CN104820534A - Membrane structure single-layer multi-point capacitive touch screen sensor manufacturing technology - Google Patents
Membrane structure single-layer multi-point capacitive touch screen sensor manufacturing technology Download PDFInfo
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Abstract
The invention relates to a membrane structure single-layer multi-point capacitive touch screen sensor manufacturing technology and belongs to the technical field of touch screen manufacturing. The technology sequentially includes the steps of cutting copper plating ITO according to the predetermined size, coating, exposure, primary etching, primary stripping, printing with ink, secondary etching, secondary stripping, insulation printing and silver paste printing. The membrane structure single-layer multi-point capacitive touch screen sensor manufacturing technology has the advantages of being capable of improving the product yield and the manufacturing accuracy and smoothness, reducing production costs and the like, achieves a breakthrough of single-layer and multi-point, and overcomes the deficiencies of a single-layer multi-point (OGS) product of a glass structure is prone to breaking and low in yield.
Description
Technical field
The invention belongs to touch-screen manufacture technology field, be specifically related to a kind of capacitive touch screen inductor manufacture craft of membrane structure individual layer multiple spot.
Background technology
Touch-screen is that induced signal is converted into digital signal by one, realizes a kind of device of man-machine interaction; Wherein capacitance touch screen is capacitance variations finger or conducting medium produced between the electrode when touching and on substrate, by the digital conversion of driving chip, exports the coordinate position of finger or conducting medium touch-control.The fields such as current capacitance touch screen is widely used in mobile phone, dull and stereotyped.The capacitive touch screen structure of present main flow has the structures such as G+F, G+F2, OGS, on-cell, in-cell.Wherein, in the single layer designs of G+F, the design adopted to realize individual layer multi-point touch cannot meet the Uncrossed condition that to connect up in same plane, can only adopt the design of wire jumper.There is the shortcomings such as making precision is lower, smoothness is inadequate, yields is low in the wire jumper design of current individual layer multiple spot.
The method for making of capacitive touch screen inductor mainly contains printing process, radium carving processing procedure and gold-tinted processing procedure etc.; Printing process technique is simple, and equipment cost is lower, but its circuit precision can only accomplish 0.1mm, and the linearity is poor, and touch-control sensing is insensitive, is not suitable for large-sized inductor and makes; Radium carving processing procedure circuit precision can reach 0.05mm, but there is process efficiency and quick-fried some problem, is not suitable for the batch production of complex figure; Gold-tinted processing procedure circuit precision can reach 0.04mm, and the linearity is good, and touch-control sensing is sensitive, and supporting the design of complex figure, is the mode of production comparing main flow at present.Traditional gold-tinted making technology is the method for making ITO layer of inductor being adopted to exposure imaging, metal level is adopted to the method for silver slurry printing, such technique needs twice image-forming, operation is comparatively complicated, require higher to the contraposition precision of levels figure, metal level live width is comparatively large, and acceptance rate is low.
The manufacture craft of the touch module of the existing disclosed two-sided conducting membrane structure of a kind of GF2, it comprises the following steps successively: steps A, dry film are laminating: at the two-sided laminating dry film of conductive film; Step B, exposure, development; Step C, first time etching, stripping; Step D, acidproof printing; Step e, second time etching, stripping; Step F, insulation print; Step G, overlay film are cut.The method adopts dry film process, and dry film processing procedure can produce film slag, pollutes thing many, and the thickness of product can be thicker, expense cost is higher, and meticulous circuit qualification rate reduces, on the make dry film is made and easily be there is burr and slight crack, and production run easily affects the shortcomings such as yield; Secondly, dry film is made and film covering performance also can be caused poor, and the live width of product is apart from the shortcoming such as being restricted.
Summary of the invention
The object of the invention is to the defect overcoming prior art, a kind of individual layer multiple spot scheme of the membrane structure touch screen induction device gold-tinted technique shaping based on single exposure is provided, adopt wet film manufacture craft, enhance the adhesion of film, covering performance is good, improve live width line-spacing, reduce product thickness, improve the making precision, smoothness, yields etc. of individual layer multiple spot class touch-screen product.Achieve the breakthrough of individual layer multiple spot, individual layer multiple spot (OGS) product the having avoided glass structure shortcoming such as easily cracked, yields is low; Be different from again the membrane structure individual layer multiple spot product of conventional multi exposure simultaneously, more save material by contrast, save man-hour, and do not produce pollution, thickness is thinner; And final finished has the live width line-spacing thinner than normal film structure individual layer multiple spot, is better than the circuit flatness of the Radium art under equal live width line-spacing.
