CN104835794B - SPM and its manufacture method - Google Patents
SPM and its manufacture method Download PDFInfo
- Publication number
- CN104835794B CN104835794B CN201510129237.4A CN201510129237A CN104835794B CN 104835794 B CN104835794 B CN 104835794B CN 201510129237 A CN201510129237 A CN 201510129237A CN 104835794 B CN104835794 B CN 104835794B
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- Prior art keywords
- radiator
- spm
- wiring
- insulating barrier
- power component
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 17
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- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 4
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- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Abstract
The present invention discloses a kind of SPM and its manufacture method, the SPM includes wiring, is arranged on the power component and non-power element in the wiring precalculated position, and the papery radiator as carrier, for the one side of the radiator as front covered with insulating barrier, the wiring is arranged on the one side away from the radiator on the insulating barrier；The another side of the radiator is provided with the gauffer for radiating, the back side of the radiator is provided with cut-off portion as the back side in the position of the corresponding power component.The present invention improves the radiating effect, electrical property and heat endurance of SPM, reduces cost.
Description
Technical field
The present invention relates to SPM technical field, more particularly to a kind of specific application scenario such as convertible frequency air-conditioner,
By transmitting SPM and its manufacture method that modular form is packaged.
Background technology
SPM (IPM, Intelligent Power Module) is a kind of by power electronics and integrated circuit
The power drive class product that technology combines.SPM integrates device for power switching and high-voltage driving circuit,
And interior keep the failure detector circuits such as overvoltage, overcurrent and overheat.On the one hand SPM receives MCU control letter
Number, driving subsequent conditioning circuit work, on the other hand send the state detection signal of system back to MCU.SPM is with Qi Gaoji
The advantages such as Cheng Du, high reliability win increasing market, are particularly suitable for the frequency converter and various inversions electricity of motor
Source.
The structure of existing SPM such as Fig. 1 (A), Fig. 1 (B) and Fig. 1 (C) are shown.Fig. 1 (A) is existing intelligence
The top view of energy power model 100, Fig. 1 (B) are Fig. 1 (A) X-X ' line profiles, and Fig. 1 (C) is after Fig. 1 (A) removes resin
Schematic diagram.
As shown in Fig. 1 (A), Fig. 1 (B) and Fig. 1 (C), existing SPM 100 has following structure, and it includes：
Circuit substrate 106；Insulating barrier 107 on the surface of circuit substrate 106；The wiring 108 formed on insulating barrier 107；Cover
It is placed on the solder mask 110 of insulating barrier 107 and the ad-hoc location of wiring 108；It is fixed on by tin cream 112 on wiring 108
Power component 109 and non-power element 104；Connect the metal of non-power element 104, power component 109 and wiring 108
Line 105；The pin 101 being connected with wiring 108；At least one side of circuit substrate 106 is sealed by sealing resin 102, in order to
Sealing is improved, the entire surface of circuit substrate 106 can all be sealed.
Because SPM 100 is generally operational in hot environment, and power component 109 can be sent at work
Substantial amounts of heat, causes the junction temperature of power component 109 very high, although circuit substrate 106 has thermolysis, because insulating barrier
107 presence, cause the overall thermal resistance of SPM 100 higher.Also, due to the heat conduction of circuit substrate 106, make power
The heat transfer of element 109 is into other devices, the temperature drift that can not ignore the electrical parameter of other devices.
Therefore, existing SPM long-term work at high temperature, can seriously reduce its service life, and can shadow
The stability of performance is rung, in extreme circumstances, SPM can be caused to be lost in the course of the work because internal components overheat
Control blast, causes casualties and property loss.
The content of the invention
It is a primary object of the present invention to provide it is a kind of it is simple in construction, beneficial to radiating, the high SPM of reliability
And its manufacture method.
In order to achieve the above object, the present invention proposes a kind of SPM, including wiring, is arranged on the electricity
The power component and non-power element in road wiring precalculated position, and the papery radiator as carrier, the one of the radiator
As front covered with insulating barrier, the wiring is arranged on the one side away from the radiator on the insulating barrier in face；Institute
The another side of radiator is stated as the back side, the gauffer for radiating is provided with the position of the corresponding power component, it is described to dissipate
The back side of hot device is provided with cut-off portion.
Preferably, there is setting spacer region, the cut-off portion is set between the power component and the non-power element
The position of the spacer region is corresponded on the back side of radiator, the width in the cut-off portion is 1mm~5mm.
Preferably, the SPM also includes being used to connect the wiring, the power component and described non-
Power component is to form the metal wire of related circuit.
Preferably, the SPM also includes configuring being connected at the power model edge, with the wiring
And to the pin as input and output extended with the gauffer opposite direction.
Preferably, the SPM also includes being provided with thermosetting resin frame, the circuit along the insulating barrier edge
Wiring, the power component and non-power element, metal wire, and the coupling part of the pin and wiring is by thermoplasticity
Resin-encapsulated, the thermoplastic resin fill the thermosetting resin frame.
Preferably, the through hole for installing the SPM is provided with the thermosetting resin frame, it is described logical
The thermosetting resin frame, the insulating barrier and the papery radiator are run through in hole.
Preferably, the wiring forms one or more weld pads at an at least edge for the insulating barrier；It is described more
Edge of the individual weld pad along the insulating barrier is aligned with；The pin is fixed by the weld pad, and is connected with the wiring
Connect.
Preferably, the radiator and the gauffer are wet type carbon composite functional paper；The radiator and institute
State gauffer bonding or be made into integration；The thickness of the radiator is 1.5mm~2.5mm；The thickness of the radiator is more than institute
State the thickness of gauffer.
Preferably, the power component, the non-power element, the wiring, the circuit of metal wire composition,
With bridge heap, compressor inversion and Active PFC function, or with bridge heap, compressor inversion, Active PFC
And blower fan inversion function.
The embodiment of the present invention also proposes a kind of SPM manufacture method, comprises the following steps：
Papery radiator is formed, in the front covering insulating barrier of the radiator, wiring is formed in surface of insulating layer
And weld pad；
Surface-mounted power component, non-power element in the wiring, and in the surface-mounted of the weld pad
Ready-made pin；
Connection between the power component, non-power element and the wiring is formed by corresponding electricity by metal wire
Road；
Ready-made thermosetting resin frame and embedding thermoplastic resin are assembled on the insulating barrier；
Cut-off portion is formed at the back side of the radiator, ready-made radiating gauffer is fixed on to the back of the body of the radiator
Face corresponds to the position of the power component.
