CN104851856B - 一种半导体散热器 - Google Patents
一种半导体散热器 Download PDFInfo
- Publication number
- CN104851856B CN104851856B CN201410051343.0A CN201410051343A CN104851856B CN 104851856 B CN104851856 B CN 104851856B CN 201410051343 A CN201410051343 A CN 201410051343A CN 104851856 B CN104851856 B CN 104851856B
- Authority
- CN
- China
- Prior art keywords
- heat
- insulated
- semiconductor
- radiator
- chilling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 77
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000009413 insulation Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 14
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000009423 ventilation Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000013536 elastomeric material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 241001061140 Caulophryne pelagica Species 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410051343.0A CN104851856B (zh) | 2014-02-15 | 2014-02-15 | 一种半导体散热器 |
PCT/CN2014/076369 WO2015120664A1 (zh) | 2014-02-15 | 2014-04-28 | 一种半导体散热器 |
US14/384,903 US20150357259A1 (en) | 2014-02-15 | 2014-04-28 | Semiconductor radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410051343.0A CN104851856B (zh) | 2014-02-15 | 2014-02-15 | 一种半导体散热器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104851856A CN104851856A (zh) | 2015-08-19 |
CN104851856B true CN104851856B (zh) | 2018-01-19 |
Family
ID=53799546
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410051343.0A Expired - Fee Related CN104851856B (zh) | 2014-02-15 | 2014-02-15 | 一种半导体散热器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20150357259A1 (zh) |
CN (1) | CN104851856B (zh) |
WO (1) | WO2015120664A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113531697B (zh) * | 2020-04-15 | 2022-06-28 | 武汉益永康医疗科技有限公司 | 节能空调*** |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1996631A (zh) * | 2006-12-26 | 2007-07-11 | 石桂菊 | 散热*** |
JP4432892B2 (ja) * | 2005-12-14 | 2010-03-17 | 株式会社デンソー | 半導体冷却構造 |
CN102086994A (zh) * | 2010-09-29 | 2011-06-08 | 邓树兴 | 采用半导体致冷装置的led路灯 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5838064A (en) * | 1994-04-22 | 1998-11-17 | Nec Corporation | Supporting member for cooling means and electronic package using the same |
US6885557B2 (en) * | 2003-04-24 | 2005-04-26 | Intel Corporaiton | Heatsink assembly |
US7289335B2 (en) * | 2003-07-08 | 2007-10-30 | Hewlett-Packard Development Company, L.P. | Force distributing spring element |
-
2014
- 2014-02-15 CN CN201410051343.0A patent/CN104851856B/zh not_active Expired - Fee Related
- 2014-04-28 US US14/384,903 patent/US20150357259A1/en not_active Abandoned
- 2014-04-28 WO PCT/CN2014/076369 patent/WO2015120664A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4432892B2 (ja) * | 2005-12-14 | 2010-03-17 | 株式会社デンソー | 半導体冷却構造 |
CN1996631A (zh) * | 2006-12-26 | 2007-07-11 | 石桂菊 | 散热*** |
CN102086994A (zh) * | 2010-09-29 | 2011-06-08 | 邓树兴 | 采用半导体致冷装置的led路灯 |
Also Published As
Publication number | Publication date |
---|---|
WO2015120664A1 (zh) | 2015-08-20 |
CN104851856A (zh) | 2015-08-19 |
US20150357259A1 (en) | 2015-12-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
EXSB | Decision made by sipo to initiate substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Yang Lifa Inventor before: The inventor has waived the right to be mentioned |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171214 Address after: 226600 Haian County, Nantong, Jiangsu, the Millennium Garden West villa district 21 3 Applicant after: Yang Lifa Address before: Longgang street Buji District Shenzhen city Guangdong province 518000 ban Ji Zheng Lu Hua Yu Garden 5 building 806 unit B Applicant before: Gu Jingyi |
|
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Du Lijuan Inventor after: Yang Na Inventor after: Wang Xiaohua Inventor after: Chen Shuai Inventor after: Jia Lei Inventor before: Yang Lifa |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20171226 Address after: Shangqiu City, Henan province 476000 Suiyang District Suiyang Middle Road No. 236 Applicant after: Shangqiu Institute of Technology Address before: 226600 Haian County, Nantong, Jiangsu, the Millennium Garden West villa district 21 3 Applicant before: Yang Lifa |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180119 Termination date: 20190215 |