To achieve these goals, the capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot provided by the invention, comprises the following steps successively:
S1, coating: apply liquid photoresist on the surface in copper facing ito film, and baking makes described liquid photoresist be cured as photoresist layer;
S2, exposure: the photoresist layer be coated on copper facing ito film surface is exposed;
S3, development: the copper facing ito film alkaline solution after exposure is developed;
S4, first time etching: the copper facing ito film acid solution after development is etched, on copper-plated metal layer and ito film, forms pattern simultaneously; This step utilizes acid solution to etch metal level and ITO simultaneously, and metal level and ITO all form pattern;
S5, for the first time stripping: the photoresist layer copper facing ito film after etching being removed copper facing ito film surface with alkaline solution;
S6, ink printing: the copper facing ito film after stripping prints acid-proof ink, under ultra violet lamp, solidifies acid-proof ink, to protect the metallic circuit pattern formed through step S4 etching outside visible area;
S7, second time etching: the copper facing ito film strong oxidizing solution after printing acid-proof ink is carried out soaking or spraying, the further metal level of etching visible area; Utilize second time etching, the metal level of visible area will be etched further, make on metal level and ITO, to form pattern after first time etching more accurate;
S8, second time stripping: the copper facing ito film alkaline solution after step S7 is carried out soaking or spraying, removes acid-proof ink;
S9, insulation print: the dielectric ink of printing transparent in the copper facing ito film after step S8, and solidify under ultra violet lamp;
S10, the printing of silver slurry: in the copper facing ito film after step S9, stamp conductive silver paste, and solidify to form wire jumper under uviol lamp, obtain the capacitive touch screen inductor of described membrane structure individual layer multiple spot.
Further, applying liquid photoresist in described step S1 is positive photoresist, and thickness is 4 ~ 7 um, and described baking-curing temperature is 120 ~ 130 DEG C.
Further, the exposure of described step S2 is in gold-tinted environment, and be the ultraviolet vertical irradiation photoresist layer of 200 ~ 400 nm with wavelength, exposure energy is 200 ~ 300 J/cm
2.
Further, in described step S3, development temperature is 20 ~ 25 DEG C, and development time is 50 ± 20 s; Described alkaline solution is NaOH or sodium carbonate liquor, and mass concentration is 0.1 ~ 1.0 %wt.
Further, in described step S4, etch temperature is 30 ~ 50 DEG C, and etching period is 50 ± 30 s; Described acid solution is nitric acid or hydrochloric acid solution, and mass concentration is 20 ± 2%wt.
Further, in described step S5, stripping temperature is 30 ± 5 DEG C, and the stripping time is 40 ± 10 s; Described alkaline solution is NaOH or sodium carbonate liquor, and mass concentration is 2 ± 0.5%wt.
Further, in described step S7, etch temperature is 30 ~ 40 DEG C, and etching period is 50 ± 30 s; Described strong oxidizing solution is hydrogen peroxide, and mass concentration is 5 ~ 6%wt.
Further, in described step S8, stripping temperature is 30 ± 5 DEG C, and the stripping time is 40 ± 10 s; Described alkaline solution is NaOH or sodium carbonate liquor, and mass concentration is 2 ± 0.5%wt.In described step S8, stripping solution can use the stripping solution in above-mentioned steps S5 equally, and can recycle, decreasing pollution, saves industrial cost.
Preferably, the acid-proof ink in described step S6 is the model of Japanese Goo Chemical Co., Ltd. is the acid-proof ink of TPER-194B-2; The model that dielectric ink in described step S9 is Japanese Toyo Boseki K. K is the dielectric ink of FR-200C-4; Conductive silver paste in described step S10 is the model of Japanese Toyo Boseki K. K is the conductive silver paste of DW-440L-29C.
Beneficial effect of the present invention: (1), compared with conventional multi exposure technology, the present invention adopts single exposure moulding process to realize individual layer multiple spot membrane structure, saves operation; (2) after etching first, protect the metallic circuit outside visible area with dielectric ink, again etch, improve making precision, the smoothness of metallic circuit, make product have the live width line-spacing thinner than normal film structure individual layer multiple spot; (3) this technique adopts the wet process of insulation print and the printing of silver slurry, achieves the breakthrough of individual layer multiple spot, individual layer multiple spot (OGS) product the having avoided glass structure shortcomings such as easily cracked, yields is low, and does not produce pollution, and product thickness is thinner; (4) before and after in this technique, the stripping solution of twice can be general, and can recycle, decreasing pollution, saves cost.
