CN104853527A - Full-automatic etching cleaning device - Google Patents
Full-automatic etching cleaning device Download PDFInfo
- Publication number
- CN104853527A CN104853527A CN201510311259.2A CN201510311259A CN104853527A CN 104853527 A CN104853527 A CN 104853527A CN 201510311259 A CN201510311259 A CN 201510311259A CN 104853527 A CN104853527 A CN 104853527A
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- CN
- China
- Prior art keywords
- etching
- controller
- manipulator
- bath
- full
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention discloses a full-automatic etching cleaning device, and the device comprises an etching tank (1), a cleaning tank (14), a grabbing mechanism, a cross bar (8), a support (9), and a control box (10). The grabbing mechanism comprises a mechanical hand controller (11), a mechanical arm (12), and a mechanical hand (13); the etching tank (1) is provided with an etching agent tube (5); the inlet of the etching agent tube (5) is connected with an etching pump (4), and the outlet of the etching agent tube (5) is located in the etching tank (1); the etching pump (4) is connected with an etching auxiliary tank (2); the interior of a detection apparatus (3) is provided with an aerometer (31) and a probe (32); a side wall of the etching tank (1) is provided with a controller (6); the cleaning tank (14) is provided with a tap water pipe (15); and the bottom of the cleaning tank (14) is provided with a water outlet (17). The beneficial effects of the invention are that the device is high in automation degree, is good in etching quality, and is high in labor intensity.
Description
Technical field
The present invention relates to Etaching device, particularly a kind of full-automatic etch cleaning device.
Background technology
Along with the improvements of electron trade, China's wiring board industry development also broad-based recovery thereupon, China will become PCB industrial base the biggest in the world in recent years, account for world market about 30% at present, in printed circuit board production process, etching is a very important technique, and a large amount of etching solutions must be used during etching, and its automaticity of existing Etaching device is not high, often need manual operation, but etching solution has strong corrosivity, easily workman is worked the mischief, and along with the carrying out etched, copper is constantly dissolved, in liquid medicine, the content of univalent copper ion rises, this constantly need add etching solution bivalent cupric ion to maintain normal etch-rate.The interpolation of ammoniacal liquor and ammonium chloride is all generally with adding etching solution manually, artificial interpolation labour intensity is large, and etching solution concentration management and control error range is large, also easily causes circuit board etching quality bad, etched rear circuit board is arranged containing etching solution, needs to clean etching solution.
Summary of the invention
The object of the invention is to the shortcoming overcoming prior art, the full-automatic etch cleaning device that a kind of automaticity is high, etching quality good and labour intensity is low is provided.
Object of the present invention is achieved through the following technical solutions: a kind of full-automatic etch cleaning device, it comprises etching bath, rinse bath, grasping mechanism, cross bar, support and control cabinet, described grasping mechanism comprises Manipulator Controller, mechanical arm and manipulator, described Manipulator Controller and mechanical arm are flexibly connected, wire is connected with between Manipulator Controller and manipulator, Manipulator Controller is movably arranged on cross bar, described cross bar is rack-mount, described control cabinet is connected with Manipulator Controller, described etching bath is provided with etchant pipe and checkout gear, the entrance of etchant pipe is connected with an etching pump, the outlet of etchant pipe is positioned at etching bath, described etching pump is connected with an etching auxiliary tank, described checkout gear is communicated with the bottom of etching bath, densimeter and probe is provided with in checkout gear, densimeter is positioned at the bottom of probe, the sidewall of described etching bath is provided with a controller, etching pump and probe are electrically connected with controller, described rinse bath is provided with running water pipe, described running water pipe is connected with outside running water pipe by running water pipe access port, described bottom of rinse bath is also provided with a delivery port, delivery port is connected with outlet pipe.
The pipeline that described etching pump is connected with etchant pipe is provided with an electromagnetically operated valve, and electromagnetically operated valve is electrically connected with controller.
The anglec of rotation of described mechanical arm is 360 degree.
