CN104827594A - Wire cutting machine capable of pouring bonding agent - Google Patents
Wire cutting machine capable of pouring bonding agent Download PDFInfo
- Publication number
- CN104827594A CN104827594A CN201510216202.4A CN201510216202A CN104827594A CN 104827594 A CN104827594 A CN 104827594A CN 201510216202 A CN201510216202 A CN 201510216202A CN 104827594 A CN104827594 A CN 104827594A
- Authority
- CN
- China
- Prior art keywords
- frame
- cutting machine
- wire cutting
- adhesive
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to equipment in the technical field of machining and production of crystal grains, in particular to a wire cutting machine capable of pouring a bonding agent. The wire cutting machine comprises a wire cutting machine body, wherein the wire cutting machine body is provided with a frame; a high-frequency power supply is arranged on the frame; cutting wires are vertically arranged on the frame in the vertical direction; an adhesive groove is further formed in the frame; an adhesive groove opening passing through a conduit is formed below the adhesive groove; the adhesive groove opening is positioned in the back part of the cutting wires; a hot air blowing device is further arranged on the frame; the hot air blowing device is opposite to the cutting wires in the transverse direction; the back part of the cutting wires is consistent with the advancing direction of the cutting wires; a rotary frame is further arranged on the frame; the rotary frame can rotate by 90 degrees in the horizontal direction; the conduit is arranged on the rotary frame. The wire cutting machine has the advantages of capability of casting the bonding agent, further guarantee of the product quality and convenience in use.
Description
Technical field
The present invention relates to the equipment of crystal grain processing technical field, particularly relate to wire cutting machine.
Background technology
Wire cutting machine is mainly made up of high frequency electric source, can complete the cutting to material.
Cooling component crystal grain used has cut by crystal bar cutting on line machine, the crystallite dimension of finished product is less, when being processed into crystal grain with crystal bar, a position of crystal bar is fixed, need through three batching cuttings, i.e. the first longitudinally cutting, second longitudinally cutting, transverse cuts, first longitudinal cutting and second longitudinally cutting is that vertical, after the cutting of this two batching cutting is stitched in " ten " or " well " shape, crystal bar is cut into flake, strip, granular shape by this three batching cutting respectively, and cutting into granular is exactly finished product crystal grain.
Prior art, raw material cutting seam in the process of cutting is not filling adhesive, like this in cutting because flake, strip-shaped product are thiner, just there will be deviation, impact is cut and the quality of product further.And the wire cutting machine of prior art does not have the device of cast adhesive, it in use can not pour into a mould adhesive, has and uses product quality that is inconvenient, cutting to be difficult to the shortcoming ensured.
Summary of the invention
Object of the present invention is exactly for above-mentioned shortcoming, provides a kind of and can pour into a mould adhesive, product quality is guaranteed further, wire cutting machine easy to use---the wire cutting machine of pourable adhesive.
Technical scheme of the present invention is achieved in that the wire cutting machine of pourable adhesive, comprise wire cutting machine body, wire cutting machine body has frame, frame is provided with high frequency electric source, cutting wire above-below direction is vertically set in frame, it is characterized in that: described frame is also provided with an adhesive glassine tank, have the adhesive glassine tank opening through conduit below adhesive glassine tank, adhesive glassine tank opening is after cutting wire above position.
Say to also have blowing hot-air device further in frame, facing to line of cut on described blowing hot-air device lateral, and consistent with the direction that line of cut advances after line of cut.
Say that described frame also has a swivel mount further, swivel mount can horizontal direction 90 ° rotation, and described conduit is arranged on swivel mount.
Say further, described blowing hot-air device is arranged on swivel mount.
The invention has the beneficial effects as follows:
1, such wire cutting machine has can pour into a mould adhesive, product quality ensures further, advantage easy to use;
2, in frame, blowing hot-air device is also had, facing to line of cut on described blowing hot-air device lateral, and consistent with the direction that line of cut advances after line of cut, also have and dry adhesive in time, use advantage more easily;
3, described frame also has a swivel mount, swivel mount can horizontal direction 90 ° rotation, described conduit is arranged on swivel mount, described blowing hot-air device is arranged on swivel mount, also having can half-twist, to the cutting seam of the first longitudinal longitudinal cutting of cutting and second pour into a mould in time adhesive, bonding, dry the advantage using more convenient, quality more can ensure.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is the schematic diagram that crystal bar cuts seam after three cuttings.
Wherein: 1, frame 2, cutting wire 3, adhesive glassine tank 4, conduit 5, blowing hot-air device 6, swivel mount 7, crystal bar.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in Figure 1, the wire cutting machine of pourable adhesive, comprise wire cutting machine body, wire cutting machine body has frame 1, frame is provided with high frequency electric source, cutting wire 2 above-below direction is vertically set in frame, it is characterized in that: described frame is also provided with an adhesive glassine tank 3, the glue channel opening through conduit 4 is had below adhesive glassine tank, adhesive glassine tank opening is after cutting wire above position, adhesive can be poured into a mould in cutting seam in time after dicing like this, thiner working position is made to become as a whole, strengthen its ability to bear, reduce in further cutting and swing, be conducive to improving the quality of products, there is advantage of the present invention, described glue channel opening after cutting wire above position, after to arrange be cast referring to carry out adhesive after cutting at position, refer to that viscose glue can flow down along cutting seam automatically above, fill cutting and stitch, at this moment can adopt natural air drying adhesive, become again as a whole after making cutting, 7 in figure represents crystal bar.