Embodiment
The invention will be further described for specific embodiment below.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
embodiment 1
The capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot provided by the invention, comprises the following steps: after cutting the copper facing ito film of preliminary dimension, carry out following steps successively;
S1, coating: apply liquid photoresist on the surface in copper facing ito film, described liquid photoresist is the model that Suzhou Ruihong Electronic Chemical Product Co., Ltd. produces is RZJ-2500 positive photoresist, the thickness applying liquid photoresist is 4 um, and toast at 120 DEG C, photoresist is solidified, is set in copper facing ITO surface and forms photoresist layer; Utilize hot setting photoresist that its solvent is volatilized, do not affect the effect of photoresist;
S2, exposure: the photoresist layer be coated on copper facing ito film surface is exposed, light shield is adopted to expose the copper facing ito film being coated with photoresist layer, under gold-tinted environment, being the direction vertical irradiation of ultraviolet from light shield towards photoresist layer of 200 nm with wavelength, is 200 ~ 300 J/cm to the exposure energy of photoresist layer
2;
S3, development: the copper facing ito film alkaline solution after exposure is developed, under gold-tinted environment, it is 20 DEG C that the copper facing ito film after exposure is immersed in temperature, and mass concentration is develop in the sodium hydroxide solution of 0.1 %wt, and development time is 30 s;
S4, first time etching: the copper facing ito film acid solution after development is etched, on copper-plated metal layer and ito film, form pattern simultaneously, be by development after copper facing ito film to be immersed in temperature be 30 DEG C, mass concentration is etch metal level and ITO in the salpeter solution of 18%wt simultaneously, and pattern is formed on metal level and ITO, etching period is 20 s;
S5, for the first time stripping: the photoresist layer copper facing ito film after etching being removed copper facing ito film surface with alkaline solution, that to be immersed in temperature be 25 DEG C by the copper facing ito film after step S4 etching, mass concentration is carry out stripping in the sodium hydroxide solution of 1.5%wt, remove the photoresist layer on copper facing ito film surface, the stripping time is 30 s;
S6, ink printing: the copper facing ito film after stripping prints acid-proof ink; acid-proof ink is solidified under ultra violet lamp; to protect the metallic circuit pattern formed through step S4 etching outside visible area; the copper facing ito film after step S5 stripping is placed in coating acid-proof ink and under having the web plate of line pattern; scrape with frictioning; being extruded uniformly according to the line pattern on web plate by acid-proof ink is printed in copper facing ito film; through ultra violet lamp; baking-curing acid-proof ink, ultraviolet light polymerization energy is 1000 mj/cm
2, the metallic circuit outside protection visible area, described acid-proof ink is the model of Japanese Goo Chemical Co., Ltd. is the acid-proof ink of TPER-194B-2;
S7, second time etching: by printing acid-proof ink after copper facing ito film mass concentration be the hydrogen peroxide of 5%wt, soak at temperature is 30 DEG C or spray, carry out pattern etching, etching period is 20 s, the metal level of further etching visible area, utilize second etch technique, the metal level of visible area will be etched further, make on metal level and ITO, to form pattern after first time etching more accurate;
S8, second time stripping: by through step S7 etching after copper facing ito film mass concentration be the sodium hydroxide solution of 1.5%wt, at temperature is 25 DEG C soak or spray, carry out stripping, the stripping time is 30 s, remove acid-proof ink; Stripping solution in this step can use the stripping solution in above-mentioned steps S5, and can recycle, decreasing pollution, saves industrial cost;
S9, insulation print: the copper facing ito film after step S8 stripping is placed in coating transparent insulation ink and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by transparent dielectric ink is printed in copper facing ito film, and under ultra violet lamp baking-curing, ultraviolet light polymerization energy is 1000 mj/cm
2, described dielectric ink is the model of Japanese Toyo Boseki K. K is the dielectric ink of FR-200C-4;
S10, silver slurry printing: the copper facing ito film after the printing of step S9 dielectric ink is placed in coating electrically conductive silver slurry and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by conductive silver paste is printed in copper facing ito film, under ultra violet lamp, baking-curing forms wire jumper, obtain the capacitive touch screen inductor of described membrane structure individual layer multiple spot, ultraviolet light polymerization energy is 1000 mj/cm
2, described conductive silver paste is the model of Japanese Toyo Boseki K. K is the conductive silver paste of DW-440L-29C.
embodiment 2
The capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot provided by the invention, comprises the following steps: after cutting the copper facing ito film of preliminary dimension, carry out following steps successively;
S1, coating: apply liquid photoresist on the surface in copper facing ito film, described liquid photoresist is the model that Suzhou Ruihong Electronic Chemical Product Co., Ltd. produces is RZJ-2500 positive photoresist, the thickness applying liquid photoresist is 7 um, and toast at 130 DEG C, photoresist is solidified, is set in copper facing ITO surface and forms photoresist layer; Utilize hot setting photoresist that its solvent is volatilized, do not affect the effect of photoresist;
S2, exposure: the photoresist layer be coated on copper facing ito film surface is exposed, light shield is adopted to expose the copper facing ito film being coated with photoresist layer, in gold-tinted environment, being the direction vertical irradiation of ultraviolet from light shield towards photoresist layer of 400 nm with wavelength, is 200 ~ 300 J/cm to the exposure energy of photoresist layer
2;
S3, development: the copper facing ito film alkaline solution after exposure is developed, under gold-tinted environment, it is 25 DEG C that the copper facing ito film after exposure is immersed in temperature, and mass concentration is develop in the sodium hydroxide solution of 1.0 %wt, and development time is 70 s;