Preferably, it is described to be connected by metal wire between the power component, non-power element and the wiring
Also include before the step of forming corresponding circuit：
The radiator for being equipped with each element is placed in cleaning machine and cleaned.
Preferably, surface-mounted power component, the non-power element in wiring, and the table in the weld pad
Face also includes before assembling the step of ready-made pin：The independent pin with coating is made；Specifically include：Choose copper-based
Material, to Copper base material by way of punching press or etching, independent pin is made；Nickel dam and nickel are sequentially formed in the pin surface
Tin alloy layers, obtain the pin with coating.
Preferably, also include after described the step of independent pin with coating is made：Independent thermohardening tree is made
Fat frame；Specially：Independent thermosetting resin frame is moulded by way of transmitting mould.
Preferably, ready-made thermosetting resin frame and the embedding thermoplastic resin of being assembled on the insulating barrier
Step includes：
The through hole of the SPM for installing is formed on thermosetting resin frame；
The thermosetting resin frame with through hole is assembled on the insulating barrier；
The insulating barrier and the papery radiator are punched in the through hole of the thermosetting resin, pass through the through hole
Wear the insulating barrier and the papery radiator.
Preferably, it is described to form cut-off portion at the back side of the radiator, ready-made radiating gauffer is fixed on institute
State radiator the back side correspond to the power component position the step of after also include：
Carry out functions of modules test.
Preferably, the formation papery radiator, insulating barrier is covered in the front of the radiator, in surface of insulating layer shape
Include into the step of wiring and weld pad：
The wet type carbon composite that preliminary dimension is chosen according to the circuit layout of setting forms papery radiator；
In the front of radiator, using insulating materials and copper material, by way of hot pressing, it is formed at insulating materials described
The surface of radiator is simultaneously used as the insulating barrier, copper material is formed at the surface of the insulating barrier as copper foil layer；
The ad-hoc location of the copper foil layer is eroded, remainder forms wiring and weld pad；
It is described to form cut-off portion at the back side of the radiator, ready-made radiating gauffer is fixed on the radiator
The back side correspond to the power component position the step of include：
By cutting, tearing, the mode such as corroding, the material of the ad-hoc location at the back side of the papery radiator is removed,
Form cut-off portion；
Gauffer is formed using wet type carbon composite, the back side that the radiator is adhered to by high temperature resistant glue is corresponding
In the position of power component.
Preferably, surface-mounted power component, the non-power element in wiring, and the table in the weld pad
The step of face assembling ready-made pin, includes：
The power component, non-power element and pin are fixed by tin cream or elargol.
A kind of SPM proposed by the present invention and its manufacture method, introduced in SPM and be used as carrier
Papery radiator, and cut-off portion is set at the back side of papery radiator, the position that radiator back face corresponds to power component is set
Radiating gauffer is put, area of dissipation is significantly greatly increased, and insulating barrier can meet power component cooling requirements without using highly heat-conductive material；
And most of heat of power component is shed without being transmitted to non-power element rapidly, always works in non-power element
In low temperature environment, the temperature drift of non-power element greatly reduces, and power component group the depositing because of cut-off portion of difference in functionality
Significantly reducing hot crosstalk, though the different few conduction each other of the heating of each heating part and dissipated by the gauffer
Lose, improve the electrical property and heat endurance of SPM；The present invention is reduced using the lighter papery radiator of weight
SPM overall weight, and carrier used requires low during to processing, and positioning is easy, reduces manufacturing cost, improves
Process qualification rate；Save power component attachment to the process of Inner heat sink, reduce equipment investment expense.
Brief description of the drawings
Fig. 1 (A) is the top view of existing SPM；
Fig. 1 (B) is Fig. 1 (A) X-X ' line profiles；
Fig. 1 (C) is that Fig. 1 (A) removes the schematic diagram after resin；
Fig. 2 (A) is the rear view of SPM preferred embodiment of the present invention；
Fig. 2 (B) is the front view of SPM preferred embodiment of the present invention；
Fig. 2 (C) is the sectional view of Fig. 2 (A) or Fig. 2 (B) X-X ' lines；
Fig. 2 (D) is that SPM of the embodiment of the present invention removes the top view after sealing resin；
Fig. 3 (A) is the front view of papery radiator in the process of the embodiment of the present invention first；
Fig. 3 (B) is the sectional view of Fig. 3 (A) X-X ' lines；
Fig. 3 (C) is to form the schematic diagram of insulating barrier and copper foil layer in the front of papery radiator；
Fig. 3 (D) is the schematic diagram that wiring is formed on the copper foil layer shown in Fig. 3 (C)；
Fig. 3 (E) is the sectional view of Fig. 3 (D) X-X ' lines；
Fig. 3 (F) is the schematic diagram to form radiating gauffer；
Fig. 3 (G) is the schematic diagram for single pin；
Fig. 3 (H) is the schematic diagram with cambered single pin；
Fig. 4 (A) is the intelligent work(of assembling power component, non-power element and pin in the process of the embodiment of the present invention second
The side view of rate module；
Fig. 4 (B) is Fig. 4 (A) top view；
Fig. 5 (A) is in the process of the embodiment of the present invention the 4th, makes power component, non-power element, radiator by metal wire
The side view of connection is formed between wiring；
Fig. 5 (B) is Fig. 5 (A) top view；
Fig. 6 (A) is in the process of the embodiment of the present invention the 5th, assembles ready-made thermosetting resin frame on the insulating layer
Side view；
Fig. 6 (B) is Fig. 6 (A) top view；
Fig. 6 (C) is the side view of embedding thermoplastic resin in thermosetting resin frame in the process of the embodiment of the present invention the 5th
Figure；
Fig. 7 (A) is in the process of the embodiment of the present invention the 6th, is formed on thermosetting resin frame for installing intelligent power mould
The top view of the through hole of block；
Fig. 7 (B) is in the process of the embodiment of the present invention the 6th, cut-off portion is formed at the back side of radiator and in power component pair
Position is answered to paste the upward view of radiating gauffer；
Fig. 7 (C) is the sectional view of Fig. 7 (B) X-X ' lines；
Fig. 8 is the manufacture method flow chart of the SPM of the embodiment of the present invention.
In order that technical scheme is clearer, clear, it is described in further detail below in conjunction with accompanying drawing.
Embodiment
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
As it was previously stated, existing SPM, because radiating effect is bad, long-term work at high temperature, can seriously drop
Its low service life, and the stability of intelligent object performance can be influenceed.