The anglec of rotation of described manipulator is 240 degree
The present invention has the following advantages: Etaching device of the present invention, is provided with manipulator and mechanical arm, thus makes circuit board in etching process, without the need to manual operation, achieves automatic etching, and detects CU in etching bath by densimeter
2+content, automatically add appropriate etching solution by etching pump simultaneously, thus make the CU in etching bath
2+content be in rational scope all the time, ensure that the quality that circuit board etches, and without the need to artificial interpolation, reduce labour intensity, be provided with rinse bath, circuit board after the etching, directly enter rinse bath by manipulator, the etching solution in rinse bath for continuing swap status, thus ensure that cleaning quality, all without the need to manual operation in whole etching and cleaning process, therefore there is the advantage that automaticity is high, etching quality is good labour intensity is low.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention
Fig. 2 is the structural representation of etching bath
In figure, 1-etching bath, 2-etches auxiliary tank, 3-checkout gear, and 4-etches pump, 5-etchant pipe, 6-controller, 7-electromagnetically operated valve, 8-cross bar, 9-support, 10-control cabinet, 11-Manipulator Controller, 12-mechanical arm, 13-manipulator, 31-densimeter, and 32-pops one's head in.
Embodiment
Below in conjunction with accompanying drawing, the present invention will be further described, and protection scope of the present invention is not limited to the following stated:
As depicted in figs. 1 and 2, a kind of full-automatic etch cleaning device, it comprises etching bath 1, rinse bath 14, grasping mechanism, cross bar 8, support 9 and control cabinet 10, described grasping mechanism comprises Manipulator Controller 11, mechanical arm 12 and manipulator 13, described Manipulator Controller 11 and mechanical arm 12 are flexibly connected, wire is connected with between Manipulator Controller 11 and manipulator 13, Manipulator Controller 11 is movably arranged on cross bar 8, described cross bar 8 is arranged on support 9, described control cabinet 10 is connected with Manipulator Controller 11, in the present embodiment, control cabinet 10 controls manipulator 13 transverse shifting, Manipulator Controller 11 controls manipulator 13 and captures circuit board, thus make the motion of circuit board in etching bath 1 be Automatic Control, reduce labour intensity, by described etching bath 1 is provided with etchant pipe 5 and checkout gear 3, the entrance of etchant pipe 5 is connected with an etching pump 4, the outlet of etchant pipe 5 is positioned at etching bath 1, described etching pump 4 is connected with an etching auxiliary tank 2, described checkout gear 3 is communicated with the bottom of etching bath 1, densimeter 31 and probe 32 is provided with in checkout gear 3, densimeter 31 is positioned at the bottom of probe 32, the sidewall of described etching bath 1 is provided with a controller 6, etching pump 4 and probe 32 are electrically connected with controller 6, etching solution CU is controlled by densimeter 31 Magnetic Induction
2+content, if CU
2+content exceeds and arranges management and control scope, i.e. CU
2+the words exceeded standard, densimeter 31 in checkout gear 3 can float and top probe 32 contact induction, probe 32 sends signal to controller 6, controller 6 controls etching pump 4 and works, fresh sub-liquid in etching auxiliary tank 2 is delivered in etching bath, when etching bath 1 inner liquid medicine has added to after in specific gravity range, densimeter 31 can decline, etching pump 4 quits work, complete automatic interpolation, described rinse bath 14 is provided with running water pipe 15, described running water pipe 15 is connected with outside running water pipe by running water pipe access port 16, a delivery port 17 is also provided with bottom described rinse bath 14, delivery port 17 is connected with outlet pipe, cleaning fluid in rinse bath 14 is added by running water pipe 15, the unnecessary cleaning fluid of rinse bath 14 then duchy's delivery port 17 is discharged, in the present embodiment, inflow is identical with water yield, thus ensure the cleaning fluid liquid level stabilizing of rinse bath 14, simultaneously by the quick exchange of cleaning fluid, ensure that the quality of cleaning fluid, thus ensure that the cleaning quality of circuit board.
In the present embodiment, the pipeline that described etching pump 4 is connected with etchant pipe 5 is provided with an electromagnetically operated valve 7, electromagnetically operated valve 7 is electrically connected with controller 6, electromagnetically operated valve 7 is in normally off, when etching pump 4 and working, controller 6 just Controlling solenoid valve 7 is opened, and electromagnetically operated valve 7 can prevent the etching solution in etching bath 1 from refluxing, and ensures the etching liquid level stabilizing in etching bath 1.