S4, first time etching: the copper facing ito film acid solution after development is etched, on copper-plated metal layer and ito film, form pattern simultaneously, that copper facing ito film after development is immersed in temperature is 50 DEG C, mass concentration is etch metal level and ITO in the salpeter solution of 22%wt simultaneously, and pattern is formed on metal level and ITO, etching period is 80 s;
S5, for the first time stripping: the photoresist layer copper facing ito film after etching being removed copper facing ito film surface with alkaline solution, that to be immersed in temperature be 35 DEG C by the copper facing ito film after step S4 etching, mass concentration is carry out stripping in the sodium hydroxide solution of 2.5%wt, remove the photoresist layer on copper facing ito film surface, the stripping time is 50 s;
S6, ink printing: the copper facing ito film after stripping prints acid-proof ink; acid-proof ink is solidified under ultra violet lamp; to protect the metallic circuit pattern formed through step S4 etching outside visible area; the copper facing ito film after step S5 stripping is placed in coating acid-proof ink and under having the web plate of line pattern; scrape with frictioning; being extruded uniformly according to the line pattern on web plate by acid-proof ink is printed in copper facing ito film; through ultra violet lamp; baking-curing acid-proof ink, ultraviolet light polymerization energy is 1000 mj/cm
2, the metallic circuit outside protection visible area, described acid-proof ink is the model of Japanese Goo Chemical Co., Ltd. is the acid-proof ink of TPER-194B-2;
S7, second time etching: by printing acid-proof ink after copper facing ito film mass concentration be the hydrogen peroxide of 6%wt, soak at temperature is 40 DEG C or spray, carry out pattern etching, etching period is 80 s, the metal level of further etching visible area, utilize second etch technique, the metal level of visible area will be etched further, make on metal level and ITO, to form pattern after first time etching more accurate;
S8, second time stripping: by through step S7 etching after copper facing ito film mass concentration be the sodium hydroxide solution of 2.5%wt, at temperature is 35 DEG C soak or spray, carry out stripping, the stripping time is 50 s, remove acid-proof ink; Stripping solution in this step can use the stripping solution in above-mentioned steps S5, and can recycle, decreasing pollution, saves industrial cost;
S9, insulation print: the copper facing ito film after step S8 stripping is placed in coating transparent insulation ink and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by transparent dielectric ink is printed in copper facing ito film, and under ultra violet lamp baking-curing, ultraviolet light polymerization energy is 1000 mj/cm
2, described dielectric ink is the model of Japanese Toyo Boseki K. K is the dielectric ink of FR-200C-4;
S10, silver slurry printing: the copper facing ito film after the printing of step S9 dielectric ink is placed in coating electrically conductive silver slurry and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by conductive silver paste is printed in copper facing ito film, under ultra violet lamp, baking-curing forms wire jumper, obtain the capacitive touch screen inductor of described membrane structure individual layer multiple spot, ultraviolet light polymerization energy is 1000 mj/cm
2, described conductive silver paste is the model of Japanese Toyo Boseki K. K is the conductive silver paste of DW-440L-29C.
embodiment 3
The capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot provided by the invention, comprises the following steps: after cutting the copper facing ito film of preliminary dimension, carry out following steps successively;
S1, coating: apply liquid photoresist on the surface in copper facing ito film, described liquid photoresist is the model that Suzhou Ruihong Electronic Chemical Product Co., Ltd. produces is RZJ-2500 positive photoresist, the thickness applying liquid photoresist is 5.5 um, and toast at 125 DEG C, photoresist is solidified, is set in copper facing ITO surface and forms photoresist layer; Utilize hot setting photoresist that its solvent is volatilized, do not affect the effect of photoresist;
S2, exposure: the photoresist layer be coated on copper facing ito film surface is exposed, light shield is adopted to expose the copper facing ito film being coated with photoresist layer, in gold-tinted environment, being the direction vertical irradiation of ultraviolet from light shield towards photoresist layer of 300 nm with wavelength, is 200 ~ 300 J/cm to the exposure energy of photoresist layer
2;
S3, development: the copper facing ito film alkaline solution after exposure is developed, under gold-tinted environment, it is 23 DEG C that the copper facing ito film after exposure is immersed in temperature, and mass concentration is develop in the sodium hydroxide solution of 0.5 %wt, and development time is 50 s;
S4, first time etching: the copper facing ito film acid solution after development is etched, on copper-plated metal layer and ito film, form pattern simultaneously, that copper facing ito film after development is immersed in temperature is 40 DEG C, mass concentration is etch metal level and ITO in the salpeter solution of 20%wt simultaneously, and pattern is formed on metal level and ITO, etching period is 50 s;
S5, for the first time stripping: the photoresist layer copper facing ito film after etching being removed copper facing ito film surface with alkaline solution, that to be immersed in temperature be 30 DEG C by the copper facing ito film after step S4 etching, mass concentration is carry out stripping in the sodium hydroxide solution of 2%wt, remove the photoresist layer on copper facing ito film surface, the stripping time is 40 s;
S6, ink printing: the copper facing ito film after stripping prints acid-proof ink; acid-proof ink is solidified under ultra violet lamp; to protect the metallic circuit pattern formed through step S4 etching outside visible area; the copper facing ito film after step S5 stripping is placed in coating acid-proof ink and under having the web plate of line pattern; scrape with frictioning; being extruded uniformly according to the line pattern on web plate by acid-proof ink is printed in copper facing ito film; through ultra violet lamp; baking-curing acid-proof ink, ultraviolet light polymerization energy is 1000 mj/cm
2, the metallic circuit outside protection visible area, described acid-proof ink is the model of Japanese Goo Chemical Co., Ltd. is the acid-proof ink of TPER-194B-2;