The present invention is it is considered that in the specific application scenario such as convertible frequency air-conditioner, although high heat conductive insulating layer and increase radiator
Can solve the heat dissipation problem of SPM, still, be radiated from high heat conductive insulating layer, one side cost is very high, separately
One side is substantial amounts of because high heat conductive insulating layer has used to mix and causes SPM hardness very big, so as to add intelligence
The manufacture difficulty of energy power model；If increasing radiator inside SPM, power component is mounted on radiator
On, it on the one hand can increase the cost of raw material, on the other hand also increase the technology difficulty of SPM；If in intelligent work(
Rate module-external increases radiator, and radiator is mounted on the back side of SPM, due to what is coordinated with SPM
There are other heater elements on application circuit, same radiator is installed if all heater elements, radiator face can be increased
Product, so as to improve application cost, installs radiator if all heater elements, then can increase assembly difficulty respectively.Therefore select
Difficulty is generated with the application of high heat conductive insulating layer and increase radiator to SPM, is unfavorable for intelligent power
Popularization of the module in the civilian occasion such as convertible frequency air-conditioner.
Based on above-mentioned consideration, the embodiment of the present invention by introducing papery radiator, papery radiator the back side formed every
Disconnected portion simultaneously sets radiating gauffer in the position corresponding to power component, and insulating barrier, circuit cloth are formed in the front of papery radiator
The elements such as line, power component, non-power element, and processing in order is completed, because papery heatsink weight is lighter, to processing when institute
Require low with carrier, positioning is easy, so as to reduce manufacturing cost, improves process qualification rate；Save and mount power component
To the process of Inner heat sink, equipment investment expense is reduced；Further, since radiating wrinkle is set at the back side of papery radiator
Pleat, area of dissipation are significantly greatly increased, and the power component group of difference in functionality significantly reduces hot string because of the presence in cut-off portion
Disturb, though the different few conduction each other of the heating of each heating part and scattered and disappeared by the gauffer, using common exhausted
On the premise of edge layer, SPM and its heat generating components of application platform is set to obtain good radiating effect, and respectively send out
Heat interference is seldom between thermal source so that SPM stable performance, and then improve the reliability of SPM；Except this
Outside, papery radiator is also convenient for transporting.
Specifically, shown in reference picture 2 (A), Fig. 2 (B), Fig. 2 (C) and Fig. 2 (D), a kind of intelligence of proposition of the embodiment of the present invention
Can power model 10, the present embodiment with bridge heap, compressor inversion, Active PFC, blower fan inversion function intelligent work(
Illustrate, the application scenario for not needing blower fan inversion function, blower fan Converting Unit removed exemplified by rate module 10,
Other parts are identical.
The present embodiment SPM 10 includes as the papery radiator 17 of carrier, wiring 18, is arranged on institute
State the power component 19 and non-power element 14 in the precalculated position of wiring 18；Wherein：
The one side of the radiator 17 is as front, and another side is as the back side.
It is arranged on remote on the insulating barrier 21 covered with insulating barrier 21, the wiring 18 in the front of radiator 17
The one side of radiator 17.
At the back side of the radiator 17, the position of the corresponding power component 19 is provided with the gauffer for radiating
17A。
Wherein, the radiator 17 and gauffer 17A can use wet type carbon composite functional paper.
Cut-off portion 22 is provided with the back side of radiator 17, cut-off portion 22 is by the radiating material of radiator back side ad-hoc location
Material, which removes, to be formed, and can partly be removed all to remove and be exposed insulating barrier 21, the present embodiment is in order to obtain more preferable radiating
Effect, by the way of all removing.
Here, the lower section of power component 19 must have gauffer 17A, the top with the cut-off portion 22 does not have power
Element 19.
The radiator 17 can be bonded by high temperature glue with the gauffer 17A, or can also both be made into integration.
(subsequent detailed).
In addition, the SPM 10 also includes：For connecting the wiring 18, the and of the power component 19
The non-power element 14 is to form the metal wire 15 of related circuit.
Here, the power component 19, the non-power element 14, the wiring 18, the metal wire 15 form
Circuit, there is bridge heap, compressor inversion and Active PFC function, or with bridge heap, compressor inversion, power factor (PF)
Correction and blower fan inversion function, make all heating circuits of the application fields such as convertible frequency air-conditioner concentrate in together while radiate；This reality
Apply example by with bridge heap, compressor inversion, Active PFC, blower fan inversion function SPM 10 exemplified by said
It is bright, the application scenario for not needing blower fan inversion function, blower fan Converting Unit is removed, other parts are identical.
As shown in Fig. 2 (A) and Fig. 2 (B), circuit unit 1001 realizes that bridge heap function, circuit unit 1002 realize compressor
Inversion function, circuit unit 1003 realize that blower fan inversion function is realized in Active PFC, circuit unit 1004.
Here, the bridge heap, the drive part of the compressor inversion, the drive part of the Active PFC, institute
The drive part of blower fan inversion is stated between other control sections by the cut-off portion 22 to be isolated.
In addition, the SPM 10 also includes：Configuration is in the power model edge and the wiring 18
Connect and to the pin as input and output with the radiating gauffer opposite direction extension.
Here, it can be configured according to the internal circuit of SPM 10 layout and peripheral applications needs, the pin 11
In an edge of SPM 10, two edges, three edges or four edges.
In addition, the SPM 10 also includes：The thermosetting resin frame 13 on the insulating barrier is configured,.
Here, the height of thermosetting resin frame necessarily be greater than the height of the metal wire 15.
In the present embodiment, the wiring 18, the power component 19 and non-power element 14, metal wire 15, with
And the coupling part of the pin 11 and wiring 18 is encapsulated by thermoplastic seal's resin 12, thermoplastic seal's resin 12 is filled out
Fill the thermosetting resin frame 13 to seal all elements, the only part of pin 11 is exposed.
In addition, the SPM 10 also includes：For installing the through hole 16 of the SPM 10.
Here, through hole 16 runs through thermosetting resin frame 13, insulating barrier 21 and papery radiator 17.The radiating gauffer 17A
Surrounded positioned at the back side of the power component 19 by the cut-off portion 22, and on the short side side at the back side of the papery radiator 17
The distance of edge at least 2mm, it is ensured that do not formed and blocked to the through hole 16.
In addition, the wiring 18 can form one or more weld pad 18A at an at least edge for insulating barrier 21；If
For multiple weld pad 18A, then edges of the multiple weld pad 18A along the insulating barrier 21 is aligned with；The pin 11 passes through institute
State weld pad 18A to fix, and be connected with the wiring 18.