In order to help to understand, Fig. 2 gives the schematic diagram that crystal bar cuts seam after three cuttings, wherein, 11 is cutting seams that the first batching is cut, 22 is cutting seams that the second batching is cut, 33 is cutting seams that the 3rd batching is cut, and the present invention can carry out filling adhesive after the first batching cutting seam or the cutting of the second batching stitch.
The adhesive used can be common, conventional adhesive, such as glue etc.
After completing three batchings cuttings, become crystal grain, this has bonding between crystal grain, and can use hot-water soak, adhesive unclamps, and can take out crystal grain, elutriation etc., process further.
Say to also have blowing hot-air device 5 further in frame, facing to line of cut on described blowing hot-air device lateral, and consistent with the direction that line of cut advances after line of cut, can dry adhesive in time like this.
Say that described frame also has a swivel mount 6 further, swivel mount can horizontal direction 90 ° rotation, and described conduit is arranged on swivel mount.Such adhesive not only can be poured into a mould the cutting seam of the first batching cutting, can also pour into a mould the second batching cutting seam.
Say further, described blowing hot-air device is arranged on swivel mount.Such adhesive not only can be dried the adhesive of the cutting seam of the first batching cutting, can also dry, use more convenient to the adhesive of the second batching cutting seam.
The foregoing is only specific embodiments of the invention, but architectural feature of the present invention is not limited to this, any those skilled in the art is in the field of the invention, and the change done or modification are all encompassed in the scope of the claims of the present invention.
Claims (4)
1. the wire cutting machine of pourable adhesive, comprise wire cutting machine body, wire cutting machine body has frame, frame is provided with high frequency electric source, cutting wire above-below direction is vertically set in frame, it is characterized in that: described frame is also provided with an adhesive glassine tank, have the adhesive glassine tank opening through conduit below adhesive glassine tank, adhesive glassine tank opening is after cutting wire above position.
2. wire cutting machine according to claim 1, is characterized in that: in frame, also have blowing hot-air device, facing to line of cut on described blowing hot-air device lateral, and consistent with the direction that line of cut advances after line of cut.
3. wire cutting machine according to claim 1 and 2, is characterized in that: described frame also has a swivel mount, and swivel mount can horizontal direction 90 ° rotation, and described conduit is arranged on swivel mount.
4. wire cutting machine according to claim 2, is characterized in that: described blowing hot-air device is arranged on swivel mount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510216202.4A CN104827594A (en) | 2015-06-11 | 2015-06-11 | Wire cutting machine capable of pouring bonding agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510216202.4A CN104827594A (en) | 2015-06-11 | 2015-06-11 | Wire cutting machine capable of pouring bonding agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104827594A true CN104827594A (en) | 2015-08-12 |
Family
ID=53805962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510216202.4A Pending CN104827594A (en) | 2015-06-11 | 2015-06-11 | Wire cutting machine capable of pouring bonding agent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104827594A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107813508A (en) * | 2017-11-29 | 2018-03-20 | 烟台海威斯特膜科技有限公司 | A kind of static casting device and its application method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4177789A (en) * | 1977-08-03 | 1979-12-11 | Giuseppe Marocco | Method for the production of slabs of marble or similar stony material |
| US4513544A (en) * | 1982-04-30 | 1985-04-30 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Method of sawing crystalline rods, and multiple-blade internal-hole saw for carrying out the method |
| JPH10296719A (en) * | 1997-04-25 | 1998-11-10 | Mitsubishi Materials Shilicon Corp | Wire saw and ingot cutting method |
| US20010023973A1 (en) * | 1996-11-12 | 2001-09-27 | Salman Akram | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| JP2003019711A (en) * | 2001-07-09 | 2003-01-21 | Furukawa Co Ltd | Method for producing ceramic substrate |
| CN104668782A (en) * | 2013-12-02 | 2015-06-03 | 光环科技股份有限公司 | Laser cutting method for semiconductor wafer |
| CN204701012U (en) * | 2015-06-11 | 2015-10-14 | 河南鸿昌电子有限公司 | The wire cutting machine of pourable adhesive |
-
2015
- 2015-06-11 CN CN201510216202.4A patent/CN104827594A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4177789A (en) * | 1977-08-03 | 1979-12-11 | Giuseppe Marocco | Method for the production of slabs of marble or similar stony material |
| US4513544A (en) * | 1982-04-30 | 1985-04-30 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Method of sawing crystalline rods, and multiple-blade internal-hole saw for carrying out the method |
| US20010023973A1 (en) * | 1996-11-12 | 2001-09-27 | Salman Akram | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| JPH10296719A (en) * | 1997-04-25 | 1998-11-10 | Mitsubishi Materials Shilicon Corp | Wire saw and ingot cutting method |
| JP2003019711A (en) * | 2001-07-09 | 2003-01-21 | Furukawa Co Ltd | Method for producing ceramic substrate |
| CN104668782A (en) * | 2013-12-02 | 2015-06-03 | 光环科技股份有限公司 | Laser cutting method for semiconductor wafer |
| CN204701012U (en) * | 2015-06-11 | 2015-10-14 | 河南鸿昌电子有限公司 | The wire cutting machine of pourable adhesive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107813508A (en) * | 2017-11-29 | 2018-03-20 | 烟台海威斯特膜科技有限公司 | A kind of static casting device and its application method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150812 |
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| WD01 | Invention patent application deemed withdrawn after publication |