S7, second time etching: by printing acid-proof ink after copper facing ito film mass concentration be the hydrogen peroxide of 5.5%wt, soak at temperature is 35 DEG C or spray, carry out pattern etching, etching period is 50 s, the metal level of further etching visible area, utilize second etch technique, the metal level of visible area will be etched further, make on metal level and ITO, to form pattern after first time etching more accurate;
S8, second time stripping: by through step S7 etching after copper facing ito film mass concentration be the sodium hydroxide solution of 2%wt, at temperature is 30 DEG C soak or spray, carry out stripping, the stripping time is 40 s, remove acid-proof ink; Stripping solution in this step can use the stripping solution in above-mentioned steps S5, and can recycle, decreasing pollution, saves industrial cost;
S9, insulation print: the copper facing ito film after step S8 stripping is placed in coating transparent insulation ink and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by transparent dielectric ink is printed in copper facing ito film, and under ultra violet lamp baking-curing, ultraviolet light polymerization energy is 1000 mj/cm
2, described dielectric ink is the model of Japanese Toyo Boseki K. K is the dielectric ink of FR-200C-4;
S10, silver slurry printing: the copper facing ito film after the printing of step S9 dielectric ink is placed in coating electrically conductive silver slurry and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by conductive silver paste is printed in copper facing ito film, under ultra violet lamp, baking-curing forms wire jumper, obtain the capacitive touch screen inductor of described membrane structure individual layer multiple spot, ultraviolet light polymerization energy is 1000 mj/cm
2, described conductive silver paste is the model of Japanese Toyo Boseki K. K is the conductive silver paste of DW-440L-29C.
embodiment 4
The capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot provided by the invention, comprises the following steps: after cutting the copper facing ito film of preliminary dimension, carry out following steps successively;
S1, coating: apply liquid photoresist on the surface in copper facing ito film, described liquid photoresist is the model that Suzhou Ruihong Electronic Chemical Product Co., Ltd. produces is RZJ-2500 positive photoresist, the thickness applying liquid photoresist is 4 um, and toast at 120 DEG C, photoresist is solidified, is set in copper facing ITO surface and forms photoresist layer; Utilize hot setting photoresist that its solvent is volatilized, do not affect the effect of photoresist;
S2, exposure: the photoresist layer be coated on copper facing ito film surface is exposed, light shield is adopted to expose the copper facing ito film being coated with photoresist layer, under gold-tinted environment, being the direction vertical irradiation of ultraviolet from light shield towards photoresist layer of 200 nm with wavelength, is 200 ~ 300 J/cm to the exposure energy of photoresist layer
2;
S3, development: the copper facing ito film alkaline solution after exposure is developed, under gold-tinted environment, it is 20 DEG C that the copper facing ito film after exposure is immersed in temperature, and mass concentration is develop in the sodium carbonate liquor of 0.1 %wt, and development time is 30 s;
S4, first time etching: the copper facing ito film acid solution after development is etched, on copper-plated metal layer and ito film, form pattern simultaneously, be by development after copper facing ito film to be immersed in temperature be 30 DEG C, mass concentration is etch metal level and ITO in the hydrochloric acid solution of 18%wt simultaneously, and pattern is formed on metal level and ITO, etching period is 20 s;
S5, for the first time stripping: the photoresist layer copper facing ito film after etching being removed copper facing ito film surface with alkaline solution, that to be immersed in temperature be 25 DEG C by the copper facing ito film after step S4 etching, mass concentration is carry out stripping in the sodium carbonate liquor of 1.5%wt, remove the photoresist layer on copper facing ito film surface, the stripping time is 30 s;
S6, ink printing: the copper facing ito film after stripping prints acid-proof ink; acid-proof ink is solidified under ultra violet lamp; to protect the metallic circuit pattern formed through step S4 etching outside visible area; the copper facing ito film after step S5 stripping is placed in coating acid-proof ink and under having the web plate of line pattern; scrape with frictioning; being extruded uniformly according to the line pattern on web plate by acid-proof ink is printed in copper facing ito film; through ultra violet lamp; baking-curing acid-proof ink, ultraviolet light polymerization energy is 1000 mj/cm
2, the metallic circuit outside protection visible area, described acid-proof ink is the model of Japanese Goo Chemical Co., Ltd. is the acid-proof ink of TPER-194B-2;
S7, second time etching: by printing acid-proof ink after copper facing ito film mass concentration be the hydrogen peroxide of 5%wt, soak at temperature is 30 DEG C or spray, carry out pattern etching, etching period is 20 s, the metal level of further etching visible area, utilize second etch technique, the metal level of visible area will be etched further, make on metal level and ITO, to form pattern after first time etching more accurate;
S8, second time stripping: by through step S7 etching after copper facing ito film mass concentration be the sodium carbonate liquor of 1.5%wt, at temperature is 25 DEG C soak or spray, carry out stripping, the stripping time is 30 s, remove acid-proof ink; Stripping solution in this step can use the stripping solution in above-mentioned steps S5, and can recycle, decreasing pollution, saves industrial cost;
S9, insulation print: the copper facing ito film after step S8 stripping is placed in coating transparent insulation ink and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by transparent dielectric ink is printed in copper facing ito film, and under ultra violet lamp baking-curing, ultraviolet light polymerization energy is 1000 mj/cm
2, described dielectric ink is the model of Japanese Toyo Boseki K. K is the dielectric ink of FR-200C-4;
S10, silver slurry printing: the copper facing ito film after the printing of step S9 dielectric ink is placed in coating electrically conductive silver slurry and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by conductive silver paste is printed in copper facing ito film, under ultra violet lamp, baking-curing forms wire jumper, obtain the capacitive touch screen inductor of described membrane structure individual layer multiple spot, ultraviolet light polymerization energy is 1000 mj/cm
2, described conductive silver paste is the model of Japanese Toyo Boseki K. K is the conductive silver paste of DW-440L-29C.