10 each inscape of SPM of the embodiment of the present invention detailed below：
Wherein, papery radiator 17 is wet type carbon composite functional paper, can be answered by powder and the Fiber Shape Carbon Material
Graphite is processed into conjunction, and tolerable more than the 350 DEG C high temperature of the wet type carbon composite can be simultaneously folded into any as needed
Shape, obtain the radiating gauffer 17A.In order to improve corrosion resistance and waterproof, surface can carry out water-proofing treatment.
The papery radiator 17 can be made into integration with the radiating gauffer 17A, can also be with the radiating gauffer 17A
It is bonded by high temperature glue.
Wherein, the two sides of papery radiator 17 is smooth, and the in irregular shape of gauffer 17A of radiating；The papery radiator
17 and radiating gauffer 17A can also be the wet type carbon composite using different-thickness, wherein, in order to increase mechanical strength,
Papery radiator 17 uses thicker wet type carbon composite, and its thickness is preferably 1.5mm~2.5mm, thin in actual design
Place's thickness may be designed as 1.5mm, and thickness can be 2.5mm at thickness, in order to reduce cost and increase gauffer 17A density, radiating
Gauffer 17A employs relatively thin wet type carbon composite, and as a kind of preferred scheme, thickness may be designed as 0.5mm.
The insulating barrier 21 can use conventional insulating materials, can add silica, silicon nitride, carborundum etc. and mix
It is miscellaneous to improve thermal conductivity, here, doping can be spherical or angular, by hot pressing mode, be pressed together on the table of papery radiator 17
Face, i.e., it is positive.
The wiring 18 is made up of metals such as copper, the ad-hoc location being formed on insulating barrier 21, according to power needs,
The thickness of wiring 18 may be designed to 0.035mm or 0.07mm etc., in general SPM 10, pay the utmost attention to set
0.07mm is counted into, 0.07mm thickness is used in the present embodiment.In addition, at the edge of the insulating barrier 21, formed with by described
The weld pad 18A that wiring 18 is formed.Here, multiple weld pads being aligned with are set near one side of the insulating barrier 21
18A, according to function needs, also multiple weld pad 18A being aligned with can be set in multiple adjacent edges of the insulating barrier 21.
The cut-off portion 22 is the 17 cavate hollow out of papery radiator, and the cut-off portion is located at each functional circuit
Heating power element group between, heat is conducted by the papery radiator 17 of high heat conduction, it is described every
The width in disconnected portion 22 is depending on the distance between described heating power element group, in general, in order to reach hot cut-off portion effect
Fruit, the width in the cut-off portion 22 are no less than 1mm, described in order to increase the mechanical strength of papery radiator 17 described in intensity
The width in cut-off portion 22 not should be greater than 5mm.In addition the cut-off portion 22 completely can remove the papery radiator 17, make institute
State insulating barrier 21 to expose, can also only remove the overwhelming majority of the papery radiator 17 and retain and combined with the insulating barrier 21
Very thin one layer, in the present embodiment, using the method removed completely.
The power component 19 and non-power element 14 are fixed on wiring 18 circuit as defined in composition.Here,
The power component 19 can use the elements such as IGBT pipes, high-voltage MOSFET pipe, high pressure FRD pipes, high-voltage diode, the work(
Rate element 19 is connected by metal wire 15 with the grade of wiring 18；The non-power element 14 using integrated circuit, transistor or
The passive element such as the active components such as diode or electric capacity or resistance, the active component installed up etc. pass through metal wire 15
It is connected with wiring 18.Here, the circuit unit 1001, the circuit unit 1002, the circuit unit 1003, institute
State circuit unit 1004 it is respective belonging to the power component 19 between, at least distance with 2mm.
The metal wire 15 can be aluminum steel, gold thread or copper cash, be made by binding between each power component 19, each non-power
Electrical connection is established between element 14, between each wiring 18；In addition, metal wire 15 can be also used for making pin 11 and electricity
Electrical connection is established between road wiring 18 or power component 19, non-power element 14.Connection for power component 19, can
Using 300 μm~400 μm of aluminum steel, the electrical connection for non-power element 14,38 μm~125 μm of aluminum steel can be used, if
In the presence of the connection across through hole 22, it is preferred to use more than 250 μm of aluminum steel.Here, the top in the cut-off portion 22 is not designed preferably
There is the binding point of the metal wire 15.
The pin 11 is fixed on the weld pad 18A at 18 1 edges of wiring, and it has is carried out with outside
Input, the effect of output.
As a kind of embodiment, it can be designed to that one side of SPM 10 sets a plurality of pin 11, pin 11
Welded with weld pad 18A by the conductive electrical binding agent such as scolding tin.Pin 11 can use the metals such as copper to be made, and copper surface passes through
Chemical plating and plating form one layer of nickeltin layer, and the thickness of alloy-layer is generally 5 μm, and coating can protect copper not to be corroded oxygen
Change, and weldability can be improved.
The thermosetting resin frame 13 moulds by transmitting mould mode to be formed, and the outward flange of thermosetting resin frame 13 is big
It is small consistent with the papery radiator 17 or more smaller than the papery radiator 17, the inward flange of thermosetting resin frame 13 with it is outer
The distance at edge is not less than 1.5mm, and at the rectangle short side of thermosetting resin frame 13, has diameter to be radiated with the papery
The consistent through hole of lead to the hole site, the diameter of device 17.
The thermoplastic resin 12 is moulded by injecting mould mode.Here, the thermoplastic resin 12 be fully located at it is described
Thermosetting resin frame 13 is interior and seals all elements on the upper surface of papery radiator 17.
The through hole 16 is radiated by the through hole of the thermosetting resin frame 13, the through hole of the insulating barrier 21, the papery
The through hole of device 17 merges composition, through the thermosetting resin frame 13, the insulating barrier 21, the papery radiator 17.
Compared with prior art, the SPM 10 of the embodiment of the present invention has the advantages that：
1st, because the back side of SPM 10 of the present invention has radiating gauffer 17A, area of dissipation is significantly greatly increased, and insulate
Layer 21 can meet the cooling requirements of power component 19 without using highly heat-conductive material.
2nd, SPM 10 is provided with bridge heap, compressor inversion function, or with bridge heap, compressor inversion, wind
Machine inversion function, all heating circuits of the application fields such as convertible frequency air-conditioner are made to concentrate in together while radiate.
3rd, radiating gauffer 17A be located at the lower section of power component 19, make heater element most of heat shed rapidly without
Non-power element 14 is transmitted to, non-power element 14 is always worked in low temperature environment, the temperature drift of non-power element 14 is very big
Reduce, improve the electrical property and heat endurance of SPM 10.
