Electronic control unit and the electric power-assisted steering apparatus using electronic control unit |
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| JP (1) | JP6131879B2 (en) |
| KR (1) | KR101624492B1 (en) |
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| JP2010267869A (en) * | 2009-05-15 | 2010-11-25 | Autonetworks Technologies Ltd | Wiring board |
| JP5110049B2 (en) | 2009-07-16 | 2012-12-26 | 株式会社デンソー | Electronic control device |
| JP5408502B2 (en) * | 2010-09-06 | 2014-02-05 | 株式会社デンソー | Electronic control unit |
| JP5692056B2 (en) * | 2011-12-28 | 2015-04-01 | 株式会社デンソー | Multilayer printed circuit board |
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|---|---|---|---|---|
| US6903524B2 (en) * | 2003-04-10 | 2005-06-07 | Mitsubishi Denki Kabushiki Kaisha | Electric motor-driven power steering apparatus |
| JP4266690B2 (en) * | 2003-04-10 | 2009-05-20 | 三菱電機株式会社 | Electric power steering device |
| JP2009056835A (en) * | 2007-08-30 | 2009-03-19 | Toyota Motor Corp | Steering device |
| CN101795926A (en) * | 2007-08-30 | 2010-08-04 | 丰田自动车株式会社 | Steering device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015159225A (en) | 2015-09-03 |
| JP6131879B2 (en) | 2017-05-24 |
| KR101624492B1 (en) | 2016-05-26 |
| CN104859708B (en) | 2017-12-29 |
| KR20150100562A (en) | 2015-09-02 |
| MY169201A (en) | 2019-02-27 |
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