embodiment 5
The capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot provided by the invention, comprises the following steps: after cutting the copper facing ito film of preliminary dimension, carry out following steps successively;
S1, coating: apply liquid photoresist on the surface in copper facing ito film, described liquid photoresist is the model that Suzhou Ruihong Electronic Chemical Product Co., Ltd. produces is RZJ-2500 positive photoresist, the thickness applying liquid photoresist is 7 um, and toast at 130 DEG C, photoresist is solidified, is set in copper facing ITO surface and forms photoresist layer; Utilize hot setting photoresist that its solvent is volatilized, do not affect the effect of photoresist;
S2, exposure: the photoresist layer be coated on copper facing ito film surface is exposed, light shield is adopted to expose the copper facing ito film being coated with photoresist layer, in gold-tinted environment, being the direction vertical irradiation of ultraviolet from light shield towards photoresist layer of 400 nm with wavelength, is 200 ~ 300 J/cm to the exposure energy of photoresist layer
2;
S3, development: the copper facing ito film alkaline solution after exposure is developed, under gold-tinted environment, it is 25 DEG C that the copper facing ito film after exposure is immersed in temperature, and mass concentration is develop in the sodium carbonate liquor of 1.0 %wt, and development time is 70 s;
S4, first time etching: the copper facing ito film acid solution after development is etched, on copper-plated metal layer and ito film, form pattern simultaneously, that copper facing ito film after development is immersed in temperature is 50 DEG C, mass concentration is etch metal level and ITO in the hydrochloric acid solution of 22%wt simultaneously, and pattern is formed on metal level and ITO, etching period is 80 s;
S5, for the first time stripping: the photoresist layer copper facing ito film after etching being removed copper facing ito film surface with alkaline solution, that to be immersed in temperature be 35 DEG C by the copper facing ito film after step S4 etching, mass concentration is carry out stripping in the sodium carbonate liquor of 2.5%wt, remove the photoresist layer on copper facing ito film surface, the stripping time is 50 s;
S6, ink printing: the copper facing ito film after stripping prints acid-proof ink; acid-proof ink is solidified under ultra violet lamp; to protect the metallic circuit pattern formed through step S4 etching outside visible area; the copper facing ito film after step S5 stripping is placed in coating acid-proof ink and under having the web plate of line pattern; scrape with frictioning; being extruded uniformly according to the line pattern on web plate by acid-proof ink is printed in copper facing ito film; through ultra violet lamp; baking-curing acid-proof ink, ultraviolet light polymerization energy is 1000 mj/cm
2, the metallic circuit outside protection visible area, described acid-proof ink is the model of Japanese Goo Chemical Co., Ltd. is the acid-proof ink of TPER-194B-2;
S7, second time etching: by printing acid-proof ink after copper facing ito film mass concentration be the hydrogen peroxide of 6%wt, soak at temperature is 40 DEG C or spray, carry out pattern etching, etching period is 80 s, the metal level of further etching visible area, utilize second etch technique, the metal level of visible area will be etched further, make on metal level and ITO, to form pattern after first time etching more accurate;
S8, second time stripping: by through step S7 etching after copper facing ito film mass concentration be the sodium carbonate liquor of 2.5%wt, at temperature is 35 DEG C soak or spray, carry out stripping, the stripping time is 50 s, remove acid-proof ink; Stripping solution in this step can use the stripping solution in above-mentioned steps S5, and can recycle, decreasing pollution, saves industrial cost;
S9, insulation print: the copper facing ito film after step S8 stripping is placed in coating transparent insulation ink and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by transparent dielectric ink is printed in copper facing ito film, and under ultra violet lamp baking-curing, ultraviolet light polymerization energy is 1000 mj/cm
2, described dielectric ink is the model of Japanese Toyo Boseki K. K is the dielectric ink of FR-200C-4;
S10, silver slurry printing: the copper facing ito film after the printing of step S9 dielectric ink is placed in coating electrically conductive silver slurry and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by conductive silver paste is printed in copper facing ito film, under ultra violet lamp, baking-curing forms wire jumper, obtain the capacitive touch screen inductor of described membrane structure individual layer multiple spot, ultraviolet light polymerization energy is 1000 mj/cm
2, described conductive silver paste is the model of Japanese Toyo Boseki K. K is the conductive silver paste of DW-440L-29C.