4th, Qiao Dui, the drive part of compressor inversion, the drive part of Active PFC, the drive part of blower fan inversion
Isolated between other control sections (including non-power element 14 etc.) by cut-off portion 22, not only make the heat interference of each heating part very
Low, most heats are scattered and disappeared by gauffer 17A, and the temperature of control section is maintained at a low state, are avoided
Because the hydraulic performance decline of SPM 10 caused by the temperature drift of control section.
5th, radiator structure is paper material, in light weight so that the overall weight of SPM 10 reduces, and is easy to long-distance fortune
Defeated and worker assembling；Because SPM 10 of the present invention possesses radiator 17 in itself, therefore need not in application process, outside
Radiator 17 is connect again, and difficulty and application cost are applied in reduction, improve assembling quality.
From the foregoing, the SPM 10 of the present invention is reducing cost simultaneously, reliability and performance are improved, and
And may be designed to define with the existing function of SPM 10 and pin 11 compatible, it is easy to the popularization of SPM 10 should
With.
In addition, one embodiment of the invention also proposes a kind of manufacture method of SPM 10, including：
Step S1, papery radiator 17 is formed, insulating barrier 21 is covered in the front of the radiator 17, in the table of insulating barrier 21
Face forms wiring 18 and weld pad 18A.
Specifically, the wet type carbon composite for preliminary dimension being chosen according to the circuit layout of setting forms papery radiator
17。
In the front of radiator 17, using insulating materials and copper material, by way of hot pressing, insulating materials is set to be formed at institute
State the surface of radiator 17 and be used as the insulating barrier 21, copper material is formed at the surface of the insulating barrier 21 as copper foil layer.
Afterwards, the ad-hoc location of copper foil layer is eroded, remainder forms wiring 18 and weld pad 18A.
Step S2, surface-mounted power component 19, non-power element 14 in the wiring 18, and in the weldering
Pad 18A surface-mounted ready-made pin 11.
Step S3, by metal wire 15 by between the power component 19, non-power element 14 and the wiring 18
Connection forms corresponding circuit.
Step S4, ready-made thermosetting resin frame 13 and embedding thermoplastic seal's resin are assembled on insulating barrier 21
12。
Step S5, cut-off portion 22 is formed at the back side of radiator 17, ready-made radiating gauffer 17A is fixed on scattered
The back side of hot device 17 corresponds to the position of the power component 19.
Specifically, by cutting, tearing, the mode such as corroding, by the ad-hoc location at the back side of the papery radiator 17
Material removes, and forms cut-off portion.
Gauffer 17A is formed using wet type carbon composite, the back of the body of the radiator 17 is adhered to by high temperature resistant glue
Face.
Further, can also include before step S3：
Step S6, the radiator 17 for being equipped with each element is placed in cleaning machine and cleaned.
Further, can also include before step S2：The independent pin 11 with coating is made.
Specifically, first, Copper base material is chosen, to Copper base material by way of punching press or etching, single pin 11 is made.
Then, nickel dam and nickeltin layer are sequentially formed on the surface of pin 11, obtains the pin 11 with coating.
Further, also include after above-mentioned steps S5：Carry out functions of modules test.
The manufacturing process of the present embodiment SPM 10 is described in detail referring to the drawings.
As a kind of preferred embodiment, the manufacture method of SPM 10 of the present invention can include：Papery is formed to dissipate
The process of hot device 17 and radiating gauffer 17A, presses and wiring 18, weld pad 18A process is formed on insulating barrier 21；In circuit cloth
The process that power component 19, non-power element 14 and pin 11 are configured on line 18；The process of cleaning；Institute is connected with metal wire 15
The process for stating non-power element 14, power component 19 and the wiring 16；In the surface configuration thermohardening of papery radiator 17
The process of resin frame 13；The process for being sealed above-mentioned key element using the injection mould molding mode of thermoplastic resin 12；Radiated in papery
The back side of device 17 forms cut-off portion 22 and the process for configuring radiating gauffer 17A；The process for carrying out functional test.Specific process chart is as schemed
Shown in 8.
The details of each operation described below.
First process：Reference picture 3 (A), Fig. 3 (B), Fig. 3 (C), Fig. 3 (D), Fig. 3 (E), Fig. 3 (F), Fig. 3 (G) and Fig. 3
(H)。
Fig. 3 (A) is the front view of papery radiator in the process of the embodiment of the present invention first；
Fig. 3 (B) is the sectional view of Fig. 3 (A) X-X ' lines；
Fig. 3 (C) is to form the schematic diagram of insulating barrier and copper foil layer in the front of papery radiator；
Fig. 3 (D) is the schematic diagram that wiring is formed on the copper foil layer shown in Fig. 3 (C)；
Fig. 3 (E) is the sectional view of Fig. 3 (D) X-X ' lines；
Fig. 3 (F) is the schematic diagram to form radiating gauffer；
Fig. 3 (G) is the schematic diagram for single pin；
Fig. 3 (H) is with cambered single pin schematic diagram.
First process of the embodiment of the present invention is to form sizeable wet type carbon composite to form papery radiator
17 and radiating gauffer 17A process, the process that the independent pin 11 with coating is made.
First, reference picture 3 (A) and prolong Fig. 3 (A) X-X ' lines sectional view 3 (B), circuit layout design as needed
Sizeable papery radiator 17, in general SPM, one piece of size can choose 64mm × 30mm, thickness
For 1.5mm, the corrosion protection such as coating marine glue, water-proofing treatment are carried out to two sides.
With reference to figure 3 (C), using insulating materials and copper material with angular or spherical doping, by way of hot pressing simultaneously,
Insulating materials is formed at the surface of the papery radiator 17 and be formed at the insulating barrier as the insulating barrier 21, copper material
21 surfaces are as copper foil layer 18B.Here, in order to improve voltage endurance, the thickness of the insulating barrier 21 can be designed as 110 μm,
In order to improve heat dissipation characteristics, the thickness of the insulating barrier 21 can be designed as 70 μm.Here, in order to improve through-current capability, it is described
Copper foil layer 18B thickness can be designed to 0.07mm, and in order to reduce cost, the thickness of the copper foil layer 18B can be designed to
0.035mm or 0.0175mm.
With reference to figure 3 (D) and the sectional view 3 (E) for the X-X ' lines for prolonging Fig. 3 (D), copper foil layer 18B ad-hoc location is eroded,
Remainder is wiring 18 and weld pad 18A.
With reference to figure 3 (F), irregular shape is formed using the wet type carbon composite that thickness is 0.5mm, is dissipated as described
Hot gauffer 17A.The corrosion protection such as coating marine glue, water-proofing treatment are carried out to two sides.