In the present embodiment, the anglec of rotation of described mechanical arm 12 is 360 degree, and the anglec of rotation of manipulator 13 is 240 degree, by the rotation between mechanical arm 12 and manipulator 13, can make that circuit board is omnibearing to be etched, also be convenient to gripper of manipulator sense circuit plate.
Claims (4)
1. a full-automatic etch cleaning device, it is characterized in that: it comprises etching bath (1), rinse bath (14), grasping mechanism, cross bar (8), support (9) and control cabinet (10), described grasping mechanism comprises Manipulator Controller (11), mechanical arm (12) and manipulator (13), described Manipulator Controller (11) and mechanical arm (12) are flexibly connected, wire is connected with between Manipulator Controller (11) and manipulator (13), Manipulator Controller (11) is movably arranged on cross bar (8), described cross bar (8) is arranged on support (9), described control cabinet (10) is connected with Manipulator Controller (11), described etching bath (1) is provided with etchant pipe (5) and checkout gear (3), the entrance of etchant pipe (5) is connected with an etching pump (4), the outlet of etchant pipe (5) is positioned at etching bath (1), described etching pump (4) is connected with an etching auxiliary tank (2), described checkout gear (3) is communicated with the bottom of etching bath (1), densimeter (31) and probe (32) is provided with in checkout gear (3), densimeter (31) is positioned at the bottom of probe (32), the sidewall of described etching bath (1) is provided with a controller (6), etching pump (4) and probe (32) are electrically connected with controller (6), described rinse bath (14) is provided with running water pipe (15), described running water pipe (15) is connected with outside running water pipe by running water pipe access port (16), described rinse bath (14) bottom is also provided with a delivery port (17), delivery port (17) is connected with outlet pipe.
2. the full-automatic etch cleaning device of one according to claim 1, is characterized in that: the pipeline that described etching pump (4) is connected with etchant pipe (5) is provided with an electromagnetically operated valve (7), and electromagnetically operated valve (7) is electrically connected with controller (6).
3. the full-automatic etch cleaning device of one according to claim 1, is characterized in that: the anglec of rotation of described mechanical arm (12) is 360 degree.
4. the full-automatic etch cleaning device of one according to claim 1, is characterized in that: the anglec of rotation of described manipulator (13) is 240 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510311259.2A CN104853527A (en) | 2015-06-09 | 2015-06-09 | Full-automatic etching cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510311259.2A CN104853527A (en) | 2015-06-09 | 2015-06-09 | Full-automatic etching cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104853527A true CN104853527A (en) | 2015-08-19 |
Family
ID=53852774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510311259.2A Pending CN104853527A (en) | 2015-06-09 | 2015-06-09 | Full-automatic etching cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104853527A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5885403A (en) * | 1996-07-10 | 1999-03-23 | Vanguard Semiconductor Corporation | System for cleaning and etching |
| CN201924078U (en) * | 2010-12-27 | 2011-08-10 | 深圳市翔宇电路有限公司 | Etching solution automatic adding device |
| CN203416507U (en) * | 2013-07-02 | 2014-01-29 | 苏州福莱盈电子有限公司 | Automatic cleaning etching apparatus of PCB |
| CN204616208U (en) * | 2015-06-09 | 2015-09-02 | 成都虹华环保科技股份有限公司 | A kind of full-automatic etch cleaning device |
-
2015
- 2015-06-09 CN CN201510311259.2A patent/CN104853527A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5885403A (en) * | 1996-07-10 | 1999-03-23 | Vanguard Semiconductor Corporation | System for cleaning and etching |
| CN201924078U (en) * | 2010-12-27 | 2011-08-10 | 深圳市翔宇电路有限公司 | Etching solution automatic adding device |
| CN203416507U (en) * | 2013-07-02 | 2014-01-29 | 苏州福莱盈电子有限公司 | Automatic cleaning etching apparatus of PCB |
| CN204616208U (en) * | 2015-06-09 | 2015-09-02 | 成都虹华环保科技股份有限公司 | A kind of full-automatic etch cleaning device |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150819 |