CN104808848A - Manufacturing method for touch screen and touch screen - Google Patents
Manufacturing method for touch screen and touch screen Download PDFInfo
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- CN104808848A CN104808848A CN201510183790.6A CN201510183790A CN104808848A CN 104808848 A CN104808848 A CN 104808848A CN 201510183790 A CN201510183790 A CN 201510183790A CN 104808848 A CN104808848 A CN 104808848A
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- transparent conductive
- conductive layer
- touch
- screen
- patterned transparent
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- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000005530 etching Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 45
- 229920002120 photoresistant polymer Polymers 0.000 claims description 30
- 238000009413 insulation Methods 0.000 claims description 26
- 238000000059 patterning Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 239000006059 cover glass Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- YTAHJIFKAKIKAV-XNMGPUDCSA-N [(1R)-3-morpholin-4-yl-1-phenylpropyl] N-[(3S)-2-oxo-5-phenyl-1,3-dihydro-1,4-benzodiazepin-3-yl]carbamate Chemical compound O=C1[C@H](N=C(C2=C(N1)C=CC=C2)C1=CC=CC=C1)NC(O[C@H](CCN1CCOCC1)C1=CC=CC=C1)=O YTAHJIFKAKIKAV-XNMGPUDCSA-N 0.000 description 1
- VEUACKUBDLVUAC-UHFFFAOYSA-N [Na].[Ca] Chemical compound [Na].[Ca] VEUACKUBDLVUAC-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 silicon nitrides Chemical class 0.000 description 1
Abstract
The embodiment of the invention relates to the technical field of mobile equipment, in particular to a manufacturing method for a touch screen and the touch screen. The manufacturing method for the touch screen provided by the embodiment of the invention comprises the following steps: after an intermediate transparent conductive layer is formed on a substrate, etching to remove the part, corresponding to a virtual electrode of the touch screen, in the intermediate transparent conductive layer to form a graphic transparent conductive layer; then, forming an insulating layer and a metal conductive layer. Namely, according to the embodiment of the invention, the area of the transparent conductive layer in the touch screen is reduced by removing the transparent conductive layer corresponding to the virtual electrode, so that the internal stress of the transparent conductive layer is reduced; the strength of the touch screen is enhanced.
Description
Technical field
The embodiment of the present invention relates to mobile device technical field, particularly relates to a kind of method for making and touch-screen of touch-screen.
Background technology
Intelligent mobile equipment technology obtains in recent years and develops fast, and people more and more be unable to do without the use of mobile device in work and life.Existing mobile device generally can be provided with touch-screen, and user can use finger to manipulate mobile device easily flexibly on the touchscreen, so the quality of touch-screen quality directly affects the experience of user.In recent years; many main flow mobile devices all start to adopt Screen Technology of entirely fitting; together with full laminating refers to and display panel and cover glass to be pasted completely in seamless mode with glue or optical cement etc.; eliminate the air between screen; what contribute to reducing between display panel and glass is reflective; screen can be allowed to seem more penetrating, strengthen the display effect of screen, and effectively can reduce the interference that display panel noise causes touch signal.
As the one of full laminating Screen Technology, single glass touch technology (Touch on Lens/One GlassSolution, TOL/OGS) is widely used.TOL/OGS technology refers to that a touch screen and cover glass integrate; tin indium oxide (Indium-Tin Oxide is plated inside cover glass; ITO) conductive layer; directly on cover glass, carry out plated film and photoetching; save a sheet glass and once fit, touch-screen is done thinner and cost is lower.ITO conductive layer utilizes the multiple methods such as sputtering, evaporation to plate one deck ito film and manufactures on glass.Because ITO is metal oxide, by high temperature plated film, there is internal stress in the horizontal and vertical both direction of conductive layer, therefore can affect the intensity of glass, namely affect the intensity of whole touch-screen.
Summary of the invention
The object of the invention is the method for making and the touch-screen that propose a kind of touch-screen, to solve the lower problem of existing touch screen intensity.
On the one hand, embodiments provide a kind of method for making of touch-screen, comprising:
Substrate, deposit transparent conductive material on substrate, forms middle transparent conductive layer through patterning processes;
Remove the middle transparent conductive layer corresponding with the dummy electrodes of touch-screen by etching and form patterned transparent conductive layer, to make patterned transparent conductive layer corresponding with the touch electrode of touch-screen;
Patterned transparent conductive layer with the substrate exposed form insulation course;
Described insulation course with the patterned transparent conductive layer exposed form metal conducting layer, and wherein said metal conducting layer comprises the bridging line of viewing area.