Each pin 11 is to use Copper base material, by way of punching press or etching, is made as shown in Fig. 3 (G), individually
Pin units be that length C is 25mm, width K is 1.5mm, and thickness H is 1mm strip；In the present embodiment, for ease of
Assembling, 90 ° of radian is also suppressed in pin units wherein one end, as shown in Fig. 3 (H)；
Then nickel dam is formed by the method for chemical plating, specifically included：
By nickel salt and sodium hypophosphite mixed solution, and appropriate complexing agent is with the addition of, forming given shape
Copper material surface forms nickel dam, and metallic nickel has very strong passivation ability, can be quickly generated one layer of very thin passivating film, can resist big
Gas, alkali and some sour corrosion.Nickel plating crystallization is superfine small, and nickel layer thickness is generally 0.1 μm.
Then by hydrosulphate technique, at room temperature by the copper material for having formed shape and nickel dam be immersed in positive tin from
It is powered in the plating solution of son, forms nickeltin layer on nickel dam surface, alloy-layer general control is at 5 μm, the formation of alloy-layer
Greatly improve the protectiveness and solderability of pin.
Second process：Reference picture 4 (A) and Fig. 4 (B).
Fig. 4 (A) is the intelligent work(of assembling power component, non-power element and pin in the process of the embodiment of the present invention second
The side view of rate module, Fig. 4 (B) are Fig. 4 (A) top views.
Second process of the embodiment of the present invention is in the surface-mounted power component 19 of the wiring 18, non-power element
14 and the process in the surface-mounted pins 11 of the weld pad 18A.
First, by stencil printer, using steel mesh, to the specific of the wiring 18 on the insulating barrier 21
Position and the weld pad 18A carry out tin cream application；Here, climbing tin height to improve, the steel mesh of 0.15mm thickness can be used, be
The risk that power device 19 and non-power element 14 shift is reduced, the steel mesh of 0.12mm thickness can be used.In the present embodiment, make
The height of power component 19 is 0.07mm, for lighter component, so steel mesh thickness can select 0.12mm thickness
Steel mesh, other suitable dimensions can also be used in other embodiments, be not limited thereto.
Then, with reference to side view Fig. 4 (A) and top view Fig. 4 (B), the papery radiator 17 is placed on carrier 20,
Carry out the installation of the power component 19, non-power element 14 and pin 11, the power component 19 and the non-power element
14 can be directly placed at the ad-hoc location of the wiring 18, and then one end will be placed on the pad 18A pin 11, separately
One end needs the fixing device 20A on the carrier 20 to be fixed, and the carrier 20 and the fixing device 20A pass through synthesis
The materials such as stone are made.Here, the carrier 20 needs to carry out bottom hollow processing, expose the radiating gauffer 17A, the paper
The dorsal edge of the matter radiator 17 at least 1mm position not by the radiating gauffer 17A coverings has contacted branch with the carrier 20
Support acts on.
Then, the papery radiator 17 being put on the carrier 20 passes through Reflow Soldering, tin cream solidification, the power member
Part 19, non-power element 14 and the pin 11 are fixed.
In said process, as a kind of preferred embodiment, the tin cream that solution temperature is 280 DEG C can be selected.
It should be noted that in other embodiments, it is also an option that elargol or silver paste replace above-mentioned tin cream.
3rd process：
3rd process of the embodiment of the present invention is the process for cleaning papery radiator 17.
The papery radiator 17 is put into cleaning machine first and cleaned, rosin remained during by Reflow Soldering etc. helps weldering
The foreign matters such as the aluminum steel remained when agent and punching press are cleaned, close in the arrangement of the wiring 18 according to the non-power element 14
Degree, the form that cleaning can be combined by spray or ultrasound or both are carried out.
During cleaning, the pin 11 is clamped by mechanical arm, the papery radiator 17 is placed in rinse bath, and to be noted
Meaning not allow mechanical arm to touch the papery radiator 17, because the papery radiator 17 enbrittles and easy deformation, such as
Fruit mechanical arm clamps the papery radiator 17, in vibrations caused by cleaning, easily causes the papery radiator 17 and occurs
Burst apart.
4th process：Reference picture 5 (A) and Fig. 5 (B), Fig. 5 (A) are in the process of the embodiment of the present invention the 5th, pass through metal wire
Make the side view that connection is formed between power component, non-power element, radiator and wiring, Fig. 5 (B) is Fig. 5 (A) vertical view
Figure.
4th process of the embodiment of the present invention is by metal wire (being referred to as binding line), makes the power component
19th, the process that connection is formed between non-power element 14, radiator 17 and the wiring 18.
According to through-current capability needs, the aluminum steel of appropriate diameter is selected as metal wire, it is integrated for being controlled for signal
Circuit, it is also contemplated that be used as metal wire using gold thread.In the present embodiment, aluminum steel is all selected, in general, to the power
The bonding of element 19 uses 350 μm~400 μm of aluminum steel, and 38 μm~200 μm are used to the bonding of the non-power element 14
Aluminum steel, 350 μm~400 μm of aluminum steel is used to the bonding of the radiator 17.
Product after the completion of this process is referred to side view Fig. 5 (A) and top view Fig. 5 (B).
Wherein make to connect between power component 19, non-power element 14, radiator 17 and wiring 18 by metal wire,
Form corresponding circuit.
As shown in Fig. 5 (B), the circuit unit 1001 realizes that the bridge heap function, the circuit unit 1002 realize institute
State compressor inversion function, the circuit unit 1003 realizes the Active PFC function, the circuit unit 1004 is real
The existing blower fan inversion function.
5th process：Reference picture 6 (A), Fig. 6 (B) and Fig. 6 (C).
Fig. 6 (A) is the side for assembling ready-made thermosetting resin frame in the process of the embodiment of the present invention the 5th on insulating barrier
View, Fig. 6 (B) are Fig. 6 (A) top views, and Fig. 6 (C) is in the process of the embodiment of the present invention the 5th, is filled in thermosetting resin frame
Seal the side view of thermoplastic resin.
5th process of the embodiment of the present invention is that thermosetting resin frame 13 and embedding thermoplastic are assembled on the insulating barrier 21
The process of property resin 12.
First, band on rectangle short side is attached on the insulating barrier 21 by the non-conductive thermosetting glue of the red glue etc. that insulate
There is the thermosetting resin frame 13 of through hole, and the papery for attaching the thermosetting resin frame 13 is dissipated in oxygen-free environment
Hot device 17 is toasted, and baking time is no less than 2 hours, 175 DEG C of baking temperature and selection, makes the thermosetting resin frame 13
It is fixed on the insulating barrier 21, referring to side view Fig. 6 (A) and top view Fig. 6 (B).Here, the thermosetting resin frame 13
Height necessarily be greater than the height of the metal wire 15.