embodiment 6
The capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot provided by the invention, comprises the following steps: after cutting the copper facing ito film of preliminary dimension, carry out following steps successively;
S1, coating: apply liquid photoresist on the surface in copper facing ito film, described liquid photoresist is the model that Suzhou Ruihong Electronic Chemical Product Co., Ltd. produces is RZJ-2500 positive photoresist, the thickness applying liquid photoresist is 5.5 um, and toast at 125 DEG C, photoresist is solidified, is set in copper facing ITO surface and forms photoresist layer; Utilize hot setting photoresist that its solvent is volatilized, do not affect the effect of photoresist;
S2, exposure: the photoresist layer be coated on copper facing ito film surface is exposed, light shield is adopted to expose the copper facing ito film being coated with photoresist layer, in gold-tinted environment, being the direction vertical irradiation of ultraviolet from light shield towards photoresist layer of 300 nm with wavelength, is 200 ~ 300 J/cm to the exposure energy of photoresist layer
2;
S3, development: the copper facing ito film alkaline solution after exposure is developed, under gold-tinted environment, it is 23 DEG C that the copper facing ito film after exposure is immersed in temperature, and mass concentration is develop in the sodium carbonate liquor of 0.5%wt, and development time is 50 s;
S4, first time etching: the copper facing ito film acid solution after development is etched, on copper-plated metal layer and ito film, form pattern simultaneously, that copper facing ito film after development is immersed in temperature is 40 DEG C, mass concentration is etch metal level and ITO in the hydrochloric acid solution of 20%wt simultaneously, and pattern is formed on metal level and ITO, etching period is 50 s;
S5, for the first time stripping: the photoresist layer copper facing ito film after etching being removed copper facing ito film surface with alkaline solution, that to be immersed in temperature be 30 DEG C by the copper facing ito film after step S4 etching, mass concentration is carry out stripping in the sodium carbonate liquor of 2%wt, remove the photoresist layer on copper facing ito film surface, the stripping time is 40 s;
S6, ink printing: the copper facing ito film after stripping prints acid-proof ink; acid-proof ink is solidified under ultra violet lamp; to protect the metallic circuit pattern formed through step S4 etching outside visible area; the copper facing ito film after step S5 stripping is placed in coating acid-proof ink and under having the web plate of line pattern; scrape with frictioning; being extruded uniformly according to the line pattern on web plate by acid-proof ink is printed in copper facing ito film; through ultra violet lamp; baking-curing acid-proof ink, ultraviolet light polymerization energy is 1000 mj/cm
2, the metallic circuit outside protection visible area, described acid-proof ink is the model of Japanese Goo Chemical Co., Ltd. is the acid-proof ink of TPER-194B-2;
S7, second time etching: by printing acid-proof ink after copper facing ito film mass concentration be the hydrogen peroxide of 5.5%wt, soak at temperature is 35 DEG C or spray, carry out pattern etching, etching period is 50 s, the metal level of further etching visible area, utilize second etch technique, the metal level of visible area will be etched further, make on metal level and ITO, to form pattern after first time etching more accurate;
S8, second time stripping: by through step S7 etching after copper facing ito film mass concentration be the sodium carbonate liquor of 2%wt, at temperature is 30 DEG C soak or spray, carry out stripping, the stripping time is 40 s, remove acid-proof ink; Stripping solution in this step can use the stripping solution in above-mentioned steps S5, and can recycle, decreasing pollution, saves industrial cost;
S9, insulation print: the copper facing ito film after step S8 stripping is placed in coating transparent insulation ink and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by transparent dielectric ink is printed in copper facing ito film, and under ultra violet lamp baking-curing, ultraviolet light polymerization energy is 1000 mj/cm
2, described dielectric ink is the model of Japanese Toyo Boseki K. K is the dielectric ink of FR-200C-4;
S10, silver slurry printing: the copper facing ito film after the printing of step S9 dielectric ink is placed in coating electrically conductive silver slurry and under having the web plate of line pattern, scrape with frictioning, being extruded uniformly according to the line pattern on web plate by conductive silver paste is printed in copper facing ito film, under ultra violet lamp, baking-curing forms wire jumper, obtain the capacitive touch screen inductor of described membrane structure individual layer multiple spot, ultraviolet light polymerization energy is 1000 mj/cm
2, described conductive silver paste is the model of Japanese Toyo Boseki K. K is the conductive silver paste of DW-440L-29C.
The performance test of the capacitive touch screen inductor of the membrane structure individual layer multiple spot that embodiment 1-6 obtains sees the following form 1:
Table 1 performance test
Can be found out that by upper table 1 acceptance rate, the transmittance of the capacitive touch screen inductor product of a kind of membrane structure individual layer multiple spot that the present invention obtains are very high, product is functional to hot and humid, low temperature storage, high temperature storage, thermal shock, salt spray test.