Further, remove the middle transparent conductive layer corresponding with the dummy electrodes of touch-screen by etching and form patterned transparent conductive layer, to make patterned transparent conductive layer corresponding with the touch electrode of touch-screen, comprising:
Middle transparent conductive layer corresponding with described dummy electrodes in viewing area is removed by etching.
Further, the area of described patterned transparent conductive layer is the half of the area of described middle transparent conductive layer.
Further, the step described insulation course with the patterned transparent conductive layer exposed forming metal conducting layer comprises:
Plated metal on described insulation course with the patterned transparent conductive layer exposed;
Described metal deposits photoresist, forms metal conducting layer through exposure, development and etching technics, and remove photoresist.
Further, described metal conducting layer also comprises the circuit line of welding disking area.
Further, described transparent conductive material is tin indium oxide.
On the other hand, embodiments provide a kind of touch-screen, comprising:
Substrate;
Patterned transparent conductive layer, be formed at except the part corresponding with the dummy electrodes of touch-screen on described substrate, described patterned transparent conductive layer is corresponding with the touch electrode of touch-screen;
Insulation course, is formed at described patterned transparent conductive layer with on the substrate exposed;
Metal conducting layer, be formed on described insulation course, described metal conducting layer comprises the bridging line of viewing area.
Further, described metal conducting layer also comprises the circuit line of welding disking area.
Further, described transparent conductive material is tin indium oxide.
The method for making of a kind of touch-screen provided in the embodiment of the present invention and touch-screen, can strengthen the intensity of touch-screen.In the method for making of the touch-screen provided in the embodiment of the present invention, by form middle transparent conductive layer on substrate after, etching removes part corresponding with the dummy electrodes of touch-screen in described middle transparent conductive layer, to form patterned transparent conductive layer, subsequently, also insulation course and metal conducting layer is formed.Namely pass through in invention the present embodiment to remove transparency conducting layer corresponding to dummy electrodes, decrease the area of transparency conducting layer in touch-screen, thus reduce the internal stress in transparency conducting layer, enhance the intensity of touch-screen.
Accompanying drawing explanation
The schematic flow sheet of the method for making of a kind of touch-screen that Fig. 1 provides for the embodiment of the present invention one;
Schematic diagram before part corresponding with the dummy electrodes of touch-screen in the removal middle transparent conductive layer that Fig. 2 (a) provides for the embodiment of the present invention one;
Schematic diagram after part corresponding with the dummy electrodes of touch-screen in the removal middle transparent conductive layer that Fig. 2 (b) provides for the embodiment of the present invention one;
The process flow diagram of step a-f in the touch-screen method for making that Fig. 3 (a) provides for the embodiment of the present invention two;
The process flow diagram of step g-k in the touch-screen method for making that Fig. 3 (b) provides for the embodiment of the present invention two;
The process flow diagram of step l-p in the touch-screen method for making that Fig. 3 (c) provides for the embodiment of the present invention two;
The structural representation of a kind of touch-screen that Fig. 4 provides for the embodiment of the present invention three.
Embodiment
Technical scheme of the present invention is further illustrated by embodiment below in conjunction with accompanying drawing.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, illustrate only part related to the present invention in accompanying drawing but not entire infrastructure.
Embodiment one
The schematic flow sheet of the method for making of a kind of touch-screen that Fig. 1 provides for the embodiment of the present invention one, as shown in Figure 1, the method comprises:
Step 101, on substrate deposit transparent conductive material, adopt patterning processes formed middle transparent conductive layer.
Exemplary, described substrate can be cover glass, is specially sodium calcium base or silicon boryl substrate glass; Described transparent conductive material can be tin indium oxide (Indium-Tin Oxide, ITO).Can adopt the techniques such as sputtering or evaporation on cover glass, deposit ITO material and form transparent conductive film.Described patterning processes specifically can be photoetching process, the step such as namely comprise gluing (photoresist), expose, develop, etch and remove photoresist.Described middle transparent conductive layer specifically can be the transparency conducting layer formed according to multiple rhombus or other shapes of certain rule arrangement.
Step 102, remove part corresponding with the dummy electrodes of touch-screen in middle transparent conductive layer, to form patterned transparent conductive layer by etching.