Then, thermoplastic resin 12 is injected into the thermosetting resin frame 13, until the quilt of thermohardening numerical frame 13
Fill up.The implantation temperature of the thermoplastic resin 12 is 150 DEG C, and after cooling, the thermoplastic resin 12 radiates the papery
All elements sealing on device 17, the only described part of pin 11 is exposed.
6th process：Reference picture 7 (A), Fig. 7 (B) and Fig. 7 (C).
Fig. 7 (A) is in the process of the embodiment of the present invention the 6th, is formed on thermosetting resin frame for installing intelligent power mould
The top view of the through hole of block, Fig. 7 (B) be in the process of the embodiment of the present invention the 6th formed at the back side of radiator cut-off portion and
Power component correspondence position pastes the upward view of radiating gauffer, and Fig. 7 (C) is the sectional view of Fig. 7 (B) X-X ' lines.
6th process of the embodiment of the present invention is to form through hole 16, cut-off portion 22, and fixed radiating gauffer 17A work
Sequence.SPM is completed through thus process as product.
With reference to figure 7 (A), by modes such as card punch, in the through hole of the thermosetting resin 13 by the insulating barrier 21
Punched with the papery radiator 17, form through hole 16.The through hole 16 is used for the assembling of the SPM 10.
With reference to figure 7 (B), by cutting, tearing, mode, the ad-hoc location at the back side of papery radiator 17 such as corroding
Handled, be removed the papery heat sink material of ad-hoc location, form the cut-off portion 22, the both sides of cut-off portion 22 are
The heating power element group of difference in functionality circuit.Papery heat sink material can be removed partly, can also all be removed described in exposing
Effect preferably is thermally isolated in order to obtain in insulating barrier 21, the present embodiment, complete using papery heat sink material using whole removing methods
During the mode that portion removes in the cut-off portion 22, it is careful not to form scuffing on the insulating barrier 21.
With reference to figure 7 (C), using high temperature resistant glue of the tolerable temperature more than 150 DEG C, by the radiating gauffer 17A adhesions
At the back side of the papery radiator 17, here, the radiating gauffer 17A be located at the back side of the power component 19 by it is described every
Disconnected portion 22 surrounds, and the distance at least 2mm of the short side edge at the back side of the papery radiator 17, it is ensured that not to the through hole
16 formation are blocked.
Then SPM 10 is put into test equipment, carries out conventional electric parameters testing, generally comprise insulation
The test events such as pressure-resistant, quiescent dissipation, delay time, test passes person are finished product.
Using above-mentioned operation, that is, complete the SPM 10 shown in Fig. 2 (A), Fig. 2 (B), Fig. 2 (C) and Fig. 2 (D).
A kind of SPM proposed by the present invention and its manufacture method, introduced in SPM and be used as carrier
Papery radiator, and cut-off portion is set at the back side of papery radiator, the position that radiator back face corresponds to power component is set
Radiating gauffer is put, area of dissipation is significantly greatly increased, and insulating barrier can meet power component cooling requirements without using highly heat-conductive material；
And most of heat of power component is shed without being transmitted to non-power element rapidly, always works in non-power element
In low temperature environment, the temperature drift of non-power element greatly reduces, and power component group the depositing because of cut-off portion of difference in functionality
Greatly reducing hot crosstalk, though the different few conduction each other of the heating of each heating part and pass through the gauffer
Scatter and disappear, improve the electrical property and heat endurance of SPM；The present invention using the lighter papery radiator of weight, pair plus
Carrier used in man-hour requires low, and positioning is easy, reduces manufacturing cost, improves process qualification rate；Save and paste power component
The process of Inner heat sink is attached to, reduces equipment investment expense.
The preferred embodiments of the present invention are above are only, are not intended to limit the scope of the invention, it is every to utilize this hair
Equivalent structure or the flow conversion that bright specification and accompanying drawing content are made, or directly or indirectly it is used in other related technology necks
Domain, it is included within the scope of the present invention.
Claims (17)
1. a kind of SPM, including wiring, it is arranged on the power component in the wiring precalculated position and non-
Power component, it is characterised in that also include papery radiator as carrier, the one side of the radiator as it is positive covered with
Insulating barrier, the wiring are arranged on the one side away from the radiator on the insulating barrier；The another side of the radiator
As the back side, the position of the corresponding power component is provided with the gauffer for radiating, the papery radiator and the wrinkle
Pleat, which is integrated, to be made, and the back side of the radiator is provided with cut-off portion；
There is setting spacer region, the cut-off portion is arranged on the back side of radiator between the power component and non-power element
The position of the corresponding spacer region.
2. SPM according to claim 1, it is characterised in that the width in the cut-off portion is 1mm~5mm.
3. SPM according to claim 1 or 2, it is characterised in that also include being used to connect the circuit cloth
Line, the power component and the non-power element are to form the metal wire of related circuit.
4. SPM according to claim 3, it is characterised in that also include configuration on the power model side
Edge, connected with the wiring and extend the pin as input and output to the direction opposite with the gauffer.
5. SPM according to claim 4, it is characterised in that be provided with thermohardening tree along the insulating barrier edge
Fat frame, the wiring, the power component and non-power element, metal wire, and the company of the pin and wiring
Socket part point is encapsulated by thermoplastic resin, and the thermoplastic resin fills the thermosetting resin frame.
6. SPM according to claim 5, it is characterised in that be provided with and be used on the thermosetting resin frame
The through hole of the SPM is installed, the through hole runs through the thermosetting resin frame, the insulating barrier and the papery
Radiator.
7. SPM according to claim 5, it is characterised in that the wiring in the insulating barrier extremely
A few edge forms one or more weld pads；Edge of the multiple weld pad along the insulating barrier is aligned with；The pin leads to
Cross the weld pad to fix, and be connected with the wiring.
8. SPM according to claim 1, it is characterised in that the radiator and the gauffer are wet type
Carbon composite functional paper；The radiator is Nian Jie with the gauffer or is made into integration；The thickness of the radiator is
1.5mm~2.5mm, the thickness of the radiator are more than the thickness of the gauffer.
9. SPM according to claim 3, it is characterised in that the power component, the non-power element,
The circuit of the wiring, metal wire composition, has bridge heap, compressor inversion and Active PFC function, or
Person has bridge heap, compressor inversion, Active PFC and blower fan inversion function.