Finally should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although done to explain to the present invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to technical scheme of the present invention or equivalent replacement, and not depart from essence and the scope of technical solution of the present invention.
Claims (8)
1. a capacitive touch screen inductor manufacture craft for membrane structure individual layer multiple spot, is characterized in that, comprise the following steps successively:
S1, coating: apply liquid photoresist on the surface in copper facing ito film, and baking makes described liquid photoresist be cured as photoresist layer;
S2, exposure: the photoresist layer be coated on copper facing ito film surface is exposed;
S3, development: the copper facing ito film alkaline solution after exposure is developed;
S4, first time etching: the copper facing ito film acid solution after development is etched, on copper-plated metal layer and ito film, forms pattern simultaneously;
S5, for the first time stripping: the photoresist layer copper facing ito film after etching being removed copper facing ito film surface with alkaline solution;
S6, ink printing: the copper facing ito film after stripping prints acid-proof ink, under ultra violet lamp, solidifies acid-proof ink, to protect the metallic circuit pattern formed through step S4 etching outside visible area;
S7, second time etching: the copper facing ito film strong oxidizing solution after printing acid-proof ink is carried out soaking or spraying, the further metal level of etching visible area;
S8, second time stripping: the copper facing ito film alkaline solution after step S7 is carried out soaking or spraying, removes acid-proof ink;
S9, insulation print: the dielectric ink of printing transparent in the copper facing ito film after step S8, and solidify under ultra violet lamp;
S10, the printing of silver slurry: in the copper facing ito film after step S9, stamp conductive silver paste, and solidify to form wire jumper under uviol lamp, obtain the capacitive touch screen inductor of described membrane structure individual layer multiple spot.
2. the capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot according to claim 1, it is characterized in that, applying liquid photoresist in described step S1 is positive photoresist, and thickness is 4 ~ 7 um, and described baking-curing temperature is 120 ~ 130 DEG C.
3. the capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot according to claim 1, it is characterized in that, the exposure of described step S2 is in gold-tinted environment, and be the ultraviolet vertical irradiation photoresist layer of 200 ~ 400 nm with wavelength, exposure energy is 200 ~ 300 J/cm
2.
4. the capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot according to claim 1, it is characterized in that, in described step S3, development temperature is 20 ~ 25 DEG C, and development time is 50 ± 20 s; Described alkaline solution is NaOH or sodium carbonate liquor, and mass concentration is 0.1 ~ 1.0 %wt.
5. the capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot according to claim 1, it is characterized in that, in described step S4, etch temperature is 30 ~ 50 DEG C, and etching period is 50 ± 30 s; Described acid solution is nitric acid or hydrochloric acid solution, and mass concentration is 20 ± 2%wt.
6. the capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot according to claim 1, it is characterized in that, in described step S5, stripping temperature is 30 ± 5 DEG C, and the stripping time is 40 ± 10 s; Described alkaline solution is NaOH or sodium carbonate liquor, and mass concentration is 2 ± 0.5%wt.
7. the capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot according to claim 1, it is characterized in that, in described step S7, etch temperature is 30 ~ 40 DEG C, and etching period is 50 ± 30 s; Described strong oxidizing solution is hydrogen peroxide, and mass concentration is 5 ~ 6%wt.
8. the capacitive touch screen inductor manufacture craft of a kind of membrane structure individual layer multiple spot according to claim 1, it is characterized in that, in described step S8, stripping temperature is 30 ± 5 DEG C, and the stripping time is 40 ± 10 s; Described alkaline solution is NaOH or sodium carbonate liquor, and mass concentration is 2 ± 0.5%wt.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106583940A (en) * | 2016-12-12 | 2017-04-26 | 晟光科技股份有限公司 | OGS touch screen silver paste laser etching method capable of eliminating micro short circuit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096505A (en) * | 2011-01-07 | 2011-06-15 | 牧东光电（苏州）有限公司 | Touch panel jointed fragmentally and manufacturing method thereof |
| CN102768586A (en) * | 2011-05-06 | 2012-11-07 | 许明松 | Touch panel and manufacturing method thereof |
| US20140076612A1 (en) * | 2011-05-13 | 2014-03-20 | Fujifilm Corporation | Conductive sheet and touch panel |
-
2015
- 2015-05-27 CN CN201510275930.2A patent/CN104820534A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102096505A (en) * | 2011-01-07 | 2011-06-15 | 牧东光电（苏州）有限公司 | Touch panel jointed fragmentally and manufacturing method thereof |
| CN102768586A (en) * | 2011-05-06 | 2012-11-07 | 许明松 | Touch panel and manufacturing method thereof |
| US20140076612A1 (en) * | 2011-05-13 | 2014-03-20 | Fujifilm Corporation | Conductive sheet and touch panel |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106583940A (en) * | 2016-12-12 | 2017-04-26 | 晟光科技股份有限公司 | OGS touch screen silver paste laser etching method capable of eliminating micro short circuit |
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Application publication date: 20150805 |