Because ITO is metal oxide, by high temperature plated film, laterally or on longitudinal (X/Y direction) there is internal stress, therefore can affect the intensity of substrate, namely affecting the intensity of whole touch-screen.Due to the very thin thickness of ito thin film, relatively little in the internal stress of thickness direction, can ignore; And the size of ito thin film can affect the size of internal stress, and then affect the intensity of cover glass, therefore ito thin film area is less, and the internal stress acted on cover glass is less, and intensity also can be better.
Touch-screen exist some dummy electrodes (dummy region); generally be arranged at the near zone receiving line (RX line) or send line (TX line); the part corresponding with these dummy electrodes in middle transparent conductive layer is removed; just the area of ito thin film can be reduced; to reduce the internal stress acted on cover glass, and then strengthen the intensity of cover glass.The front and back of part corresponding with the dummy electrodes of touch-screen in the removal middle transparent conductive layer that Fig. 2 a and Fig. 2 b provides for the embodiment of the present invention one contrast schematic diagram, as seen from the figure, after part 201 corresponding with the dummy electrodes of touch-screen in Fig. 2 a is removed, expose part substrate 202 corresponding with it in figure 2b, substantially reduce the area of ito thin film.
Preferably, the area of patterned transparent conductive layer is the half of the area of middle transparent conductive layer.
Exemplary, the method removing part corresponding with the dummy electrodes of touch-screen in middle transparent conductive layer specifically can be and again adopts patterning processes to etch middle transparent conductive layer, thus forms patterned transparent conductive layer.Patterning processes in this step and the difference of the patterning processes described in step 101 are that the pattern of the mask plate adopted when exposing is different.
Preferably, remove part corresponding with the dummy electrodes of touch-screen in middle transparent conductive layer by etching, to form patterned transparent conductive layer, comprising: remove middle transparent conductive layer corresponding with dummy electrodes in viewing area by etching.
Further, also can prepare and a kind ofly comprise for the formation of pattern needed for middle transparent conductive layer and the mask plate for the formation of pattern needed for patterned transparent conductive layer, by using this mask plate to carry out a patterning processes to reach the object directly forming patterned transparent conductive layer simultaneously.
Step 103, on patterned transparent conductive layer and the substrate that exposes, form insulation course.
Exemplary, the material of described insulation course specifically can be silicon nitride, has the photoresist of insulation characterisitic and other organic insulations etc.According to photoresist, then after caning be passed through photoresist, exposure and development, using the photoresist that stays directly as insulation course; According to materials such as silicon nitrides, first can deposit the materials such as one deck silicon nitride on patterned transparent conductive layer with the substrate exposed, then through upper photoresist, exposure, development and etching, form insulation course, finally remove remaining photoresist.
Step 104, on insulation course and the patterned transparent conductive layer that exposes, form metal conducting layer.
Wherein, metal conducting layer comprises the bridging line of viewing area.
Exemplary, the techniques such as sputtering or evaporation plated metal on insulation course with the patterned transparent conductive layer exposed can be adopted, and continue to adopt patterning processes to form the bridging line of peripheral circuit line and viewing area, namely on metal, photoresist is deposited, form metal conducting layer through exposure, development and etching technics, and remove photoresist.
Further, metal conducting layer also comprises the circuit line of welding disking area.
In the method for making of the touch-screen that the embodiment of the present invention one provides, by form middle transparent conductive layer on substrate after, etching removes part corresponding with the dummy electrodes of touch-screen in described middle transparent conductive layer, to form patterned transparent conductive layer, subsequently, also insulation course and metal conducting layer is formed.Namely pass through in the present embodiment to remove transparency conducting layer corresponding to dummy electrodes, decrease the area of transparency conducting layer in touch-screen, thus reduce the internal stress in transparency conducting layer, enhance the intensity of touch-screen.Further, through checkings such as falling ball impact test and sharp object impulse tests, confirming touch screen intensity can truly have lifting, effectively can reduce touch-screen in user uses, surprisingly be subject to blunt or the rear chipping probability of sharp object impact.
Embodiment two
The method for making that the embodiment of the present invention two provides a kind of preferred touch-screen on the basis of above-described embodiment is used as a kind of embodiment, the process flow diagram of the method for making of a kind of touch-screen that Fig. 3 (a)-Fig. 3 (c) provides for the embodiment of the present invention two, as shown in the figure, the technological process of the method comprises:
Step a, cover glass 301 deposits ITO material form ITO transparent conductive film 302.