10. a kind of SPM manufacture method, it is characterised in that comprise the following steps：
Form papery radiator and the position of power component is corresponded in papery radiator back face and form gauffer for radiating, its
Middle papery radiator is made into integration with gauffer, and in the front covering insulating barrier of the radiator, circuit is formed in surface of insulating layer
Wiring and weld pad；
Surface-mounted power component, non-power element in the wiring, and in the surface-mounted advance of the weld pad
Manufactured pin；
Connection between the power component, non-power element and the wiring is formed by corresponding circuit by metal wire；
Ready-made thermosetting resin frame and embedding thermoplastic resin are assembled on the insulating barrier；
The cut-off for corresponding to setting interval zone position between power component and non-power element is formed at the back side of the radiator
Portion.
11. SPM manufacture method according to claim 10, it is characterised in that it is described by metal wire by institute
Also include before stating the step of connection forms corresponding circuit between power component, non-power element and the wiring：
The radiator for being equipped with each element is placed in cleaning machine and cleaned.
12. SPM manufacture method according to claim 10, it is characterised in that the table in wiring
Face assembling power component, non-power element, and before the step of surface-mounted ready-made pin of the weld pad also
Including：
The independent pin with coating is made；Specifically include：
Copper base material is chosen, to Copper base material by way of punching press or etching, independent pin is made；
Nickel dam and nickeltin layer are sequentially formed in the pin surface, obtains the pin with coating.
13. SPM manufacture method according to claim 12, it is characterised in that described that independent band plating is made
Also include after the step of pin of layer：
Independent thermosetting resin frame is made；
Specially：Independent thermosetting resin frame is moulded by way of transmitting mould.
14. SPM manufacture method according to claim 13, it is characterised in that described on the insulating barrier
The step of assembling ready-made thermosetting resin frame and embedding thermoplastic resin includes：
The through hole of the SPM for installing is formed on thermosetting resin frame；
By thermosetting resin frame assembling on the insulating barrier；
The insulating barrier and the papery radiator are punched in the through hole of the thermosetting resin, the through hole is run through institute
State insulating barrier and the papery radiator.
15. SPM manufacture method according to claim 14, it is characterised in that described in the radiator
The back side forms cut-off portion, and the back side that ready-made radiating gauffer is fixed on the radiator is corresponded into the power component
Also include after the step of position：
Carry out functions of modules test.
16. the SPM manufacture method according to any one of claim 10-15, it is characterised in that the shape
Into papery radiator, in the front covering insulating barrier of the radiator, the step of wiring and weld pad is formed in surface of insulating layer
Suddenly include：
The wet type carbon composite that preliminary dimension is chosen according to the circuit layout of setting forms papery radiator；
In the front of radiator, using insulating materials and copper material, by way of hot pressing, insulating materials is set to be formed at the radiating
The surface of device is simultaneously used as the insulating barrier, copper material is formed at the surface of the insulating barrier as copper foil layer；
The ad-hoc location of the copper foil layer is eroded, remainder forms wiring and weld pad；
It is described to form cut-off portion at the back side of the radiator, ready-made radiating gauffer is fixed on to the back of the body of the radiator
Face correspond to the power component position the step of include：
By cutting, tearing, forms of corrosion, the material of the ad-hoc location at the back side of the papery radiator is removed, formed every
Disconnected portion；
Gauffer is formed using wet type carbon composite, the back side that the radiator is adhered to by high temperature resistant glue corresponds to work(
The position of rate element.
17. SPM manufacture method according to claim 16, it is characterised in that the table in wiring
Face assembling power component, non-power element, and include in the step of surface-mounted ready-made pin of the weld pad：
The power component, non-power element and pin are fixed by tin cream or elargol.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510129237.4A CN104835794B (en) | 2015-03-23 | 2015-03-23 | SPM and its manufacture method |
| US15/559,834 US10615155B2 (en) | 2015-03-23 | 2016-03-23 | Intelligent power module and manufacturing method thereof |
| PCT/CN2016/077143 WO2016150391A1 (en) | 2015-03-23 | 2016-03-23 | Smart power module and manufacturing method therefor |
| JP2018500841A JP6500162B2 (en) | 2015-03-23 | 2016-03-23 | Intelligent power module and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510129237.4A CN104835794B (en) | 2015-03-23 | 2015-03-23 | SPM and its manufacture method |
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| CN104835794B true CN104835794B (en) | 2018-02-02 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6500162B2 (en) * | 2015-03-23 | 2019-04-10 | 広東美的制冷設備有限公司Ｇｄ Ｍｉｄｅａ Ａｉｒ−Ｃｏｎｄｉｔｉｏｎｉｎｇ Ｅｑｕｉｐｍｅｎｔ Ｃｏ．，Ｌｔｄ． | Intelligent power module and manufacturing method thereof |
| CN109194243A (en) * | 2018-10-31 | 2019-01-11 | 广东美的制冷设备有限公司 | Electric appliance and intelligent power module |
| CN109510561A (en) * | 2018-12-29 | 2019-03-22 | 广东美的制冷设备有限公司 | Highly integrated power module and air conditioner |
| CN109510562A (en) * | 2019-01-02 | 2019-03-22 | 广东美的暖通设备有限公司 | Power module, air conditioner |
| CN110289230B (en) * | 2019-06-17 | 2021-05-28 | 广东美的制冷设备有限公司 | Manufacturing tool and method of intelligent power module |
| CN113035605B (en) * | 2021-02-26 | 2024-04-16 | 联合汽车电子有限公司 | Fixing structure of switching device and mounting method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102484103A (en) * | 2009-08-31 | 2012-05-30 | 阿波制纸株式会社 | Paper sheet radiator |
| CN102687270A (en) * | 2010-01-15 | 2012-09-19 | 三菱电机株式会社 | Power semiconductor module |
| CN104112719A (en) * | 2013-08-22 | 2014-10-22 | 广东美的制冷设备有限公司 | Hybrid integrated circuit module and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002099878A1 (en) * | 2001-05-30 | 2002-12-12 | International Rectifier Corporation | Power semiconductor module |
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2015
- 2015-03-23 CN CN201510129237.4A patent/CN104835794B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102484103A (en) * | 2009-08-31 | 2012-05-30 | 阿波制纸株式会社 | Paper sheet radiator |
| CN102687270A (en) * | 2010-01-15 | 2012-09-19 | 三菱电机株式会社 | Power semiconductor module |
| CN104112719A (en) * | 2013-08-22 | 2014-10-22 | 广东美的制冷设备有限公司 | Hybrid integrated circuit module and manufacturing method thereof |
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