Step b, form the first photoresist layer 303 (positive glue) at the surperficial resist coating of ITO transparent conductive film 302.
Step c, the first photoresist layer 303 covers the first mask plate 304 and exposes.
Steps d, carry out developing and remove through the part photoresist of overexposure, form the first center pattern photoresist layer 305.
Step e, to remove not by the part ITO transparent conductive film that the first center pattern photoresist layer 305 covers through over etching, ITO transparency conducting layer 306 in the middle of being formed.
Step f, remove the first center pattern photoresist layer 305.
Step g, form the second photoresist layer 307 (positive glue) at the surperficial resist coating of middle ITO transparency conducting layer 306.
Step h, the second photoresist layer 303 covers the second mask plate 308 and exposes.Wherein, the pattern on the second mask plate 308 is corresponding with the dummy electrodes of touch-screen.
Step I, carry out developing and remove through the part photoresist of overexposure, form the second center pattern photoresist layer 309.
Step j, to remove not by the partially transparent electroconductive ITO film that the second center pattern photoresist layer 309 covers through over etching, form pattern I TO transparency conducting layer 310.
Step k, remove the second center pattern photoresist layer 309.
Step l, form the 3rd photoresist layer 311 (positive glue) at pattern I TO transparency conducting layer 310 and the cover glass 301 upper surface resist coating that exposes.
Step m, on the 3rd photoresist layer 311, cover the 3rd mask plate 312 exposing.
Step n, carry out developing and remove through the part photoresist of overexposure, remaining photoresist is insulation course 313.
Step o, utilize sputtering technology plated metal on insulation course 313 and the pattern I TO transparency conducting layer 310 that exposes.
Step p, carry out the steps such as follow-up patterning processes, finally form metal conducting layer 315, wherein, in metal conducting layer 315, comprise the bridging line of viewing area and the circuit line etc. of welding disking area.
The embodiment of the present invention two provides a kind of preferred embodiment on the basis of embodiment one; describe the technological process of touch-screen method for making in detail; part ito thin film corresponding to dummy electrodes is removed through using the method; decrease the area of ito thin film in touch-screen; thus the internal stress reduced in ito thin film; namely reduce the size of the internal stress acted on above cover glass, and then enhance the intensity of whole touch-screen.
Embodiment three
The structural representation of a kind of touch-screen that Fig. 4 provides for the embodiment of the present invention three, as shown in Figure 4, this touch-screen comprises: substrate 401; Patterned transparent conductive layer 402, be formed at except the part corresponding with the dummy electrodes of touch-screen on substrate 401, patterned transparent conductive layer 402 is corresponding with the touch electrode of touch-screen; Insulation course 403, is formed at patterned transparent conductive layer 402 with on the substrate 401 exposed; Metal conducting layer 404, be formed on insulation course 403, metal conducting layer 404 comprises the bridging line of viewing area.
Further, metal conducting layer 404 also can comprise the circuit line of welding disking area.
Further, transparent conductive material can be tin indium oxide.
In the touch-screen that the embodiment of the present invention three provides, transparency conducting layer in existing touch-screen is replaced by patterned transparent conductive layer 402, be formed on substrate 401 except the part corresponding with the dummy electrodes of touch-screen, corresponding with the touch electrode of touch-screen, the area of patterned transparent conductive layer 402 is less than the transparency conducting layer in existing touch-screen, reduce the internal stress in transparency conducting layer, namely reduce the size of the internal stress acted on substrate 401, and then enhance the intensity of touch-screen.Further, through checkings such as falling ball impact test and sharp object impulse tests, confirming touch screen intensity can truly have lifting, effectively can reduce touch-screen in user uses, surprisingly be subject to blunt or the rear chipping probability of sharp object impact.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and can not protection scope of the present invention be departed from.Therefore, although be described in further detail invention has been by above embodiment, the present invention is not limited only to above embodiment, when not departing from the present invention's design, can also comprise other Equivalent embodiments more, and scope of the present invention is determined by appended right.
Claims (9)
1. a method for making for touch-screen, is characterized in that, comprising:
Deposit transparent conductive material on substrate, adopts patterning processes to form middle transparent conductive layer;
Part corresponding with the dummy electrodes of touch-screen in described middle transparent conductive layer is removed, to form patterned transparent conductive layer by etching;
Described patterned transparent conductive layer with the substrate exposed form insulation course;
Described insulation course with the patterned transparent conductive layer exposed form metal conducting layer, and wherein said metal conducting layer comprises the bridging line of viewing area.
2. method according to claim 1, is characterized in that, described by part corresponding with the dummy electrodes of touch-screen in the described middle transparent conductive layer of etching removal, to form patterned transparent conductive layer, comprising:
Middle transparent conductive layer corresponding with described dummy electrodes in viewing area is removed by etching.
3. method according to claim 1, is characterized in that, the area of described patterned transparent conductive layer is the half of the area of described middle transparent conductive layer.
4. method according to claim 1, is characterized in that, the step that described insulation course with the patterned transparent conductive layer exposed are formed metal conducting layer comprises:
Plated metal on described insulation course with the patterned transparent conductive layer exposed;
Described metal deposits photoresist, forms metal conducting layer through exposure, development and etching technics, and remove photoresist.
5. method according to claim 1, is characterized in that, described metal conducting layer also comprises the circuit line of welding disking area.
6. the method according to any one of claim 1-5, is characterized in that, described transparent conductive material is tin indium oxide.
7. a touch-screen, is characterized in that, comprising:
Substrate;
Patterned transparent conductive layer, be formed at except the part corresponding with the dummy electrodes of touch-screen on described substrate, described patterned transparent conductive layer is corresponding with the touch electrode of touch-screen;
Insulation course, is formed at described patterned transparent conductive layer with on the substrate exposed;
Metal conducting layer, be formed on described insulation course, described metal conducting layer comprises the bridging line of viewing area.
8. touch-screen according to claim 7, is characterized in that, described metal conducting layer also comprises the circuit line of welding disking area.
9. touch-screen according to claim 7, is characterized in that, described transparent conductive material is tin indium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510183790.6A CN104808848B (en) | 2015-04-17 | 2015-04-17 | The production method and touch screen of a kind of touch screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510183790.6A CN104808848B (en) | 2015-04-17 | 2015-04-17 | The production method and touch screen of a kind of touch screen |
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| Publication Number | Publication Date |
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| CN104808848A true CN104808848A (en) | 2015-07-29 |
| CN104808848B CN104808848B (en) | 2018-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510183790.6A Expired - Fee Related CN104808848B (en) | 2015-04-17 | 2015-04-17 | The production method and touch screen of a kind of touch screen |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112433632A (en) * | 2020-11-19 | 2021-03-02 | 湖北长江新型显示产业创新中心有限公司 | Display panel, preparation method thereof and display device |
| CN113050825A (en) * | 2021-03-09 | 2021-06-29 | 昆山龙腾光电股份有限公司 | Touch screen and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101694605A (en) * | 2009-10-27 | 2010-04-14 | 友达光电股份有限公司 | Touch panel |
| US20100238133A1 (en) * | 2009-03-17 | 2010-09-23 | Wintek Corporation | Capacitive touch panel |
| CN203720820U (en) * | 2014-01-13 | 2014-07-16 | 深圳莱宝高科技股份有限公司 | Touch panel |
-
2015
- 2015-04-17 CN CN201510183790.6A patent/CN104808848B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100238133A1 (en) * | 2009-03-17 | 2010-09-23 | Wintek Corporation | Capacitive touch panel |
| CN101694605A (en) * | 2009-10-27 | 2010-04-14 | 友达光电股份有限公司 | Touch panel |
| CN203720820U (en) * | 2014-01-13 | 2014-07-16 | 深圳莱宝高科技股份有限公司 | Touch panel |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112433632A (en) * | 2020-11-19 | 2021-03-02 | 湖北长江新型显示产业创新中心有限公司 | Display panel, preparation method thereof and display device |
| CN112433632B (en) * | 2020-11-19 | 2022-06-21 | 湖北长江新型显示产业创新中心有限公司 | Display panel, preparation method thereof and display device |
| CN113050825A (en) * | 2021-03-09 | 2021-06-29 | 昆山龙腾光电股份有限公司 | Touch screen and preparation method thereof |
| CN113050825B (en) * | 2021-03-09 | 2024-03-12 | 昆山龙腾光电股份有限公司 | Touch screen and preparation method thereof |
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| CN104808848B (en) | 2018-07-03 |
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